TI SN65MLVD204AD

SN65MLVD200A, SN65MLVD202A
SN65MLVD204A, SN65MLVD205A
www.ti.com
SLLS573 – DECEMBER 2003
MULTIPOINT-LVDS LINE DRIVER AND RECEIVER
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
Low-Voltage Differential 30-Ω to 55-Ω Line
Drivers and Receivers for Signaling Rates (1)
Up to 100 Mbps, Clock Frequencies up to
50 MHz
Type-1 Receivers Incorporate 25 mV of
Hysteresis (200A, 202A)
Type-2 Receivers Provide an Offset(100 mV)
Threshold to Detect Open-Circuit and Idle-Bus
Conditions (204A, 205A)
Meets or Exceeds the M-LVDS Standard
TIA/EIA-899 for Multipoint Data Interchange
Power Up/Down Glitch Free
Controlled Driver Output Voltage Transition
Times for Improved Signal Quality
–1 V to 3.4 V Common-Mode Voltage Range
Allows Data Transfer With 2 V of Ground
Noise
Bus Pins High Impedance When Disabled or
VCC ≤ 1.5 V
200-Mbps Devices Available (SN65MLVD201,
203, 206, 207)
Bus Pin ESD Protection Exceeds 8 kV
Package in 8-Pin SOIC (200A, 204A) and
14-Pin SOIC (202A, 205A)
Improved Alternatives to the SN65MLVD200,
202, 204, and 205
APPLICATIONS
•
•
•
•
•
(1)
Low-Power High-Speed Short-Reach
Alternative to TIA/EIA-485
Backplane or Cabled Multipoint Data and
Clock Transmission
Cellular Base Stations
Central-Office Switches
Network Switches and Routers
DESCRIPTION
The SN65MLVD200A, 202A, 204A, and 205A are
multipoint-low-voltage differential (M-LVDS) line
drivers and receivers, which are optimized to operate
at signaling rates up to 100 Mbps. All parts comply
with the multipoint low-voltage differential signaling
(M-LVDS) standard TIA/EIA-899. These circuits are
similar to their TIA/EIA-644 standard compliant LVDS
counterparts, with added features to address
multipoint applications. The driver output has been
designed to support multipoint buses presenting
loads as low as 30 Ω, and incorporates controlled
transition times to allow for stubs off of the backbone
transmission line.
These devices have Type-1 and Type-2 receivers
that detect the bus state with as little as 50 mV of
differential input voltage over a common-mode
voltage range of –1 V to 3.4 V. The Type-1 receivers
exhibit 25 mV of differential input voltage hysteresis
to prevent output oscillations with slowly changing
signals or loss of input. Type-2 receivers include an
offset threshold to provide a known output state
under open-circuit, idle-bus, and other fault
conditions.
The SN65MLVD200A, 202A, 204A, and 205A have
enhancements over their predecessors. Improved
features include better controlled slew rate on the
driver output to help minimize reflections while
improving overall signal integrity (SI) resulting in
better jitter performance. Additionally, 8-kV ESD
protection on the bus pins for more robustness. The
same footprint definition was maintained making for
an easy drop-in replacement for a system
performance upgrade.
The devices are characterized for operation from
–40°C to 85°C.
The signaling rate of a line, is the number of voltage
transitions that are made per second expressed in the nits
bps (bits per second).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–TBD, Texas Instruments Incorporated
SN65MLVD200A, SN65MLVD202A
SN65MLVD204A, SN65MLVD205A
www.ti.com
SLLS573 – DECEMBER 2003
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
LOGIC DIAGRAM (POSITIVE LOGIC)
SN65MLVD200A, SN65MLVD204A
SN65MLVD202A, SN65MLVD205A
3
DE
D
4
D
DE
2
RE
RE
6
1
R
7
5
R
B
Y
10
4
Z
3
2
A
9
12
11
A
B
ORDERING INFORMATION
PART
(1)
NUMBER (1)
FOOTPRINT
RECEIVER TYPE
SN65MLVD200AD
SN75176
Type 1
PACKAGE MARKING
MF200A
SM65MLVD202AD
SN75ALS180
Type 1
MLVD202A
SN65MLVD204AD
SN75176
Type 2
MF204A
SM65MLVD205AD
SN75ALS180
Type 2
MLVD205A
Available tape and reeled. To order a tape and reeled part, add the suffix R to the part number (e.g., SN65MLVD200ADR).
