TI SN74LVC06APWR

SN54LVC06A, SN74LVC06A
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS596N – OCTOBER 1997 – REVISED JULY 2005
FEATURES
•
•
Operate From 1.65 V to 3.6 V
Specified From –40°C to 85°C,
–40°C to 125°C, and –55°C to 125°C
Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
SN54LVC06A . . . J OR W PACKAGE
SN74LVC06A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
2
13
3
12
4
11
5
10
6
7
9
8
VCC
6A
6Y
5A
5Y
4A
4Y
1Y
2A
2Y
3A
3Y
1
14
1Y
1A
NC
VCC
6A
VCC
14
2
13 6A
3
12 6Y
4
11 5A
5
6
10 5Y
9 4A
7
8
4Y
1
SN54LVC06A . . . FK PACKAGE
(TOP VIEW)
SN74LVC06A . . . RGY PACKAGE
(TOP VIEW)
1A
1A
1Y
2A
2Y
3A
3Y
GND
•
GND
•
Max tpd of 3.7 ns at 3.3 V
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
2A
NC
2Y
NC
3A
4
3 2 1 20 19
18
5
6
17
16
7
8
15
14
9 10 11 12 13
6Y
NC
5A
NC
5Y
3Y
GND
NC
4Y
4A
•
•
NC - No internal connection
DESCRIPTION/ORDERING INFORMATION
These hex inverter buffers/drivers are designed for 1.65-V to 3.6-V VCC operation.
The outputs of the 'LVC06A devices are open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 24 mA.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators
in a mixed 3.3-V/5-V system environment.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
QFN – RGY
Tube of 50
SN74LVC06AD
Reel of 2500
SN74LVC06ADR
Reel of 250
SN74LVC06ADT
SOP – NS
Reel of 2000
SN74LVC06ANSR
LVC06A
SSOP – DB
Reel of 2000
SN74LVC06ADBR
LC06A
Tube of 90
SN74LVC06APW
Reel of 2000
SN74LVC06APWR
TSSOP – PW
–55°C to 125°C
(1)
TOP-SIDE MARKING
SN74LVC06ARGYR
SOIC – D
–40°C to 125°C
ORDERABLE PART NUMBER
Reel of 1000
LC06A
LVC06A
LC06A
Reel of 250
SN74LVC06APWT
TVSOP – DGV
Reel of 2000
SN74LVC06ADGVR
LC06A
CDIP – J
Tube of 25
SNJ54LVC06AJ
SNJ54LVC06AJ
CFP – W
Tube of 150
SNJ54LVC06AW
SNJ54LVC06AW
LCCC – FK
Tube of 55
SNJ54LVC06AFK
SNJ54LVC06AFK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
Copyright © 1997–2005, Texas Instruments Incorporated
SN54LVC06A, SN74LVC06A
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS596N – OCTOBER 1997 – REVISED JULY 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
OUTPUT
Y
H
L
L
H
LOGIC DIAGRAM, EACH INVERTER (POSITIVE LOGIC)
A
Y
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
Supply voltage range
–0.5
6.5
V
VI
Input voltage
range (2)
–0.5
6.5
V
VO
Output voltage range
–0.5
6.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
VCC
Continuous current through VCC or GND
D
package (3)
86
DB package (3)
θJA
Package thermal impedance
96
DGV package (3)
127
NS package (3)
76
PW package (3)
113
RGY package (4)
Tstg
Ptot
(1)
(2)
(3)
(4)
(5)
(6)
2
Storage temperature range
Power
dissipation (5) (6)
°C/W
47
–65
TA = –40°C to 125°C
UNIT
150
°C
500
mW
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
For the D package: above 70°C the value of Ptot derates linearly with 8 mW/K.
For the DB, DGV, NS, and PW packages: above 60°C the value of Ptot derates linearly with 5.5 mW/K.
