STA8058 Teseo™ high performance GPS multi chip module (MCM) Data Brief Features ■ GPS Multi Chip Module: – STA2058 Teseo Baseband – STA5620 RF Front-end ■ Complete Embedded Memory System: – Flash 256K+16K bytes – RAM 64K bytes. ■ 66-MHz ARM7TDMI 32 bit processor ■ High performance GPS engine (HPGPS) ■ SBAS (WAAS and EGNOS) supported ■ Sensitivity (-146dBm acquisition, -159dBm tracking) ■ Time to first fix (1s reacquisition, 2.5s hot start, 34s warm start, 39s cold start) ■ Accuracy (2m autonomous) ■ Extensive GPS receiver interfaces: 32 GPIOs, 4 UARTs, 2 SPIs, 2 I2Cs, 1CANs 2.0, 1 USB 1.1, 1 HDLC and 4 channels ADC ■ Compatible with L1 Signal (C/A code) ■ ST Proprietary Technology – CMOS Flash Embebbed technology for STA2058 – BiCMOS Sige technology for STA5620 ■ LFBGA104 lead-free package ■ -40°C to 85°C operating temperature range LFBGA104 (7x11x1.4mm) Description STA8058 Teseo MCM is a fully embedded GPS engine integrating STA2058 Teseo baseband. and STA5620 RF front-end. The embedded flash memory enables the equipment manufacturer to load the entire GPS software (including tracking, acquisition, navigation and data output) after customising its interfaces to his needs. A standard GPS library is available from ST. By combining the ARM7TDMI microcontroller core with on-chip FLASH/RAM, 16-channel GPS correlator DSP, RF Front-end and an extensive range of interfaces on single package solution, the STA8058 provides a highly-flexible and costeffective solution for GPS applications. Evaluation kits ■ STA8058 module reference designs (17x19mm and 25x25mm) ■ Evaluation board hosting STA8058 module Table 1. Device summary Order code Package Packing STA8058 LFBGA104 (7x11x1.4mm) Tray October 2007 Rev 1 For further information contact your local STMicroelectronics sales office. 1/14 www.st.com 14 Contents STA8058 Contents 1 Features summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 LFBGA104 ball out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 Power supply pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2/14 STA8058 1 Features summary Features summary ● ARM7TDMI 16/32 bit RISC CPU based host microcontroller running at a frequency up to 66 MHz. ● Complete Embedded Memory System: – FLASH 256K bytes + 16K bytes (100K erasing/programming cycles) – RAM 64K bytes. ● 16 channel High performance GPS correlation DSP. ● ST Propietary Technology: – CMOS Flash Embedded Technology for Baseband – BiCMOS Sige for Radio Front-end ● SBAS (WAAS and EGNOS) supported. ● -40°C to 85°C operating temperature range. ● 104-pin LFBGA104 package. ● Power Supply: – 3.0V to 3.6V operating supply range for Input/Output periphery – 3.0V to 3.6V operating supply range for A/D Converter reference – 1.8V operating supply range for core supply provided by internal Voltage Regulator with external stabilization capacitor or by external supply voltage – 2.4V to 3V operating supply range for RF Front-end section ● Reset and Clock Control Unit able to provide low power modes (WAIT, SLOW, STOP, STANDBY) and to generate the internal