STTH2003C Hight frequency secondary rectifier Main product characteristics IF(AV) 2 x 10 A VRRM 300 V Tj (max) 170° C VF(max) 1V trr (typ) 35 ns A1 K A2 K A2 K A1 ■ Combines highest recovery and reverse voltage performance ■ Ultra-fast, soft and noise-free recovery ■ Insulated packages: TO-220FPAB Electric insulation: 2000 V DC Capacitance: 12 pF A2 TO-220AB STTH2003CT K A1 I2PAK STTH2003CR Order codes Packaged in TO-220AB, TO-220FPAB, I2PAK or D2PAK, this device is especially intended for secondary rectification. March 2007 A2 K A1 Description Dual center tap Fast Recovery Epitaxial Diodes suited for Switch Mode Power Supply and high frequency DC/DC converters. D2PAK STTH2003CG TO-220FPAB STTH2003CFP Features and benefits A2 A1 Rev 8 Part Number Marking STTH2003CT STTH2003CT STTH2003CG STTH2003CG STTH2003CG-TR STTH2003CG STTH2003CF STTH2003CF STTH2003CFP STTH2003CFP STTH2003CR STTH2003CR 1/11 www.st.com 11 Characteristics STTH2003C 1 Characteristics Table 1. Absolute ratings (limiting values, per diode) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 300 V IF(RMS) RMS forward voltage 30 A IF(peak) Peak working forward current δ = 0.5 10 20 A 110 A 5 A -65 to + 175 °C 175 °C Value (max) Unit I2PAK, D2PAK, TO-220AB Tc = 140°C TO-220FPAB Tc = 125°C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal IRSM Non repetitive avalanche current tp = 10 µs square Tstg Storage temperature range Tj Table 2. Maximum operating junction temperature Thermal resistance Symbol Parameter I2PAK, D2PAK, TO-220AB Rth(j-c) Per diode Per device Per diode 2.5 Total 1.3 Per diode 4.6 Junction to case TO-220FPAB °C/W Total Rth(c) Table 3. Symbol I2PAK, D2PAK, TO-220AB Coupling 0.1 TO-220FPAB 3.5 Coupling Static electrical characteristics (per diode) Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25° C Tj = 125° C Tj = 25° C Tj = 125° C Typ Max. Unit µA 30 300 1.25 IF = 10 A 1. Pulse test: tp = 5 ms, δ < 2 % 2/11 Min. 20 VR = 300 V 2. Pulse test: tp = 380 µs, δ < 2 % Note: 4 To evaluate the conduction losses use the following equation: P = 0.75 x IF(AV) + 0.025 IF2(RMS)) V 0.85 1 STTH2003C Table 4. Symbol trr Characteristics Recovery Characteristics Parameter Reverse recovery time Test conditions Tj = 25°C IF = 0.5 A IR = 1 A Min. Typ Irr = 0.25 A Max. Unit 25 ns VR = 30 V IF = 1 A dIF/dt = -50 A/µs 35 Forward recovery time Tj = 25°C IF = 10 A dIF/dt = 100 A/µs VFR = 1.1 x VFmax 230 ns VFP Peak forward voltage Tj = 25°C IF = 10 A 3.5 V IRM Reverse recovery current VCC = 200V IF = 10 A dIF/dt = 200 A/µs 8 A Tj = 125°C tfr Sfactor Softness factor dIF/dt = 100 A/µs 0.3 - 3/11 Characteristics Figure 1. STTH2003C Conduction losses versus average Figure 2. forward current (per diode) P1(W) Forward voltage drop versus forward current (maximum values, per diode) IFM(A) 14 δ = 0.05 12 200 δ = 0.1 δ = 0.2 δ = 0.5 100 Tj=125°C 10 δ=1 8 Tj=25°C 10 6 4 Tj=75°C T 2 IF(AV)(A) δ=tp/T 0 0 2 Figure 3. 