STMICROELECTRONICS L9374XP

L9374
Four channel valve driver
Data Brief
Features
■
■
■
■
■
■
■
■
Four low-side output drivers with protection
diagnostic
– 2 PWM controlled channels (0.2Ω typ)
– 2 current controlled channels with 6%
accuracy (0.3Ω typ)
All outputs with 35V Zener clamp
Programmable channel timer
Clock monitor
Integrated recirculation diodes
Serial Peripheral Interface with 16bits, up to
5MHz with diagnosis
Battery compatible supply voltage
Detailed Load diagnosis
– Over load protection
– Open Load
– Under-current
– Under Voltage
– Temperature Warning and Shutdown
– Power or Signal GND loss
– Freewheeling diode loss
– Silent valve driver test
PowerSO-36
PowerSSO-36
are stored in the PWM and in the Counter
Configuration Register respectively.
The PWM Controller translates the programmed
digital duty cycle value in a PWM signal which
controls the output.
For the current controlled channels the target
current value is programmed. It is also possible to
program two different target currents. The target
current is compared with the real load current.
The output duty cycle is then calculated with an
Arithmetic Logic Unit. As base for the calculation
a load model is used respecting the resistivity of
the load, the supply voltage as well as the
internal recirculation path. To check the
plausibility of the current controller all measured
and calculated values are available and
accessible via SPI.
Description
The L9374 is a four channel low side driver with
integrated recirculation diodes. The switching of
the channels is programmable via a SPI (Serial
Peripheral Interface). The main time base is given
by an external clock via CLKin. The Clock Unit
monitors this external clock and provides the
system clock for all timings.
A Synchronization Unit is used to monitor the SPI
communication and provides a sync signal for the
channel activation.
All channels are equipped with a load Diagnostic.
This allows to detect an open load in off condition
as well as an under current in on condition. The
power stage is protected against over current and
over temperature. A weak connection in power
ground or in the recirculation path is monitored.
All monitored functions can be read out in a serial
diagnostic protocol dedicated for each channel
via SPI..
The Output Duty Cycle for each channel can be
programmed individually and will be activated by
the Set Point Unit. Is possible to program two
output Duty Cycles per channel with a block of 16
SPI commands as well as an individual Duration
Time for each channel actuation. Both information
Table 1.
July 2007
Rev 2
For further information contact your local STMicroelectronics sales office.
Device summary
Order code
Package
Packing
L9374
PowerSO-36 (slug down)
Tube
L9374XP
PowerSSO-36 (exp. pad)
Tube
1/10
www.st.com
10
Synchronization
Unit
EN
SPICLK
MOSI
MISO
SPICS
Clock Unit
Set Point Unit
Signal / Power
GND loss
Power-on Reset
Supply Voltage
CLKIN
SGND
Vs
Configure Register
Communication
2/10
SPI
Channel 1
DAC
Channel 3
Channel 2
Channel 4
PWM
Controller
Under
Current
Open
Load
PWM
Unit
Current
Detection
Open
Load
Under
Current
Q4
PGND1/2
Q2
PGND3/4
D2/D4
PGND1/2
Q1
PGND3/4
Q3
D1/D3
Current regulated valve
Safety switch
Reverse
polarity
protection
Vbatt
Figure 1.
Current regulated valve
1
PWM controlled valve
Ignition switch
Block diagram
L9374
Block diagram
Block diagram
PWM controlled valve
Diagnose Register
CLK/SYNC/SPI/Test-Modi / Standard
Error Detection
PWM Configuration Register
Count Configuration Register
L9374
2
Pins description
Pins description
Figure 2.
