STTH2002 Ultrafast recovery diode Main product characteristics IF(AV) 20 A VRRM 200 V Tj (max) 175° C VF (typ) 0.86 V trr (typ) 16 ns K A K A Features and benefits ■ Ultrafast switching ■ Low reverse current ■ Low thermal resistance ■ Reduces switching and conduction losses ■ High Tj ■ Insulating voltage: 2500 Vrms ■ Capacitance: 7 pF A K K TO-220AC STTH2002D TO-220ACins STTH2002DI K A Description Single rectifier suited for switch mode power supply and high frequency DC to DC converter. Packaged in D²PAK, TO-220AC and insulated TO220AC, this device is intended for low voltage, high frequency inverters, free wheeling and polarity protection applications May 2006 NC D2PAK STTH2002G Order codes Part Number Marking STTH2002D STTH2002 STTH2002DI STTH2002 STTH2002G STTH2002 STTH2002G-TR STTH2002 Rev 1 1/10 www.st.com Characteristics STTH2002 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) RMS forward current 35 A 20 A 175 A -65 to + 175 °C 175 °C Value Unit IF(AV) Average forward current, δ = 0.5 IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Table 2. TO-220AC, D2PAK Tc = 120° C TO-220ACins Tc = 60° C tp = 10 ms Sinusoidal Maximum operating junction temperature Thermal parameters Symbol Parameter TO-220AC, D2PAK Rth(j-c) Table 3. Symbol IR(1) ° C/W TO-220ACins Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 150° C VF Forward voltage drop Min. Typ Max. Unit 10 VR = VRRM IF = 20 A µA 10 100 1 1.1 0.86 0.95 Tj = 25° C Tj = 125° C 1.15 IF = 25 A Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.75 x IF(AV) + 0.01 IF2(RMS) 2/10 5 Static electrical characteristics Tj = 25° C (2) 2.4 Junction to case 0.94 1.05 0.9 1 V STTH2002 Characteristics Table 4. Dynamic characteristics Symbol Parameter trr Test conditions Typ Max. IF = 1 A, dIF/dt = -200 A/µs, VR = 30 V, Tj = 25 °C 16 20 IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C 33 40 Reverse recovery current IF = 20 A, dIF/dt = 100 A/µs, VR = 160 V, Tj = 125 °C 8 10 Forward recovery time IF = 20 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax, Tj = 25 °C 230 ns Forward recovery voltage IF = 20 A, dIF/dt = 100 A/µs, VFR = 1.1 x VFmax, Tj = 25 °C 2 V Reverse recovery time IRM tfr VFP Figure 1. Peak current versus duty cycle Figure 2. Min. Unit ns A Forward voltage drop versus forward current (typical values) IM(A) IFM(A) 100 200 T IM 180 δd=tp/T 80 tp 160 140 60 120 P = 10 W 100 40 80 P=5W Tj=150°C 60 P=3W Tj=25°C 40 20 20 δ 0 0.0 Figure 3. 0.1 VFM(V) 0 0.0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.5 1.0 1.5 2.0 2.5 1.0 Forward voltage drop versus forward current (maximum values) Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration Zth(j-c)/Rth(j-c) IFM(A) 200 1.0 Single pulse TO-220AC TO-220ACins D²PAK 180 160 140 120 100 80 Tj=150°C 60 Tj=25°C 40 20 VFM(V) tp(s) 0 0.0 0.5 1.0 1.5 2.0 2.5 0.1 1.E-03 1.E-02 1.E-01 1.E+00 3/10 Characteristics Figure 5. STTH2002 Junction capacitance versus reverse applied voltage (typical values) Figure 6. C(pF) Reverse recovery charges versus dIF/dt (typical values) QRR(nC) 1000 400 F=1MHz Vosc=30mVRMS Tj=25°C IF = 20 A VR = 160 V 350 300 250 100 Tj=125 °C 200 150 100 Tj=25 °C 50 dIF/dt(A/µs) VR(V) 10 0 1 10 Figure 7. 100 1000 Reverse recovery time versus dIF/dt (typical values) 10 100 Figure 8. tRR(ns) 1000 Peak reverse recovery current versus dIF/dt (typical values) IRM(A) 80 20 IF=20A VR=160V 70 IF= 20 A VR= 160 V 18 16 60 Tj = 125 °C 14 50 12 40 Tj=125 °C 10 Tj = 25 °C 30 8 6 20 Tj=25 °C 4 10 dIF/dt(A/µs) 2 dIF/dt(A/µs) 0 0 10 Figure 9. 100 10 1000 Dynamic parameters versus junction temperature 100 1000 Figure 10. Thermal resistance, junction to ambient, versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 µm) for D2PAK QRR; IRM [T j] / Q RR; IRM [T j=125°C] Rth(j-a) (°C/W) 80 1.4 D²PAK IF=20 A VR= 160 V 1.2 70 60 1.0 50 IRM 0.8 40 0.6 QRR 30 0.4 20 0.2 10 Tj(°C) SCU(cm²) 0 0.0 25 4/10 50 75 100 125 150 0 5 10 15 20 25 30 35 40 STTH2002 2 Ordering information scheme Ordering information scheme STTH 20 02 XXX Ultrafast switching diode Average forward current 20 = 20 A Repetitive peak reverse voltage 02 = 200 V Package D = TO-220AC in Tube DI = TO-220ACins in Tube G = D2PAK in Tube G-TR = D2PAK in Tape and reel 5/10 Package information 3 STTH2002 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm Table 5. T0-220AC dimensions DIMENSIONS REF. A H2 ØI C L5 L7 L6 L2 F1 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 D L9 L4 L2 F M E 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 G M Diam. I 6/10 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 STTH2002 Package information Table 6. T0-220ACins dimensions DIMENSIONS REF Millimeters Min. A 15.20 a1 C B ØI b2 L F A I4 c2 a1 l2 a2 M b1 e c1 Typ. Inches Max. Min. 15.90 0.598 3.75 Typ. Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 M 2.60 0.646 0.661 0.102 7/10 Package information Table 7. STTH2002 D2PAK dimensions DIMENSIONS REF. A E C2 L2 D Millimeters Inches Min. Max Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 L L3 A1 B2 R C B G A2 2mm min. FLAT ZONE V2 R V2 0.40 typ. 0° 0.016 typ. 8° 0° 8° Figure 11. D2PAK footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STTH2002 4 Ordering information Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH2002D STTH2002 TO-220AC 1.90 g 50 Tube STTH2002DI STTH2002 TO-220ACins 2.30 g 50 Tube STTH2002G STTH2002 D2PAK 1.48 g 50 Tube STTH2002 D2 1.48 g 1000 Tape and reel STTH2002G-TR 5 PAK Revision history Date Revision 03-May-2006 1 Description of Changes First issue 9/10 STTH2002 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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