UTC-IC 7N65

UNISONIC TECHNOLOGIES CO., LTD
7N65
Power MOSFET
7 Amps, 650 Volts
N-CHANNEL POWER MOSFET
DESCRIPTION
The UTC 7N65 is a high voltage MOSFET and is designed to
have better characteristics, such as fast switching time, low gate
charge, low on-state resistance and have a high rugged avalanche
characteristics. This power MOSFET is usually used at high speed
switching applications in power supplies, PWM motor controls, high
efficient DC to DC converters and bridge circuits.
1
TO-220F
FEATURES
* RDS(ON) = 1.35Ω @VGS = 10 V
* Ultra low gate charge ( typical 30 nC )
* Low reverse transfer capacitance ( CRSS = typical 18 pF )
* Fast switching capability
* Avalanche energy specified
* Improved dv/dt capability, high ruggedness
*Pb-free plating product number: 7N65L
SYMBOL
2.Drain
1.Gate
3.Source
ORDERING INFORMATION
Normal
7N65-TF3-T
Order Number
Lead Free Plating
7N65L-TF3-T
Package
TO-220F
Pin Assignment
1
2
3
G
D
S
Packing
Tube
7N65L-TF3-T
(1)Packing Type
(1) T: Tube
(2)Package Type
(2) TF3: TO-220F
(3)Lead Plating
(3) L: Lead Free Plating, Blank: Pb/Sn
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Copyright © 2005 Unisonic Technologies Co., Ltd
1 of 8
QW-R502-104,A
7N65
Power MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25℃, unless otherwise specified)
PARAMETER
SYMBOL
VDSS
VGSS
RATINGS
UNIT
650
V
±30
V
TC = 25°C
7.0
A
Continuous Drain Current
ID
TC = 100°C
4.7
A
Drain Current Pulsed (Note 1)
IDM
28
A
Avalanche Energy, Single Pulsed (Note 2)
EAS
530
mJ
Avalanche Energy, Repetitive, Limited by TJMAX
EAR
14.2
mJ
Peak Diode Recovery dv/dt (Note 3)
dv/dt
4.5
V/ns
Power Dissipation (TC = 25°C)
PD
142
W
Junction Temperature
TJ
+150
℃
Storage Temperature
TSTG
-55 ~ +150
℃
Note Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
Drain-Source Voltage
Gate-Source Voltage
THERMAL DATA
PARAMETER
SYMBOL
θJA
θJC
Junction-to-Ambient
Junction-to-Case
MIN
TYP
MAX
62.5
0.88
UNIT
°C/W
°C/W
ELECTRICAL CHARACTERISTICS (TC =25℃, unless otherwise specified)
PARAMETER
OFF Characteristics
Drain-Source Breakdown Voltage
SYMBOL
BVDSS
Drain-Source Leakage Current
Gate-Source Leakage Current
IDSS
Forward
Reverse
Breakdown Voltage Temperature
Coefficient
ON Characteristics
Gate Threshold Voltage
Drain-Source ON-State Resistance
Forward Transconductance
Dynamic Characteristics
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
Turn-on Delay Time
Turn-on Rise Time
Turn-off Delay Time
Turn-off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
IGSS
VGS = 0 V, ID = 250 µA
VDS = 650 V, VGS = 0 V
VDS = 520 V, TC = 125°C
VGS = 30 V, VDS = 0 V
VGS = -30 V, VDS = 0 V
MIN TYP MAX UNIT
650
1
1
100
-100
△BVDSS/△TJ ID = 250 µA, Referenced to 25°C
VGS(TH)
RDS(ON)
gFS
CISS
COSS
CRSS
tD(ON)
tR
tD(OFF)
tF
QG
QGS
QDD
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TEST CONDITIONS
VDS = VGS, ID = 250 µA
VGS = 10 V, ID = 3.5 A
VDS = 40 V, ID = 3.5 A (Note 4)
VDS = 25 V, VGS = 0 V, f = 1MHz
VDD = 325V, ID = 7.0 A
(Note 4, 5)
VDS= 520V, ID= 7.0A, VGS= 10 V
(Note 4, 5)
0.67
2.0
V
µA
µA
nA
nA
V/℃
4.0
1.35
V
Ω
S
1200 1600
150 190
18
25
pF
pF
pF
1
8.0
35
79
80
52
30
6.5
13
80
165
160
120
ns
ns
ns
ns
nC
nC
nC
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QW-R502-104,A
7N65
Power MOSFET
ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER
SYMBOL
TEST CONDITIONS
Source- Drain Diode Ratings and Characteristics
Drain-Source Diode Forward Voltage
VSD
VGS = 0 V, IS =7.0 A
Maximum Continuous Drain-Source
IS
Diode Forward Current
Maximum Pulsed Drain-Source Diode
ISM
Forward Current
Reverse Recovery Time
tRR
VGS = 0 V, IS = 7.0 A,
dIF/dt = 100 A/µs (Note 4)
Reverse Recovery Charge
QRR
Notes: 1. Repetitive Rating : Pulse width limited by TJ
2. L = 19.5mH, IAS = 7.0A, VDD = 50V, RG = 0 Ω, Starting TJ = 25°C
3. ISD ≤ 7.0A, di/dt ≤100A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test: Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
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MIN
TYP MAX UNIT
320
2.4
1.4
V
7.0
A
28
A
ns
µC
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QW-R502-104,A
7N65
Power MOSFET
TEST CIRCUITS AND WAVEFORMS
+
D.U.T.
