SEMIKRON SEMIX403GD128DC

SEMiX 403GD128Dc
Absolute Maximum Ratings
Symbol Conditions
IGBT
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156'71
SPT IGBT Modules
SEMiX 403GD128Dc
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= 0'(( Units
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8
SEMiX® 33c
Values
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Inverse Diode
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Module
156
Preliminary Data
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Features
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Typical Applications
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Characteristics
Symbol Conditions
IGBT
8
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1
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min.
typ.
max.
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HIJ
GD
1
20-04-2007 SCH
© by SEMIKRON
SEMiX 403GD128Dc
Characteristics
Symbol Conditions
Inverse Diode
? 1?
''+ $; 8 ( ?(
?
®
SEMiX 33c
SPT IGBT Modules
1556
E
1?
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%I% 2B+( $I>
8 0+ ; :(( 5.K
! %%
min.
typ.
max.
Units
. '+ ,!"@
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0-3
'-4
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0-0
0-2+
. 0'+ ,
(-3+
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2
2-D
C
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2-'
2-B
C
. 0'+ ,
':(
'B
$
>
0(
F
(-04
HIJ
Module
SEMiX 403GD128Dc
Preliminary Data
Features
!" !
!#
Typical Applications
$ " %"
&
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L
5MAM
@- !
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6
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4
6
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+
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Temperature sensor
50((
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(-2B49+O
)C
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4++(9'O
H
PHQ; G
This is an electrostatic discharge sensitive device (ESDS), international standard
IEC 60747-1, Chapter IX.
This technical information specifies semiconductor devices but promises no
characteristics. No warranty or guarantee expressed or implied is made regarding
delivery, performance or suitability.
GD
2
20-04-2007 SCH
© by SEMIKRON
SEMiX 403GD128Dc
Fig. 1 Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2 Rated current vs. temperature IC = f (TC)
Fig. 3 Typ. turn-on /-off energy = f (IC)
Fig. 4 Typ. turn-on /-off energy = f (RG)
Fig. 5 Typ. transfer characteristic
Fig. 6 Typ. gate charge characteristic
3
20-04-2007 SCH
© by SEMIKRON
SEMiX 403GD128Dc
Fig. 7 Typ. switching times vs. IC
Fig. 8 Typ. switching times vs. gate resistor RG
Fig. 9 Typ. transient thermal impedance
Fig. 10 Typ. CAL diode forward charact., incl. RCC'+EE'
Fig. 11 Typ. CAL diode peak reverse recovery current
Fig. 12 Typ. CAL diode recovery charge
4
20-04-2007 SCH
© by SEMIKRON
SEMiX 403GD128Dc
6R 44
5
8K
20-04-2007 SCH
© by SEMIKRON