TI TPS79933DDCT

TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
200mA Low Quiescent Current, Ultra-Low Noise,
High PSRR, Low Dropout Linear Regulator
FEATURES
•
•
•
•
•
•
•
•
•
•
•
DESCRIPTION
200mA Low Dropout Regulator with EN
Low IQ: 40µA
Available in Multiple Output Voltage Versions:
– Fixed Outputs of 1.5V, 1.6V, 1.8V, 2.5V, 2.7V,
2.8V, 2.85V, 2.9V, 3.0V, 3.2V and 3.3V
– Adjustable Outputs from 1.2V to 6.5V
– Additional Outputs Available Using
Innovative Factory EEPROM Programming
High PSRR: 66dB at 1kHz
Ultra-low Noise: 29.5µVRMS
Fast Start-Up Time: 45µs
Stable with a 2.0µF Ceramic Output
Capacitance
Excellent Load/Line Transient Response
2% Overall Accuracy (Load/Line/Temp)
Very Low Dropout: 100mV
ThinSOT-23, WCSP, and 2mm x 2mm SON
(Available 9/05) Packages
The TPS799xx family of low-dropout (LDO)
low-power linear regulators offer excellent AC performance with very low ground current. High
power-supply rejection ratio (PSRR), low noise, fast
start-up, and excellent line and load transient response are provided while consuming a very low
40µA (typical) ground current. The TPS799xx is
stable with ceramic capacitors and uses an advanced
BiCMOS fabrication process to yield dropout voltage
typically 110mV at 200mA output. The TPS799xx
uses a precision voltage reference and feedback loop
to achieve overall accuracy of 2% over all load, line,
process, and temperature variations. It is fully specified from TJ = -40°C to +125°C and is offered in low
profile ThinSOT23 and Wafer Chip-Scale packages
(WCSP), ideal for wireless handsets and WLAN
cards.
APPLICATIONS
•
•
•
•
Cellular Phones
Wireless LAN, Bluetooth™
VCOs, RF
Handheld Organizers, PDAs
TPS799xxDDC
TSOT23−5
(TOP VIEW)
TPS79901DDC
TSOT23−5
(TOP VIEW)
TPS799xxYZU
WCSP PACKAGE
(TOP VIEW)
C3
IN
GND
1
5
OUT
2
IN
5
1
GND
OUT
2
IN
3
4
NR
OUT
4
FB
IN
GND
GND
3
EN
C3
C1
B2
A3
EN
TPS79901YZU
WCSP PACKAGE
(TOP VIEW)
NR
A1
EN
TPS799xx DRV PACKAGE
2mm x 2mm SON
(TOP VIEW)
TPS79901 DRV PACKAGE
2mm x 2mm SON
(TOP VIEW)
OUT
1
6
IN
OUT
1
6
IN
NR
2
5
N/C
FB
2
5
N/C
GND
3
4
EN
GND
3
4
EN
C1
OUT
B2
A3
A1
FB
EN
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth SIG, Inc.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
VOUT (2)
PRODUCT
TPS799xxyyyz
(1)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Output voltages from 1.2V to 4.5V in 50mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.
PRODUCT
VOLTAGE
TPS79901
Adjustable
1.2V to 5.5V (1)
TPS79915
1.5V
TPS79916
1.6V
TPS79918
2
1.8V
TPS79925
2.5V
TPS79927
2.7V
TPS79928
(1)
XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).
YYY is package designator.
Z is package quantity.
2.8V
TPS79285
2.85V
TPS79929
2.9V
TPS79930
3.0V
TPS79932
3.2V
TPS79933
3.3V
For fixed 1.2V operation, tie FB to OUT.
