3.3V, 2GHz ANY-DIFFERENTIAL INPUT-TO-LVDS 1:4 FANOUT BUFFER/ Precision Edge™ SY89833L TRANSLATOR W/ INTERNAL TERMINATION FEATURES ■ Accepts any differential input signal and provides four LVDS output copies ■ Guaranteed AC performance over temperature and voltage: • > 2.0GHz fMAX • < 20ps within-device skew • < 190ps rise/fall times ■ Low jitter design • < 1ps(rms) cycle-to-cycle jitter • < 10ps(pk-pk) total jitter ■ 3.3V power supply operation ■ TTL/CMOS input for enable ■ Unique input termination and VT pin accepts DCcoupled and AC-coupled inputs (CML, PECL, LVDS, and HSTL) ■ High-speed LVDS outputs ■ Wide operating temperature range: –40°C to +85°C ■ Available in 16-pin (3mm × 3mm) MLF™ package Precision Edge™ DESCRIPTION The SY89833L is a 3.3V, high-speed 2GHz differential Low Voltage Differential Swing (LVDS) 1:4 fanout buffer optimized for ultra-low skew applications. Within device skew is guaranteed to be less than 20ps over supply voltage and temperature. The differential input buffer has a unique internal termination design that allows access to the termination network through a VT pin. This feature allows the device to easily interface to different logic standards. A VREF_AC reference is included for AC-coupled applications. The SY89833L is part of Micrel’s high-speed clock synchronization family. For 2.5V applications, the SY89832U provides similar functionality while operating from a 2.5V ±5% supply. For applications that require a different I/O combination, consult the Micrel website at www.micrel.com, and choose from a comprehensive product line of highspeed, low-skew fanout buffers, translators and clock generators. APPLICATIONS ■ ■ ■ ■ Processor clock distribution SONET clock distribution Fibre Channel clock distribution Gigabit Ethernet clock distribution FUNCTIONAL BLOCK DIAGRAM TYPICAL PERFORMANCE 622MHz Output Q0 /Q0 IN VT /IN –15mV Offset (50mV/div.) Q1 /Q1 50Ω 50Ω Q2 /Q2 EN VREF—AC D Q Q3 /Q3 TIME (321.9ps/div.) Precision Edge is a trademark of Micrel, Inc. MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc. Rev.: D 1 Amendment: /0 Issue Date: February 2003 Precision Edge™ SY89833L Micrel PACKAGE/ORDERING INFORMATION /Q0 Q0 VCC GND Ordering Information 16 15 14 13 Q1 1 12 IN /Q1 2 11 Q2 /Q2 3 4 10 9 VT VREF—AC /IN Part Number Package Type Operating Range Package Marking SY89833LMI MLF-16 Industrial 833L SY89833LMITR* MLF-16 Industrial 833L *Tape and Reel Q3 /Q3 VCC EN 5 6 7 8 16-Pin MLF™ PIN DESCRIPTION Pin Number Pin Name Pin Function 15, 16, 1, 2, 3, 4, 5, 6 (Q0, /Q0) to (Q3, /Q3) “LVDS Outputs” section, Figure 2a. Unused outputs should be terminated with a 100Ω LVDS Differential (Outputs): Normally terminated with 100Ω across the pair (Q, /Q). See resistor across each pair. 8 EN TTL/CMOS Compatible Synchronous Enable: When EN goes LOW, Q outputs will go LOW and /Q outputs will go HIGH on the next LOW transition at IN inputs. Input threshold is VCC/2V. A 25kΩ pull-up resistor is included. The default state is HIGH when left floating. The internal latch is clocked on the falling edge of the input signal (IN, /IN). 9, 12 /IN, IN 10 VREF–AC 11 VT Termination Center-Tap. For CML or LVDS inputs, leave this pin floating. See Figures 3a to 3f. See “LVDS Outputs” Figures 2a and 2b for LVDS differential and common mode measurements. 