Freescale Semiconductor Technical Data MPXH6400A Rev 1, 05/2005 High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The Freescale MPXH6400A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale pressure sensor a logical and economical choice for the system designer. The MPXH6400A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. MPXH6400A SERIES INTEGRATED PRESSURE SENSOR 20 TO 400 kPA (3.0 TO 58 psi) 0.2 TO 4.8 V OUTPUT (3.0 TO 58 psi) SUPER SMALL OUTLINE PACKAGES MPXH6400A6U/6T1 CASE 1317-04 Features • • • • • • Improved Accuracy at High Temperature Available in Small and Super Small Outline Packages 1.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from –40° to +125°C Durable Thermoplastic (PPS) Surface Mount Package MPXH6400AC6U/C6T1 CASE 1317A-01 PIN NUMBERS(1) Typical Applications 1 N/C 5 N/C • • 2 VS 6 N/C 3 GND 7 N/C 4 VOUT 8 N/C Industrial Controls Engine Control/Manifold Absolute Pressure (MAP) ORDERING INFORMATION Device Type Basic Element Ported Element Options Case No. MPX Series Order No. Absolute, Element Only 1317 MPXH6400A6U Absolute, Element Only 1317 MPXH6400A6T1 Absolute, Axial 1317A MPXH6400AC6U Port Packing Options Rails Device Marking MPXH6400A Tape & Reel MPXH6400A Rails MPXH6400A Absolute, Axial 1317A MPXH6400AC6T1 Tape & Reel MPXH6400A Port © Freescale Semiconductor, Inc., 2005. All rights reserved. 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Vout Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 1600 kPa Storage Temperature TSTG –40° to +125° °C Operating Temperature TA –40° to +125° °C Output Source Current @ Full Scale Output(2) I o+ 0.5 mAdc Output Sink Current @ Minimum Pressure Offset2 Io – –0.5 mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to GND or Vout to VS in the application circuit. MPXH6400A 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 20 — 400 kPa Supply Voltage(1) VS 4.64 5.0 5.36 Vdc Supply Current Io — 6.0 10 mAdc Minimum Pressure Offset @ VS = 5.1 Volts(2) (0 to 85°C) Voff 0.133 0.2 0.267 Vdc Full Scale Output @ VS = 5.1 Volts(3) (0 to 85°C) VFSO 4.733 4.8 4.866 Vdc Full Scale Span @ VS = 5.1 Volts(4) (0 to 85°C) VFSS 4.467 4.6 4.733 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %VFSS V/P — 12.1 — mV/kPa Response Time(6) tR — 1.0 — ms Warm-Up Time(7) — — 20 — ms Offset Stability(8) — — ±0.25 — %VFSS Sensitivity 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXH6400A Sensors Freescale Semiconductor 3 Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 illustrates a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXH6400A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluoro Silicone Gel Die Coat Stainless Steel Cap Die P1 Wire Bond Thermoplastic Case Lead Frame Absolute Element Die Bond Sealed Vacuum Reference Figure 2. Cross Sectional Diagram SSOP (not to scale) +5.1 V VS Pin 2 MPXH6400A VOUT Pin 4 100 nF To ADC 47 pF GND Pin 3 51 K Figure 3. Typical Application Circuit (Output Source Current Operation) 5.0 4.5 4.0 Output (Volts) 3.5 Transfer Function: VOUT = VS x (0.002421xP–0.00842 ± Error VS = 5.0 VDC Temperature = 0 to 85°C 3.0 2.5 MAX 2.0 TYP 1.5 1.0 0 MIN 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 0.5 Pressure (Reference to Sealed Vacuum) in kPa Figure 4. Output versus Absolute Pressure MPXH6400A 4 Sensors Freescale Semiconductor Transfer Function (MPXH6400A) Normal Transfer Value: VOUT = VS x (0.002421 x P – 0.0.00842) ± Pressure Error x Temp. Factor x 0.002421 x VS VS = 5.0 ± 0.36 VDC Temperature Error Band MPXH6400A Series 4.0 3.0 Temperature Error Factor Break Points 2.0 1.0 Temp 0.0 -40 -20 0 20 80 40 60 Temperature in C° 100 120 140 NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C - 40 0 to 85 125 Multiplier 3 1 1.75 Pressure Error Band Error Limits for Pressure ±5.5 (kPa) 6.0 5.0 4.0 Pressure Error (kPa) 3.0 2.0 1.0 0.0 -1.0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 -2.0 -3.0 -4.0 - 5.0 Pressure (in kPa) Pressure Error (Max) - 6.0 20 to 400 (kPa) ±5.5 (kPa) SURFACE MOUNTING INFORMATION Minimum Recommended Footprint for Super Small Outline Packages Surface mount board layout is a critical portion of the total 0.050 0.387 design. The footprint for the semiconductor package must be 1.27 9.83 TYP the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a 0.150 solder reflow process. It is always recommended to fabricate 3.81 boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317 and 1317A) MPXH6400A Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS 2X 0.006 C A B 0.420 0.400 0.050 NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5˚ MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM. 0.025 0.300 0.280 3 0.019 5 0.014 M 0.004 C A B 8X A 0.300 0.280 B 3 0.298 0.278 .014 GAGE PLANE 0.165 0.145 0.010 0.002 0.004 10˚ 0˚ DETAIL D DETAIL D C 0.038 0.048 SEATING PLANE CASE 1317-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXH6400A 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS 2X 0.006 C A B 0.420 0.400 NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 55 MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM. 0.050 0.025 0.345 0.325 8X A 0.345 0.325 B 0.018 0.014 0.004 M 5 .014 C A B GAGE PLANE 0.010 0.002 0.048 0.038 10˚ 0˚ DETAIL E 0.130 0.110 0.200 0.180 0.300 0.280 0.390 0.370 3 0.004 C SEATING PLANE A 0.300 0.280 B 3 DETAIL E BOTTOM VIEW CASE 1317A-01 ISSUE A SUPER SMALL OUTLINE PACKAGE MPXH6400A Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. 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