PowerSSO36 pins connection (top view)
NC
1
36
PGND3
Q3
2
35
NC
Q3
3
34
NC
D1/D3
4
33
NC
D1/D3
5
32
NC
Q1
6
31
SGND
Q1
7
30
EN
PGND1
8
29
SPICS
PGND12
9
28
MISO
PGND2
10
27
MOSI
Q2
11
26
SPICLK
Q2
12
25
CLKIN
NC
13
24
VS
D4/D2
14
23
NC
D4/D2
15
22
NC
Q4
16
21
NC
Q4
17
20
NC
NC
18
19
PGND4
D06AT546A
Figure 3.
PowerSO36 pins connection (top view)
PGND
1
36
PGND3
Q3
2
35
NC
Q3
3
34
NC
D1/D3
4
33
NC
D1/D3
5
32
NC
Q1
6
31
SGND
Q1
7
30
EN
PGND1
8
29
SPICS
PGND12
9
28
MISO
PGND2
10
27
MOSI
Q2
11
26
SPICLK
Q2
12
25
CLKIN
NC
13
24
VS
D4/D2
14
23
NC
D4/D2
15
22
NC
Q4
16
21
NC
Q4
17
20
NC
PGND
18
19
PGND4
AC00419
3/10
Pins description
L9374
Table 2.
4/10
Pins description
Pin No.
PwSSO36
PwSO36
Description
1
N.C.
PGND
2
Q3
Q3
Output.
3
Q3
Q3
Output.
4
D1/D3
D1/D3
Free wheeling diode.
5
D1/D3
D1/D3
Free wheeling diode.
6
Q1
Q1
Output.
7
Q1
Q1
Output.
8
PGND1
PGND1
Power ground of the output driver 1& 2.
9
PGND12
PGND12
Power ground of the output driver 1& 2.
10
PGND2
PGND2
Power ground of the output driver 1& 2.
11
Q2
Q2
Output.
12
Q2
Q2
Output.
13
N.C.
N.C.
14
D4/D2
D4/D2
Free wheeling diode.
15
D4/D2
D4/D2
Free wheeling diode.
16
Q4
Q4
Output.
17
Q4
Q4
Output.
18
N.C.
PGND
Not connected/Power ground
19
PGND4
PGND4
Power ground of the output driver 4.
20
N.C.
N.C.
Not connected.
21
N.C.
N.C.
Not connected.
22
N.C.
N.C.
Not connected.
23
N.C.
N.C.
Not connected.
24
VS
VS
25
CLKIN
CLKIN
26
SPICLK
SPICLK
27
MOSI
MOSI
Master Out Slave In for SPI communication.
28
MISO
MISO
Master In Slave Out for SPI communication.
29
SPICS
SPICS
SPI Chip Select.
30
EN
EN
31
SGND
SGND
Signal ground.
32
N.C.
N.C.
Not connected.
33
N.C.
N.C.
Not connected.
34
N.C.
N.C.
Not connected.
35
N.C.
N.C.
Not connected.
36
PGND3
PGND3
Not connected/Power ground
Not connected.
Supply pin
Input for precise clock.
SPI communication CLocK.
Enable
Power ground of the output driver 3.
L9374
3
Absolute maximum ratings
Absolute maximum ratings
Table 3.
Absolute maximum ratings
Symbol
Parameter
Min
Max
Unit
Vs
Supply voltage
-0.3
38
V
VDx
Freewheeling diode voltage
-0.3
35
V
VQx
Output voltage
-0.3
35
V
Enable voltage
SPI clock voltage
SPI chip select voltage
SPI MOSI voltage
SPI MISO voltage
SPI clock input voltage
-0.3
6
V
-4
A
-2
A
+3
+10
mA
VEN
VSPICLK
VSPICS
VMOSI
VMISO
VCLKIN
IQ1; 2
Output current at reversal voltage
IQ3; 4
IEN_CL
ISPICLK_
CL
ISPICS_C Input clamping currents (static)
Input clamping currents (dynamic)
L
IMOSI_CL
ICLKIN_C
-3
-10
L
Definition:
Current from outside into the L9374-> " + "
Current from L9374 towards external components -> " - "
Warning:
Transients beyond this limit will cause currents into ESD
structures which must be limited externally to ±10 mA
(maximum energy to be dissipated: 2 mJ).
