SMP50 / SMTPA / TPA ® TRISIL™ FOR TELECOM EQUIPMENT PROTECTION FEATURES ■ Bidirectional crowbar protection ■ Voltage range from 62V to 270V ■ Low capacitance from 12pF to 20pF @ 50V ■ Low leakage current : IR = 2µA max ■ Holding current: IH = 150 mA min ■ Repetitive peak pulse current : IPP = 50 A (10/1000µs) MAIN APPLICATIONS Telecommunication equipment such as: ■ ■ SMA (JEDEC DO-214AC) SMP50 SMB (JEDEC DO-214AA) SMTPA Analog and digital line cards (xDSL, T1/E1, ISDN, ...) Terminals (phone, fax, modem, ...) and central office equipment DO-15 TPA DESCRIPTION These Trisil series have been designed to protect telecommunication equipment against lightning and transient induced by AC power lines. They are available in SMA, SMB and DO-15 packages. BENEFITS Trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection. They are used to help equipment to meet various standards such as UL1950, IEC950 / CSA C22.2, UL1459 and FCC part 68. Trisils have UL94 V0 approved resin. SMA and SMB packages are JEDEC registered (DO-214AC and DO-214AA). Trisils are UL497B approved (file: E136224). November 2004 Table 1: Order Codes Part Number SMP50-xxx TPAxxx SMTPAxxx Marking See page 9 Figure 1: Schematic Diagram REV. 1 1/10 SMP50 / SMTPA / TPA Table 2: In compliances with the following standards STANDARD Peak Surge Voltage (V) Waveform Voltage Required peak current (A) Current waveform Minimum serial resistor to meet standard (Ω) GR-1089 Core First level 2500 1000 2/10 µs 10/1000 µs 500 100 2/10 µs 10/1000 µs 20 10 GR-1089 Core Second level 5000 2/10 µs 500 2/10 µs 40 GR-1089 Core Intra-building 1500 2/10 µs 100 2/10 µs 0 ITU-T-K20/K21 6000 1500 10/700 µs 150 37.5 5/310 µs 53 0 ITU-T-K20 (IEC61000-4-2) 8000 15000 1/60 ns VDE0433 4000 2000 10/700 µs 100 50 5/310 µs 21.5 0 VDE0878 4000 2000 1.2/50 µs 100 50 1/20 µs 0 0 IEC61000-4-5 4000 4000 10/700 µs 1.2/50 µs 100 100 5/310 µs 8/20 µs 21.5 0 FCC Part 68, lightning surge type A 1500 800 10/160 µs 10/560 µs 200 100 10/160 µs 10/560 µs 12.5 6.5 FCC Part 68, lightning surge type B 1000 9/720 µs 25 5/320 µs 0 ESD contact discharge ESD air discharge 0 0 Table 3: Absolute Ratings (Tamb = 25°C) Symbol Parameter IPP Repetitive peak pulse current (see figure 2) IFS Fail-safe mode : maximum current (note 1) ITSM I2t Tstg Tj TL Non repetitive surge peak on-state current (sinusoidal) I2t value for fusing Storage temperature range Maximum junction temperature Maximum lead temperature for soldering during 10 s. Note 1: in fail safe mode, the device acts as a short circuit 2/10 Value Unit 50 100 55 65 75 100 100 A 8/20 µs 2.5 kA t = 0.2 s t=1s t=2s t = 15 mn 16 11.5 10 3.5 A t = 16.6 ms t = 20 ms 6.2 6.5 A2s -55 to 150 150 °C 260 °C 10/1000 µs 8/20 µs 10/560 µs 5/310 µs 10/160 µs 1/20 µs 2/10 µs SMP50 / SMTPA / TPA Table 4: Thermal Resistances Symbol Rth(j-a) Rth(j-l) Parameter Junction to ambient (with recommended footprint or