RHFL4913 Rad-hard adjustable positive voltage regulator Features ■ 3 A low dropout voltage ■ Embedded overtemperature and overcurrent protection ■ Adjustable overcurrent limitation ■ Output overload monitoring/signalling ■ Adjustable output voltage ■ Inhibit (ON/OFF) TTL-compatible control ■ Programmable output short-circuit current ■ Remote sensing operation ■ Rad-hard: guaranteed up to 300 krad Mil Std 883E Method 1019.6 high dose rate and 0.01 rad/s in ELDRS conditions ■ Heavy ion, SEL, and SEU immune; able to sustain 2x1014 protons/cm2 and 2x1014 neutrons/cm2 Flat-16 SMD5C: 5-connection SMD Description The RHFL4913 high-performance adjustable positive voltage regulator provides exceptional radiation performance. It is tested in accordance with Mil Std 883E Method 1019.6, in ELDRS conditions. The device is available in the Flat-16 and the new SMD5C hermetic ceramic package, and the QML-V die is specifically designed for space and harsh radiation environments. It operates with an input supply of up to 12 volts. The RHFL4913 is QML-V qualified, DSCC SMD #5962F02524. November 2007 Rev 8 1/19 www.st.com 19 Contents RHFL4913 1 Contents 1 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 8 6.1 ADJ pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.2 Inhibit ON-OFF control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.3 Overtemperature protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.4 Overcurrent protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.5 OCM pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.6 Alternatives to the RHFL4913 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.1 Notes on the 16-pin hermetic package . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.2 Remote sensing operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.3 FPGA power supply lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Die information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8.1 Die bonding pad locations and electrical functions . . . . . . . . . . . . . . . . . 13 9 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 10 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2/19 RHFL4913 Diagram 2 Diagram Figure 1. Block diagram 3/19 Pin configuration RHFL4913 3 Pin configuration Figure 2. Pin configuration (top view for Flat-16, bottom view for SMD5C) SMD5C Flat-16 Table 1. 4/19 Pin description Pin name Flat-16 SMD5C VO 1, 2, 6, 7 1 VI 3, 4, 5 4 GND 13 5 ISC 8 OCM 10 INHIBIT 14 3 ADJ 15 2 NC 9, 11, 12, 16 RHFL4913 Maximum ratings 4 Maximum ratings Table 2. Recommended maximum operating ratings (see Note:) Symbol Parameter Value Unit 12 V 1.23 to 9 V VI DC input voltage, VI - VGROUND VO DC output voltage range IO Output current, RHFL4913KPA 2 IO Output current, RHFL4913SCA 3 PD TC = 25 °C power dissipation 15 W Tstg Storage temperature range -65 to +150 °C Top Operating junction temperature range -55 to +150 °C ESD A Electrostatic discharge capability Note: Exceeding maximum ratings may damage the device. Table 3. Thermal data Symbol Parameter Class 3 Value Unit RthJC Thermal resistance junction-case, Flat-16 and SMD5C 8.3 °C/W TSOLD Maximum soldering temperature, 10 sec. 300 °C 5/19 Electrical characteristics RHFL4913 5 Electrical characteristics Table 4. Electrical characteristics (TJ = 25 °C, VI = VO+2.5 V, CI = CO = 1 µF, unless otherwise specified) Symbol Parameter Test conditions Max. Unit 3 12 V IO = 1 A and or 2, VO = 1.23 V 1.19 1.27 V IO = 1 A and or 2, VO = 9 V 8.7 9.3 V VI Operating input voltage IO = 1 A, TJ = -55 to 125°C VO Operating output voltage ISHORT ΔVO/ΔVI Output current limit Line regulation ΔVO/ΔVO Load regulation ZOUT Iq Iq 6/19 Output impedance Quiescent current Quiescent current ON mode (1) Adjustable by mask/external resistor Min. 1 Typ. 4.5 A VI = VO+2.5 V to 12 V, IO = 5 mA, TJ = +25°C 0.35 VI = VO+2.5 V to 12 V, IO = 5 mA, TJ = -55°C 0.4 VI = VO+2.5 V to 12 V, IO = 5 mA, TJ = +125°C 0.4 VI = VO+2.5 V, IO = 5 to 400 mA, TJ = +25°C 0.3 VI = VO+2.5 V, IO = 5 to 400 mA, TJ = -55°C 0.5 VI = VO+2.5 V, IO = 5 to 400 mA, TJ = +125°C 0.5 VI = VO+2.5 V, IO = 5 mA to 1 A, TJ = +25°C 0.5 VI = VO+2.5 V, IO = 5 mA to 1A, TJ = -55°C 0.6 VI = VO+2.5 V, IO = 5 mA to 1A, TJ = +125°C 0.6 IO = 100 mA DC and 20 mA rms % % 100 mΩ VI = VO+2.5 