STMICROELECTRONICS T0609MH

T0605xH
T0609xH

SENSITIVE GATE TRIACS
FEATURES
IT(RMS) = 6A
VDRM = 400V to 800V
IGT ≤ 5mA to ≤ 10mA
A1
A2
G
DESCRIPTION
The T06xxxH series of triacs uses a high
performance MESA GLASS technology. These
parts are intended for general purpose
applications where gate high sensitivity is
required.
TO220
non-insulated
(Plastic)
ABSOLUTE RATINGS (limiting values)
Symbol
IT(RMS)
ITSM
I2t
dI/dt
Tstg
Tj
Tl
Symbol
VDRM
VRRM
January 1995
Parameter
Value
Unit
RMS on-state current
(360° conduction angle)
Tc= 100 °C
6
A
Non repetitive surge peak on-state current
(Tj initial = 25°C )
tp = 8.3 ms
63
A
tp = 10 ms
60
I2t Value for fusing
tp = 10 ms
18
A2s
Critical rate of rise of on-state current
diG /dt = 0.1 A/µs.
IG = 50 mA
Repetitive
F = 50 Hz
10
A/µs
Non
Repetitive
50
Storage and operating junction temperature range
Maximum lead temperature for soldering during 10s at
4.5mm from case
°C
260
°C
Voltage
Parameter
Repetitive peak off-state voltage
Tj = 125°C
- 40, + 150
- 40, + 125
Unit
D
M
S
N
400
600
700
800
V
1/5
T0605xH / T0609xH
THERMAL RESISTANCES
Symbol
Parameter
Value
Unit
Rth(j-a)
Junction to ambient
60
°C/W
Rth(j-c)
Junction to case for D.C
4
°C/W
Rth(j-c)
Junction to case for A.C 360° conduction angle (F=50Hz)
3
°C/W
Sensitivity
Unit
GATE CHARACTERISTICS (maximum values)
PG (AV)= 1 W PGM = 10 W (tp = 20 µs)
IGM = 4 A (tp = 20 µs)
ELECTRICAL CHARACTERISTICS
Symbol
Test Conditions
Quadrant
05
09
5
10
IGT
VD=12V (DC) RL=33Ω
Tj= 25°C
I-II-III-IV
MAX
VGT
VD=12V (DC) RL=33Ω
Tj= 25°C
I-II-III-IV
MAX
1.5
V
VGD
VD=VDRM RL=3.3kΩ
Tj= 125°C
I-II-III-IV
MIN
0.2
V
tgt
VD=VDRM IG = 40mA
IT = 8.5A
dIG/dt = 0.5A/µs
Tj= 25°C
I-II-III-IV
TYP
2
µs
IH *
IT= 50mA Gate open
Tj= 25°C
IG= 1.2 IGT
Tj= 25°C
IL
mA
MAX
5
10
mA
I-III-IV
TYP
5
10
mA
II
TYP
10
20
VTM *
ITM= 8.5A tp= 380µs
Tj= 25°C
MAX
1.65
V
IDRM
IRRM
VD = VDRM
VR = VRRM
Tj= 25°C
MAX
5
µA
Tj= 110°C
MAX
2
mA
Tj= 110°C
MIN
dV/dt *
(dV/dt)c *
VD=67%VDRM
Gate open
(dI/dt)c = 2.7 A/ms
Tj= 110°C
TYP
10
TYP
1
20
V/µs
2
V/µs
* For either polarity of electrode A2 voltage with reference to electrode A1
ORDERING INFORMATION
T
06
09
M
H
PACKAGE :
H = TO220 Non-insulated
TRIAC MESA GLASS
CURRENT
SENSITIVITY
2/5

VOLTAGE
T0605xH / T0609xH
Fig.1 : Maximum RMS power dissipation versus
RMS on-state current.
Fig.2 : Correlation between maximum RMS power
dissipation and maximum allowable temperature
(Tamb and Tcase) for different thermal resistances
heatsink + contact.
10
10
o
180 O
o
8
= 120
= 90
6
= 60
= 30
Rth = 0 o C/W
2.5 o C/W
5 o C/W
10 o C/W
= 180
8
4
o
-100
-110
4
o
-115
2
-120
I T(RMS) (A)
0
-95
-105
6
o
2
0
Tcase (o C)
P (W)
P(W)
1
2
3
4
o
Tamb ( C)
5
6
Fig.3 : RMS on-state current versus case temperature.
0
0
20
40
60
80
100
-125
140
120
Fig.4 : Relative variation of thermal impedance
versus pulse duration.
Zth/Rth
I T(RMS) (A)
1
7
6
Zt h( j-c)
5
4
0.1
o
= 180
Zt h( j-a)
3
2
1
o
tp (s)
Tcase( C)
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130
Fig.5 : Relative variation of gate trigger current and
holding current versus junction temperature.
Igt[Tj]
o
Igt[Tj=25 C]
Ih[Tj]
o
Ih[Tj=25 C]
1E-2
1E-1
1E +0
1 E +1
1E +2 5 E+2
Fig.6 : Non repetitive surge peak on-state current
versus number of cycles.
ITSM(A)
60
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.01
1E-3
o
Tj initial = 25 C
50
40
Igt
30
Ih
20
10
Number of cycles
Tj(oC)
-40
-20
0
20
40
60
80
100
120 140
0
1
10
100
100 0
3/5

T0605xH / T0609xH
Fig.7 : Non repetitive surge peak on-state current
for a sinusoidal pulse with width : t ≤ 10ms, and corresponding value of I2t.
1000
Fig.8 : On-state characteristics (maximum values).
I TSM (A). I2 t (A 2 s)
I TM (A)
100
Tj initial = 25o C
Tj initial
o
25 C
I TSM
100
Tj max
10
I2t
Tj max
Vto =0.93V
Rt =0.078
10
1
1
VTM (V)
t (ms)
10
4/5

1
0
0.5 1
1.5 2 2.5 3 3.5 4
4.5 5
5.5 6
T0605xH / T0609xH
PACKAGE MECHANICAL DATA
TO220 Non-insulated (Plastic)
REF.
DIMENSIONS
Millimeters
Inches
Typ. Min. Max. Typ. Min. Max.
A
A
H
B
J
G
I
L
D
P
N1
M
N
6.5
0.406
0.248 0.256
9.1
0.358
12.7
F
G
C
F
6.3
C
D
B
O
10.3
0.500
4.2
3.0
0.165
0.118
H
I
4.5
3.53
4.7
3.66
0.177 0.185
0.139 0.144
J
1.2
1.3
0.047 0.051
0.9
0.035
L
M
2.7
0.106
N
N1
O
P
5.3
2.54
0.209
0.100
1.2
1.4
1.15
0.047 0.055
0.045
Marking : type number
Weight : 1.8 g
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THO MSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
 1995 SGS-THOMSON Microelectronics - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
5/5