clock from the external reference through integrated PLL. ● 32 programmable General Purpose I/O, each pin programmable independently as digital input or digital output; 30 are multiplexed with peripheral functions; 16 can generate an interrupt on input level/transition. ● Real time clock module with 32KHz low power oscillator and separate power supply to continue running during stand-by mode. ● 16-bit Watchdog Timer with 8 bits prescaler for system reliability and integrity. ● One CAN module compliant with the CAN specification V2.0 part B (active) and bit rate can be programmed up to 1 MBaud. ● Four 16-bit programmable Timers with 7 bit prescaler, up to two input capture/output compare, one pulse counter function, one PWM channel with selectable frequency each. ● 4 channels 12-bit sigma-delta Analog to Digital Converter, single channel or multi channel conversion modes, single-shot or continuous conversion modes, sample rate 1 KHz, conversion range 0-2.5V. ● Three Serial Communication Interfaces (UART) allow full duplex, asynchronous, communications with external devices, independently programmable TX and RX baud rates up to 625K baud. ● One UART adapted to suit Smart Card interface needs, for asynchronous SC as defined by ISO 7816-3. It includes SC clock generation. ● Two Serial Peripheral Interfaces (SPI) allow full duplex, synchronous communications with external devices, master or slave operation, max baud rate of 5.5Mb/s. One SPI may be used as Multimedia Card interface. 3/14 Features summary 4/14 STA8058 ● Two I2C Interfaces provide multi-master and slave functions, support normal and fast I2C mode (400 KHz), 7/10 bit addressing modes. One I2C Interface is multiplexed with one SPI, so either 2 x SPI + 1 x I2C or 1 x SPI + 2 x I2C may be used at a time. ● Enhanced Interrupt Controller supports 32 interrupt vectors, independently maskable, with interrupt vector table for faster response and 16 priority levels, software programmable for each source. Up to 2 maskable interrupts may be mapped on FIQ. ● Wake-up unit allows exiting from powerdown modes by detection of an event on two external pins (one is active high and other is active low) or on internal Real Time Clock alarm. ● USB unit V1.1 compliant, software configurable endpoint setting, USB Suspend/Resume support ● High Level Data Link Controller (HDLC) unit supports full duplex operating mode, NRZ, NRZI, FM0 and MANCHESTER modes, and internal 8-bit Baud Rate Generator. ● RF Front-end Features: – LOW IF (4MHz) architecture – Compatible with GPS L1 signal – VGA Gain internally regulated – On chip programmable PLL – SPI Interface STA8058 Pin description 2 Pin description 2.1 Logic symbol Figure 1. Power Pads STA8058 Teseo MCM symbol V18 [2] Xtal (IN,Out,Clk) V33 [7] SPI (DI,DO,CS, CLK) V27 [8] Enable (Chip,RF) VSS [10] Mode GPS_CLK VSSRF [11] Sign AVSS AVDD V18BKP RF Pads TESEO MCM RF_IN AGC_CNTR IF_TEST GPSCLK Clock & Reset JTAG Port CK RSTINn JTDI JTCK JTMS JTRSTn JTDO P0.[15:0] GeneraI Purpose I/O P1.