VDS
+
-
L
RG
Driver
* dv/dt controlled by RG
* I SD controlled by pulse period
* D.U.T.-Device Under Test
Same Type
as D.U.T.
VGS
VDD
Fig. 1A Peak Diode Recovery dv/dt Test Circuit
VGS
(Driver)
P.W.
Period
D=
P. W.
Period
VGS= 10V
I FM, Body Diode Forward Current
ISD
(D.U.T.)
di/dt
IRM
Body Diode Reverse Current
Body Diode Recovery dv/dt
VDS
(D.U.T.)
VDD
Body Diode
Forward Voltage Drop
Fig. 1B Peak Diode Recovery dv/dt Waveforms
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QW-R502-104,A
7N65
Power MOSFET
TEST CIRCUITS AND WAVEFORMS (Cont.)
RL
VDS
VDS
90%
VDD
VGS
RG
VGS
D.U.T.
10V
10%
t D(ON )
Pulse Width ≤ 1μs
tD (OFF)
tF
tR
Duty Factor ≤0.1%
Fig. 2A Switching Test Circuit
Same Type
as D.U.T.
50kΩ
0.2μF
Fig. 2B Switching Waveforms
QG
10V
0.3μF
VDS
QGS
QGD
VGS
DUT
VG
1mA
Charge
Fig. 3A Gate Charge Test Circuit
Fig. 3B Gate Charge Waveform
L
VDS
BVDSS
RD
10V
VDD
D.U.T.
tp
Fig. 4A Unclamped Inductive Switching Test Circuit
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IAS
tp
Time
Fig. 4B Unclamped Inductive Switching Waveforms
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QW-R502-104,A
7N65
Power MOSFET
Breakdown Voltage Variation vs.
Temperature
1.2
1.1
1.0
Note:
1. VGS=0V
2. ID=250µA
0.9
0.8
-100 -50 0 50 100 150 200
Junction Temperature, T J (℃)
On-Resistance Junction Temperature
Drain-Source On-Resistance,
RDS(ON) (Normalized)
Drain-Source Breakdown Voltage,
BVDSS (Normalized)
TYPICAL CHARACTERISTICS
3.0
2.5
2.0
1.5
0.5
0.0
-100 -50 0 50 100 150 200
Junction Temperature, T J (℃)
Maximum Drain Current vs. Case
Temperature
Maximum Safe Operating Area
100 µs
10
1ms
10 ms
1
0.1
1
DC
Notes:
1 . T J=25℃
2 . T J=150 ℃
3 . Single Pulse
10
8
DS(ON)
Drain Current, I D (A)
Drain Current, ID (A)
Operation in This Area is Limited by R
100
Note:
1. VGS =10V
2. I D=3.5A
1.0
6
4
2
0
1000
25
Drain-Source Voltage, VDS (V)
On-State Characteristics
1
0.1
Notes:
1. 250µs Pulse Test
2. T C=25℃
0.1
1
10
Drain-to-Source Voltage, VDS (V)
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Transfer Characteristics
Drain Current, I D (A)
Drain Current, I D (A)
10
VGS
Top: 10V
8V
7.5V
7V
6.5V
6V
5.5V
Bottorm:5.5V
50
75 100 125 150
Case Temperature, TC (℃)
10
25℃
1
0.1
150℃
Notes:
1. VDS =50 V
2. 250 µs Pulse Test
2
4
6
8
10
Gate-Source Voltage, VGS (V)
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QW-R502-104,A
7N65
Power MOSFET
TYPICAL CHARACTERISTICS(Cont.)
On State Current vs. Allowable Case
Temperature
2.5
VGS =20V
2.0
VGS=10V
1.5
1.0
0.5
0
Note: TJ=25℃
0
5 10 15 20 25
Drain Current, I D (A)
Reverse Drain Current, IDR (A)
Drain-Source On-Resistance,
RDS(ON) (ohm)
On-Resistance Variation vs. Drain
Current and Gate Voltage
10
150℃
25℃
1
Notes:
1. VGS=0V
2. 250µs Test
0.1
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Source-Drain Voltage, VSD (V)
Capacitance Characteristics
(Non-Repetitive)
2000
12
Gate-Source Voltage, VGS (V)
C iss=C gs +C gd (C ds=shorted )
C os s=Cds +Cgd Crss=C gd
1600
Capacitance (pF)
Gate Charge Characteristics
Ciss
1200
Coss
800
400
Notes:
1. V GS =0V
2. f = 1MHz
Crss
0
0.1
10
VDS=520V
VDS=325V
8
VDS =130V
6
4
2
Note: ID=7A
0
1
0
10
10 20
30
40
50
60
70
Total Gate Charge, QG (nC)
Drain-SourceVoltage, VDS (V)
Transient Thermal Response
Curve
Thermal Response, θJC (t)
1
0.1
Notes :
1. θJC (t) = 0. 88℃/W Max.
2. Duty Factor , D=t1/t2
3.TJM-TC=P DM×θJC (t)
0.01
1E-5
1E-4 1E-3 0.01 0.1
1
10
Square Wave Pulse Duration, t1 (sec)
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QW-R502-104,A
7N65
Power MOSFET
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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QW-R502-104,A