STMICROELECTRONICS M48T512Y

M48T512Y
M48T512V*
5.0 or 3.3V, 4 Mbit (512 Kbit x 8) TIMEKEEPER® SRAM
FEATURES SUMMARY
■
■
■
■
■
■
■
■
■
INTEGRATED ULTRA LOW POWER SRAM,
REAL TIME CLOCK, POWER-FAIL
CONTROL CIRCUIT, BATTERY, AND
CRYSTAL
BCD CODED YEAR, MONTH, DAY, DATE,
HOURS, MINUTES, AND SECONDS
AUTOMATIC POWER-FAIL CHIP
DESELECT and WRITE PROTECTION
WRITE PROTECT VOLTAGES:
(VPFD = Power-fail Deselect Voltage)
– M48T512Y: VCC = 4.5 to 5.5V
4.2V ≤ VPFD ≤ 4.5V
– M48T512V*: VCC = 3.0 to 3.6V
2.7V ≤ VPFD ≤ 3.0V
CONVENTIONAL SRAM OPERATION;
UNLIMITED WRITE CYCLES
SOFTWARE CONTROLLED CLOCK
CALIBRATION FOR HIGH ACCURACY
APPLICATIONS
10 YEARS OF DATA RETENTION AND
CLOCK OPERATION IN THE ABSENCE OF
POWER
PIN AND FUNCTION COMPATIBLE WITH
INDUSTRY STANDARD 512K x 8 SRAMS
SELF-CONTAINED BATTERY AND
CRYSTAL IN DIP PACKAGE
Figure 1. 32-pin, PMDIP Module
32
1
PMDIP32 (PM)
Module
* Contact local ST sales office for availability of 3.3V version.
February 2005
1/21
M48T512Y, M48T512V*
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. 32-pin, PMDIP Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2.
Table 1.
Figure 3.
Figure 4.
Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
32-pin DIP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
OPERATING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
READ Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. READ Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3. READ Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
WRITE Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 6. WRITE AC Waveforms, WRITE Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 7. WRITE AC Waveforms, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4. WRITE Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Data Retention Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
CLOCK OPERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Reading the Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Setting the Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Stopping and Starting the Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 5. Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Calibrating the Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8. Crystal Accuracy Across Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 9. Calibration Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
VCC Noise And Negative Going Transients. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 10.Supply Voltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 6. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 7. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11.AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 8. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 9. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 12.Power Down/Up Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 10. Power Down/Up AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 11. Power Down/Up Trip Points DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/21
M48T512Y, M48T512V*
PACKAGE MECHANICAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 13.PMDIP32 – 32-pin Plastic Module DIP, Package Outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 12. PMDIP32 – 32-pin Plastic Module DIP, Package Mechanical Data . . . . . . . . . . . . . . . . 18
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 13. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 14. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3/21
M48T512Y, M48T512V*
SUMMARY DESCRIPTION
The M48T512Y/V TIMEKEEPER® RAM is a
512Kb x 8 non-volatile static RAM and real time
clock organized as 524,288 words by 8 bits. The
special DIP package provides a fully integrated
battery back-up memory and real time clock solution.
The M48T512Y/V directly replaces industry standard 512Kb x 8 SRAMs. It also provides the nonvolatility of Flash without any requirement for special WRITE timing or limitations on the number of
WRITEs that can be performed.
Figure 2. Logic Diagram
Table 1. Signal Names
VCC
A0-A18
Address Inputs
DQ0-DQ7
Data Inputs / Outputs
E
Chip Enable Input
G
Output Enable Input
W
WRITE Enable Input
E
VCC
Supply Voltage
G
VSS
Ground
19
8
A0-A18
W
DQ0-DQ7
M48T512Y
M48T512V
VSS
AI02262
Figure 3. 32-pin DIP Connections
A18
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
32
2
31
3
30
4
29
28
5
27
6
7
26
8 M48T512Y 25
9 M48T512V 24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
AI02263
4/21
VCC
A15
A17
W
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
M48T512Y, M48T512V*
Figure 4. Block Diagram
8x8
TIMEKEEPER
REGISTERS
OSCILLATOR AND
CLOCK CHAIN
32,768 Hz
CRYSTAL
A0-A18
POWER
524,280 x 8
SRAM ARRAY
LITHIUM
CELL
DQ0-DQ7
E
VOLTAGE SENSE
AND
SWITCHING
CIRCUITRY
VCC
W
VPFD
G
VSS
AI02384
5/21
M48T512Y, M48T512V*
OPERATING MODES
The 32-pin, 600mil DIP Hybrid houses a controller
chip, SRAM, quartz crystal, and a long life lithium
button cell in a single package. Figure
11., page 15 illustrates the static memory array
and the quartz controlled clock oscillator. The
clock locations contain the year, month, date, day,
hour, minute, and second in 24 hour BCD format.