[15:0] nSTDBY_I RTCXTO RTCXTI RTC & WKUP Pads WAKEUP BOOTEN GPSDAT USBDP USBDN USB Pads 5/14 Pin description 2.2 STA8058 System block diagram Figure 2. STA8058 Teseo Baseband block diagram ARM7TD 1 DP MI 256K 64KRAM 5 DP STC (JTAG) 3 DP 5 DP HPGPS 16-ch. APB BRIDGE3 ARM7 Native BUS Flash 3 DP correlator + Emerald DSP APB BRIDGE1 VREG APB BRIDGE2 RCCU PLL INTERRUPT CONTR. ADC TIMER0 APB BUS 12-bit APB BUS 4 AF I2C0 2 AF I2C1 2 AF SPI0 4 AF 4 AF TIMER1 SPI1 4 AF 2 AF TIMER2 UART0 2 AF 4 AF TIMER3 UART1 2 AF RTC UART2 2 AF UART3 2 AF [USB] 3 DP [CAN] 2 AF HDLC 3 AF 2 DP OSCILL 16 AF Wakeup WATCH 2 AF DOG Fully Prog. 32 IO 6/14 I/O PORTS MODE RF_EN SPI_DI SPI_DO SPI_CS/ SPI_CLK TEST_CLK TEST_EN1 TEST_EN2 RF_IN hce Buffer SPI Interface Test Logic RFA test_clk lo48_clk xtal_clk reset <chip config> gps_clk sign mag 0˚ 90˚ Polyphase Filter / 48 /N CP CHIP_EN Reset Generator Combiner IF filter XO xtal_clk /2 /R PFD mag AGC XI Xtal Osc Variable LO96 gps_clk sign mag gce CMOS Drivers gce & rfe Xtal xce sample_mode (1:0) 2 bits if_out_en ADC AGC_CTRL IF_TEST XTAL_CLK GPS_CLK MAG SIGN Figure 3. IR Mixer enabled by rfe & speci fic enables STA8058 Pin description STA5620 RF Front-end 7/14 LNA 8/14 TCXO SAW Filter XTAL_IN AGC_CNTR MODE IF_TEST RF_IN VSSRF [10] VSSRF_A [2] VSSRF_IO V27_PLL[4] V33 GPS_CLK XTAL_CLK RF_EN CHIP_EN V27_RF [5] STA5620 RF Front-End GPSCLK CK AVDD V33IO_PLL V33 [4] V18BKP V18[2] VSS [4] VSS18[2] VSS_BKP VSS_REG AVSS VSSIO_PLL STA2058 Baseband V33_REG_BKP GPIO GPIO GPS_Dat S1_SCLK SPI_CLK Sign S1_MISO SPI_DO S1_SSN S1_MOSI SPI_DI SPI_CS RTCXTO RTCXTI JTDI,JTCK,JTMS,JTRSTn,JTDO BOOT0, BOOT1, BOOTEN NSTDBY_IN NRSTIN Wake_Up P1.9/PRN P1.8/PPS USB[3], CAN[2], HDLC[3] SPI[4], I2C[3], 3 UARTS [6] 3 Timers [9], ADC[4] Figure 4. STA8058 Teseo MCM The two dice must be interconnected eachother at board l leve Pin description STA8058 STA8058 Teseo MCM block diagram STA8058 Pin description 2.3 LFBGA104 ball out Table 2. Ball out for LFBGA104 package 1 2 3 4 5 6 7 8 9 10 11 12 13 A VSS AVSS AVDD V18BKP RTCXTO RTCXTI V33RE G_BKP GPSDA T nJTRST RF_EN XTAL_O UT XTAL_IN VSSRF B P1.2/T3_ OCMPA/ AIN.2 VSS18 V18 VSSBKP NSTDBY _IN V33 VSSRE G GPSCL K GPS_CLK CHIP_EN V27PLL V27PLL V27PLL C P1.1/T3_ ICAPA/AI N.1 P1.0/T3_ OCMPB/ AIN.0 P1.4/T1 _ICAPA P1.5/T1_ ICAPB NRSTIN PO.15/W AKEUP CK P0.5/S1 _MOSI SPI_DI XTAL_CLK VSSRF V27PLL V27RF D V33IO_P LL P1.3/T3_ ICAPB/AI N.3 P1.7/T1 _OCMP A VSS VSS JTCK JTDO P0.6/S1 _SCLK SPI_CLK MODE VSSRF VSSRF VSSRF_A E VSSIO_P P1.8/PP LL S P1.9/PR N.11 P1.6/T1_ OCMPB VSS18 P0.13/U2 _RX/T2. OCMPA JTMS JTDI SPI_CS IF_TEST VSSRF VSSRF RF_IN F P1.11/ CANRX P1.10/U SBCLK P0.3/SO _SSN/I1. SDA V18 P0.14/U2 _TX/T2.I CAPA V33 P0.4/S1 _MISO SPI_DO AGC_CNT R VSSRF VSSRF VSSRF_A G P1.12/ CANTX P0.1/SO _MOSI/ U3.RX P0.0/SO _MISO/U 3.TX P0.7/S1_ SSN P0.9/UO _TX/BO OT.0 P0.11/U 1_TX/B OOT.1 BOOTE N SIGN V27RF V27RF V27RF VSSRF H VSS P1.14/H RXD/IO. SDA P1.15/HT XD P0.2/SO PO.12/S _SCLK/I1 CCLK .SCL PO.8/U O_RX/U 0.TX P0.10/U 1_RX/U 1.TX V33 VSSRF:IO V33 V27RF VSSRF USBDP USBDN P1.13/H CLK/IO.S CL 2.4 Power supply pins Table 3. Power supply pins Symbol I/O