V, IO = 5 mA, ON mode (+25°C) 6 VI = VO+2.5 V, IO = 30 mA, ON mode (+25°C) 8 VI = VO+2.5 V, IO = 300 mA, ON mode (+25°C) 25 VI = VO+2.5 V, IO = 1 A, ON mode (+25°C) 60 VI = VO+2 V, VINH = 2.4 V, OFF mode 1 VI = VO+2.5 V, IO = 30 mA, (-55°C) 14 VI = VO+2.5 V, IO = 300 mA, (-55°C) 40 VI = VO+2.5 V, IO = 1 A, (-55°C) 100 mA mA VI = VO+2.5 V, IO = 30 mA, (+125°C) 8 VI = VO+2.5 V, IO = 300 mA, (+125°C) 20 VI = VO+2.5 V, IO = 1 A, (+125°C) 40 RHFL4913 Table 4. Symbol Vd Electrical characteristics Electrical characteristics (continued) (TJ = 25 °C, VI = VO+2.5 V, CI = CO = 1 µF, unless otherwise specified) Parameter Test conditions Dropout voltage Typ. Max. IO = 400 mA, VO = 2.5 to 9 V, (+25°C) 350 450 IO = 400 mA, VO = 2.5 to 9 V, (-55°C) 300 400 IO = 400 mA, VO = 2.5 to 9 V, (+125°C) 450 550 IO = 1 A, VO = 2.5 to 9 V, (+25°C) 650 IO = 1 A, VO = 2.5 to 9 V, (-55°C) 550 IO = 1 A, VO = 2.5 to 9 V, (+125°C) 800 900 IO = 2 A, VO = 2.5 to 9 V, (+125°C) 950 IO = 5 mA, TJ = -55 to +125°C VINH(OFF) Inhibit voltage IO = 5 mA, TJ = -55 to +125°C ISH VOCM tPLH tPHL eN VI = VO + 2.5 V ± 0.5 V, VO = 3 V IO = 5 mA Supply voltage rejection (1) 0.8 V 2.4 f = 120 Hz 60 70 f = 33 kHz 30 40 dB Shutdown input current VINH = 5 V OCM pin voltage Sinked IOCM = 24 mA active low Inhibit propagation delay (1) VI = VO + 2.5V, VINH = 2.4 V, IO = 400 mA VO = 3 V Output noise voltage (1) Unit mV IO = 2 A, VO = 2.5 to 9 V, (+25°C) VINH(ON) Inhibit voltage SVR Min. 15 µA 0.38 V ON-OFF 20 µs OFF-ON 100 µs B = 10 Hz to 100 kHz, IO = 5 mA to 2 A 40 µVrms 1. These values are guaranteed by design. For each application it is strongly recommended to comply with the maximum current limit of the package used. Figure 3. Application diagram for remote sensing operation 7/19 Device description 6 RHFL4913 Device description The RHFL4913 adjustable voltage regulator contains a PNP type power element controlled by a signal resulting from an amplified comparison between the internal temperaturecompensated band-gap and the fraction of the desired output voltage value obtained from an external resistor divider bridge. The device is protected by several functional blocks. 6.1 ADJ pin The load output voltage feedback comes from an external resistor divider bridge mid-point connected to the ADJ pin (allowing all possible output voltage settings as per user requirements) established between load terminals. 6.2 Inhibit ON-OFF control By setting the INHIBIT pin TTL high, the device switches off the output current and voltage. The device is ON when the INHIBIT pin is set low. Since the INHIBIT pin is pulled down internally, it can be left floating in cases where the inhibit function is not used. 6.3 Overtemperature protection A temperature detector internally monitors the power element junction temperature. The device turns off when a temperature of approximately 175 °C is reached, returning to ON mode when back to approximately 135 °C. Combined with the other protection blocks, the device is protected from destructive junction temperature excursions in all load conditions. It should be noted that when the internal temperature detector reaches 175 °C, the active power element can be as high as 225 °C. Prolonged operation under these conditions far exceeds the maximum operating ratings and device reliability cannot be guaranteed. 6.4 Overcurrent protection An internal non fold-back short circuit limitation is set with ISHORT > 3.8 A (VO is 0 V). This value can be decreased via an external resistor connected between the ISC and VI pins, with a typical value range of 10 kΩ to 200 kΩ. To maintain optimal VO regulation, it is necessary to set ISHORT 1.6 times greater than the maximum desired application IO. When IO reaches ISHORT – 300 mA, the current limiter overrules the regulation, VO starts to drop and the OCM flag is raised. When no current limitation adjustment is required, the ISC pin must be left unbiased (as it is in 3 pin packages). 6.5 OCM pin The OCM pin goes low when the current limit becomes active, otherwise VOCM = VI. It is buffered and can sink 10 mA. The OCM pin is internally pulled up by a 5 kΩ resistor. 