Corrections for 28, 29 (leap year - compliant until
the year 2100), 30, and 31 day months are made
automatically. Byte 7FFF8h is the clock control
register (see Table 5., page 11). This byte controls
user access to the clock information and also
stores the clock calibration setting. The seven
clock bytes (7FFFFh-7FFF9h) are not the actual
clock counters, they are memory locations consisting of BiPORT™ READ/WRITE memory cells
within the static RAM array. The M48T512Y/V includes a clock control circuit which updates the
clock bytes with current information once per second. The information can be accessed by the user
in the same manner as any other location in the
static memory array. The M48T512Y/V also has its
own Power-Fail Detect circuit. This control circuitry
constantly monitors the supply voltage for an out
of tolerance condition. When VCC is out of tolerance, the circuit write protects the TIMEKEEPER
register data and SRAM, providing data security in
the midst of unpredictable system operation. As
VCC falls, the control circuitry automatically switches to the battery, maintaining data and clock operation until valid power is restored.
Table 2. Operating Modes
Mode
VCC
Deselect
WRITE
READ
4.5 to 5.5V
or
3.0 to 3.6V
READ
E
G
W
DQ0-DQ7
Power
VIH
X
X
High Z
Standby
VIL
X
VIL
DIN
Active
VIL
VIL
VIH
DOUT
Active
VIL
VIH
VIH
High Z
Active
Deselect
VSO to VPFD (min)(1)
X
X
X
High Z
CMOS Standby
Deselect
≤ VSO(1)
X
X
X
High Z
Battery Back-up Mode
Note: X = VIH or VIL; VSO = Battery Back-up Switchover Voltage.
1. See Table 10., page 17 for details.
6/21
M48T512Y, M48T512V*
READ Mode
The M48T512Y/V is in the READ Mode whenever
W (WRITE Enable) is high and E (Chip Enable) is
low. The unique address specified by the 19 Address Inputs defines which one of the 524,288
bytes of data is to be accessed. Valid data will be
available at the Data I/O pins within Address Access Time (tAVQV) after the last address input signal is stable, providing the E and G access times
are also satisfied. If the E and G access times are
not met, valid data will be available after the latter
of the Chip Enable Access Times (tELQV) or Output
Enable Access Time (tGLQV). The state of the eight
three-state Data I/O signals is controlled by E and
G. If the outputs are activated before tAVQV, the
data lines will be driven to an indeterminate state
until tAVQV. If the Address Inputs are changed
while E and G remain active, output data will remain valid for Output Data Hold Time (tAXQX) but
will go indeterminate until the next Address Access.
Figure 5. READ Mode AC Waveforms
tAVAV
A0-A18
VALID
tAVQV
tAXQX
tELQV
tEHQZ
E
tELQX
tGLQV
tGHQZ
G
tGLQX
DQ0-DQ7
DATA OUT
AI02389
Note: WE = High.
Table 3. READ Mode AC Characteristics
Symbol
M48T512Y
M48T512V
–70
–85
Parameter(1)
Min
Max
Min
Unit
Max
tAVAV
READ Cycle Time
tAVQV
Address Valid to Output Valid
70
85
ns
tELQV
Chip Enable Low to Output Valid
70
85
ns
tGLQV
Output Enable Low to Output Valid
40
55
ns
70
85
ns
tELQX(2)
Chip Enable Low to Output Transition
5
5
ns
tGLQX(2)
Output Enable Low to Output Transition
5
5
ns
tEHQZ(2)
Chip Enable High to Output Hi-Z
25
30
ns
tGHQZ(2)
Output Enable High to Output Hi-Z
25
30
ns
tAXQX
Address Transition to Output Transition
10
5
ns
Note: 1. Valid for Ambient Operating Temperature: TA = 0 to 70°C; VCC = 4.5 to 5.5V or 3.0 to 3.6V (except where noted).