PACKAGE-LEAD
(DESIGNATOR)
PACKAGE
MARKING
SOT23 (DDC)
AWT
WCSP (YZU)
E9
SOT23 (DDC)
AWU
WCSP (YZU)
EA
WCSP (YZU)
F2
SOT23 (DDC)
AWV
WCSP (YZU)
EB
SOT23 (DDC)
AWW
WCSP (YZU)
EC
WCSP (YZU)
F5
SOT23 (DDC)
AWX
WCSP (YZU)
ED
SOT23 (DDC)
AXY
WCSP (YZU)
EE
WCSP (YZU)
EZ
SOT23 (DDC)
AXZ
WCSP (YZU)
EF
WCSP (YZU)
F4
SOT23 (DDC)
AXX
WCSP (YZU)
EG
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
ABSOLUTE MAXIMUM RATINGS
Over operating temperature range (unless otherwise noted) (1)
TPS799xx
UNIT
VIN range
PARAMETER
-0.3 to +7.0
V
VEN range
-0.3 to VIN +0.3
V
VOUT range
-0.3 to VIN +0.3
V
Peak output current
Internally limited
Continuous total power dissipation
See Dissipation Ratings Table
Junction temperature range, TJ
-55 to +150
Storage junction temperature range , TSTG
-55 to +150
°C
ESD rating, HBM
2
kV
ESD rating, CDM
500
V
(1)
°C
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
DISSIPATION RATINGS
BOARD
PACKAGE
RθJC
RθJA
DERATING FACTOR
ABOVE TA = 25°C
TA < 25°C
TA = 70°C
TA = 85°C
Low-K (1)
DDC
90°C/W
280°C
3.6mW/°C
360mW
200mW
145mW
High-K (2)
DDC
90°C/W
200°C
5.0mW/°C
500mW
275mW
200mW
Low-K (1)
YZU
27°C/W
255°C
3.9mW/°C
390mW
215mW
155mW
High-K (2)
YZU
27°C/W
190°C
5.3mW/°C
530mW
295mW
215mW
(1)
(2)
The JEDEC low-K (1s) board used to derive this data was a 3in x 3in, two-layer board with 2-ounce copper traces on top of the board.
The JEDEC high-K (2s2p) board used to derive this data was a 3in x 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
3
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
ELECTRICAL CHARACTERISTICS
Over operating temperature range (TJ = – 40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,
VEN = VIN, COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V.
Typical values are at TJ = +25°C.
PARAMETER
TEST CONDITIONS
range (1)
VIN
Input voltage
VFB
Internal reference (TPS79901)
Output voltage range (TPS79901)
VOUT
Output accuracy
VOUT
∆VOUT%/ ∆VIN
Output
(1)
(2)
4
+2.0
%
500µA ≤ IOUT≤ 200mA
IOUT = 200mA
ICL
Output current limit
VOUT = 0.9 × VOUT(NOM)
IGND
Ground pin current
500µA ≤ IOUT ≤ 200mA
ISHDN
Shutdown current (IGND)
VEN ≤ 0.4V, 2.7V ≤ VIN ≤ 6.5V
Feedback pin current (TPS79901)
Power-supply rejection ratio
VIN = 3.85V, VOUT = 2.85V,
CNR = 0.01µF, IOUT = 100mA
Output noise voltage
BW = 10Hz – 100kHz, VOUT = 2.8V
Startup time
VOUT = 2.85V,
RL = 14Ω, COUT = 2.2µF
IEN(HI)
Enable pin current, enabled
TSD
Thermal shutdown temperature
TJ
Operating junction temperature
UVLO
%
VOUT(NOM) + 0.3V ≤ VIN≤ 6.5V
VOUT≥ 3.3V
Enable low (shutdown)
+1.0
-2.0
Dropout voltage
(VIN = VOUT(NOM) - 0.1V)
VEN(LO)
V
-1.0
VDO
Enable high (enabled)
6.5-VDO
VOUT + 0.3V ≤ VIN ≤ 6.5V
500µA ≤ IOUT ≤ 200mA
Line regulation (1)
VEN(HI)
V
VFB
TJ = +25°C
VOUT < 3.3V IOUT = 200mA
TSTR
V
1.217
Over VIN,
IOUT, Temp
VDO
VN
6.5
1.193
1.169
Dropout voltage (2)
(VIN = VOUT(NOM) - 0.1V)
PSRR
MAX
Nominal
∆VOUT%/ ∆IOUT Load regulation
IFB
TYP
2.7
VOUT
accuracy (1)
MIN
200
±1.0
UNIT
0.02
%/V
0.002
%/mA
100
175
mV
90
160
mV
400
600
mA
40
60
µA
0.15
1.0
µA
0.5
µA
-0.5
f = 100Hz
70
dB
f = 1kHz
66
dB
f = 10kHz
51
dB
f = 100kHz
38
dB
CNR = 0.01µF
29.5
µVRMS
CNR = none
263
µVRMS
CNR = 0.001µF
45
µs
CNR = 0.047µF
45
µs
CNR = 0.01µF
50
µs
CNR = none
50
1.2
µs
VIN
0
V
0.4
V
1.0
µA
VEN = VIN = 6.5V
0.03
Shutdown, temperature increasing
165
°C
Reset, temperature decreasing
145
°C
-40
Under voltage lockout
VIN rising
Hysteresis
VIN falling
Minimum VIN = VOUT + VDO or 2.7V, whichever is greater.
