L9374 Four channel valve driver Data Brief Features ■ ■ ■ ■ ■ ■ ■ ■ Four low-side output drivers with protection diagnostic – 2 PWM controlled channels (0.2Ω typ) – 2 current controlled channels with 6% accuracy (0.3Ω typ) All outputs with 35V Zener clamp Programmable channel timer Clock monitor Integrated recirculation diodes Serial Peripheral Interface with 16bits, up to 5MHz with diagnosis Battery compatible supply voltage Detailed Load diagnosis – Over load protection – Open Load – Under-current – Under Voltage – Temperature Warning and Shutdown – Power or Signal GND loss – Freewheeling diode loss – Silent valve driver test PowerSO-36 PowerSSO-36 are stored in the PWM and in the Counter Configuration Register respectively. The PWM Controller translates the programmed digital duty cycle value in a PWM signal which controls the output. For the current controlled channels the target current value is programmed. It is also possible to program two different target currents. The target current is compared with the real load current. The output duty cycle is then calculated with an Arithmetic Logic Unit. As base for the calculation a load model is used respecting the resistivity of the load, the supply voltage as well as the internal recirculation path. To check the plausibility of the current controller all measured and calculated values are available and accessible via SPI. Description The L9374 is a four channel low side driver with integrated recirculation diodes. The switching of the channels is programmable via a SPI (Serial Peripheral Interface). The main time base is given by an external clock via CLKin. The Clock Unit monitors this external clock and provides the system clock for all timings. A Synchronization Unit is used to monitor the SPI communication and provides a sync signal for the channel activation. All channels are equipped with a load Diagnostic. This allows to detect an open load in off condition as well as an under current in on condition. The power stage is protected against over current and over temperature. A weak connection in power ground or in the recirculation path is monitored. All monitored functions can be read out in a serial diagnostic protocol dedicated for each channel via SPI.. The Output Duty Cycle for each channel can be programmed individually and will be activated by the Set Point Unit. Is possible to program two output Duty Cycles per channel with a block of 16 SPI commands as well as an individual Duration Time for each channel actuation. Both information Table 1. July 2007 Rev 2 For further information contact your local STMicroelectronics sales office. Device summary Order code Package Packing L9374 PowerSO-36 (slug down) Tube L9374XP PowerSSO-36 (exp. pad) Tube 1/10 www.st.com 10 Synchronization Unit EN SPICLK MOSI MISO SPICS Clock Unit Set Point Unit Signal / Power GND loss Power-on Reset Supply Voltage CLKIN SGND Vs Configure Register Communication 2/10 SPI Channel 1 DAC Channel 3 Channel 2 Channel 4 PWM Controller Under Current Open Load PWM Unit Current Detection Open Load Under Current Q4 PGND1/2 Q2 PGND3/4 D2/D4 PGND1/2 Q1 PGND3/4 Q3 D1/D3 Current regulated valve Safety switch Reverse polarity protection Vbatt Figure 1. Current regulated valve 1 PWM controlled valve Ignition switch Block diagram L9374 Block diagram Block diagram PWM controlled valve Diagnose Register CLK/SYNC/SPI/Test-Modi / Standard Error Detection PWM Configuration Register Count Configuration Register L9374 2 Pins description Pins description Figure 2. PowerSSO36 pins connection (top view) NC 1 36 PGND3 Q3 2 35 NC Q3 3 34 NC D1/D3 4 33 NC D1/D3 5 32 NC Q1 6 31 SGND Q1 7 30 EN PGND1 8 29 SPICS PGND12 9 28 MISO PGND2 10 27 MOSI Q2 11 26 SPICLK Q2 12 25 CLKIN NC 13 24 VS D4/D2 14 23 NC D4/D2 15 22 NC Q4 16 21 NC Q4 17 20 NC NC 18 19 PGND4 D06AT546A Figure 3. PowerSO36 pins connection (top view) PGND 1 36 PGND3 Q3 2 35 NC Q3 3 34 NC D1/D3 4 33 NC D1/D3 5 32 NC Q1 6 31 SGND Q1 7 30 EN PGND1 8 29 SPICS PGND12 9 28 MISO PGND2 10 27 MOSI Q2 11 26 SPICLK Q2 12 25 CLKIN NC 13 24 VS D4/D2 14 23 NC D4/D2 15 22 NC Q4 16 21 NC Q4 17 20 NC PGND 18 19 PGND4 AC00419 3/10 Pins description L9374 Table 2. 4/10 Pins description Pin No. PwSSO36 PwSO36 Description 1 N.C. PGND 2 Q3 Q3 Output. 3 Q3 Q3 Output. 4 D1/D3 D1/D3 Free wheeling diode. 5 D1/D3 D1/D3 Free wheeling diode. 6 Q1 Q1 Output. 7 Q1 Q1 Output. 8 PGND1 PGND1 Power ground of the output driver 1& 2. 