PACKAGE DISSIPATION RATINGS
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 85°C
POWER RATING
D(8)
532 mW
4.6 mW/°C
254 mW
D(14)
940 mW
8.2 mW/°C
450 mw
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
SN65MLVD200A,
202A, 204A, and 205A
Supply voltage range (2), VCC
Input voltage range
–0.5 V to 4 V
D, DE, RE
–0.5 V to 4 V
A, B (200A, 204A)
–1.8 V to 4 V
A, B (202A, 205A)
Output voltage range
Electrostatic discharge
–4 V to 6 V
R
–0.3 V to 4 V
Y, Z, A, or B
–1.8 V to 4 V
Human Body Model (3)
Charged-Device
Model (4)
A, B, Y, and Z
±8 kV
All pins
±4 kV
All pins
Continuous power dissipation
Storage temperature range
(1)
(2)
(3)
(4)
2
±1500 V
See Dissipation Rating Table
–65°C to 150°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
Tested in accordance with JEDEC Standard 22, Test Method A114-A.
Tested in accordance with JEDEC Standard 22, Test Method C101.
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RECOMMENDED OPERATING CONDITIONS
MIN
NOM
3.3
MAX
UNIT
VCC
Supply voltage
3
3.6
V
VIH
High-level input voltage
2
VCC
V
VIL
Low-level input voltage
GND
0.8
V
V
Voltage at any bus terminal VA, VB, VY or VZ
–1.4
3.8
|VID|
Magnitude of differential input voltage
0.05
VCC
RL
Differential load resistance
1/tUI
Signaling rate
TA
Operating free-air temperature
30
–40
V
Ω
50
100
Mbps
85
°C
DEVICE ELECTRICAL CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
ICC
PD
(1)
Supply current
TEST CONDITIONS
Driver only
RE and DE at VCC, RL = 50 Ω, All others open
Both disabled
RE at VCC, DE at 0 V, RL = No Load, All others open
Both enabled
RE at 0 V, DE at VCC, RL = 50 Ω, All others open
Receiver only
RE at 0 V, DE at 0 V, All others open
Device power dissipation
RL = 50 Ω, Input to D is a 50-MHz 50% duty cycle square
wave, DE = high, RE = low, TA = 85°C
MIN
TYP( (1)
)
MAX
13
22
1
4
16
24
4
13
94
UNIT
mA
mW
All typical values are at 25°C and with a 3.3-V supply voltage.
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SLLS573 – DECEMBER 2003
DRIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
|VAB| or
|VYZ|
Differential output voltage magnitude
∆|VAB| or
∆|VYZ|
Change in differential output voltage magnitude
between logic states
VOS(SS)
Steady-state common-mode output voltage
∆VOS(SS)
Change in steady-state common-mode output
voltage between logic states
VOS(PP)
Peak-to-peak common-mode output voltage
VY(OC) or
VA(OC)
Maximum steady-state open-circuit output voltage
VZ(OC) or
VB(OC)
Maximum steady-state open-circuit output voltage
VP(H)
Voltage overshoot, low-to-high level output
VP(L)
Voltage overshoot, high-to-low level output
IIH
High-level input current (D, DE)
VIH = 2 V to VCC
IIL
Low-level input current (D, DE)
VIL = GND to 0.8 V
|IOS|
Differential short-circuit output current magnitude
See Figure 4
IOZ
High-impedance state output current (driver only)
–1.4 V ≤ (VY or VZ) ≤ 3.8 V,
Other output = 1.2 V
IO(OFF)
Power-off output current
–1.4 V ≤ (VY or VZ) ≤ 3.8 V, Other
output = 1.2 V, 0 V ≤ VCC≤ 1.5 V
MIN (1) TYP (2)
MAX
UNIT
480
650
mV
–50
50
mV
0.8
1.2
V
–50
50
mV
150
mV
0
2.4
V
0
2.4
V
1.2 VSS
V
0
10
µA
0
10
µA
24
mA
–15
10
µA
–10
10
µA
See Figure 2
See Figure 3
See Figure 7
See Figure 5
–0.2 VSS
V
V, (3)
CY or CZ
Output capacitance
VI = 0.4 sin(30E6πt) + 0.5
Other input at 1.2 V, driver
disabled
CYZ
Differential output capacitance
VAB = 0.4 sin(30E6πt) V,
Driver disabled
CY/Z
Output capacitance balance, (CY/CZ)
(1)
(2)
(3)
4
3
pF
(3)
2.5
0.99
1.01
The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
All typical values are at 25°C and with a 3.3-V supply voltage.