VDO is not measured for devices with VOUT(NOM) < 2.8V because minimum VIN = 2.7V.
1.90
+125
2.20
70
2.50
°C
V
mV
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
DEVICE INFORMATION
FUNCTIONAL BLOCK DIAGRAMS
IN
OUT
IN
OUT
400Ω
400Ω
2µA
Current
Limit
Thermal
Shutdown
EN
3.3MΩ
Current
Limit
Overshoot
Detect
Thermal
Shutdown
EN
UVLO
Overshoot
Detect
UVLO
Quickstart
1.193V
Bandgap
NR
1.193V
Bandgap
FB
500k
500k
GND
GND
Figure 1. Fixed Voltage Versions
Figure 2. Adjustable Voltage Versions
Table 1. PIN DESCRIPTIONS
TPS799xx
NAME
DDC
YZU
DESCRIPTION
IN
1
C3
Input supply.
GND
2
B2
Ground
EN
3
A1
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into
shutdown mode. EN can be connected to IN if not used.
NR
4
A3
Fixed voltage versions only; connecting an external capacitor to this pin bypasses noise generated
by the internal bandgap. This allows output noise to be reduced to very low levels.
FB
4
A3
Adjustable version only; this is the input to the control loop error amplifier, and is used to set the
output voltage of the device.
OUT
5
C1
Output of the regulator. A small capacitor (total typical capacitance ≥ 2.0µF ceramic) is needed from
this pin to ground to assure stability.
5
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
TYPICAL CHARACTERISTICS
Over operating temperature range (TJ=- 40°C to +125°C), VIN=VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT=1mA, VEN =
VIN, COUT=2.2µF, CNR=0.01µF, unless otherwise noted. For TPS79901, VOUT=3.0V. Typical values are at TJ=+25°C.
LOAD REGULATION
LINE REGULATION
28.50
1.0
21.38
0.8
IOUT = 100mA
Change in VOUT (%)
Change in VOUT (mV)
0.6
14.25
TJ = +25°C
7.13
TJ = −40°C
0
−7.13
−14.25
TJ = +125°C
−21.38
TJ = −40°C
0.4
TJ = +25°C
0.2
0
−0.2
TJ = +125°C
−0.4
TJ = +85°C
−0.6
TJ = +85°C
−0.8
−1.0
−28.50
0
50
100
150
2.5
200
3.5
4.5
Figure 4.
OUTPUT VOLTAGE vs
JUNCTION TEMPERATURE
TPS799285 DROPOUT VOLTAGE vs
OUTPUT CURRENT
2.0
200
1.5
180
IOUT = 1mA
0.5
IOUT = 100mA
0
−0.5
TJ = +85°C
140
IOUT = 200mA
−1.0
7.5
TJ = +125°C
160
1.0
VDO (mV)
Change in VOUT (%)
Figure 3.
120
100
80
TJ = +25°C
60
40
−1.5
TJ = −40°C
20
−2.0
0
−40 −25 −15
5
20
35
50
65
80
95
0
110 125
50
100
150
200
I OUT (mA)
TJ (°C)
Figure 5.
Figure 6.
TPS799285 DROPOUT VOLTAGE vs
JUNCTION TEMPERATURE
TPS79901 DROPOUT vs
INPUT VOLTAGE
200
110
180
100
I OUT = 200mA
90
160
I OUT = 200mA
120
100
IOUT = 100mA
80
60
80
VDO (mV)
140
VDO (mV)
6.5
VIN (V)
IOUT (mA)
70
60
50
40
30
40
20
20
IOUT = 1mA
10
0
0
−40 −25 −15
5
20
35
50
TJ (°C)
Figure 7.