V33 - Digital supply voltage for I/O circuitry (3.3 Volt) VSS - Digital ground for I/O circuitry V33IO-PLL - Digital supply voltage for I/O circuitry and for PLL reference (3.3V) D1 VSSIO-PLL - Digital ground for I/O circuitry and for PLL reference E1 V33REG_BKP - Digital supply voltage for backup block I/O circuitry and for Ballast I/O (3.3V) A7 VSSREG - Digital ground for Ballast I/O B7 V18 - Digital supply voltage for core circuitry (1.8 Volt): When using the internal voltage regulator, this pin shall not be driven by an external voltage supply, but a capacitance of at least 10μF (Tantalum, low series resistance) + 33nF (ceramic) shall be connected between these pins and VSS18 to guarantee on-chip voltage stability. B3,F5 VSS18 - Digital ground for core circuitry B2,E5 - Digital supply voltage for backup block (RTC, oscillator, Wake-up controller - 1.8 Volt): when using the internal voltage regulator, this pin shall not be driven by an external voltage supply, but a capacitance of at least 1μF shall be connected between this pin and VSSBKP to guarantee on-chip voltage stability. V18BKP Function LFBGA104 B6,F7,G10,H9,H11 A1,D4,D5,H1 A4 9/14 Pin description Table 3. STA8058 Power supply pins (continued) Symbol I/O VSSBKP - Digital ground for backup logic B4 AVDD - Analog supply voltage for the A/D converter A3 AVSS - Analog supply ground for the A/D converter A2 V27RF - Analog supply voltage for RF chain (2.7V) V27PLL - Analog supply voltage for PLL embedded into RF part (2.7V) B11,B12,B13,C12 VSSRF - Analog supply ground for RF core A13,C11,D11,D13, E11,E12,F11,F12, G13,H13 VSSRF_A - Analog supply ground for RF amplifier VSSRF_IO - Analog supply ground for RF IO circuirty Note: Function LFBGA104 C13,G10,G11,G12,H 12 D13, F13 H10 V33 and V33IO-PLL are all internally connected. Same for VSS and VSSIO-PLL. All VSS, VSS18, VSSBKP, AVSS,VSSRF,VSSRF_A and VSSRF_IO pins must be tied together to the common ground plane, taking care of noise filtering, especially on AVSS ,VSSRF , VSSRF_A and VSSRF_IO 10/14 STA8058 3 Electrical characteristics Electrical characteristics See STA2058 (Teseo Baseband) and STA5620 (RF Front-end) datasheet for related data. 11/14 Package information 4 STA8058 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 5. LFBGA104 (11x7x1.4mm) mechanical data and package dimensions mm inch DIM. MIN. TYP. A A1 MAX. MIN. TYP. 1.400 0.210 MAX. 0.0551 0.0083 A2 0.990 0.0390 A3 0.200 0.0079 A4 0.800 0.350 D 10.900 11.000 11.100 0.4291 0.4331 0.4370 E 0.400 0.0315 b D1 0.450 0.0138 0.0157 0.0177 9.600 6.900 OUTLINE AND MECHANICAL DATA 7.000 0.3780 7.100 0.2717 0.2756 0.2795 E1 5.600 0.2205 e 0.800 0.0315 F 0.700 0.0276 Body: 11 x 7 x 1.4mm ddd 0.100 0.0039 eee 0.150 0.0059 fff 0.080 0.0031 LFBGA104 Low profile Fine Pitch Ball Grid Array 8054244 B 12/14 STA8058 5 Revision history Revision history Table 4. Document revision history Date Revision 25-Oct-2007 1 Changes Initial release. 13/14 STA8058 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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