FREESCALE MPXH6400A6T1

Freescale Semiconductor
Technical Data
MPXH6400A
Rev 1, 05/2005
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The Freescale MPXH6400A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-chip
integration make the Freescale pressure sensor a logical and economical choice
for the system designer.
The MPXH6400A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a
pressure sensor chip.
MPXH6400A
SERIES
INTEGRATED
PRESSURE SENSOR
20 TO 400 kPA (3.0 TO 58 psi)
0.2 TO 4.8 V OUTPUT
(3.0 TO 58 psi)
SUPER SMALL OUTLINE PACKAGES
MPXH6400A6U/6T1
CASE 1317-04
Features
•
•
•
•
•
•
Improved Accuracy at High Temperature
Available in Small and Super Small Outline Packages
1.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated from –40° to +125°C
Durable Thermoplastic (PPS) Surface Mount Package
MPXH6400AC6U/C6T1
CASE 1317A-01
PIN NUMBERS(1)
Typical Applications
1
N/C
5
N/C
•
•
2
VS
6
N/C
3
GND
7
N/C
4
VOUT
8
N/C
Industrial Controls
Engine Control/Manifold Absolute Pressure (MAP)
ORDERING INFORMATION
Device
Type
Basic
Element
Ported
Element
Options
Case
No.
MPX Series
Order No.
Absolute,
Element Only
1317 MPXH6400A6U
Absolute,
Element Only
1317 MPXH6400A6T1
Absolute, Axial 1317A MPXH6400AC6U
Port
Packing
Options
Rails
Device
Marking
MPXH6400A
Tape & Reel MPXH6400A
Rails
MPXH6400A
Absolute, Axial 1317A MPXH6400AC6T1 Tape & Reel MPXH6400A
Port
© Freescale Semiconductor, Inc., 2005. All rights reserved.
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
1600
kPa
Storage Temperature
TSTG
–40° to +125°
°C
Operating Temperature
TA
–40° to +125°
°C
Output Source Current @ Full Scale Output(2)
I o+
0.5
mAdc
Output Sink Current @ Minimum Pressure Offset2
Io –
–0.5
mAdc
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from Vout to GND or Vout to VS in the application circuit.
MPXH6400A
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
20
—
400
kPa
Supply Voltage(1)
VS
4.64
5.0
5.36
Vdc
Supply Current
Io
—
6.0
10
mAdc
Minimum Pressure Offset
@ VS = 5.1 Volts(2)
(0 to 85°C)
Voff
0.133
0.2
0.267
Vdc
Full Scale Output
@ VS = 5.1 Volts(3)
(0 to 85°C)
VFSO
4.733
4.8
4.866
Vdc
Full Scale Span
@ VS = 5.1 Volts(4)
(0 to 85°C)
VFSS
4.467
4.6
4.733
Vdc
Accuracy(5)
(0 to 85°C)
—
—
—
±1.5
%VFSS
V/P
—
12.1
—
mV/kPa
Response Time(6)
tR
—
1.0
—
ms
Warm-Up Time(7)
—
—
20
—
ms
Offset Stability(8)
—
—
±0.25
—
%VFSS
Sensitivity
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXH6400A
Sensors
Freescale Semiconductor
3
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317). Figure 3
illustrates a typical application circuit (output source current
operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXH6400A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Fluoro Silicone
Gel Die Coat
Stainless Steel Cap
Die
P1
Wire Bond
Thermoplastic Case
Lead Frame
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP
(not to scale)
+5.1 V
VS Pin 2
MPXH6400A
VOUT Pin 4
100 nF
To ADC
47 pF
GND Pin 3
51 K
Figure 3. Typical Application Circuit
(Output Source Current Operation)
5.0
4.5
4.0
Output (Volts)
3.5
Transfer Function:
VOUT = VS x (0.002421xP–0.00842 ± Error
VS = 5.0 VDC
Temperature = 0 to 85°C
3.0
2.5
MAX
2.0
TYP
1.5
1.0
0
MIN
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
320
340
360
380
400
0.5
Pressure (Reference to Sealed Vacuum) in kPa
Figure 4. Output versus Absolute Pressure
MPXH6400A
4
Sensors
Freescale Semiconductor
Transfer Function (MPXH6400A)
Normal Transfer Value: VOUT = VS x (0.002421 x P – 0.0.00842)
± Pressure Error x Temp. Factor x 0.002421 x VS
VS = 5.0 ± 0.36 VDC
Temperature Error Band
MPXH6400A Series
4.0
3.0
Temperature
Error
Factor
Break Points
2.0
1.0
Temp
0.0
-40
-20
0
20
80
40
60
Temperature in C°
100
120
140
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C
- 40
0 to 85
125
Multiplier
3
1
1.75
Pressure Error Band
Error Limits for Pressure
±5.5 (kPa)
6.0
5.0
4.0
Pressure Error (kPa)
3.0
2.0
1.0
0.0
-1.0
20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400
-2.0
-3.0
-4.0
- 5.0
Pressure (in kPa)
Pressure
Error (Max)
- 6.0
20 to 400 (kPa)
±5.5 (kPa)
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Super Small Outline Packages
Surface mount board layout is a critical portion of the total
0.050
0.387
design. The footprint for the semiconductor package must be
1.27
9.83
TYP
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
0.150
solder reflow process. It is always recommended to fabricate
3.81
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
MPXH6400A
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
2X
0.006 C A B
0.420
0.400
0.050
NOTES:
1. ALL DIMENSIONS ARE IN INCHES.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M-1994.
3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS. MOLD FLASH OR PROTRUSIONS
SHALL NOT EXCEED .006 INCHES PER SIDE.
4. ALL VERTICAL SURFACES TO BE 5˚ MAXIMUM.
5. DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE .008 INCHES MAXIMUM.
0.025
0.300
0.280
3
0.019
5
0.014
M
0.004
C A B
8X
A
0.300
0.280
B
3
0.298
0.278
.014
GAGE
PLANE
0.165
0.145
0.010
0.002
0.004
10˚
0˚
DETAIL D
DETAIL D
C
0.038
0.048
SEATING
PLANE
CASE 1317-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXH6400A
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
2X
0.006 C A B
0.420
0.400
NOTES:
1. ALL DIMENSIONS ARE IN INCHES.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M-1994.
3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS. MOLD FLASH OR PROTRUSIONS
SHALL NOT EXCEED .006 INCHES PER SIDE.
4. ALL VERTICAL SURFACES TO BE 55 MAXIMUM.
5. DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE .008 INCHES MAXIMUM.
0.050
0.025
0.345
0.325
8X
A
0.345
0.325
B
0.018
0.014
0.004
M
5
.014
C A B
GAGE
PLANE
0.010
0.002
0.048
0.038
10˚
0˚
DETAIL E
0.130
0.110
0.200
0.180
0.300
0.280
0.390
0.370
3
0.004
C
SEATING
PLANE
A
0.300
0.280
B
3
DETAIL E
BOTTOM VIEW
CASE 1317A-01
ISSUE A
SUPER SMALL OUTLINE PACKAGE
MPXH6400A
Sensors
Freescale Semiconductor
7
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MPXH6400A
Rev. 1
05/2005
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