with Llead = 10mm for DO-15) Junction to leads (Llead = 10mm for DO-15) DO-15 Value SMA SMB 100 120 100 °C/W 60 30 20 °C/W Unit Table 5: Electrical Characteristics (Tamb = 25°C) Symbol Parameter VRM Stand-off voltage VBR Breakdown voltage VBO Breakover voltage IRM Leakage current IPP Peak pulse current IBO Breakover current IH Holding current VR Continuous reverse voltage IR Leakage current at VR C Capacitance IRM @ VRM Types max. IR @ VR max. note1 µA SMP50-62 / TPA62 SMTPA62 SMP50-68 / TPA68 SMTPA68 SMP50-100 / TPA100 SMTPA100 SMP50-120 / TPA120 SMTPA120 SMP50-130 / TPA130 SMTPA130 SMP50-180 / TPA180 SMTPA180 SMP50-200 / TPA200 SMTPA200 SMP50-220 / TPA220 SMTPA220 SMP50-240 / TPA240 SMTPA240 SMP50-270 / TPA270 SMTPA270 Note 1: Note 2: Note 3: V µA Dynamic Static VBO VBO @ IBO max. max. max. note 2 note 3 C C min. typ. typ. note 4 note 5 note 6 mA pF pF V V V 56 62 85 82 20 40 61 68 93 90 20 40 90 100 135 133 16 35 108 120 160 160 16 30 130 173 173 14 30 117 2 5 mA IH 800 150 162 180 235 240 14 25 180 200 262 267 12 25 198 220 285 293 12 25 216 240 300 320 12 25 243 270 350 360 12 25 IR measured at VR guarantee VBR min ≥ VR see functional test circuit 1 see test circuit 2 Note 4: see functional holding current test circuit 3 Note 5: VR = 50V bias, VRMS=1V, F=1MHz Note 6: VR = 2V bias, VRMS=1V, F=1MHz 3/10 SMP50 / SMTPA / TPA Figure 2: Pulse waveform (10/1000µs) % I PP Figure 3: Non repetitive surge peak on-state current versus overload duration ITSM(A) Repetitive peak pulse current 30 tr = rise time (µs) tp = pulse duration time (µs) 100 F=50Hz 25 20 15 50 10 5 0 tr t(s) t tp 0 1E-2 Figure 4: On-state voltage versus on-state current (typical values) 1E-1 1E+0 1E+1 1E+2 1E+3 Figure 5: Relative variation of holding current versus junction temperature IH[Tj] / IH[Tj=25°C] IT(A) 2.0 50 1.8 1.6 Tj=25°C 20 1.4 1.2 10 1.0 0.8 5 0.6 0.4 2 0.2 VT(V) Tj(°C) 0.0 1 0 1 2 3 4 5 6 7 8 9 10 Figure 6: Relative variation of breakover voltage versus junction temperature -40 -20 0 20 40 60 80 100 120 Figure 7: Relative variation of leakage current versus reverse voltage applied (typical values) VBO[Tj] / VBO[Tj=25°C] IRM[Tj] / IRM[Tj=25°C] 1.10 2000 VR=VRM 1000 1.05 100 1.00 270 V 10 0.95 62 V Tj(°C) Tj(°C) 1 0.90 -40 4/10 -20 0 20 40 60 80 100 25 50 75 100 125 SMP50 / SMTPA / TPA Figure 8: Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4, SCu=35µm, recommended pad layout) Figure 9: Relative variation of junction capacitance versus reverse voltage applied (typical values) C[VR] / C[VR=50V] Zth(j-a)(°C/W) 2.5 1E+2 Tj=25°C F=1MHz VRMS=1V 2.0 SMTPA / TPA 1E+1 1.5 SMP50 1.0 1E+0 0.5 VR(V) tp(s) 1E-1 0.0 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 1 2 5 10 20 50 100 300 Figure 10: Test circuit 1 for Dynamic IBO and VBO parameters 100 V / µs, di /dt < 10 A / µs, Ipp = 50 A 2Ω U 83 Ω 45 Ω 10 µF 66 Ω 46 µH 0.36 nF 470 Ω KeyTek 'System 2' generator with