13, Exposed Pad GND Ground. Exposed pad internally connected to GND and must be connected to a ground plane for proper thermal operation. 7, 14 VCC Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors. Differential Clock (Inputs): Internal 50Ω termination resistors to the VT pin. See “Input Interface Applications” section. Reference Voltages: Equals to VCC–1.4V, and is used for AC-coupled applications. The maximum sink/source current is 0.5mA. See “Input Interface Applications.” When using VREF–AC, bypass with a 0.01µF capacitor to VCC. TRUTH TABLE IN /IN EN Q /Q 0 1 1 0 1 1 0 1 1 0 0 0(1) 1(1) X Note 1. X On next negative transition of the input signal (IN). 2 Precision Edge™ SY89833L Micrel Absolute Maximum Ratings(Note 1) Operating Ratings(Note 2) Supply Voltage (VCC) .................................. –0.5V to +4.0V Input Voltage (VIN) ............................... –0.5V to VCC +0.3V Output Current (IOUT) ............................................... ±10mA Input Current (IN, /IN) ............................................... ±50mA VT Current (IVT) ...................................................... ±100mA Input Sink/Source Current (VREF–AC), Note 3 ............ ±2mA Lead Temperature (Soldering, 10 sec.) .................... 220°C Storage Temperature (TS) ....................... –65°C to +150°C Supply Voltage Range ............................ +2.97V to +3.63V Ambient Temperature (TA) ......................... –40°C to +85°C Package Thermal Resistance MLF™ (θJA) Still-Air ............................................................. 60°C/W 500lfpm ............................................................ 54°C/W MLF™ (ψJB), Note 4 ........................................... 32°C/W Note 1. Note 2. Note 3. Note 4. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. Due to the limited drive capability use for input of the same package only. Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. DC ELECTRICAL CHARACTERISTICS(Note 1, 2) TA = –40°C to +85°C Symbol Parameter Min Typ Max Units VCC Power Supply Voltage Range 2.97 3.3 3.63 V ICC Power Supply Current 75 100 mA RIN Differential Input Resistance (IN, /IN) 100 120 Ω VIH Input HIGH Voltage (IN, /IN) Note 3 0.1 VCC+0.3 V VIL Input LOW Voltage (IN, /IN) Note 3 –0.3 VCC+0.2 V VIN Input Voltage Swing Note 3, see Figure 2c VIN (max), VT = floating. 0.1 3.6 V VDIFF_IN Differential Input Voltage Note 3, see Figure 2d 0.2 |IIN| Input Current (IN, /IN) Note 3 VREF–AC Reference Voltage Note 3 Note 1. Note 2. Note 3. Condition No Load 80 V 45 VCC–1.525 VCC–1.425 VCC–1.325 mA V The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Specification for packaged product only. Due to the internal termination (see “Differential Input”) the input current depends on the applied voltages at IN, /IN and VT inputs. Do not apply a combination of voltages that causes the input current to exceed the maximum limit. 