2. CL = 5pF.
7/21
M48T512Y, M48T512V*
WRITE Mode
Chip Enable or tWHAX from WRITE Enable prior to
the initiation of another READ or WRITE cycle.
Data-in must be valid tDVWH prior to the end of
WRITE and remain valid for tWHDX afterward. G
should be kept high during WRITE cycles to avoid
bus contention; although, if the output bus has
been activated by a low on E and G a low on W will
disable the outputs tWLQZ after W falls.
The M48T512Y/V is in the WRITE Mode whenever
W (WRITE Enable) and E (Chip Enable) are low
state after the address inputs are stable.
The start of a WRITE is referenced from the latter
occurring falling edge of W or E. A WRITE is terminated by the earlier rising edge of W or E. The addresses must be held valid throughout the cycle. E
or W must return high for a minimum of tEHAX from
Figure 6. WRITE AC Waveforms, WRITE Enable Controlled
tAVAV
VALID
A0-A18
tAVWH
tWHAX
tAVEL
E
tWLWH
tAVWL
W
tWHQX
tWLQZ
tWHDX
DQ0-DQ7
DATA INPUT
tDVWH
AI02386
Figure 7. WRITE AC Waveforms, Chip Enable Controlled
tAVAV
VALID
A0-A18
tAVEH
tAVEL
tELEH
tEHAX
E
tAVWL
W
tEHDX
DQ0-DQ7
DATA INPUT
tDVEH
AI02387
8/21
M48T512Y, M48T512V*
Table 4. WRITE Mode AC Characteristics
Symbol
Parameter
M48T512Y
M48T512V
-70
-85
(1)
Min
Max
Min
Unit
Max
tAVAV
WRITE Cycle Time
70
85
ns
tAVWL
Address Valid to WRITE Enable Low
0
0
ns
tAVEL
Address Valid to Chip Enable Low
0
0
ns
tWLWH
WRITE Enable Pulse Width
50
60
ns
tELEH
Chip Enable Low to Chip Enable High
55
65
ns
tWHAX
WRITE Enable High to Address Transition
5
5
ns
tEHAX
Chip Enable High to Address Transition
10
15
ns
tDVWH
Input Valid to WRITE Enable High
30
35
ns
tDVEH
Input Valid to Chip Enable High
30
35
ns
tWHDX
WRITE Enable High to Input Transition
5
5
ns
tEHDX
Chip Enable High to Input Transition
10
15
ns
tWLQZ (2,3)
WRITE Enable Low to Output Hi-Z
25
30
ns
tAVWH
Address Valid to WRITE Enable High
60
70
ns
tAVEH
Address Valid to Chip Enable High
60
70
ns
WRITE Enable High to Output Transition
5
5
ns
tWHQX (2,3)
Note: 1. Valid for Ambient Operating Temperature: TA = 0 to 70°C; VCC = 4.5 to 5.5V or 3.0 to 3.6V (except where noted).
2. CL = 5pF.
3. If E goes low simultaneously with W going low, the outputs remain in the high impedance state.
9/21
M48T512Y, M48T512V*
Data Retention Mode
With valid VCC applied, the M48T512Y/V operates
as a conventional BYTEWIDE™ static RAM.
Should the supply voltage decay, the RAM will automatically deselect, write protecting itself when
VCC falls between VPFD (max), VPFD (min) window. All outputs become high impedance and all
inputs are treated as “Don't care.”
Note: A power failure during a WRITE cycle may
corrupt data at the current addressed location, but
does not jeopardize the rest of the RAM's content.