5/10
ESD susceptibility
L9374
4
ESD susceptibility
4.1
HBM
ESD susceptibility HBM according to EIA/JESD 22-A 114B otherwise defined.
Table 4.
HBM
Pin
Condition
All Pins
Output pins DX; QX;
4.2
PGND12, PGND3, PGND4, LGND
and GND are connected together.
Min
Max
Unit
±2
kV
±4
kV
MM
ESD susceptibility according to EIA/JESD22-A115-A
Table 5.
MM
Parameter
Machine Model (MM)
6/10
Condition
All pins
Min
± 250
Max
Unit
V
L9374
5
Package informations
Package informations
In order to meet environmental requirements, ST offers this device in ECOPACK® package.
This package has a Lead-free second level interconnect. The category of second level
Interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 4.
PowerSO-36 (slug down) mechanical data and package dimensions
DIM.
mm
MIN.
TYP.
A
a1
inch
MAX.
MIN.
TYP.
3.60
0.10
0.30
a2
MAX.
0.1417
0.0039
0.0118
3.30
0.1299
a3
0
0.10
b
0.22
0.38
0.0087
0.0150
c
0.23
0.32
0.0091
0.0126
D
15.80
16.00 0.6220
0.6299
D1
9.40
9.80
0.3701
0.3858
E
13.90
14.5
0.5472
0.5709
E1
10.90
11.10 0.4291
0.4370
2.90
0.1142
E2
E3
5.80
e
0.0039
0.2283
0.65
e3
0
H
15.50
h
0.8
0.2441
0.0256
11.05
G
L
6.20
OUTLINE AND
MECHANICAL DATA
0.4350
0.10
0.0039
15.90 0.6102
0.6260
1.10
0.0433
1.10
0.0315
N
10˚ (max)
s
8˚ (max)
0.0433
PowerSO-36
Note: “D and E1” do not include mold flash or protusions.
- Mold flash or protusions shall not exceed 0.15mm (0.006”)
- Critical dimensions are "a3", "E" and "G".
0096119 C
7/10
Package informations
Figure 5.
L9374
PowerSSO-36 (exposed pad) mechanical data and package dimensions
DIM.
A
A2
a1
b
c
D (1)
E (1)
e
e3
F
G
G1
H
h
L
M
N
O
Q
S
T
U
X
Y
MIN.
2.15
2.15
0
0.18
0.23
10.10
mm
TYP.
7.4
MAX.
2.47
2.40
0.075
0.36
0.32
10.50
MIN.
0.084
0.084
0
0.007
0.009
0.398
7.6
0.291
0.50
8.50
2.3
0.55
MAX.
0.097
0.094
0.003
0.014
0.012
0.413
OUTLINE AND
MECHANICAL DATA
0.299
0.020
0.035
0.090
0.10
0.06
10.50
0.40
0.85
10.10
inch
TYP.
0.004
0.002
0.413
0.016
0.033
0.398
0.022
4.3
0.169
10˚ (max)
1.2
0.8
2.9
3.65
1.0
4.10
6.50
0.047
0.031
0.114
0.144
0.039
4.70
7.10
0.161
0.256
0.185
0.279
(1) “D and E” do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.15mm (0.006”)
(2) No intrusion allowed inwards the leads.
(3) Flash or bleeds on exposed die pad shall not exceed 0.4 mm
per side
PowerSSO-36
(exposed pad)
7587131 A
8/10
L9374
6
Revision history
Revision history
Table 6.
Document revision history
Date
Revision
Changes
4-Jun-2007
1
Initial release.
31-Jul-2007
2
Updated Section 1: Block diagram , Section 2: Pins description and
Section 4: ESD susceptibility.
9/10
L9374
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
10/10