STPS3L40 Power Schottky rectifier Main product characteristics A IF(AV) 3A VRRM 40 V Tj (max) 150° C VF(max) 0.44 V K SMC STPS3L40S Features and Benefits ■ Negligible switching losses ■ Low thermal resistance ■ Low forward voltage drop ■ Avalanche capability specified A K SMB flat STPS3L40UF Description Order codes Schottky rectifier suited for switched mode power supplies and high frequency DC to DC converters. Packaged in SMC, and low profile SMB, this device is intended for use in DC/DC chargers. Table 1. Marking STPS3L40S S3L4 STPS3L40UF FS3L4 Absolute Ratings (limiting values) Symbol Parameter Value Unit 40 V 3 A VRRM Repetitive peak reverse voltage IF(AV) Average forward current IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 1300 W -65 to + 175 °C 150 °C Tstg dPtot --------------dTj SMC TL = 120° C δ = 0.5 SMB flat TL = 130° C δ = 0.5 Storage temperature range Operating junction temperature (1) Tj 1. Part Number < 1 -------------------------Rth ( j – a ) February 2007 condition to avoid thermal runaway for a diode on its own heatsink Rev 3 1/8 www.st.com 8 Characteristics 1 STPS3L40 Characteristics Table 2. Thermal resistance Symbol Rth(j-l) Parameter Value SMC 18 SMB flat 10 Unit Junction to lead Table 3. Static electrical characteristics Symbol IR(1) °C/W Parameter Test Conditions Tj = 25° C Reverse leakage current VR = VRRM Tj = 125° C IF = 3 A Tj = 125° C Forward voltage drop 16 Max. Unit 100 µA 40 mA 0.5 Tj = 25° C VF(1) Typ. 0.40 0.44 V Tj = 25° C 0.62 IF = 6 A Tj = 125° C 0.52 0.58 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.30 x IF(AV) + 0.047 IF2(RMS) Figure 1. Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) - SMC IF(AV)(A) PF(AV)(W) 3.5 2.0 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-l) 1.6 SMC 3.0 δ = 0.05 δ=1 2.5 Rth(j-a)=75°C/W 1.2 2.0 1.5 0.8 1.0 T T 0.4 0.5 IF(AV)(A) δ=tp/T 0.0 0.0 2/8 0.5 1.0 1.5 2.0 2.5 3.0 δ=tp/T tp 0.0 3.5 4.0 0 Tamb(°C) tp 25 50 75 100 125 150 STPS3L40 Characteristics Figure 3. Average forward current versus ambient temperature (δ = 0.5) SMB flat Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) SMC IM(A) IF(AV)(A) 14 3.5 SMC Rth(j-a)=Rth(j-l) 12 3.0 SMB flat 2.5 10 Rth(j-a)=75°C/W Ta=25°C 2.0 8 1.5 6 1.0 Ta=75°C 4 Ta=125°C T IM 0.5 2 δ=tp/T 0.0 0 t Tamb(°C) tp t(s) δ=0.5 0 25 Figure 5. 50 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat 1.E-03 Figure 6. IM(A) 1.E-01 1.E+00 Normalized avalanche power derating versus pulse duration PARM(tp) PARM(1µs) 45 SMB flat (non exposed pad) 40 1.E-02 1 35 30 0.1 25 TL=25°C 20 TL=75°C 15 0.01 TL=125°C 10 IM 5 t t(s) δ=0.5 1.E-03 Figure 7. 1.E-02 tp(µs) 0.001 0 1.E-01 0.01 1.E+00 Normalized avalanche power derating versus junction temperature Figure 8. 0.1 1 10 100 1000 Relative variation of thermal impedance junction to ambient versus pulse duration - SMC Zth(j-c)/Rth(j-c) PARM(tp) PARM(25°C) 1.0 0.9 1.2 SMC 0.8 1 0.7 0.8 0.6 0.5 0.6 0.4 0.4 0.3 T 0.2 0.2 Single pulse Tj(°C) 0.1 0 25 50 75 100 125 150 tp(s) δ=tp/T 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 tp 1.E+03 3/8 Characteristics Figure 9. STPS3L40 Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat Figure 10. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) Zth(j-l)/Rth(j-l) 1.E+02 1.0 SMB flat 0.9 Tj=125°C 1.E+01 0.8 Tj=100°C 0.7 1.E+00 0.6 0.5 0.4 1.E-01 0.3 Tj=25°C 0.2 1.E-02 Single pulse 0.1 tp(s) VR(V) 0.0 1.E-03 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 0 5 10 15 20 25 30 35 40 Figure 12. Forward voltage drop versus forward current IFM(A) C(pF) 100 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C (typical values) 10 Tj=125°C (maximum values) 100 1 Tj=25°C (maximum values) 0 VR(V) VFM(V) 10 0 1 10 100 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU=35µm) Rth(j-a)(°C/W) 110 100 90 SMC 80 70 60 SMB flat 50 40 30 20 10 SCU(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 FIG 15A - WITHOUT EXPOSED PAD 4/8 4.0 4.5 5.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 STPS3L40 2 Package Information Package Information ● Epoxy meets UL94,V0 Table 4. SMC package mechanical data Dimensions Ref Millimeters Inches E1 Min. Max. Min. Max. A 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.40 0.030 0.063 D E A1 C A2 E2 L b Figure 14. SMC footprint (dimensions in mm) 1.54 5.03 1.54 3.15 8.11 5/8 Package Information Table 5. STPS3L40 SMB Flat dimensions Dimensions Ref. D L L2 E E1 L L1 b Inches Min. Typ. Max. Min. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 (1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 A c Millimeters c Typ. L1 0.40 0.016 L2 0.60 0.024 Max. 1. Applies to plated leads Figure 15. SMB Flat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 1.20 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STPS3L40 3 4 Ordering information Ordering information Ordering type Marking Package Weight Base qty Delivery mode STPS3L40S S3L4 SMC 0.24 g 2500 Tape and reel STPS3L40UF FS3L4 SMB flat 0.50 g 5000 Tape and reel Revision history Date Revision Jul-2003 2A 08-Feb-2007 3 Description of Changes Last update. Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. 7/8 STPS3L40 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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