At voltages below VPFD (min), the memory will be
in a write protected state, provided the VCC fall
time is not less than tF. The M48T512Y/V may respond to transient noise spikes on VCC that cross
into the deselect window during the time the de-
10/21
vice is sampling VCC.Therefore, decoupling of the
power supply lines is recommended. When VCC
drops below VSO, the control circuit switches power to the internal battery, preserving data and powering the clock. The internal energy source will
maintain data in the M48T512Y/V for an accumulated period of at least 10 years at room temperature. As system power rises above VSO, the
battery is disconnected, and the power supply is
switched to external VCC. Write protection continues until VCC reaches VPFD (min) plus tREC (min).
Normal RAM operation can resume tREC after VCC
exceeds VPFD (max). Refer to Application Note
(AN1012) on the ST Web Site for more information
on battery life.
M48T512Y, M48T512V*
CLOCK OPERATIONS
Reading the Clock
Updates to the TIMEKEEPER® registers should
be halted before clock data is read to prevent
reading data in transition (see Table 5.). The BiPORT™ TIMEKEEPER cells in the RAM array are
only data registers and not the actual clock
counters, so updating the registers can be halted
without disturbing the clock itself.
Updating is halted when a '1' is written to the
READ Bit, D6 in the Control Register (7FFF8h). As
long as a '1' remains in that position, updating is
halted. After a halt is issued, the registers reflect
the count; that is, the day, date, and time that were
current at the moment the halt command was issued. All of the TIMEKEEPER registers are updated simultaneously. A halt will not interrupt an
update in progress. Updating occurs 1 second after the READ Bit is reset to a '0.'
Setting the Clock
Bit D7 of the Control Register (7FFF8h) is the
WRITE Bit. Setting the WRITE Bit to a '1,' like the
READ Bit, halts updates to the TIMEKEEPER registers. The user can then load them with the correct day, date, and time data in 24 hour BCD
format (see Table 5., page 11). Resetting the
WRITE Bit to a '0' then transfers the values of all
time registers 7FFFFh-7FFF9h to the actual TIMEKEEPER counters and allows normal operation to
resume. After the WRITE Bit is reset, the next
clock update will occur approximately one second
later. See Application Note, AN923, “TIMEKEEPER ® Rolling Into the 21st Century” on the ST Web
Site for more information on Century Rollover.
Note: Upon power-up, both the WRITE Bit and the
READ Bit will be reset to '0.'
Stopping and Starting the Oscillator.
The oscillator may be stopped at any time. If the
device is going to spend a significant amount of
time on the shelf, the oscillator can be turned off to
minimize current drain on the battery. The STOP
bit is located at Bit D7 within 7FFF9h. Setting it to
a '1' stops the oscillator. The M48T512Y/V is
shipped from STMicroelectronics with the STOP
bit set to a '1.' When reset to a '0,' the M48T512Y/
V oscillator starts after approximately one second.
Note: It is not necessary to set the WRITE Bit
when setting or resetting the FREQUENCY TEST
Bit (FT) or the STOP Bit (ST).
Table 5. Register Map
Data
Address
D7
7FFFFh
D6
D5
D4
D3
10 Years
10 M
D1
D0
Function/Range
BCD Format
Year
Year
00-99
Month
Month
01-12
Date
Date
01-31
Day
01-07
Hours
Hours
00-23
7FFFEh
0
0
7FFFDh
0
0
7FFFCh
0
0
0
7FFFBh
0
0
10 Hours
7FFFAh
0
10 Minutes
Minutes
Minutes
00-59
7FFF9h
ST
10 Seconds
Seconds
Seconds
00-59
7FFF8h
W
R
0
D2
10 Date
S
0
0
Day
Calibration
Control
Keys: S = SIGN Bit
R = READ Bit
W = WRITE Bit
ST = STOP Bit
0 = Must be set to '0'
11/21
M48T512Y, M48T512V*
Calibrating the Clock
The M48T512Y/V is driven by a quartz controlled
oscillator with a nominal frequency of 32,768Hz.
