NUF6005MU 6 Line EMI Filter with ESD Protection in UDFN Package This device is a 6 line EMI filter array for wireless applications. Greater than -25 dB typical attenuation is obtained at frequencies from 800 MHz to 3.0 GHz. The NUF6005MU has a typical cut-off frequency of 185 MHz. This UDFN package is specifically designed to enhance EMI filtering for low-profile or slim design electronics especially where space and height is a premium. It also offers ESD protection clamping transients from static discharges. ESD protection is provided across all capacitors. http://onsemi.com 12 1 Cd Cd Cd Cd Cd Cd Cd Cd Cd Cd Cd 2 11 Features •EMI Filtering and ESD Protection •Integration of 30 Discrete Components •UDFN Package, 1.2 x 2.5 mm •Moisture Sensitivity Level 1 •ESD Ratings: IEC61000-4-2 (Level 4) Cd 3 10 4 Machine Model = C Human Body Model = 3B •This is a Pb-Free Device* 9 5 8 Benefits •Reduces EMI/RFI Emissions on a Data Line •Low Profile Package; Typical Height of 0.5 mm •Design-Friendly and Easy-to-Use Pin Configurations, 6 7 Particularly for Portable Electronics •Integrated Solution Offers Cost and Space Savings in UDFN Package •Excellent S21 Characteristics with very Low Parasitic Inductances •Integrated Solution Improves System Reliability (Top View) 12 MARKING DIAGRAM Applications •EMI Filtering and ESD Protection for Data Lines •Keypad Interface and Protection for Portable Electronics •Bottom Connector Interface for Mobile Handsets •Notebook Computers and Digital Cameras •LCD Display Interface in Mobile Handsets •Camera Display Interface in Mobile Handsets 1 UDFN12 MU SUFFIX CASE 517AE 605 M G 605M G 1 = Specific Device Code = Date and Assembly Location = Pb-Free Package ORDERING INFORMATION *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2007 October, 2007 - Rev. 1 1 Device Package Shipping† NUF6005MUT2G UDFN12 (Pb-Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF6005MU/D NUF6005MU MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Symbol Value Unit VPP 8 kV DC Power per Resistor PR 100 mW DC Power per Package PT 600 mW ESD Discharge IEC61000-4-2 Contact Discharge Operating Temperature Range TOP -40 to 85 °C Storage Temperature Range TSTG -55 to 150 °C TL 260 °C Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Symbol Test Conditions Min Typ Max Unit 5.0 V 7.0 8.0 V 10 100 nA VRWM VBR IR = 1.0 mA Leakage Current IR VRWM = 3.3 V Resistance RA IR = 20 mA 100 115 Capacitance (Notes 1 and 2) Cd VR = 2.5 V, f = 1.0 MHz 10 15 pF Cut-Off Frequency (Note 3) f3dB Above this frequency, appreciable attenuation occurs 185 1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz. 2. Total line capacitance is 2 times the Diode Capacitance (Cd). 3. 50 source and 50 load termination. http://onsemi.com 2 6.0 85 MHz NUF6005MU 0 0 -5 -10 -10 -20 S41 (dB) S21 (dB) -15 -20 -25 -30 -40 -50 -30 -35 -60 -40 -70 -45 1.0E+6 -80 1.0E+7 1.0E+8 1.0E+9 1.0E+10 10E+6 100E+6 Figure 1. Typical Insertion Loss 10E+9 Figure 2. Typical Analog Crosstalk 2 1.05 NORMALIZED RESISTANCE NORMALIZED CAPACITANCE 1.0E+9 FREQUENCY (Hz) FREQUENCY (Hz) 1.5 1 0.5 0 0 1 2 3 4 1.025 1.0 0.975 0.95 -40 5 -20 0 20 40 60 TEMPERATURE (°C) REVERSE VOLTAGE (V) Figure 3. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance, Cd @ 2.5 V) Figure 4. Typical Resistance over Temperature (Normalized) http://onsemi.com 3 80 NUF6005MU PACKAGE DIMENSIONS UDFN12, 2.5x1.2, 0.4P CASE 517AE-01 ISSUE O 0.15 C PIN ONE REFERENCE 2X ÉÉ ÇÇ ÉÉ A3 A B D 2X ÉÉ ÉÉ E A1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DETAIL A 0.15 C DIM A A1 A3 b D D2 E E2 e K L TOP VIEW (A3) DETAIL A A 0.10 C 12X SEATING PLANE 0.08 C SIDE VIEW D2 12X C A1 SOLDERING FOOTPRINT* 10X e L 1 6 MILLIMETERS MIN NOM MAX 0.45 0.50 0.55 0.00 0.03 0.05 0.127 REF 0.15 0.20 0.25 2.50 BSC 1.70 1.80 1.90 1.20 BSC 0.20 0.30 0.40 0.40 BSC 0.20 ----0.20 0.25 0.30 1.50 E2 0.40 12X K 12 7 12X BOTTOM VIEW b 0.10 C A B 0.05 C 0.35 NOTE 3 11X 0.30 12 X 0.45 1.95 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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