6
5.5
65
80
95
110 125
2.5
3.0
3.5
4.0
4.5
5.0
VIN (V)
Figure 8.
5.5
6.0
6.5
7.0
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ=- 40°C to +125°C), VIN=VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT=1mA, VEN =
VIN, COUT=2.2µF, CNR=0.01µF, unless otherwise noted. For TPS79901, VOUT=3.0V. Typical values are at TJ=+25°C.
GROUND PIN CURRENT vs
INPUT VOLTAGE
TPS799285 GROUND PIN CURRENT vs
JUNCTION TEMPERATURE
60
60
50
50
VIN = 3.2V
VIN = 5.0V
IOUT = 200mA
40
IOUT = 500µA
IGND (µA)
IGND (µA)
40
30
30
20
20
10
10
0
VIN = 2.7V
(dropout)
VOUT = 2.85V
IOUT = 200mA
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.5
6.0
−40 −25 −15
7.0
5
20
VIN (V)
600
50
65
80
95
110 125
TJ (°C)
Figure 9.
Figure 10.
GROUND PIN CURRENT (DISABLED) vs
JUNCTION TEMPERATURE
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 1.0V)
90
VEN = 0.4V
I OUT = 100mA
80
500
I OUT = 1mA
70
PSRR (dB)
400
IGND (nA)
35
300
60
40
30
200
VIN = 6.5V
20
100
10
VIN = 3.2V
CNR = 0.01µF
COUT = 2.2µF
0
0
−40 −25 −15
IOUT = 200mA
50
5
20
35
50
TJ (°C)
Figure 11.
65
80
95
110 125
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Figure 12.
7
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ=- 40°C to +125°C), VIN=VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT=1mA, VEN =
VIN, COUT=2.2µF, CNR=0.01µF, unless otherwise noted. For TPS79901, VOUT=3.0V. Typical values are at TJ=+25°C.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 0.5V)
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 0.25V)
90
90
IOUT = 100mA
80
70
70
60
60
PSRR (dB)
PSRR (dB)
80
IOUT = 1mA
50
40
30
10
100
1k
10k
100k
1M
10M
CNR = 0.01µF
COUT = 2.2µF
IOUT = 100mA
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
Figure 13.
Figure 14.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 1.0V)
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 0.25V)
90
90
80
80
IOUT = 1mA
70
60
IOUT = 200mA
50
40
30
60
50
40
IOUT = 200mA
30
20
10
IOUT = 1mA
70
PSRR (dB)
PSRR (dB)
IOUT = 200mA
0
10
20
CNR = 0.01µF
COUT = 10.0µF
10
0
CNR = 0.01µF
COUT = 10.0µF
0
10
100
1k
10k
100k
1M
10M
10
100
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
Figure 15.
Figure 16.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 1.0V)
POWER-SUPPLY RIPPLE REJECTION vs
VIN - VOUT, IOUT = 1mA
90
90
80
80
70
0.1kHz
1kHz
60
50
40
30
50
40
100kHz
10kHz
30
20
20
10
1MHz
10M
70
IOUT = 1mA
60
PSRR (dB)
PSRR (dB)
40
20
IOUT = 200mA
CNR = 0.01µF
COUT = 2.2µF
0
IOUT = 200mA
CNR = None
COUT = 10.0µF
10
0
10
8
50
30
20
10
IOUT = 1mA
100
1k
10k
100k
1M
10M
0
0.0
CNR = 0.01µF
COUT = 2.2µF
0.5
1.0
1.5
2.0
2.5
Frequency (Hz)
VIN − VOUT (V)
Figure 17.
Figure 18.
3.0
3.5
4.0
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ=- 40°C to +125°C), VIN=VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT=1mA, VEN =
VIN, COUT=2.2µF, CNR=0.01µF, unless otherwise noted. For TPS79901, VOUT=3.0V. Typical values are at TJ=+25°C.