The devices are factory calibrated at 25°C and
tested for accuracy. Clock accuracy will not exceed 35 ppm (parts per million) oscillator frequency error at 25°C, which equates to about ±1.53
minutes per month. When the Calibration circuit is
properly employed, accuracy improves to better
than +1/–2 ppm at 25°C. The oscillation rate of
crystals changes with temperature. The
M48T512Y/V design employs periodic counter
correction. The calibration circuit adds or subtracts
counts from the oscillator divider circuit at the divide by 256 stage (see Figure 9., page 13).
The number of times pulses are blanked (subtracted, negative calibration) or split (added, positive
calibration) depends upon the value loaded into
the five Calibration bits found in the Control Register. Adding counts speeds the clock up, subtracting counts slows the clock down. The Calibration
bits occupy the five lower order bits (D4-D0) in the
Control Register 7FFF8h. These bits can be set to
represent any value between 0 and 31 in binary
form. Bit D5 is a Sign bit; '1' indicates positive calibration, '0' indicates negative calibration. Calibration occurs within a 64 minute cycle. The first 62
minutes in the cycle may, once per minute, have
one second either shortened by 128 or lengthened
by 256 oscillator cycles. If a binary '1' is loaded into
the register, only the first 2 minutes in the 64
minute cycle will be modified; if a binary 6 is loaded, the first 12 will be affected, and so on. Therefore, each calibration step has the effect of adding
512 or subtracting 256 oscillator cycles for every
125, 829, 120 actual oscillator cycles; that is,
+4.068 or –2.034 ppm of adjustment per calibration step in the calibration register.
Assuming that the oscillator is running at exactly
32,768Hz, each of the 31 increments in the Calibration byte would represent +10.7 or –5.35 seconds per month which corresponds to a total range
of +5.5 or –2.75 minutes per month.
One method for ascertaining how much calibration
a given M48T512Y/V may require involves setting
the clock, letting it run for a month and comparing
it to a known accurate reference and recording deviation over a fixed period of time.
Calibration values, including the number of seconds lost or gained in a given period, can be found
in STMicroelectronics Application Note AN934,
TIMEKEEPER Calibration.” This allows the designer to give the end user the ability to calibrate
the clock as the environment requires, even if the
final product is packaged in a non-user serviceable enclosure. The designer could provide a simple utility that accesses the Calibration bits. For
more information on calibration (see the Application Note AN934, “TIMEKEEPER® Calibration” on
the ST Web Site).
Figure 8. Crystal Accuracy Across Temperature
Frequency (ppm)
20
0
–20
–40
–60
–80
–100
∆F = -0.038 ppm (T - T )2 ± 10%
0
F
C2
–120
T0 = 25 °C
–140
–160
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
Temperature °C
AI00999
12/21
M48T512Y, M48T512V*
Figure 9. Calibration Waveform
NORMAL
POSITIVE
CALIBRATION
NEGATIVE
CALIBRATION
AI00594B
VCC Noise And Negative Going Transients
ICC transients, including those produced by output
switching, can produce voltage fluctuations, resulting in spikes on the VCC bus. These transients
can be reduced if capacitors are used to store energy, which stabilizes the VCC bus. The energy
stored in the bypass capacitors will be released as
low going spikes are generated or energy will be
absorbed when overshoots occur.
A ceramic bypass capacitor value of 0.1µF is recommended in order to provide the needed filtering.
In addition to transients that are caused by normal
SRAM operation, power cycling can generate negative voltage spikes on VCC that drive it to values
below VSS by as much as one volt. These negative
spikes can cause data corruption in the SRAM
while in battery backup mode. To protect from
these voltage spikes, ST recommends connecting
a schottky diode from VCC to VSS (cathode connected to VCC, anode to VSS). (Schottky diode
1N5817 is recommended for through hole and
MBRS120T3 is recommended for surface mount).
Figure 10. Supply Voltage Protection
VCC
VCC
0.1µF
DEVICE
VSS
AI02169
13/21
M48T512Y, M48T512V*
MAXIMUM RATING
Stressing the device above the rating listed in the
“Absolute Maximum Ratings” table may cause
permanent damage to the device. These are
stress ratings only and operation of the device at
these or any other conditions above those indicated in the Operating sections of this specification is
not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device
reliability.
Refer
also
to
the
STMicroelectronics SURE Program and other relevant quality documents.