8/19 RHFL4913 6.6 Device description Alternatives to the RHFL4913 The adjustable RHFL4913 is recommended to replace all industry positive voltage regulators due to its exceptional radiation performance. To replace 3-terminal industry devices, the fixed voltage versions of the RHFL4913 should be used. 9/19 Application information 7 RHFL4913 Application information To adjust the output voltage, the R2 resistor must be connected between the VO and ADJ pins. The R1 resistor must be connected between ADJ and ground. Resistor values can be derived from the following formula: VO = VADJ (R1+ R2) / R1 The VADJ is 1.23 V, controlled by the internal temperature-compensated band gap block. The minimum output voltage is therefore 1.22 V and minimum input voltage is 3 V. The RHFL4913 adjustable is functional as soon as the VI - VO voltage difference is slightly above the power element saturation voltage. The adjust pin to ground resistor value must not be greater than 10 kΩ, in order to keep the output feedback error below 0.2%. A minimum of 0.5 mA IO must be set to ensure perfect no-load regulation. It is advisable to dissipate this current into the divider bridge resistor. All available VI pins, as well as all available VO pins, should always be externally interconnected, otherwise the stability and reliability of the device cannot be guaranteed. The inhibit function switches off the output current electronically, and therefore very quickly. According to Lenz’s Law, external circuitry reacts with LdI/dt terms which can be of high amplitude in case somewhere a serial coil inductance exists. Large transient voltage would develop on both device terminals. It is advisable to protect the device with Schottky diodes to prevent negative voltage excursions. In the worst case, a 14 V Zener diode could protect the device input. The device has been designed for high stability and low dropout operation. Therefore, tantalum input and output capacitors with a minimum 1 µF are mandatory. Capacitor ESR range is from 0.5 Ω to over 20 Ω. This range is useful when ESR increases at low temperature. When large transient currents are expected, larger value capacitors are necessary. In the case of high current operation with short circuit events expected, caution must be exercised with regard to capacitors. They must be connected as close as possible to the device terminals. As some tantalum capacitors may permanently fail when subjected to high charge-up surge currents, it is recommended to decouple them with 470 nF polyester capacitors. Since the RHFL4913 adjustable voltage regulator is manufactured with very high speed bipolar technology (6 GHz fT transistors), the PCB layout must be designed with exceptional care, with very low inductance and low mutually coupling lines. Otherwise, high frequency parasitic signals may be picked up by the device resulting in system self-oscillation. The benefit is an SVR performance extended to far higher frequencies. 7.1 Notes on the 16-pin hermetic package The bottom section of the 16-pin package is metallized in order to allow the user to directly solder the RHFL4913 onto the equipment heat sink for enhanced heat removal. 7.2 Remote sensing operation A separate kelvin voltage sensing line provides the ADJ pin with exact load "high potential" information (see Figure 3) . But variable remote load current consumption induces variable Iq current (Iq is roughly the IO current divided by the hFE of the internal PNP series power element) routed through the parasitic series line resistor RW2. To compensate for this 10/19 RHFL4913 Application information parasitic voltage, resistor RW1can be introduced to provide the necessary compensating voltage signal to the ADJUST pin. 7.3 FPGA power supply lines Because these devices are very sensitive to VDD transients beyond a few % of their nominal supply voltage (usually 1.5 V), special attention must be given by supply lines designers to mitigate possible heavy ion L4913 disturbances. The worst case heavy ion effect can be summarized as: the L4913 internal control loop being cut (made open) or short-circuited for a sub-microsecond duration. During such an event, the L4913 die power element can either provide excessive current or current supply stoppage to the output (VOUT) for a duration of about one microsecond, after which time the L4913 smoothly recovers to nominal operation. To mitigate these "transients", it is recommended to implement the L4913 PCB layout as follows: ● Minimizing series/parallel parasitic inductances of the PC path ● Using a low ESR 47 µF Tantalum VOUT filtering capacitor with a 470 nF ceramic capacitor in parallel with the former (to reduce dynamic ESR) ● Inserting a 100-200 nH ferrite core on the VOUT-to-tantalum capacitor wire With this implementation, the ELDO simulated worst transient case shows no more than 90 mV deviation from the nominal line voltage value. 