3 Precision Edge™ SY89833L Micrel LVDS OUTPUTS DC ELECTRICAL CHARACTERISTICS(Note 1, 2) VCC = 3.3V ±10%, TA = –40°C to +85°C Symbol Parameter Condition VOH Output HIGH Voltage Note 3 VOL Output LOW Voltage Note 3 VOCM Output Common Mode Voltage ∆VOCM Change in Common Mode Voltage VOUT Single-Ended Output see Figures 2c-2d 250 VDIFF_OUT Differential Output see Figures 2c-2d 500 Note 1. Note 2. Note 3. Min Typ Max Units 1.475 V 0.925 V 1.125 1.275 V –50 50 mV 350 450 mV 700 900 mV Max Units The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Specification for packaged product only. Measured as per Figure 2a, 100Ω across Q and /Q outputs. LVTTL/CMOS INPUTS DC ELECTRICAL CHARACTERISTICS(Note 1, 2) VCC = 3.3V ±10%, TA = –40°C to +85°C Symbol Parameter VIH Input HIGH Voltage 2.0 VCC V VIL Input LOW Voltage 0 0.8 V IIH Input HIGH Current –125 20 µA IIL Input LOW Current –300 µA Note 1. Note 2. Condition Min Typ The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Specification for packaged product only. 4 Precision Edge™ SY89833L Micrel AC ELECTRICAL CHARACTERISTICS(Note 1, 2) VCC = 3.3V ±10%, TA = –40°C to +85°C Symbol Parameter Condition Min Typ Max Units fMAX Maximum Frequency ≥200mVpp Output Swing 2.0 tPLH tPHL Differential Propagation (Delay) (IN-to-Q) Input Swing: <400mV 400 500 600 ps Input Swing: ≥400V 330 440 530 ps tSKEW Within-Device Skew (Differential) Note 3 5 20 ps 200 ps GHz Part-to-Part Skew (Differential) tS Set-Up Time (EN to IN, /IN) Note 4 and Note 5 300 ps tH Hold Time (EN to IN, /IN) Note 4 and Note 5 500 ps tJITTER Cycle-to-Cycle Jitter (rms) Note 6 1 ps(rms) Total Jitter Note 7 10 ps(pk-pk) 190 ps t r, t f Output Rise/Fall Times (20% to 80%) 60 110 Note 1. Measured with 400mV input signal, 50% duty cycle, all outputs are loaded with 100Ω between Q and /Q. Output swing is ≥ 200mV. Note 2. Specification for packaged product only. Note 3. Skew is measured between outputs under identical transitions. Note 4. Set-up and hold times apply to synchronous applications that intend to enable/disable before the next clock cycle. For asynchronous applications set-up and hold times do not apply. Note 5. See “Timing Diagram.” Note 6. Cycle-to-cycle jitter definition: The variation period between adjacent cycles over a random sample of adjacent cycle pairs. TJITTER_CC = Tn –Tn+1 where T is the time between rising edges of the output signal. Total jitter definition: with an ideal clock input frequency of ≤ fMAX (device), no more than one output edge in 1012 output edges will deviate by more than the specified peak-to-peak jitter value. Note 7. TIMING DIAGRAM EN VCC/2 tS VCC/2 tH /IN IN VIN tPLH, tPHL tPLH,tPHL /Q VOUT Swing Q 5 Precision Edge™ SY89833L Micrel TYPICAL OPERATING CHARACTERISTICS VCC = 3.3V, VIN = 400mV, TA = 25°C, unless otherwise stated. TSKEW vs. Temperature Output Swing vs. Frequency 350 14 12 TSKEW (ps) 250 200 150 10 8 6 100 4 50 2 0 0 0.5 1 1.5 2 FREQUENCY (GHz) 0 -40 -20 0 20 40 60 80 100 TEMPERATURE (°C) 2.5 Propagation Delay vs. Input Voltage Swing 600 PROPAGATION DELAY (ps) AMPLITUDE (mV) 300 500 400 300 200 100 0 0 200 400 600 800 INPUT VOLTAGE SWING (mV) 6 Precision Edge™ SY89833L Micrel FUNCTIONAL CHARACTERISTICS VCC = 3.3V, VIN = 400mV, TA = 25°C, unless otherwise stated. (150mV/div.) —15mV Offset 622MHz Output (150mV/div.) TIME (321.9ps/div.) TIME (1.29ns/div.) (150mV/div.) 1GHz Output —10mV Offset —15mV Offset 155MHz Output TIME (200ps/div.) 7 Precision Edge™ SY89833L Micrel INPUT STAGE VCC VCC 1.86k W 1.86k W VCC 25kΩ R EN 1.86k W 1.86k W R IN 50 VT 50 W W GND GND /IN Figure 1a. Simplified Differential Input Buffer Figure 1b. Simplified TTL/CMOS Input Buffer LVDS OUTPUTS LVDS specifies a small swing of 350mV typical, on a nominal 1.25V common mode above ground. The common mode voltage has tight limits to permit large variations in ground noise between an LVDS driver and receiver. 