HP4194A impedance analyzer (or equivalent)
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pF
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SLLS573 – DECEMBER 2003
RECEIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
Type 1
50
Type 2
150
VIT+
Positive-going differential input voltage threshold
VIT-
Negative-going differential input voltage threshold
VHYS
Differential input voltage hysteresis, (VIT+– VIT–)
VOH
High-level output voltage
IOH = –8 mA
VOL
Low-level output voltage
IOL = 8 mA
IIH
High-level input current (RE)
VIH = 2 V to VCC
IIL
Low-level input current (RE)
VIL = GND to 0.8 V
IOZ
High-impedance output current
VO = 0 V or 3.6 V
Input capacitance
VI = 0.4 sin(30E6πt) + 0.5 V, (2)
Other input at 1.2 V
CA or
CB
CAB
Differential input capacitance
CA/B
Input capacitance balance, (CA/CB)
(1)
(2)
MIN TYP (1) MAX
Type 1
See Figure 9, Table 1 and Table
2
Type 2
UNIT
mV
–50
mV
50
Type 1
25
Type 2
0
mV
2.4
VAB = 0.4 sin(30E6πt)
V
0.4
V
–10
0
µA
–10
0
µA
–10
15
µA
3
pF
V (2)
2.5
0.99
pF
1.01
All typical values are at 25°C and with a 3.3-V supply voltage.
HP4194A impedance analyzer (or equivalent)
BUS INPUT AND OUTPUT ELECTRICAL CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
Receiver or transceiver with driver disabled
input current
IA
Receiver or transceiver with driver disabled
input current
IB
IAB
Receiver or transceiver with driver disabled
differential input current (IA– IB)
IA(OFF)
Receiver or transceiver power-off input current
IB(OFF)
Receiver or transceiver power-off input current
TEST CONDITIONS
MIN
TYP (1)
MAX
VA = 3.8 V,
VB = 1.2 V,
0
32
VA = 0 V or 2.4 V,
VB = 1.2 V
–20
20
VA = -1.4 V,
VB = 1.2 V
–32
0
VB = 3.8 V,
VA = 1.2 V
0
32
VB = 0 V or 2.4 V,
VA = 1.2 V
–20
20
VB = -1.4 V,
VA = 1.2 V
–32
0
VA = VB,
1.4 ≤ VA ≤ 3.8 V
-4
4
VA = 3.8 V,
VB = 1.2 V,
0 V ≤ VCC ≤ 1.5 V
0
32
VA = 0 V or 2.4 V,
VB = 1.2 V,
0 V ≤ VCC ≤ 1.5 V
–20
20
VA = -1.4 V,
VB= 1.2 V,
0 V ≤ VCC ≤ 1.5 V
–32
0
VB = 3.8 V,
VA = 1.2 V,
0 V ≤ VCC ≤ 1.5 V
0
32
VB = 0 V or 2.4 V,
VA = 1.2 V,
0 V ≤ VCC ≤ 1.5 V
–20
20
VB = -1.4 V,
VA = 1.2 V,
0 V ≤ VCC ≤ 1.5 V
–32
0
–4
4
UNIT
µA
µA
µA
µA
µA
IAB(OFF)
Receiver input or transceiver power-off
differential input current (IA– IB)
VA = VB, 0 V ≤ VCC ≤ 1.5 V, –1.4 ≤ VA ≤ 3.8 V
CA
Transceiver with driver disabled input
capacitance
VA = 0.4 sin (30E6πt) + 0.5 V (2), VB =1.2 V
5
pF
CB
Transceiver with driver disabled input
capacitance
VB = 0.4 sin (30E6πt) + 0.5 V (2), VA =1.2 V
5
pF
CAB
Transceiver with driver disabled differential
input capacitance
VAB = 0.4 sin (30E6πt)V (2)
CA/B
Transceiver with driver disabled input
capacitance balance, (CA/CB)
(1)
(2)
3
0.99
µA
pF
1.01
All typical values are at 25°C and with a 3.3-V supply voltage.
