TPN3021 Tripolar overvoltage protection for network interfaces Features ■ Triple crowbar protection ■ Low capacitance ■ Low holding current: IH = 30 mA minimum ■ Surge current: – IPP = 200 A, 2/10 µs – IPP = 30 A, 10/1000 µs Main applications SO-8 Dedicated to data line protection, this device provides a tripolar protection function. It ensures the same protection capability with the same breakdown voltage in both common and differential modes. Description Schematic diagram The TPN3021 is a low capacitance transient surge arrestor designed for protection of high debit rate communication network. Its low capacitance avoids distorsion of the signal as it has been designed for T1/E1 and Ethernet networks. Rx+ / Tx+ 1 8 NC NC 2 7 NC NC 3 6 GND Rx- / Tx- 4 5 NC Benefits Trisil technology is not subject to ageing and provides a fail safe mode in short circuit for a better protection. They are used to help equipment to meet main standards such as UL1950, IEC950 / CSA C22.2 and UL1459. They have UL94 V0 ap-proved resin. SO8 package is JEDEC registered. Trisils comply with the following standards GR1089 Core, ITU-T-K20/K21, VDE0433, VDE0878, IEC61000-4-2. February 2006 Rev 4 1/8 www.st.com 8 Characteristics TPN3021 1 Characteristics Table 1. Complies with the following standards Standard Peak surge voltage (V) Voltage waveform Required peak current (A) Current waveform Minimum serial resistor to meet standard (Ω) GR-1089 Core First level 2500 1000 2/10 µs 10/1000 µs 500 100 2/10 µs 10/1000 µs 7.5 25 GR-1089 Core Intrabuilding 1500 2/10 µs 100 2/10 µs 0 ITU-T-K20/K21 1000 10/700 µs 25 5/310 µs 0 ITU-T-K20 (IEC61000-4-2) 6000 8000 1/60 ns VDE0433 4000 2000 10/700 µs 100 50 5/310 µs 40 0 VDE0878 4000 2000 1.2/50 µs 100 50 1/20 µs 0 0 IEC61000-4-5 2000 2000 10/700 µs 1.2/50 µs 50 50 5/310 µs 8/20 µs 0 0 Table 2. - Electrical characteristics (Tamb=25°C) Symbol 2/8 ESD contact discharge ESD air discharge Parameter VRM Stand-off voltage VBO Breakover voltage VBR Breakdown voltage IH Holding current IBO Breakover current IRM Leakage current at VRM IPP Peak pulse current C Capacitance VR Continous reverse voltage IR Leakage current at VR I IPP IBO IR IH IRM V VRM VR Rev 4 VBR VBO TPN3021 Characteristics Table 3. Absolute ratings (Tamb =25°C) Symbol Parameter Value Unit 10/1000 µs 8/20 µs 10/560 µs 5/310 µs 10/160 µs 1/20 µs 2/10 µs 30 100 40 50 75 100 200 A Non repetitive surge peak on-state current One cycle 50 Hz 60 Hz 8 9 A Non repetitive surge peak on-state current F=50Hz 0.2 s 2s 3 1.5 A -55 to +150 -40 to +150 °C °C 260 °C Peak pulse pulse current: tr / tp Ipp ITSM Storage temperature range Operating junction temperature range Tstg Tj Maximum lead temperature for soldering during 10s TL Repetitive peak pulse current tr : rise time (µs) tp: pulse duration time (µs) % I PP 100 example: pulse waveform 10/1000 µs, tr = 10 µs, tp = 1000 µs 50 0 tr Table 4. t tp Thermal resistances Symbol Parameter Value Unit Rth(j-a) Junction to ambient 170 °C/W Table 5. Electrical parameters (Tamb = 25°C) VBO max@IBO (1) IRM @VRM Type TPN3021 max. max. IH (2) min. C(3) typ. µA V V mA mA pF 4 28 38 300 30 16 1. See Figure 1: Test circuit 1 for IBO and VBO parameters 2. See Figure 2: Test circuit 2 for IH parameter 3. VR = 0 V bias, VRMS = 1 V, F = 1 MHz Rev 4 3/8 Characteristics Figure 1. TPN3021 Test circuit 1 for IBO and VBO parameters K ton = 20ms R1 = 140Ω R2 = 240Ω VBO measurement DUT Vout 1/4 IBO measurement Figure 2. Test circuit 2 for IH parameter Surge generator R D.U.T Vbat < Vbr 4/8 Rev 4 TPN3021 Ordering information scheme Figure 3. Non repetitive surge peak on-state current versus overload duration (Tj initial = 25°C) Figure 4. C(pF) ITSM(A) 12 F=50Hz 10 8 6 4 2 t(s) 0 1E-2 Variation of junction capacitance versus reverse voltage applied (typical values) 1E-1 Figure 5. 1E+0 1E+1 1E+2 1E+3 22 20 18 16 14 12 10 8 6 4 2 0 Tj=25°C F=1MHz VRMS=1V VR(V) 0 5 10 15 20 25 30 Relative variation of holding current versus junction temperature IH[Tj] / IH[Tj=25°C] 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 2 Tj(°C) -20 0 20 40 60 80 100 120 Ordering information scheme TPN 30 2 1 RL Tripolar Protection for Network Numerical code Version Package: 1 = SO-8 Plastic Packaging: RL = Tape & reel = Tube Rev 4 5/8 Package mechanical data 3 TPN3021 Package mechanical data Table 6. SO-8 (Plastic) dimensions DIMENSIONS REF. Millimetres Min. Typ. A a1 0.1 a2 Inches Max. Min. Typ. Max. 1.75 0.069 0.25 0.004 0.010 1.65 0.065 b 0.35 0.48 0.014 0.019 b1 0.19 0.25 0.007 0.010 C 0.50 0.020 c1 45° (typ) D 4.8 5.0 0.189 0.197 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 3.81 0.150 F 3.8 4.0 0.15 0.157 L 0.4 1.27 0.016 0.050 0.6 0.024 M S 8° (max) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 Rev 4 TPN3021 4 Ordering information Ordering information Part number Marking TPN3021 TPN302 TPN3021RL (1) Package Weight SO-8 0.08 g TPN302 Base qty Delivery mode 100 Tube 2500 Tape and reel 1. Preferred device 5 Revision history Date Revision Sep 2001 3 Previous release. 4 Reformatted to current template. Maximum junction temperature parameter replaced by Operating junction temperature range in Table 3. Added footnote 1 to Ordering information table 07-Feb-2006 Changes Rev 4 7/8 TPN3021 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Rev 4