STPS0530Z Schottky rectifiers Main product characteristics IF(AV) 0.5 A VRRM 30 V VF(max) 0.33 V Features and benefits ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching K A SOD-123 STPS0503Z Description Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Order code Packaged in SOD-123, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package this device fits GSM and PCMCIA requirements. Table 1. Marking STPS0503Z Z53 Absolute ratings (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 30 V IF(RMS) RMS forward current 2 A IF(AV) Average forward current δ = 0.5 Ta = 55° C 0.5 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 5.5 A dV/dt Critical rate of rise of reverse voltage 10000 V/µs -65 to + 150 °C Maximum operating junction temperature (1) 150 °C Maximum temperature for soldering during 10 s 260 °C Storage temperature range Tstg Tj TL 1. Order code dPtot --------------dTj < 1 -------------------------Rth ( j – a ) October 2006 condition to avoid thermal runaway for a diode on its own heatsink Rev 2 1/7 www.st.com 7 Characteristics 1 STPS0530Z Characteristics Table 2. Thermal resistance Symbol Rth(j-a) Parameter Junction to ambient 1. Copper area on PCB S = 2.5 mm Table 3. Value Unit 340 (1) °C/W 2 Static electrical characteristics Value Symbol Parameter Test conditions STPS0530Z Typ. Tj = 25° C IR(1) Reverse leakage current Tj = 125° C Tj = 25° C Tj = 125° C Tj = 25° C VF(2) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C VR = 15 V 3 VR = VRRM 9 Max. 12 µA 5 mA 130 µA 21 mA 0.375 IF = 0.1 A 0.20 0.22 V 0.43 IF = 0.5 A 0.31 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation: P = 0.23 x IF(AV) + 0.18 IF2(RMS) 2/7 Unit 0.33 STPS0530Z Characteristics Figure 1. Conduction losses versus average Figure 2. current PF(AV)(W) Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) 0.22 δ = 0.1 δ = 0.05 0.20 δ = 0.2 0.55 δ = 0.5 0.50 0.18 0.45 0.16 0.40 δ=1 0.14 0.35 0.12 0.30 0.10 0.25 0.08 0.20 Rth(j-a)=340°C/W S=2.5mm² 0.15 0.06 T 0.10 0.04 0.02 IF(AV)(A) 0.0 0.1 Figure 3. 0.2 0.05 δ=tp/T 0.00 0.3 0.4 tp 0.5 Tamb(°C) 0.00 0.6 Non repetitive surge peak forward current versus overload duration (maximum values) 0 25 Figure 4. IM(A) 50 75 100 125 Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-a)/Rth(j-a) 4.0 1.0E+00 δ = 0.5 3.5 δ = 0.2 3.0 δ = 0.1 1.0E-01 2.5 2.0 Tamb=25°C 1.5 1.0E-02 Tamb=50°C 1.0 T Single pulse IM Tamb=75°C 0.5 t tp(s) t(s) δ=0.5 0.0 δ=tp/T 1.0E-03 1.E-03 1.E-02 Figure 5. 1.E-01 1.E+00 Reverse leakage current versus reverse voltage applied (typical values) 1.E-03 1.E-02 Figure 6. IR(mA) 1.E-01 1.E+00 1.E+01 tp 1.E+02 Reverse leakage current versus junction temperature (typical values) IR(mA) 1.E+01 1.E+01 VR=30V Tj=125°C 1.E+00 1.E+00 Tj=100°C Tj=75°C 1.E-01 1.E-01 Tj=50°C 1.E-02 1.E-02 Tj=25°C Tj(°C) VR(V) 1.E-03 1.E-03 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 0 25 50 75 100 125 3/7 Characteristics Figure 7. STPS0530Z Junction capacitance versus reverse voltage applied (typical values) Figure 8. Forward voltage drop versus forward current IFM(A) C(pF) 2.0 1000 F=1MHz VOSC=30mVRMS Tj=25°C 1.8 Tj=125°C (Maximum values) 1.6 1.4 1.2 Tj=25°C (Maximum values) Tj=125°C (Typical values) 1.0 100 0.8 0.6 0.4 0.2 VR(V) 10 1 10 Figure 9. 100 Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, Cu = 35 µm, typical values) Rth(j-a)(°C/W) 350 300 250 200 150 100 50 S(mm²) 0 0 4/7 10 20 30 40 50 60 70 80 90 100 0.0 0.00 VFM(V) 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 STPS0530Z 2 Package information Package information ● Epoxy meets UL94, V0. ● Band indicates cathode. Table 4. SOD-123 dimensions Dimensions H Ref A2 A1 b Millimeters Min. A E A D c G Max. Inches Min. 1.45 Max. 0.057 A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053 b 0.55 Typ. 0.022 Typ. c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067 G 0.25 H 3.55 0.01 3.95 0.14 0.156 Figure 10. Footprint (in millimeters) 4.45 0.65 0.97 2.51 0.97 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information 3 4 6/7 STPS0530Z Ordering information Ordering type Marking Package Weight Base qty Delivery mode STPS0530Z Z53 SOD-123 0.01 g 3000 Tape & reel Revision history Date Revision Mar-2003 1A 17-Oct-2006 2 Changes Initial release. Reformated to current standards. Updated maximum junction temperatures to 150° C and updated package illustration to show cathode bar on page 1 STPS0530Z Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7