50Ω vOUT 100Ω vOH, vOL 50Ω vOH, vOL vOCM, ∆vOCM GND GND Figure 2b. LVDS Common Mode Measurement Figure 2a. LVDS Differential Measurement QOUT QOUT VOUT, VIN 350mV (typical) 700mV QOUT – /QOUT VDIFF_IN, VDIFF_OUT /QOUT /QOUT Figure 2c. Single-Ended Swing Figure 2d. Differential Swing 8 Precision Edge™ SY89833L Micrel INPUT INTERFACE APPLICATIONS VCC = 3.3V VCC = 3.3V VCC VCC = 3.3V VCC = 3.3V VCC = 3.3V IN IN IN CML CML LVPECL /IN /IN /IN SY89833L SY89833L SY89833L VCC–2V* NC VT VT NC VREF_AC VREF_AC VT 0.01µF VREF_AC NC 50Ω 0.01µF VCC Figure 3a. DC-Coupled CML Input Interface VCC = 3.3V (*Bypass with 0.01µF to GND) Figure 3b. AC-Coupled CML Input Interface VCC = 3.3V VCC VCC = 3.3V IN VCC = 3.3V IN LVDS /IN HSTL /IN SY89833L Rpd 100Ω VCC = 1.8V to 3.3V IN LVPECL Rpd 100Ω Figure 3c. DC-Coupled PECL Input Interface /IN SY89833L VT VREF_AC 0.01µF NC VT NC VREF_AC SY89833L VT NC VREF_AC VCC Figure 3d. AC-Coupled PECL Input Interface Figure 3e. LVDS Input Interface Figure 3f. HSTL Input Interface RELATED PRODUCT AND SUPPORT DOCUMENTS Part Number Function Data Sheet Link SY89830U 2.5V/3.3V/5V 2.5GHz 1:4 PECL/ECL Clock Driver with 2:1 Differential Input Mux http://www.micrel.com/product-info/products/sy89830u.shtml 2GHz Ultra Low-Jitter and Skew 1:4 LVPECL Fanout Buffer/Translator w/ Internal Termination http://www.micrel.com/product-info/products/sy89831u.shtml 2GHz Ultra Low-Jitter and Skew 1:4 LVPECL Fanout Buffer/Translator w/ Internal Termination http://www.micrel.com/product-info/products/sy89832u.shtml 2GHz ANY DIFFERENTIAL INPUT-to-LVDS Out 1:4 Fanout Buffer Translator w/ Internal Termination http://www.micrel.com/product-info/products/sy89833u.shtml 16-MLF™ Manufacturing Guidelines Exposed Pad Application Note http://www.amkor.com/products/notes_papers/MLF_appnote_0301.pdf New Products and Termination App. Note http://www.micrel.com/product-info/as/solutions.shtml SY89831U SY89832U SY89833U HBW Solutions 9 Precision Edge™ SY89833L Micrel 16 LEAD EPAD MicroLeadFrame™ (MLF-16) 0.42 +0.18 –0.18 0.23 +0.07 –0.05 0.85 +0.15 –0.65 0.01 +0.04 –0.01 3.00BSC 1.60 +0.10 –0.10 0.65 +0.15 –0.65 0.20 REF. 2.75BSC 0.42 PIN 1 ID +0.18 –0.18 N 16 1 1 0.50 DIA 2 2 2.75BSC 3.00BSC 3 3 1.60 +0.10 –0.10 4 4 12° max 0.5 BSC 0.42 +0.18 –0.18 SEATING PLANE 1.5 REF BOTTOM VIEW TOP VIEW CC 0.23 +0.07 –0.05 CL 4 0.01 +0.04 –0.01 SECTION "C-C" SCALE: NONE 0.5BSC 0.40 +0.05 –0.05 1. 2. 3. 4. DIMENSIONS ARE IN mm. DIE THICKNESS ALLOWABLE IS 0.305mm MAX. PACKAGE WARPAGE MAX 0.05mm. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20mm AND 0.25mm FROM TIP. 5. APPLIES ONLY FOR TERMINALS FOR EVEN TERMINAL/SIDE Rev. 02 Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane PCB Thermal Consideration for 16-Pin MLF™ Package (Always solder, or equivalent, the exposed pad to the PCB) Package Notes: Note 1. Note 2. Package meets Level 2 moisture sensitivity classification, and are shipped in dry-pack form. Exposed pads must be soldered to a ground for proper thermal management. MICREL, INC. TEL 1849 FORTUNE DRIVE SAN JOSE, CA 95131 + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB USA http://www.micrel.com The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2003 Micrel, Incorporated. 10