HP4194A impedance analyzer (or equivalent)
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SLLS573 – DECEMBER 2003
DRIVER SWITCHING CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN TYP (1) MAX
UNIT
tpLH
Propagation delay time, low-to-high-level output
2
2.5
3.5
ns
tpHL
Propagation delay time, high-to-low-level output
2
2.5
3.5
ns
tr
Differential output signal rise time
2
2.6
3.2
ns
tf
Differential output signal fall time
2
2.6
3.2
ns
tsk(p)
Pulse skew (|tpHL– tpLH|)
30
150
ps
tsk(pp)
Part-to-part skew
tjit(per)
Period jitter, rms (1 standard deviation) (2)
50 MHz clock input (3)
tjit(pp)
Peak-to-peak jitter (2) (4)
100 Mbps 215-1 PRBS input (5)
tPHZ
tPLZ
tPZH
Enable time, high-impedance-to-high-level output
tPZL
Enable time, high-impedance-to-low-level output
(1)
(2)
(3)
(4)
(5)
See Figure 5
0.9
ns
2
3
ps
55
150
ps
Disable time, high-level-to-high-impedance output
4
7
ns
Disable time, low-level-to-high-impedance output
4
7
ns
4
7
ns
4
7
ns
See Figure 6
All typical values are at 25°C and with a 3.3-V supply voltage.
Jitter is ensured by design and characterization. Stimulus jitter has been subtracted from the numbers.
tr = tf = 0.5 ns (10% to 90%), measured over 30 k samples.
Peak-to-peak jitter includes jitter due to pulse skew (tsk(p)).
tr = tf = 0.5 ns (10% to 90%), measured over 100 k samples.
RECEIVER SWITCHING CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
(1)
MAX
UNIT
tPLH
Propagation delay time, low-to-high-level output
2
3.6
6
ns
tPHL
Propagation delay time, high-to-low-level output
2
3.6
6
ns
tr
Output signal rise time
1
2.3
ns
tf
Output signal fall time
tsk(p)
Pulse skew (|tpHL– tpLH|)
tsk(pp)
Part-to-part skew (2)
tjit(per)
Period jitter, rms (1 standard
2.3
ns
Type 1
CL = 15 pF, See Figure 10
100
300
ps
Type 2
300
500
ps
1
ns
deviation) (3)
50 MHz clock
Type 1
input (4)
4
7
ps
200
700
ps
225
800
ps
tjit(pp)
Peak-to-peak jitter (3) (5)
tPHZ
Disable time, high-level-to-high-impedance output
6
10
ns
tPLZ
Disable time, low-level-to-high-impedance output
6
10
ns
tPZH
Enable time, high-impedance-to-high-level output
10
15
ns
tPZL
Enable time, high-impedance-to-low-level output
10
15
ns
(1)
(2)
(3)
(4)
(5)
(6)
6
Type 2
100 Mbps 215–1 PRBS input (6)
1
See Figure 11
All typical values are at 25°C and with a 3.3-V supply voltage.
HP4194A impedance analyzer (or equivalent)
Jitter is ensured by design and characterization. Stimulus jitter has been subtracted from the numbers.
VID = 200 mVpp (LVD200A, 202A), VID = 400 mVpp (LVD204A, 205A), Vcm = 1 V, tr = tf = 0.5 ns (10% to 90%), measured over 30 k
samples.
Peak-to-peak jitter includes jitter due to pulse skew (tsk(p)).
VID = 200 mVpp (LVD200A, 202A), VID = 400 mVpp (LVD204A, 205A), Vcm = 1 V, tr = tf = 0.5 ns (10% to 90%), measured over 100 k
samples.
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PARAMETER MEASUREMENT INFORMATION
VCC
IA or IY
A/Y
II
D
IB or IZ
VAB or VYZ
VA or VY
B/Z
VI
VOS
VB or VZ
VA + VB
2
or
VY + VZ
2
Figure 1. Driver Voltage and Current Definitions
3.32 kΩ
A/Y
VAB or VYZ
D
B/Z
A.
+
_
49.9 Ω
-1 V ≤ Vtest ≤ 3.4 V
3.32 kΩ
All resistors are 1% tolerance.
Figure 2. Differential Output Voltage Test Circuit
R1
24.9 Ω
A/Y
C1
1 pF
D
≈ 1.3 V
B/Z
≈ 0.7 V
VOS(PP)
B/Z
C2
1 pF
A/Y
R2
24.9 Ω
VOS
C3
2.5 pF
VOS(SS)
VOS(SS)
A.
All input pulses are supplied by a generator having the following characteristics: tr or tf≤ 1 ns, pulse frequency = 1
MHz, duty cycle = 50 ± 5%.
B.
C1, C2 and C3 include instrumentation and fixture capacitance within 2 cm of the D.U.T. and are ±20%.