SN54LVC06A, SN74LVC06A
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS596N – OCTOBER 1997 – REVISED JULY 2005
Recommended Operating Conditions
(1)
SN54LVC06A (2)
–55°C to 125°C
Operating
VCC
Supply voltage
VIH
High-level input voltage
Data retention only
MAX
1.65
3.6
1.5
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
Low-level input voltage
V
0.65 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
MIN
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
V
VI
Input voltage
0
5.5
V
VO
Output voltage
0
5.5
V
VCC = 1.65 V
IOL
(1)
(2)
Low-level output current
4
VCC = 2.3 V
8
VCC = 2.7 V
12
VCC = 3 V
24
mA
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Product preview
Recommended Operating Conditions (1)
SN74LVC06A
TA = 25°C
VCC
Supply voltage
VIH
High-level
input voltage
Operating
Data retention only
–40°C to 85°C
–40°C to 125°C
MAX
MIN
MAX
MIN
MAX
1.65
3.6
1.65
3.6
1.65
3.6
1.5
1.5
1.5
0.65 × VCC
0.65 × VCC
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
1.7
1.7
VCC = 2.7 V to 3.6 V
2
VCC = 1.65 V to 1.95 V
UNIT
MIN
VCC = 1.65 V to 1.95 V
2
V
V
2
0.35 × VCC
0.35 × VCC
0.35 × VCC
0.7
0.7
0.7
VIL
Low-level
input voltage
VI
Input voltage
0
5.5
0
5.5
0
5.5
V
VO
Output voltage
0
5.5
0
5.5
0
5.5
V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 1.65 V
IOL
(1)
Low-level
output current
0.8
4
0.8
4
V
0.8
4
VCC = 2.3 V
8
8
8
VCC = 2.7 V
12
12
12
VCC = 3 V
24
24
24
mA
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN54LVC06A, SN74LVC06A
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS596N – OCTOBER 1997 – REVISED JULY 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
SN54LVC06A (1)
PARAMETER
TEST CONDITIONS
VCC
–55°C to 125°C
UNIT
MIN TYP (2) MAX
IOL = 100 µA
VOL
II
ICC
∆ICC
Ci
(1)
(2)
1.65 V to 3.6 V
0.2
IOL = 4 mA
1.65 V
0.45
IOL = 8 mA
2.3 V
0.7
IOL = 12 mA
2.7 V
0.4
IOL = 24 mA
3V
0.55
±5
µA
3.6 V
10
µA
2.7 V to 3.6 V
500
µA
VI = 5.5 V or GND
3.6 V
VI = VCC or GND, IO = 0
One input at VCC – 0.6 V, Other inputs at VCC or GND
V
VI = VCC or GND
3.3 V
5
pF
Product preview
TA = 25°C
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
SN74LVC06A
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C
MIN
IOL = 100 µA
VOL
MAX
–40°C to 125°C
MIN
IOL = 4 mA
1.65 V
0.24
0.45
0.6
IOL = 8 mA
2.3 V
0.3
0.7
0.75
IOL = 12 mA
2.7 V
0.4
0.4
0.6
3V
VI = 5.5 V or GND
ICC
VI = VCC or GND, IO = 0
One input at VCC – 0.6 V,
Other inputs at VCC or GND
VI = VCC or GND
UNIT
MAX
0.2
VI or VO = 5.5 V
Ci
MIN
0.1
Ioff
∆ICC
–40°C to 85°C
MAX
1.65 V to 3.6 V
IOL = 24 mA
II
TYP
0.3
V
0.55
0.55
0.8
3.6 V
±1
±5
±20
µA
0
±1
±10
±20
µA
3.6 V
1
10
40
µA
500
500
5000
µA
2.7 V to 3.6 V
3.3 V
5
pF
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
SN54LVC06A (1)
PARAMETER
tpd
FROM
(INPUT)
A
TO
(OUTPUT)
Y
VCC
MIN
MAX
1.8 V ± 0.15 V
1.4
5.6
2.5 V ± 0.2 V
1
3.1
2.7 V
3.3 V ± 0.3 V
(1)
4
Product preview
–55°C to 125°C
3.9
1
3.7
UNIT
ns
SN54LVC06A, SN74LVC06A
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS596N – OCTOBER 1997 – REVISED JULY 2005
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
SN74LVC06A
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
TA = 25°C
MIN
tpd
A
Y
–40°C to 85°C
TYP MAX
MIN MAX
–40°C to 125°C
MIN
MAX
1.8 V ± 0.15 V
1.4
3
5.1
1.4
5.6
1.4
7.6
2.5 V ± 0.2 V
1
1.9
2.8
1
3.1
1
4
2.7 V
1
2.4
3.7
1
3.9
1
5
3.3 V ± 0.3 V
1
2.2
3.5
1
3.7
1
5
UNIT
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance per buffer/driver
TEST
CONDITIONS
f = 10 MHz
VCC
TYP
1.8 V
2.1
2.5 V
2.3
3.3 V
2.5
UNIT
pF
5
SN54LVC06A, SN74LVC06A
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS596N – OCTOBER 1997 – REVISED JULY 2005
PARAMETER MEASUREMENT INFORMATION
(OPEN DRAIN)
VLOAD
S1
RL
From Output
Under Test
Open
TEST
GND
RL
CL
(see Note A)
S1
tPZL (see Notes E and F)
VLOAD
tPLZ (see Notes E and G)
VLOAD
tPHZ/tPZH
VLOAD
LOAD CIRCUIT
INPUT
VCC
VI
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VM
tr/tf
≤ 2 ns
≤ 2 ns
≤ 2.5 ns
≤ 2.5 ns
VCC
VCC
2.7 V
2.7 V
VLOAD
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
CL
RL
V∆
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
th
VI
VM
Input
VM
VM
Data Input
VM
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VI
VM
Input
VM
0V
Output
VM
VOL
tPHL
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VM
VM
tPZL
VOH
VM
VI
Output
Control
tPHL
tPLH
VI
Output
Waveform 2
S1 at VLOAD
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VLOAD/2 - V∆
VLOAD/2
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V∆.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LVC06AD
ACTIVE
SOIC
D
14
SN74LVC06ADBR
ACTIVE
SSOP
DB
SN74LVC06ADBRE4
ACTIVE
SSOP
SN74LVC06ADE4
ACTIVE
SN74LVC06ADGVR
50
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
14
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06ADGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06ADR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06ADRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06ADT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06ADTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06ANSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06ANSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06APW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06APWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06APWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06APWLE
OBSOLETE
TSSOP
PW
14
SN74LVC06APWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06APWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06APWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06APWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06APWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06APWTG4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC06ARGYR
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
50
TBD
(1)
Call TI
Call TI
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2005
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated