ESDA14V2-4BF2 ® ASD (Application Specific Devices) QUAD BIDIRECTIONAL TRANSIL™ ARRAY FOR ESD PROTECTION APPLICATION Where transient overvoltage protection in ESD sensitive equipment is required, such as : Computers Printers ■ Communication systems and cellular phones ■ Video equipment This device is particularly adapted to the protection of symmetrical signals. ■ ■ DESCRIPTION The ESDA14V2-4BF2 is a monolithic array designed to protect up to 4 lines in a bidirectional way against ESD transients. The device is ideal for situations where board space saving is requested. FEATURES ■ 4 Bidirectional Transil functions ■ ESD Protection: IEC61000-4-2 level 4 ■ Stand off voltage: 12 V Min. ■ Low leakage current < 1 µA ■ 50 W Peak pulse power (8/20 µs) Flip-Chip (5 Bumps) Table 1: Order Code Part Number ESDA14V2-4BF2 Figure 1: Pin Configuration (Bump side) A3 A1 BENEFITS ■ High ESD protection level ■ High integration ■ Suitable for high density boards COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 15 kV (air discharge) 8 kV (contact discharge) Marking EA C1 C3 GND Figure 2: Pin Configuration (Bump Side) 3 MIL STD 883F- Method 3015-7: class3 25 kV (human body model) 2 1 A B C TM: TRANSIL is a trademark of STMicroelectronics. January 2006 REV. 3 1/7 ESDA14V2-4BF2 Table 2: Absolute Ratings (limiting values) Symbol VPP PPP Tj Tstg Parameter Value Unit ± 25 ± 15 ±8 kV Peak pulse power (8/20 µs) 50 W Junction temperature 125 °C -55 to +150 °C 260 °C -40 to +125 °C ESD discharge MIL STD 883E - Method 3015-7 IEC61000-4-2 air discharge IEC61000-4-2 contact discharge Storage temperature range TL Lead solder temperature (10 seconds duration) Top Operating temperature range Table 3: Electrical Characteristics (Tamb = 25 °C) Symbol VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current C I Parameter VCL VBR VRM Slope: 1 / Rd IPP Capacitance @ IR VBR min. max. IRM @ VRM max. Part Number ESDA14V2-4BF2 V V mA 14.2 18 1 Note 1: Square pulse, IPP = 3A, tp = 2.5 µs. Note 2: ∆VBR = αT (Tamb -25 °C) x VBR (25 °C) 2/7 V µA V 1 12 0.1 3 Rd αT C typ. max. max. note 1 note 2 0V bias Ω 10-4/°C pF 3.2 10 15 ESDA14V2-4BF2 Figure 3: Clamping voltage versus peak pulse current (Tj initial = 25 °C) (Rectangular waveform, tp = 2.5 µs) Figure 4: Capacitance versus reverse applied voltage (typical values) C(pF) IPP(A) 14 10.0 tp = 2.5µs F=1MHz VOSC=30mVRMS Tj=25°C 12 10 8 1.0 6 4 2 VR(V) VCL(V) 0 0.1 0 10 20 30 40 50 60 Figure 5: Relative variation of leakage current versus junction temperature (typical values) 0 2 4 6 8 10 12 14 Figure 6: ESD response to IEC61000-4-2 (+15 kV air discharge) IR[Tj] / IR[Tj=25°C] 1000 100 V(i/o) 10 Tj(°C) 1 25 50 75 100 125 Figure 7: ESD response to IEC61000-4-2 (-15 kV air discharge) Figure 8: Analog crosstalk Typical crosstalk response of ESDA14V2-4BF1 (A1/A3 line) 0.00 -10.00 -20.00 -30.00 V(i/o) -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 -100.0 100.0k 1.0M 10.0M f/Hz 100.0M 1.0G 3/7 ESDA14V2-4BF2 Figure 9: Digital crosstalk rise time: t10-90% = 3ns VG1 VIN = A1 V = 0-3V F = 5MHz β21VG1 VOUT = C3 Figure 10: Application example A1 Connector A3 IC to be protected C1 C3 B2 Figure 11: Aplac model 1.2pF 1.2pF 100m 100m D02_r BV = 16 IBV = 1m CJO = 200p M = 0.3333 RS = 1 VJ = 0.6 TT = 100n 4/7 1.2pF 100m D02_r D02_f BV = 16 IBV = 1m CJO = 10.4p M = 0.3333 RS = 2 VJ = 0.6 TT = 100n B2 B2 50pH 50m C3 C1 A3 A1 160pH 1.8 1.2pF 100m ESDA14V2-4BF2 Figure 12: Ordering Information Scheme ESDA 14V2 - 4 B Fx ESD Array Breakdown Voltage 14V2 = 14.2 Volts min. Number of line 4 = 4 lines Type B = Bidirectional Package F = Flip-Chip x = 2: Leadfree Pitch = 500µm, Bump = 315µm Figure 13: FLIP-CHIP Package Mechanical Data 700µm ± 50 650µm ± 65 49 5 µm ± 40 1.12 mm ± 50µm 315µm ± 50 1.12 mm ± 50µm Figure 14: Foot print recommendations Copper pad Diameter : 250µm recommended , 300µm max Figure 15: Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 315µm copper pad diameter x x z y ww 5/7 ESDA14V2-4BF2 Figure 16: FLIP-CHIP Tape and Reel Specification Dot identifying Pin A1 location 1.75 +/- 0.1 Ø 1.5 +/- 0.1 4 +/- 0.1 3.5 +/- 0.1 ST E xxz yww ST E xxz yww ST E xxz yww 8 +/- 0.3 0.73 +/- 0.05 4 +/- 0.1 User direction of unreeling All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 4: Ordering Information Ordering code Marking Package Weight Base qty Delivery mode ESDA14V2-4BF2 EA Flip-Chip 2.1 mg 5000 Tape & reel 7” Note: More informations are available in the application notes: AN1235: “Flip-Chip: Package description and recommendations for use” Table 5: Revision History 6/7 Date Revision Description of Changes 14-Mar-2005 1 First issue. 18-Oct-2005 2 Dimension from center bump to corner bump changed in Figure 13 to indicate diagonal instead of perpendicular measurement. No values changed. ECOPACK statement added. 17-Jan-2006 3 Die dimensions changed in Figure 13. Cavity depth changed in Figure 16 ESDA14V2-4BF2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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