C.
R1 and R2 are metal film, surface mount, ±1%, and located within 2 cm of the D.U.T.
D.
The measurement of VOS(PP) is made on test equipment with a -3 dB bandwidth of at least 1 GHz.
Figure 3. Test Circuit and Definitions for the Driver Common-Mode Output Voltage
A/Y
IOS
0 V or VCC
+
B/Z
VTest
-1 V or 3.4 V
-
Figure 4. Driver Short-Circuit Test Circuit
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PARAMETER MEASUREMENT INFORMATION (continued)
A/Y
D
C1
1 pF
C3
0.5 pF
R1
Output
50 Ω
B/Z
C2
1 pF
VCC
VCC/2
Input
0V
tpLH
tpHL
VSS
0.9VSS
VP(H)
Output
0V
VP(L)
0.1V
SS
0 V SS
tf
tr
A.
All input pulses are supplied by a generator having the following characteristics: tr or tf≤ 1 ns, frequency = 1 MHz,
duty cycle = 50 ± 5%.
B.
C1, C2, and C3 include instrumentation and fixture capacitance within 2 cm of the D.U.T. and are ±20%.
C.
R1 is a metal film, surface mount, and 1% tolerance and located within 2 cm of the D.U.T.
D.
The measurement is made on test equipment with a -3 dB bandwidth of at least 1 GHz.
Figure 5. Driver Test Circuit, Timing, and Voltage Definitions for the Differential Output Signal
R1
24.9 Ω
A/Y
0 V or VCC
C1
1 pF
D
B/Z
DE
C4
Output
0.5 pF
C2
1 pF
R2
24.9 Ω
VCC
VCC/2
0V
DE
tpZH
tpHZ
∼ 0.6 V
0.1 V
0V
Output With
D at VCC
Output With
D at 0 V
C3
2.5 pF
tpZL
tpLZ
0V
-0.1 V
∼ -0.6 V
A.
All input pulses are supplied by a generator having the following characteristics: tr or tf≤ 1 ns, frequency = 1 MHz,
duty cycle = 50 ± 5%.
B.
C1, C2, C3, and C4 includes instrumentation and fixture capacitance within 2 cm of the D.U.T. and are ±20%.
C.
R1 and R2 are metal film, surface mount, and 1% tolerance and located within 2 cm of the D.U.T.
D.
The measurement is made on test equipment with a -3 dB bandwidth of at least 1 GHz.
Figure 6. Driver Enable and Disable Time Circuit and Definitions
8
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PARAMETER MEASUREMENT INFORMATION (continued)
A/Y
0 V or VCC
B/Z
VA, VB, VY or VZ
1.62 kΩ , ±1%
Figure 7. Maximum Steady State Output Voltage
VCC
CLOCK
INPUT
VCC/2
0V
1/f0
Period Jitter
IDEAL
OUTPUT 0 V
VA -VB or VY -VZ
VCC
PRBS INPUT
0V
ACTUAL
OUTPUT 0 V
VA -VB or VY -VZ
VCC/2
1/f0
Peak to Peak Jitter
VA -VB or VY -VZ
OUTPUT 0 V Diff
tc(n)
tjit(per) = tc(n) -1/f0
VA -VB or VY -VZ
tjit(pp)
A.
All input pulses are supplied by an Agilent 81250 Stimulus System.
B.
The measurement is made on a TEK TDS6604 running TDSJIT3 application software
C.
Period jitter is measured using a 50 MHz 50 ±1% duty cycle clock input.
D.
Peak-to-peak jitter is measured using a 100Mbps 215–1 PRBS input.