POWER-SUPPLY RIPPLE REJECTION vs
VIN - VOUT, IOUT = 100mA
POWER-SUPPLY RIPPLE REJECTION vs
VIN- VOUT, IOUT = 200mA
90
90
0.1kHz
80
70
60
10kHz
PSRR (dB)
PSRR (dB)
1kHz
70
60
50
40
30
100kHz
1MHz
20
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
10kHz
50
40
30
100kHz
1MHz
20
CNR = 0.01µF
COUT = 2.2µF
10
CNR = 0.01µF
COUT = 2.2µF
10
0
0.0
4.0
0.5
1.0
1.5
2.0
2.5
3.0
VIN − VOUT (V)
VIN − VOUT (V)
Figure 19.
Figure 20.
TPS799285
TOTAL NOISE vs CNR
TPS799285
TOTAL NOISE vs COUT
200
3.5
4.0
35
IOUT = 1mA
COUT = 2.2µF
180
30
Total Noise (µVrms)
160
140
PSRR (dB)
0.1kHz
80
1kHz
120
100
80
60
25
20
15
10
40
5
20
0
0.01
IOUT = 1mA
CNR = 0.01µF
0
0.1
1
10
0
5
10
CNR (nF)
15
20
25
COUT (µF)
Figure 21.
Figure 22.
TPS799285
LINE TRANSIENT RESPONSE
TPS799285
LOAD TRANSIENT RESPONSE
VIN = 3.35V
IOUT = 150mA
COUT = 2.2µF
100mV/div
IOUT
COUT = 10µF
20mV/div
VOUT
COUT = 10 µF
100mV/div
20mV/div
C OUT = 2.2µF
VOUT
4.15V
dVIN
= 1V/µs
1V/div
3.15V
150mA
100mA/div
dt
IOUT
1mA
IOUT
VIN
20µs/div
Figure 23.
20µs/div
Figure 24.
9
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ=- 40°C to +125°C), VIN=VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT=1mA, VEN =
VIN, COUT=2.2µF, CNR=0.01µF, unless otherwise noted. For TPS79901, VOUT=3.0V. Typical values are at TJ=+25°C.
TPS799285
TURN-ON RESPONSE (VEN = VIN)
TPS799285
ENABLE RESPONSE
RLOAD = 19Ω
COUT = 2.2µF
VIN = 3.85V
RLOAD = 19Ω, 2.85kΩ
COUT = 2.2µF
VOUT
VOUT
RLOAD = 19Ω, 2.85kΩ
COUT = 10µF
RLOAD = 2.85kΩ
C OUT = 2.2µF, 10µF
1V/div
1V/div
3.85V
VIN
0V
4V/div
VEN
5V/div
10µs/div
10µs/div
Figure 25.
Figure 26.
TPS799285
POWER-UP / POWER-DOWN
7
RL = 19Ω
6
VIN
5
Volts
4
3
2
VOUT
1
0
−1
50ms/div
Figure 27.
10
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
APPLICATION INFORMATION
The TPS799xx family of LDO regulators combines the high performance required of many RF and precision
analog applications with ultra-low current consumption. High PSRR is provided by a high gain, high bandwidth
error loop with good supply rejection at very low headroom (VIN – VOUT). Fixed voltage versions provide a noise
reduction pin to bypass noise generated by the bandgap reference and to improve PSRR while a quick-start
circuit fast-charges this capacitor at startup for quick startup times. The combination of high performance and low
ground current also make the TPS799xx an excellent choice for portable applications. All versions have thermal
and over-current protection and are fully specified from –40°C to +125°C.
Figure 28 shows the basic circuit connections for fixed voltage models. Figure 29 gives the connections for the
adjustable output version (TPS79901). R1 and R2 can be calculated for any output voltage using the formula in
Figure 29. Sample resistor values for common output voltages are shown in Figure 29.
Optional input capacitor.
May improve source
impedance, noise, or PSRR.
VIN
Optional input capacitor.
May improve source
impedance, noise, or PSRR.
IN
GND
VIN
NR
IN
R2
× 1.193
2.2µF
Ceramic
Optional bypass capacitor
to reduce output noise
and increase PSRR.