11/19 Die information RHFL4913 8 Die information Figure 4. Die map GND 0;1002 13 INBH -1542;868 14 ADJ -1545;574 15 10 OCM 1517;5 SENSE -1545;287 16 8 Short 1517;2 1-2 VO -890;-974 Note: 12/19 3-4-5 VI 0;-974 6-7 VO 970;-974 Pad numbers reflect terminal numbers when placed in case Flat-16. RHFL4913 8.1 Die information Die bonding pad locations and electrical functions Die physical dimensions: Die size: 150 mils x 110 mils (3.81 mm by 2.79 mm) Die thickness: 375 µm ± 25 µm (14.8 mils ± 1 mil) Pad size: VIN, VOUT pads: 450 µm x 330 µm (17.7 mils by 13 mils) Control pads: 184 µm x 184 µm (7.25 mils square) Interface materials: Top metallization: Al/Si/Cu, 1.05 µm ± 0.15 µm Backside metallization: none Glassivation: Type: p. vapox + nitride Thickness: 0.6 µm ± 0.1 µm + 0.6 µm ± 0.08 µm Substrate: bare silicon Assembly related information: Substrate potential: floating recommended to be tied to ground Special assembly instructions: "Sense" pad not used; not internally connected to any part of the IC. Can be connected to ground when space anti-static electricity rules apply. 13/19 Die information RHFL4913 FLAT-16 (MIL-STD-1835) mechanical data mm. inch. Dim. Min. A Typ. 2.16 Max. Min. 2.72 0.085 Typ. 0.107 b 0.43 0.017 c 0.13 0.005 D 9.91 0.390 E 6.91 0.272 E2 4.32 0.170 E3 0.76 0.030 e 1.27 0.050 L 6.72 0.265 Q 0.66 S1 0.13 Max. 1.14 0.026 0.045 0.005 b e c L E3 9 16 E E2 1 8 E3 L S1 D 14/19 Q A 7450901A RHFL4913 Die information SMD5C mechanical data Dim. mm. inch. Min. Typ. Max. Min. Typ. Max. A 2.84 3.00 3.15 0.112 0.118 0.124 A1 0.25 0.38 0.51 0.010 0.015 0.020 b 7.13 7.26 7.39 0.281 0.286 0.291 b1 4.95 5.08 5.21 0.195 0.200 0.205 b2 2.28 2.41 2.54 0.090 0.095 0.100 b3 2.92 3.05 3.18 0.115 0.120 0.125 D 13.71 13.84 13.97 0.540 0.545 0.550 D1 0.76 E 7.39 0.296 0.301 e 0.030 7.52 1.91 7.65 0.291 0.075 7924296B 15/19 Packaging 9 RHFL4913 Packaging The RHFL4913 adjustable voltage regulator is available in a high thermal dissipation 16-pin hermetic Flat package, the bottom flange of which is metallized to allow direct soldering to a heat sink (efficient thermal conductivity). The device is also available in the SMD5C hermetic ceramic package. 16/19 RHFL4913 Ordering information 10 Ordering information Table 5. Order code Flat-16 SMD5C Terminal finish Output voltage Quality level RHFL4913KPA-01V RHFL49143SCA-07V Gold Adj QML-V Solder Adj QML-V Die RHFL4913KPA-02V RHFL4913KPA1 RHFL4913SCA1 Gold Adj EM1 RHFL4913KPA2 RHFL4913SCA2 Gold Adj EM2=EM1+48hours B.I. L4913ADIE2V Adj QML-V die L4913ADIES Adj EM1 die Table 6. Table 7. Part number - SMD equivalent ST part number SMD part number RHFL4913KPA-01V 5962F0252401VXC RHFL4913KPA-02V 5962F0252401VXA L4913ADIE2V 5962F0252401V9A Environmental characteristics Parameter Conditions Value Unit Output voltage thermal drift -55°C to +125°C 40 ppm/°C Output voltage radiation drift From 0 krad to 300 krad at 0.55 rad/s 8 ppm/krad Output voltage radiation drift From 0 krad to 300 krad, Mil Std 883E Method 1019.6 6 ppm/krad 17/19 Revision history RHFL4913 11 Revision history Table 8. Document revision history Date Revision 29-Oct-2004 3 New Order Codes added - Tables 4 and 5. 27-May-2005 4 The Features, Tables 4, 5 and the Figure 1 has been updated. Add the Mechanical Data SOC-16. 08-Jun-2005 5 Mistake on Table 4 (Q.ty Level), Table 7 has been updated and add DIE Information. 30-Jan-2006 6 Added new Package SMD5C and Removed old Package SOC-16. 26-Jan-2007 7 DIE Information and DIE Pad has been updated par. 6, pages 9 and 10. 23-Nov-2007 8 Pin information for the SMD5C package updated in Table 1; added section 7.3: FPGA power supply lines on page 11. Minor text changes. 18/19 Changes RHFL4913 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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