Figure 8. Driver Jitter Measurement Waveforms
IA
A
VID
VCM
(VA + VB)/2
VA
R
IO
B
IB
VO
VB
Figure 9. Receiver Voltage and Current Definitions
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Table 1. Type-1 Receiver Input Threshold Test Voltages
RESULTING DIFFERENTIAL
INPUT VOLTAGE
APPLIED VOLTAGES
(1)
RESULTING COMMONMODE INPUT VOLTAGE
RECEIVER
(1)OUTPUT
VIA
VIB
VID
VIC
2.400
0.000
2.400
1.200
0.000
2.400
–2.400
1.200
L
3.425
3.335
0.050
3.4
H
3.375
3.425
–0.050
3.4
L
–0.975
–1.025
0.050
–1
H
–1.025
–0.975
–0.050
–1
L
H
H= high level, L = low level, output state assumes receiver is enabled (RE = L)
Table 2. Type-2 Receiver Input Threshold Test Voltages
RESULTING DIFFERENTIAL
INPUT VOLTAGE
APPLIED VOLTAGES
(1)
RESULTING COMMONMODE INPUT VOLTAGE
RECEIVER
OUTPUT (1)
VIA
VIB
VID
VIC
2.400
0.000
2.400
1.200
0.000
2.400
–2.400
1.200
L
3.475
3.325
0.150
3.4
H
3.425
3.375
0.050
3.4
L
–0.925
–1.075
0.150
–1
H
–0.975
–1.025
0.050
–1
L
H
H= high level, L = low level, output state assumes receiver is enabled (RE = L)
VID
VA
CL
VO
15 pF
VB
VA
1.2 V
VB
1.0 V
VID
0.2 V
0V
-0.2 V
tpHL
VO
tpLH
VOH
90%
VCC/2
10%
tf
VOL
tr
A.
All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, frequency = 1 MHz,
duty cycle = 50 ± 5%. CL is a combination of a 20%-tolerance, low-loss ceramic, surface-mount capacitor and fixture
capacitance within 2 cm of the D.U.T.
B.
The measurement is made on test equipment with a –3 dB bandwidth of at least 1 GHz.
Figure 10. Receiver Timing Test Circuit and Waveforms
10
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1.2 V
B
RL
499 Ω
R
A
Inputs
CL
RE
+
_
VO
VTEST
15 pF
VCC
VTEST
1V
A
VCC
RE
VCC/2
0V
tpZL
Output
tpLZ
VCC
VCC/2
VOL +0.5 V
VOL
R
VTEST
0V
1.4 V
A
VCC
RE
VCC/2
0V
tpZH
tpHZ
VO
VOH
VOH -0.5 V
VCC/2
0V
A.
All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, frequency = 1 MHz,
duty cycle = 50 ± 5%.
B.
RL is 1% tolerance, metal film, surface mount, and located within 2 cm of the D.U.T.
C.
CL is the instrumentation and fixture capacitance within 2 cm of the DUT and ±20%.
Figure 11. Receiver Enable/Disable Time Test Circuit and Waveforms
Submit Documentation Feedback
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SN65MLVD200A, SN65MLVD202A
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SLLS573 – DECEMBER 2003
INPUTS
VA -VB
0.2 V - Type 1
0.4 V - Type 2
CLOCK INPUT
VA -VB
1/f0
VIC
1V
Period Jitter
IDEAL
OUTPUT
VOH
VA
VCC/2
PRBS INPUT
VOL
1/f0
VB
VOH
ACTUAL
OUTPUT VCC/2
Peak to Peak Jitter
VOH
VOL
tc(n)
tjit(per) = tc(n) -1/f0
OUTPUT V
CC/2
VOL
tjit(pp)
A.
All input pulses are supplied by an Agilent 8304A Stimulus System.
B.
The measurement is made on a TEK TDS6604 running TDSJIT3 application software
C.
Period jitter is measured using a 50 MHz 50 ±1% duty cycle clock input.
D.
Peak-to-peak jitter is measured using a 100 Mbps 215-1 PRBS input.
Figure 12. Receiver Jitter Measurement Waveforms
PIN ASSIGNMENTS
SN65MLVD200AD (Marked as MF200A)
SN65MLVD204AD (Marked as MF204A)
(TOP VIEW)
R
RE
DE
D
1
8
2
7
3
6
4
5
VCC
B
A
GND
SN65MLVD202AD (Marked as MLVD202A)
SN65MLVD205AD (Marked as MLVD205A)
(TOP VIEW)
NC
R
RE
DE
D
GND
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
NC - No internal connection
12
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VCC
VCC
A
B
Z
Y
NC
SN65MLVD200A, SN65MLVD202A
SN65MLVD204A, SN65MLVD205A
www.ti.com
SLLS573 – DECEMBER 2003
DEVICE FUNCTION TABLES
TYPE-1 RECEIVER (200A, 202A)
INPUTS
TYPE-2 RECEIVER (204A, 205A)
OUTPUT
INPUTS
OUTPUT
VID = VA - VB
RE
R
VID = VA - VB
RE
R
VID ≥ 50 mV
- 50 mV < VID < 50 mV
VID ≤ - 50 mV
X
X
L
L
L
H
Open
H
?
L
Z
Z
VID ≥ 150 mV
50 mV < VID < 150 mV
VID ≤ 50 mV
X
L
L
L
H
X
Open
H
?