9 PGND12 PGND12 Power ground of the output driver 1& 2. 10 PGND2 PGND2 Power ground of the output driver 1& 2. 11 Q2 Q2 Output. 12 Q2 Q2 Output. 13 N.C. N.C. 14 D4/D2 D4/D2 Free wheeling diode. 15 D4/D2 D4/D2 Free wheeling diode. 16 Q4 Q4 Output. 17 Q4 Q4 Output. 18 N.C. PGND Not connected/Power ground 19 PGND4 PGND4 Power ground of the output driver 4. 20 N.C. N.C. Not connected. 21 N.C. N.C. Not connected. 22 N.C. N.C. Not connected. 23 N.C. N.C. Not connected. 24 VS VS 25 CLKIN CLKIN 26 SPICLK SPICLK 27 MOSI MOSI Master Out Slave In for SPI communication. 28 MISO MISO Master In Slave Out for SPI communication. 29 SPICS SPICS SPI Chip Select. 30 EN EN 31 SGND SGND Signal ground. 32 N.C. N.C. Not connected. 33 N.C. N.C. Not connected. 34 N.C. N.C. Not connected. 35 N.C. N.C. Not connected. 36 PGND3 PGND3 Not connected/Power ground Not connected. Supply pin Input for precise clock. SPI communication CLocK. Enable Power ground of the output driver 3. L9374 3 Absolute maximum ratings Absolute maximum ratings Table 3. Absolute maximum ratings Symbol Parameter Min Max Unit Vs Supply voltage -0.3 38 V VDx Freewheeling diode voltage -0.3 35 V VQx Output voltage -0.3 35 V Enable voltage SPI clock voltage SPI chip select voltage SPI MOSI voltage SPI MISO voltage SPI clock input voltage -0.3 6 V -4 A -2 A +3 +10 mA VEN VSPICLK VSPICS VMOSI VMISO VCLKIN IQ1; 2 Output current at reversal voltage IQ3; 4 IEN_CL ISPICLK_ CL ISPICS_C Input clamping currents (static) Input clamping currents (dynamic) L IMOSI_CL ICLKIN_C -3 -10 L Definition: Current from outside into the L9374-> " + " Current from L9374 towards external components -> " - " Warning: Transients beyond this limit will cause currents into ESD structures which must be limited externally to ±10 mA (maximum energy to be dissipated: 2 mJ). 5/10 ESD susceptibility L9374 4 ESD susceptibility 4.1 HBM ESD susceptibility HBM according to EIA/JESD 22-A 114B otherwise defined. Table 4. HBM Pin Condition All Pins Output pins DX; QX; 4.2 PGND12, PGND3, PGND4, LGND and GND are connected together. Min Max Unit ±2 kV ±4 kV MM ESD susceptibility according to EIA/JESD22-A115-A Table 5. MM Parameter Machine Model (MM) 6/10 Condition All pins Min ± 250 Max Unit V L9374 5 Package informations Package informations In order to meet environmental requirements, ST offers this device in ECOPACK® package. This package has a Lead-free second level interconnect. The category of second level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 4. PowerSO-36 (slug down) mechanical data and package dimensions DIM. mm MIN. TYP. A a1 inch MAX. MIN. TYP. 3.60 0.10 0.30 a2 MAX. 0.1417 0.0039 0.0118 3.30 0.1299 a3 0 0.10 b 0.22 0.38 0.0087 0.0150 c 0.23 0.32 0.0091 0.0126 D 15.80 16.00 0.6220 0.6299 D1 9.40 9.80 0.3701 0.3858 E 13.90 14.5 0.5472 0.5709 E1 10.90 11.10 0.4291 0.4370 2.90 0.1142 E2 E3 5.80 e 0.0039 0.2283 0.65 e3 0 H 15.50 h 0.8 0.2441 0.0256 11.05 G L 6.20 OUTLINE AND MECHANICAL DATA 0.4350 0.10 0.0039 15.90 0.6102 0.6260 1.10 0.0433 1.10 0.0315 N 10˚ (max) s 8˚ (max) 0.0433 PowerSO-36 Note: “D and E1” do not include mold flash or protusions. - Mold flash or protusions shall not exceed 0.15mm (0.006”) - Critical dimensions are "a3", "E" and "G". 0096119 C 7/10 Package informations Figure 5. L9374 PowerSSO-36 (exposed pad) mechanical data and package dimensions DIM. A A2 a1 b c D (1) E (1) e e3 F G G1 H h L M N O Q S T U X Y MIN. 2.15 2.15 0 0.18 0.23 10.10 mm TYP. 7.4 MAX. 2.47 2.40 0.075 0.36 0.32 10.50 MIN. 0.084 0.084 0 0.007 0.009 0.398 7.6 0.291 0.50 8.50 2.3 0.55 MAX. 0.097 0.094 0.003 0.014 0.012 0.413 OUTLINE AND MECHANICAL DATA 0.299 0.020 0.035 0.090 0.10 0.06 10.50 0.40 0.85 10.10 inch TYP. 0.004 0.002 0.413 0.016 0.033 0.398 0.022 4.3 0.169 10˚ (max) 1.2 0.8 2.9 3.65 1.0 4.10 6.50 0.047 0.031 0.114 0.144 0.039 4.70 7.10 0.161 0.256 0.185 0.279 (1) “D and E” do not include mold flash or protusions. Mold flash or protusions shall not exceed 0.15mm (0.006”) (2) No intrusion allowed inwards the leads. (3) Flash or bleeds on exposed die pad shall not exceed 0.4 mm per side PowerSSO-36 (exposed pad) 7587131 A 8/10 L9374 6 Revision history Revision history Table 6. Document revision history Date Revision Changes 4-Jun-2007 1 Initial release. 31-Jul-2007 2 Updated Section 1: Block diagram , Section 2: Pins description and Section 4: ESD susceptibility. 9/10 L9374 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10