Table 6. Absolute Maximum Ratings
Symbol
TA
TSTG
TSLD(1)
Parameter
Value
Unit
0 to 70
°C
–40 to 85
°C
260
°C
–0.3 to VCC +0.3
V
M48T512Y
–0.3 to 7.0
V
M48T512V
–0.3 to 4.6
V
Ambient Operating Temperature
Storage Temperature (VCC Off, Oscillator Off)
Lead Solder Temperature for 10 seconds
VIO
Input or Output Voltages
VCC
Supply Voltage
IO
Output Current
20
mA
PD
Power Dissipation
1
W
Note: 1. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
No preheat above 150°C, or direct exposure to IR reflow (or IR preheat) allowed, to avoid damaging the Lithium battery.
CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.
14/21
M48T512Y, M48T512V*
DC AND AC PARAMETERS
This section summarizes the operating and measurement conditions, as well as the DC and AC
characteristics of the device. The parameters in
the following DC and AC Characteristic tables are
derived from tests performed under the Measure-
ment Conditions listed in the relevant tables. Designers should check that the operating conditions
in their projects match the measurement conditions when using the quoted parameters.
Table 7. Operating and AC Measurement Conditions
Parameter
M48T512Y
M48T512V
Unit
4.5 to 5.5
3.0 to 3.6
V
0 to 70
0 to 70
°C
Load Capacitance (CL)
100
50
pF
Input Rise and Fall Times
≤5
≤5
ns
0 to 3
0 to 3
V
1.5
1.5
V
Supply Voltage (VCC)
Ambient Operating Temperature (TA)
Input Pulse Voltages
Input and Output Timing Ref. Voltages
Figure 11. AC Measurement Load Circuit
650Ω
DEVICE
UNDER
TEST
1.75V
CL
CL includes JIG capacitance
AI03971
Note: 50pF for M48T512V.
Table 8. Capacitance
Parameter(1,2)
Symbol
CIN
CIO(3)
Min
Max
Unit
Input Capacitance
20
pF
Input / Output Capacitance
20
pF
Note: 1. Effective capacitance measured with power supply at 5V (M48T512Y) or 3.3V (M48T512V). Sampled only, not 100% tested.
2. At 25°C, f = 1MHz.
3. Outputs deselected.
15/21
M48T512Y, M48T512V*
Table 9. DC Characteristics
Symbol
Parameter
M48T512Y
M48T512V
–70
–85
Test
Condition(1)
Min
ILI
ILO(2)
Input Leakage Current
Output Leakage Current
Max
Min
Unit
Max
0V ≤ VIN ≤ VCC
±2
±2
µA
0V ≤ VOUT ≤ VCC
±2
±2
µA
Outputs open
115
60
mA
E = VIH
8
4
mA
E = VCC – 0.2V
4
3
mA
ICC
Supply Current
ICC1
Supply Current (Standby) TTL
ICC2
Supply Current (Standby)
CMOS
VIL
Input Low Voltage
–0.3
0.8
–0.3
0.4
V
VIH
Input High Voltage
2.2
VCC +0.3
2.2
VCC +0.3
V
VOL
Output Low Voltage
IOL = 2.1mA
0.4
V
VOH
Output High Voltage
IOH = –1mA
0.4
2.4
2.2
Note: 1. Valid for Ambient Operating Temperature: TA = 0 to 70°C; VCC = 4.5 to 5.5V or 3.0 to 3.6V (except where noted).
2. Outputs deselected.
16/21
V
M48T512Y, M48T512V*
Figure 12. Power Down/Up Mode AC Waveforms
VCC
VPFD (max)
VPFD (min)
VSO
VSS
tF
tDR
tR
tRB
tFB
INPUTS
tREC
DON'T CARE
RECOGNIZED
(Including E)
RECOGNIZED
HIGH-Z
OUTPUTS
VALID
VALID
AI02385
Table 10. Power Down/Up AC Characteristics
Parameter(1)
Symbol
Min
tF(2)
VPFD (max) to VPFD (min) VCC Fall Time
tFB(3)
VPFD (min) to VSS VCC Fall Time
Max
Unit
300
µs
M48T512Y
10
µs
M48T512V
150
µs
tR
VPFD (min) to VPFD (max) VCC Rise Time
10
µs
tRB
VSS to VPFD (min) VCC Rise Time
1
µs
E Recovery Time
40
tREC
200
ms
Note: 1. Valid for Ambient Operating Temperature: TA = 0 to 70°C; VCC = 4.5 to 5.5V or 3.0 to 3.6V (except where noted).