L
Z
Z
Open Circuit
L
?
Open Circuit
L
L
DRIVER
INPUT
ENABLE
D
L
H
OPEN
X
X
DE
H
H
H
OPEN
L
OUTPUTS
A OR Y
B OR Z
L
H
L
Z
Z
H
L
H
Z
Z
H = high level, L = low level, Z = high impedance, X = Don’t care, ? = indeterminate
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
DRIVER OUTPUT
DRIVER INPUT AND DRIVER ENABLE
RECEIVER ENABLE
VCC
VCC
VCC
360 kΩ
400 Ω
400 Ω
D or DE
A/Y or B/Z
7V
RE
7V
360 kΩ
RECEIVER INPUT
RECEIVER OUTPUT
VCC
VCC
100 kΩ
100 kΩ
250 kΩ
10 Ω
250 kΩ
A
R
B
10 Ω
200 kΩ
200 kΩ
Submit Documentation Feedback
7V
13
SN65MLVD200A, SN65MLVD202A
SN65MLVD204A, SN65MLVD205A
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SLLS573 – DECEMBER 2003
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
FREQUENCY
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
30
20
ICC − Supply Current − mA
Tx
ICC − Supply Current − mA
VCC = 3.3 V
f = 50 MHz
VID = 200 mV
VIC = 1 V
25
15
10
Rx
VCC = 3.3 V
VID = 200 mV
VIC = 1 V
TA = 25°C
5
20
Tx
15
10
Rx
5
0
0
10
20
30
40
50
−40
f − Frequency − MHz
Figure 14.
RECEIVER LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
RECEIVER HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
TA = 25°C
60
VCC = 3.6 V
50
VCC = 3.3 V
40
VCC = 3.0 V
IOH − Receiver High Level Output Current − mA
IOL − Receiver Low Level Output Current − mA
14
85
Figure 13.
70
30
20
10
0
−15
10
35
60
TA − Free-Air Temperature − °C
0
1
2
3
4
TA = 25°C
−10
−20
−30
VCC = 3.0 V
−40
−50
VCC = 3.3 V
−60
−70
VCC = 3.6 V
−80
−90
0
1
2
3
VOL − Low Level Output Voltage − V
VOH − High Level Output Voltage − V
Figure 15.
Figure 16.
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SN65MLVD204A, SN65MLVD205A
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SLLS573 – DECEMBER 2003
TYPICAL CHARACTERISTICS (continued)
DRIVER PROPAGATION DELAY
vs
FREE-AIR TEMPERATURE
RECEIVER PROPAGATION DELAY
vs
FREE-AIR TEMPERATURE
2.8
4
Receiver Propagation Delay − ns
Driver Propagation Delay − ns
VCC = 3.3 V
f = 1 MHz
RL = 50 Ω
2.6
tpHL
2.4
tpLH
2.2
2
VCC = 3.3 V
VID = 200 mV
VIC = 1 V
f = 1 MHz
CL = 15 pF
3.80
3.60
tpLH
3.40
3.20
3
−40
−15
10
35
60
−40
85
10
35
60
Figure 17.
Figure 18.
ADDED DRIVER CYCLE-TO-CYCLE JITTER
vs
CLOCK FREQUENCY
ADDED DRIVER PEAK-TO-PEAK JITTER
vs
SIGNALING RATE
85
60
30
VCC = 3.3 V
TA = 25°C
Input = Clock
Added Driver Peak-To-Peak Jitter − ps
Added Driver Cycle-To-Cycle Jitter − ps
−15
TA − Free-Air Temperature − °C
TA − Free-Air Temperature − °C
24
tpHL
18
12
6
0
10
20
30
40
50
VCC = 3.3 V
TA = 25°C
215-1 PRBS NRZ
52
44
36
28
20
Clock Frequency − MHz
Figure 19.
20
40
60
80
Signaling Rate − Mbps
100
Figure 20.
