MSS40 THYRISTOR MODULE .. .. FEATURES VDRM = VRRM UP TO 1400 V IT(RMS) = 55 A HIGH SURGE CAPABILITY INSULATED PACKAGE : INSULATING VOLTAGE 2500 V(RMS) G1 A2 A1 DESCRIPTION The MSS40 family are constitued of two general purpose SCR. Suitable for AC switching and phase control on resistive and inductive load up to 400 Hz. The small volume (7cm3) and weight (29g) of the isotop package are well adapted to new generation of medium size module market applications. G2 Screw version ISOTOPTM (Plastic) PIN CONNECTIONS 1 : Thyristor 2 Anode (A2) 2 : Thyristor 2 Gate (G2) 3 : Thyristor 1 Anode (A1) 4 : Thyristor 1 Gate (G1) ABSOLUTE RATINGS (limiting values) Symbol IT(RMS) ITSM I2t Parameter Tc = 80°C 55 A Non repetitive surge peak on-state current ( Tj initial = 25°C ) tp = 8.3ms 420 A tp = 10ms 400 I2t value for fusing tp = 10ms 800 A2s 100 A/µs - 40 + 150 - 40 + 125 °C Critical rate of rise of on-state current Gate supply : IG = 400mA – diG/dt = 1A/µs Tstg Tj Storage temperature range Operating junction temperature range VDRM VRRM Unit RMS on-state current dI/dt Symbol Value Parameter Repetitive peak off-state voltage Tj = 125 °C MSS40 Unit -800 -1200 -1400 800 1200 1400 V TM : ISOTOP is a trademark of SGS-THOMSON Microelectronics April 1995 1/6 MSS40 THERMAL RESISTANCES Symbol Rth (j-c) Rth (c-h) Parameter Junction to case Value Unit DC 1 °C/W AC 0.6 Contact (case to heatsink) (4) 0.05 °C/W Value Unit (4) With contact grease utilisation GATE CHARACTERISTICS (maximum values) PGM = 50 W (tp = 20 µs) PG (AV)= 1 W IFGM = 4 A (tp = 20 µs) VRGM = 5V. ELECTRICAL CHARACTERISTICS Symbol Test Conditions IGT VD=12V (DC) RL=33Ω Tj=25°C MAX 50 mA VGT VD=12V (DC) RL=33Ω Tj=25°C MAX 1.5 V VGD VD=VDRM R L=3.3kΩ Tj=125°C MIN 0.2 V tgt VD=VDRM IG = 500mA dIG/dt = 3A/µs Tj=25°C TYP 2 µs IL IG=1.2 IGT Tj=25°C TYP 60 mA MAX 120 TYP 40 MAX 80 IH IT= 0.5A gate open mA VTM ITM= 80A tp= 380µs Tj=25°C MAX 1.7 V IDRM IRRM VDRM VRRM Tj=25°C MAX 0.05 mA Tj=125°C MAX 10 IT= 80A VR=75V VD =67%VDRM dI/dt=30A/µs dV/dt=20V/µs Gate open Tj=125°C TYP 100 µs Linear slope up to VD =67%VDRM gate open Tj=125°C MIN 500 V/µs tq dV/dt * Rated Rated * For higher guaranteed values, please consult us. Note : MSS40-1400 - IDRM and IRRM at Tj = 125°C is defined at 1200 V - dV/dt at Tj = 125°C is defined at 67% of 1200 V 2/6 Tj=25°C MSS40 Fig. 1 : Maximun RMS power dissipation versus RMS on-state current. (F= 50 Hz) P(W) Fig. 2 : Correlation between maximum RMS power dissipation and maximum allowable temperature (Tamb) for different thermal resistances heatsink + contact. P (W) Rth=O oC/W Rth=O.75 o C/W Rth=1.0 oC/W Rth=1.5 oC/W Tamb( oC) Fig. 3 : RMS on-state current versus case temperature. I T(RMS)(A) Fig. 4: Thermal transient impedance junction to case versus pulse duration. Zth(j-c) (oC/W) =180 o Tcase( oC) Fig. 5 : Relative variation of gate trigger and holding current versus junction temperature. Igt;Ih [Tj] / Igt; Ih [Tj=25oC] tp(s) Fig. 6 : Non repetitive surge peak on-state current versus number of cycles. I TSM(A) 0 Tj initial = 25 C Igt Ih Tj(oC) Number of cycles 3/6 MSS40 Fig.7 : Non repetitive surge peak on-state current for a sinusoidal pulse with width : tp ≤ 10 ms and correspond2 ing value of I t . I TSM(A);I2t(A2s) Fig. 8 : On-state characteristics . (Maximum values) V TM (V) Tj initial = 25oC I2t Tj=125 oC: Rt=11m ITSM Tj initial = 25 o C tp(ms) 4/6 Tj initial = 125 oC I TM(A) MSS40 PACKAGE MECHANICAL DATA ISOTOP plastic : SCREW VERSION M A G / OJ O B / OI / OI D H E F C K L REF. A B C D E F G H I J K L M O P DIMENSIONS Millimeters Inches Min. Max. Min. Max. 11.80 12.20 0.465 0.480 8.90 9.10 0.350 0.358 1.95 2.05 0.077 0.081 0.75 0.85 0.029 0.034 12.60 12.80 0.496 0.504 25.10 25.50 0.988 1.004 31.50 31.70 1.240 1.248 4.00 0.157 4.10 4.30 0.161 0.169 4.10 4.30 0.161 0.169 14.90 15.10 0.586 0.595 30.10 30.30 1.185 1.193 37.80 38.20 1.488 1.504 7.80 8.20 0.307 0.323 5.50 0.216 P screw H M4 Cooling method : C Marking : Type number Weight : 28 g. (without screws) Electrical isolation : 2500V(RMS) Capacitance : < 45 pF Inductance : < 5 nH - Recommended torque value : 1.3 N.m (Max 1.5 N.m) for the 6 x M4 screws. (2 x M4 screws recommended for mounting the package on the heatsink and the 4 screws given with the screw version). - The screws supplied with the package are adapted for mounting on a board (or others types of terminals) with a thickness of 0.6 mm min and 2.2 mm max. 5/6 MSS40 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THO MSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 6/6