2. VPFD (max) to VPFD (min) fall time of less than tF may result in deselection/write protection not occurring until 200µs after VCC passes VPFD (min).
3. VPFD (min) to VSS fall time of less than tFB may cause corruption of RAM data.
Table 11. Power Down/Up Trip Points DC Characteristics
Symbol
Parameter(1,2)
VPFD
Power-fail Deselect Voltage
VSO
Battery Back-up Switchover Voltage
tDR(3)
Expected Data Retention Time
Min
Typ
Max
Unit
M48T512Y
4.2
4.35
4.5
V
M48T512V
2.7
2.9
3.0
V
M48T512Y
3.0
V
M48T512V
VPFD –100mV
V
10
YEARS
Note: 1. All voltages referenced to VSS.
2. Valid for Ambient Operating Temperature: TA = 0 to 70°C; VCC = 4.5 to 5.5V or 3.0 to 3.6V (except where noted).
3. At 25°C, VCC = 0V.
17/21
M48T512Y, M48T512V*
PACKAGE MECHANICAL INFORMATION
Figure 13. PMDIP32 – 32-pin Plastic Module DIP, Package Outline
A
A1
B
S
L
C
eA
e1
e3
D
N
E
1
PMDIP
Note: Drawing is not to scale.
Table 12. PMDIP32 – 32-pin Plastic Module DIP, Package Mechanical Data
mm
inches
Symb
Typ
18/21
Min
Max
A
9.27
A1
Typ
Min
Max
9.52
0.365
0.375
0.38
–
0.015
–
B
0.43
0.59
0.017
0.023
C
0.20
0.33
0.008
0.013
D
42.42
43.18
1.670
1.700
E
18.03
18.80
0.710
0.740
e1
2.29
2.79
0.090
0.110
e3
34.29
41.91
1.350
1.650
eA
14.99
16.00
0.590
0.630
L
3.05
3.81
0.120
0.150
S
1.91
2.79
0.075
0.110
N
32
32
M48T512Y, M48T512V*
PART NUMBERING
Table 13. Ordering Information Scheme
Example:
M48T
512Y
–70
PM
1
Device Type
M48T
Supply Voltage and Write Protect Voltage
512Y = VCC = 4.5 to 5.5V; VPFD = 4.2 to 4.5V
512V(1) = VCC = 3.0 to 3.6V; VPFD = 2.7 to 3.0V
Speed
–70 = 70ns (512Y)
–85 = 85ns (512V)
Package
PM = PMDIP32
Temperature Range
1 = 0 to 70°C
Note: 1. Contact local ST sales office for availability of 3.3V version.
For other options, or for more information on any aspect of this device, please contact the ST Sales Office
nearest you.
19/21
M48T512Y, M48T512V*
REVISION HISTORY
Table 14. Document Revision History
Date
Version
June 1998
1.0
First Issue
03-Dec-99
1.1
M48T512Y: VPFD (Min) changed; AC Measurement Load Circuit changed (Figure 11); tFB
and tRB changed (Figure 12, Table 10)
11-Dec-00
2.0
Reformatted
20-Jul-01
2.1
Segments re-ordered; temp./voltage info. added to tables (Table 8, 9, 3, 4, 10, 11)
07-Aug-01
2.2
Text re-ordered from last adjustment (“Operating Modes” section)
20-May-02
2.3
Add countries to disclaimer
07-Aug-02
2.4
Add marketing status
31-Mar-03
3.0
v2.2 template applied; data retention condition updated (Table 11)
22-Feb-05
4.0
Reformatted; IR reflow update (Table 6)
20/21
Revision Details
M48T512Y, M48T512V*
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
21/21