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SLLS573 – DECEMBER 2003
TYPICAL CHARACTERISTICS (continued)
ADDED DRIVER PEAK-TO-PEAK JITTER
vs
FREE-AIR TEMPERATURE
ADDED RECEIVER CYCLE-TO-CYCLE JITTER
vs
CLOCK FREQUENCY
72
40
VCC = 3.3 V
VIC = 1 V
f = 100 Mbps
215-1 PRBS NRZ
Added Receiver Cycle-To-Cycle Jitter − ps
Added Driver Peak-To-Peak Jitter − ps
80
64
56
48
40
−40
−15
10
35
60
TA − Free-Air Temperature − °C
22
Type-2
VID = 400 mV
16
10
50
ADDED RECEIVER PEAK-TO-PEAK JITTER
vs
SIGNALING RATE
ADDED RECEIVER PEAK-TO-PEAK JITTER
vs
FREE-AIR TEMPERATURE
300
Type-2
VID = 400 mV
VCC = 3.3 V
TA = 25C
VIC = 1 V
215-1 PRBS NRZ
180
Type-1
VID = 200 mV
120
60
0
VCC = 3.3 V
VIC = 1 V
215-1 PRBS NRZ
Type-2
VID = 400 mV
240
180
Type-1
VID = 200 mV
120
60
0
20
40
60
80
Signaling Rate − Mbps
100
Figure 23.
16
20
30
40
Clock Frequency − MHz
Figure 22.
Added Receiver Peak-To-Peak Jitter − ps
Added Receiver Peak-To-Peak Jitter − ps
28
10
85
Type-1
VID = 200 mV
34
Figure 21.
300
240
VCC = 3.3 V
TA = 25°C
VIC = 1 V
−40
−15
10
35
60
TA − Free-Air Temperature − °C
Figure 24.
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SN65MLVD200A, SN65MLVD202A
SN65MLVD204A, SN65MLVD205A
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SLLS573 – DECEMBER 2003
TYPICAL CHARACTERISTICS (continued)
Vertical Scale = 127.2 mV/div
SN65MLVD200A DRIVER OUTPUT EYE PATTERN
vs
100 Mbps, 215-1 PRBS, RL = 50 Ω
Horizontal Scale = 2 ns/div
Figure 25.
Vertical Scale = 400 mV/div
SN65MLVD200A RECEIVER OUTPUT EYE PATTERN
vs
100 Mbps, 215-1 PRBS, cL = 15 pF
Horizontal Scale = 2 ns/div
Figure 26.
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SN65MLVD200A, SN65MLVD202A
SN65MLVD204A, SN65MLVD205A
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SLLS573 – DECEMBER 2003
APPLICATION INFORMATION
COMPARISON OF MLVD TO TIA/EIA-485
Receiver Input Threshold (Failsafe)
The MLVD standard defines a type 1 and type 2 receiver. Type 1 receivers include no provisions for failsafe and
have their differential input voltage thresholds near zero volts. Type 2 receivers have their differential input
voltage thresholds offset from zero volts to detect the absence of a voltage difference. The impact to receiver
output by the offset input can be seen in Table 3 and Figure 27.
Table 3. Receiver Input Voltage Threshold Requirements
RECEIVER TYPE
OUTPUT LOW
OUTPUT HIGH
Type 1
–2.4 V ≤ VID ≤ -0.05 V
0.05 V ≤ VID ≤ 2.4 V
Type 2
–2.4 V ≤ VID ≤ 0.05 V
0.15 V ≤ VID ≤ 2.4 V
200
Type 1
Type 2
VID - Differential Input Voltage - mV
High
150
100
High
50
0
Low
-50
-100
Low
Transition Regions
Figure 27. Expanded Graph of Receiver Differential Input Voltage Showing Transition Region
18
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PACKAGE OPTION ADDENDUM
www.ti.com
8-Jan-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65MLVD200AD
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD200ADG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD200ADR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD200ADRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD202AD
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD202ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD202ADR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD202ADRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD204AD
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD204ADG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD204ADR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD204ADRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD205AD
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD205ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD205ADR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD205ADRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jan-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jun-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
16-Jun-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN65MLVD200ADR
D
8
FMX
330
0
6.4
5.2
2.1
8
12
Q1
SN65MLVD202ADR
D
14
FMX
330
0
6.5
9.0
2.1
8
16
Q1
SN65MLVD204ADR
D
8
FMX
330
0
6.4
5.2
2.1
8
12
Q1
SN65MLVD205ADR
D
14
FMX
330
0
6.5
9.0
2.1
8
16
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN65MLVD200ADR
D
8
FMX
342.9
336.6
20.6
SN65MLVD202ADR
D
14
FMX
342.9
336.6
28.58
SN65MLVD204ADR
D
8
FMX
342.9
336.6
20.6
SN65MLVD205ADR
D
14
FMX
342.9
336.6
28.58
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jun-2007
Pack Materials-Page 3
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