PN246I module 1 kV / µs, di /dt < 10 A / µs, Ipp = 10 A 250 Ω 26 µH U 60 µF 47 Ω 46 µH 12 Ω KeyTek 'System 2' generator with PN246I module 5/10 SMP50 / SMTPA / TPA Figure 11: Test circuit 2 for IBO and VBO parameters K ton = 20ms R1 = 140Ω R2 = 240Ω 220V 50Hz DUT Vout VBO measurement 1/4 IBO measurement TEST PROCEDURE Pulse test duration (tp = 20ms): ● for Bidirectional devices = Switch K is closed ● for Unidirectional devices = Switch K is open VOUT selection: ● Device with VBO < 200V ➔ VOUT = 250 VRMS, R1 = 140Ω ● Device with VBO ≤ 200V ➔ VOUT = 480 VRMS, R2 = 240Ω Figure 12: Test circuit 3 for dynamic IH parameters R VBAT = - 48 V Surge generator D.U.T This is a GO-NOGO test which allows to confirm the holding current (IH) level in a functional test circuit. TEST PROCEDURE 1/ Adjust the current level at the IH value by short circuiting the AK of the D.U.T. 2/ Fire the D.U.T. with a surge current ➔ IPP = 10A, 10/1000µs. 3/ The D.U.T. will come back off-state within 50ms maximum. 6/10 SMP50 / SMTPA / TPA Figure 13: Ordering Information Scheme SMP 50 - xxx Series SMP = Trisil surface mount in SMA SMTP = Trisil surface mount in SMB TP = Trisil in DO-15 Repetitive Peak Pulse Current A or 50 = 50A Voltage 62 = 62V Figure 14: SMA Package Mechanical Data DIMENSIONS E1 REF. D E Millimeters Inches Min. Max. Min. Max. A1 1.90 2.03 0.075 0.080 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 A1 A2 C L b Figure 15: Foot Print Dimensions (in millimeters) 1.65 1.45 2.40 1.45 7/10 SMP50 / SMTPA / TPA Figure 16: SMB Package Mechanical Data DIMENSIONS E1 REF. D E Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 A1 A2 C L b Figure 17: Foot Print Dimensions (in millimeters) 2.3 1.52 2.75 1.52 Figure 18: DO-15 Package Mechanical data DIMENSIONS C A D 8/10 B C REF. Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 SMP50 / SMTPA / TPA Table 6: Ordering Information Part Number SMP50-62 SMP50-68 SMP50-100 SMP50-120 SMP50-130 SMP50-180 SMP50-200 SMP50-220 SMP50-240 SMP50-270 SMTPA62 SMTPA68 SMTPA100 SMTPA120 SMTPA130 SMTPA180 SMTPA200 SMTPA220 SMTPA240 SMTPA270 TPA62 TPA62RL TPA68 TPA68RL TPA100 TPA100RL TPA120 TPA130 TPA130RL TPA180 TPA180RL TPA200 TPA200RL TPA220 TPA220RL TPA240 TPA240RL TPA270 TPA270RL Marking V06 V07 V10 V12 V13 V18 V20 V22 V24 V27 U01 U05 U13 U17 U19 U25 U27 U31 U35 U39 Package Weight Base qty Delivery mode SMA 0.068 g 5000 Tape & reel SMB 0.11 g 2500 Tape & reel 0.40 g 1000 6000 1000 6000 1000 6000 1000 1000 6000 1000 6000 1000 6000 1000 6000 1000 6000 1000 6000 Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel TPA62 TPA68 TPA100 TPA120 TPA130 TPA180 TPA200 TPA220 TPA240 TPA270 DO-15 Table 7: Revision History Date Revision 16-Nov-2004 1 Description of Changes SMP50, SMTPA and TPA datasheets merge. 9/10 SMP50 / SMTPA / TPA Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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