Figure 28. Typical Application Circuit for
Fixed Voltage Versions
VOUT
OUT
TPS799xx
EN
VEN
(R1 + R2)
VOUT
OUT
TPS799xx
EN
VOUT =
GND
R1
FB
CFB
2.2µF
Ceramic
R2
VEN
Figure 29. Typical Application Circuit for
Adjustable Voltage Version
Input and Output Capacitor Requirements
Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1µF to
1µF low ESR capacitor across the input supply near the regulator. This will counteract reactive input sources and
improve transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if
large, fast rise-time load transients are anticipated or the device is located several inches from the power source.
If source impedance is not sufficiently low, a 0.1µF input capacitor may be necessary to ensure stability.
The TPS799xx is designed to be stable with standard ceramic capacitors of values 2.2µF or larger. X5R and
X7R type capacitors are best as they have minimal variation in value and ESR over temperature. Maximum ESR
should be < 1.0Ω.
Feedback Capacitor Requirements (TPS79901 only)
The feedback capacitor, CFB, shown in Figure 29 is required for stability. For a parallel combination of R1 and R2
equal to 250kΩ, any value from 3pF to 1nF can be used. Fixed voltage versions have an internal 30pF feedback
capacitor which is quick-charged at start-up. The adjustable version does not have this quick-charge circuit, so
values below 5pF should be used to ensure fast startup; values above 47pF can be used to implement an output
voltage soft-start. Larger value capacitors also improve noise slightly. The TPS79901 is stable in unity-gain
configuration (OUT tied to FB) without CFB.
11
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
Output Noise
In most LDOs, the bandgap is the dominant noise source. If a noise reduction capacitor (CNR) is used with the
TPS799xx, the bandgap does not contribute significantly to noise. Instead, noise is dominated by the output
resistor divider and the error amplifier input. To minimize noise in a given application, use a 0.01µF noise
reduction capacitor; for the adjustable version, smaller value resistors in the output resistor divider reduce noise.
A parallel combination that gives 2µA of divider current will have the same noise performance as a fixed voltage
version. To further optimize noise, equivalent series resistance of the output capacitor can be set to
approximately 0.2Ω. This configuration maximizes phase margin in the control loop, reducing total output noise
by up to 10%.
Noise can be referred to the feedback point (FB pin) such that with CNR = 0.01µF total noise is approximately
given by Equation 1:
10.7VRMS
VN VOUT
V
(1)
The TPS79901 adjustable version does not have the noise-reduction pin available, so ultra-low noise operation is
not possible. Noise can be minimized according to the above recommendations.
Board Layout Recommendations to Improve PSRR and Noise Performance
To improve ac performance such as PSRR, output noise, and transient response, it is recommended that the
board be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the
GND pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the
GND pin of the device.
Internal Current Limit
The TPS799xx internal current limit helps protect the regulator during fault conditions. During current limit, the
output will source a fixed amount of current that is largely independent of output voltage. For reliable operation,
the device should not be operated in current limit for extended periods of time.
The PMOS pass element in the TPS799xx has a built-in body diode that conducts current when the voltage at
OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is
anticipated, external limiting may be appropriate.
Shutdown
The enable pin (EN) is active high and is compatible with standard and low voltage TTL-CMOS levels. When
shutdown capability is not required, EN can be connected to IN.
Dropout Voltage
The TPS799xx uses a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout
voltage (VDO), the PMOS pass device is in its linear region of operation and the input-to-output resistance is the
RDS,ON of the PMOS pass element. Because the PMOS device behaves like a resistor in dropout, VDO will
approximately scale with output current.
As with any linear regulator, PSRR and transient response are degraded as (VIN – VOUT) approaches dropout.
This effect is shown in Figure 18 through Figure 20 in the Typical Characteristics section.
Startup
Fixed voltage versions of the TPS799xx use a quick-start circuit to fast-charge the noise reduction capacitor,
CNR, if present (see Functional Block Diagrams, Figure 1). This allows the combination of very low output noise
and fast start-up times. The NR pin is high impedance so a low leakage CNR capacitor must be used; most
ceramic capacitors are appropriate in this configuration.