4 6 8 VFM(V) tp 10 12 1 0.50 0.75 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB / D2PAK / I2PAK) 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 Relative variation of thermal impedance junction to case versus pulse duration (TO-22FP0AB) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.8 0.8 δ = 0.5 δ = 0.5 0.6 0.6 δ = 0.2 0.4 δ = 0.2 0.4 δ = 0.1 δ = 0.1 T T 0.2 0.2 Single pulse δ=tp/T tp(s) 0.0 1E-3 1E-2 Figure 5. tp 1E-1 δ=tp/T tp(s) 1E+0 tp 0.0 1E-2 1E-1 Peak reverse recovery current Figure 6. versus dIF/dt (90% confidence, per diode) 1E+0 1E+1 Reverse recovery time versus dIF/dt (90% confidence, per diode) trr(ns) IRM(A) 100 16 VR=200V Tj=125°C VR=200V Tj=125°C 14 Single pulse IF=2 x IF(AV) 12 80 IF=IF(AV) IF=IF(AV) 10 IF=0.5 x IF(AV) 60 IF=2 x IF(AV) IF=0.5 x IF(AV) 8 40 6 4 20 2 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 4/11 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 STTH2003C Figure 7. Characteristics Softness factor (tb/ta) versus dIF/dt Figure 8. (typical values, per diode) S factor Relative variation of dynamic parameters versus junction temperature (reference: Tj = 125°C) 2.4 0.60 2.2 VR=200V Tj=125°C 0.50 2.0 1.8 S factor 1.6 0.40 1.4 1.2 0.30 1.0 0.8 0.20 IRM 0.6 0.4 0.10 0.2 dIF/dt(A/µs) 0.00 Tj(°C) 0.0 0 50 Figure 9. 100 150 200 250 300 350 400 450 500 25 50 75 100 125 Transient peak forward voltage Figure 10. Forward recovery time versus dIF/dt versus dIF/dt (90% confidence, per (90% confidence, per diode) diode) (TO-220AB) tfr(ns) VFP(V) 500 10 IF=IF(AV) VFR=1.1 x VF max. Tj=125°C IF=IF(AV) Tj=125°C 8 400 6 300 4 200 2 100 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 Figure 11. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35 µm) (D2PAK). Rth(j-a)(°C/W) 80 70 60 50 40 30 20 10 S(Cu)(cm²) 0 0 5 10 15 20 25 30 35 40 5/11 Package information 2 STTH2003C Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.55 Nm ● Maximum torque value: 0.70 Nm I2PAK dimensions Table 5. Dimensions Ref. A E c2 L2 D L1 A1 b1 L b c Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 e e1 6/11 STTH2003C Package information Table 6. D2PAK dimensions Dimensions Ref. Millimeters Min. A E C2 L2 D L L3 Typ. Inches Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 1.40 0.048 0.055 A1 B2 R C B G A2 2mm min. FLAT ZONE V2 R V2 0.40 0° 0.016 8° 0° 8° Figure 12. Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 8.90 3.70 7/11 Package information Table 7. STTH2003C TO-220AB dimensions Dimensions Ref. Dia Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 C L5 L7 L6 L2 F2 D L9 L4 L2 F M G1 Inches A H2 F1 Millimeters 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 E G M Diam. 8/11 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 STTH2003C Package information Table 8. TO-220FPAB dimensions Dimensions Ref. A B H Dia L6 L2 L7 L3 L5 F1 L4 F G Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 D F2 G1 Millimeters L2 E 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information 3 4 10/11 STTH2003C Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH2003CT STTH2003CT TO-220AB 2.2 g 50 Tube STTH2003CG STTH2003CG D2PAK 1.48 g 50 Tube STTH2003CG-TR STTH2003CG D2PAK 1.48 g 500 Tape & reel STTH2003CFP STTH2003CFP TO-220AB 2.08 g 50 Tube STTH2003CR STTH2003CR I2PAK 1.49 g 50 Tube Revision history Date Revision Aug-2003 7D 26-Mar-2007 8 Description of Changes Last release. Removed ISOWATT package. STTH2003C Please Read Carefully: Information in this document is provided solely in connection with ST products. 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