Note that for fastest startup, VIN should be applied first, then the enable pin (EN) driven high. If EN is tied to IN,
startup will be somewhat slower. Refer to Figure 25 and Figure 26 in the Typical Characteristics section. The
quick-start switch is closed for approximately 135µs. To ensure that CNR is fully charged during the quick-start
time, a 0.01µF or smaller capacitor should be used.
12
www.ti.com
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
SBVS056C – JANUARY 2005 – REVISED MAY 2005
Transient Response
As with any regulator, increasing the size of the output capacitor will reduce over/undershoot magnitude but
increase duration of the transient response. In the adjustable version, adding CFB between OUT and FB will
improve stability and transient response. The transient response of the TPS799xx is enhanced by an active
pull-down that engages when the output overshoots by approximately 5% or more when the device is enabled.
When enabled, the pull-down device behaves like a 350Ω resistor to ground.
Under-Voltage Lock-Out (UVLO)
The TPS799xx utilizes an under-voltage lock-out circuit to keep the output shut off until internal circuitry is
operating properly. The UVLO circuit has a de-glitch feature so that it will typically ignore undershoot transients
on the input if they are less than 50µs duration.
Minimum Load
The TPS799xx is stable and well-behaved with no output load. To meet the specified accuracy, a minimum load
of 500µA is required. Below 500µA at junction temperatures near +125°C, the output can drift up enough to
cause the output pull-down to turn on. The output pull-down will limit voltage drift to 5% typically but ground
current could increase by approximately 50µA. In typical applications, the junction cannot reach high
temperatures at light loads since there is no appreciable dissipated power. The specified ground current would
then be valid at no load in most applications.
Thermal Information
Thermal Protection
Thermal protection disables the output when the junction temperature rises to approximately +165°C, allowing
the device to cool. When the junction temperature cools to approximately +145°C the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage due to
overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, junction temperature should be limited to +125°C maximum. To estimate the
margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal
protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should
trigger at least +35°C above the maximum expected ambient condition of your particular application. This
configuration produces a worst-case junction temperature of +125°C at the highest expected ambient
temperature and worst-case load.
The internal protection circuitry of the TPS799xx has been designed to protect against overload conditions. It
was not intended to replace proper heatsinking. Continuously running the TPS799xx into thermal shutdown will
degrade device reliability.
Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in
the PCB layout. The PCB area around the device that is free of other components moves the head from the
device to the ambient air. Performance data for JEDEC low- and high-K boards are given in the Dissipation
Ratings table. Using heavier copper will increase the effectiveness in removing heat from the device. The
addition of plated through-holes to heat-dissipating layers will also improve the heatsink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation is equal to the product of the
output current time the voltage drop across the output pass element, as shown in Equation 2:
P D VINV OUT I OUT
(2)
Package Mounting
Solder pad footprint recommendations for the TPS799xx are available from the Texas Instruments' web site at
www.ti.com.
13
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C – JANUARY 2005 – REVISED MAY 2005
Thermal Information (continued)
1,052
0,952
1,416
1,316
Pin A1 Index Area
0,35
0,25
0,625 Max
0,30
0,20
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoStar package configuration.
NanoStar is a trademark of Texas Instruments.
Figure 30. YZU Wafer Chip-Scale Preliminary Package Dimensions (mm)
14
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jul-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
HPA00086DDCR
ACTIVE
TO/SOT
DDC
5
3000
TPS79901DDCR
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79901DDCRG4
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79901DDCT
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79901DDCTG4
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79915DDCR
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79915DDCRG4
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79915DDCT
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79915DDCTG4
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79918DDCR
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79918DDCRG4
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79918DDCT
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79918DDCTG4
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79925DDCR
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79925DDCRG4
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79925DDCT
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79925DDCTG4
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS799285DDCR
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS799285DDCRG4
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS799285DDCT
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS799285DDCTG4
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79928DDCR
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79928DDCRG4
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79928DDCT
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79928DDCTG4
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jul-2005
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS79930DDCR
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79930DDCRG4
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79930DDCT
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79930DDCTG4
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79933DDCR
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79933DDCRG4
ACTIVE
TO/SOT
DDC
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79933DDCT
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79933DDCTG4
ACTIVE
TO/SOT
DDC
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 2
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