MC74LCX138 Low-Voltage CMOS 3-to-8 Decoder/Demultiplexer With 5 V−Tolerant Inputs T h e M C 7 4 L C X 1 3 8 i s a h i g h p e r f o r m a n c e , 3 −t o −8 decoder/demultiplexer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX138 inputs to be safely driven from 5 V devices. The MC74LCX138 is suitable for memory address decoding and other TTL level bus−oriented applications. The MC74LCX138 high−speed 3−to−8 decoder/demultiplexer accepts three binary weighted inputs (A0, A1, A2) and, when enabled, provides eight mutually exclusive active−LOW outputs (O0−O7). The LCX138 features three Enable inputs, two active−LOW (E1, E2) and one active−HIGH (E3). All outputs will be HIGH unless E1 and E2 are LOW, and E3 is HIGH. This multiple enabled function allows easy parallel expansion of the device to a 1−of−32 (5 lines to 32 lines) decoder with just four LCX138 devices and one inverter (see Figure 1). The LCX138 can be used as an 8−output demultiplexer by using one of the active−LOW Enable inputs as the data input and the other Enable inputs as strobes. The Enable inputs which are not used must be permanently tied to their appropriate active−HIGH or active−LOW state. Current drive capability is 24 mA at the outputs. Features Designed for 2.3 V to 3.6 V VCC Operation 5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic LVTTL Compatible http://onsemi.com MARKING DIAGRAMS 16 SOIC−16 D SUFFIX CASE 751B 16 1 LCX138G AWLYWW 1 16 16 1 LCX 138 ALYWG G TSSOP−16 DT SUFFIX CASE 948F 1 A WL, L Y WW, W G or G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA ESD Performance: Human Body Model >2000 V Machine Model >200 V NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. 10 1 Publication Order Number: MC74LCX138/D MC74LCX138 A2 3 VCC O0 O1 O2 O3 O4 O5 O6 16 15 14 13 12 11 10 9 7 8 1 2 3 4 5 6 A0 A1 A2 E1 E2 E3 A1 2 A0 1 E1 E2 4 E3 5 6 O7 GND Figure 1. Pinout: 16−Lead (Top View) 7 O7 9 O6 10 O5 11 O4 12 O3 13 O2 14 O1 15 O0 Figure 2. Logic Diagram PIN NAMES Pins Function A0−A2 Address Inputs E1−E2 Enable Inputs E3 Enable Input O0−O7 Outputs TRUTH TABLE Inputs Outputs E1 E2 E3 A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7 H X X X H X X X L X X X X X X X X X H H H H H H H H H H H H H H H H H H H H H H H H L L L L L L L L H H H H L H L H L L H H L L L L L H H H H L H H H H L H H H H L H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H L H H H H L H H H H L H H H H L L L H L L H L L H H L H L L H L H H L L H H H H H = High Voltage Level L = Low Voltage Level X = High or Low Voltage Level and Transitions are Acceptable For ICC reasons, DO NOT FLOAT Inputs http://onsemi.com 2 MC74LCX138 A0 A1 A2 ‘04 A3 A4 H 123 A0 A1 A2 123 E O0 O1 O2 O3 O4 O5 O6 O7 A0 A1 A2 123 123 E A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7 E A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7 E O0 O1 O2 O3 O4 O5 O6 O7 O0 O31 Figure 3. Expansion to 1−of−32 Decoding ORDERING INFORMATION Package Shipping† MC74LCX138DR2G SOIC−16 (Pb−Free) 2500 Tape & Reel MC74LCX138DTG TSSOP−16 (Pb−Free) 96 Units / Rail MC74LCX138DTR2G TSSOP−16 (Pb−Free) 2500 Tape & Reel NLV74LCX138DR2G* SOIC−16 (Pb−Free) 2500 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. MAXIMUM RATINGS Symbol VCC Parameter DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK IOK Value Condition −0.5 to +7.0 Units V −0.5 VI +7.0 V −0.5 VO VCC + 0.5 Output in HIGH or LOW State (Note 1) V DC Input Diode Current −50 VI < GND mA DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current 50 mA ICC DC Supply Current Per Supply Pin 100 mA IGND DC Ground Current Per Ground Pin 100 mA TSTG Storage Temperature Range −65 to +150 C MSL Moisture Sensitivity Level 1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. http://onsemi.com 3 MC74LCX138 RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage Min Typ Max Units 2.0 1.5 2.5, 3.3 2.5, 3.3 3.6 3.6 V 0 5.5 V 0 VCC V Operating Data Retention Only VI Input Voltage VO Output Voltage (HIGH or LOW State) (3−State) IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −24 −12 −8 mA IOL LOW Level Output Voltage VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V +24 +12 +8 mA TA Operating Free−Air Temperature Dt/DV −40 +85 C 0 10 ns/V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V DC ELECTRICAL CHARACTERISTICS TA = −40C to +85C Symbol Characteristic VIH HIGH Level Input Voltage (Note 2) VIL LOW Level Input Voltage (Note 2) VOH VOL IOFF HIGH Level Output Voltage LOW Level Output Voltage Power Off Leakage Current Condition Min 2.3 V VCC 2.7 V 1.7 2.7 V VCC 3.6 V 2.0 Max Units V 2.3 V VCC 2.7 V 0.7 2.7 V VCC 3.6 V 0.8 2.3 V VCC 3.6 V; IOH = −100 mA VCC − 0.2 VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 V V 2.3 V VCC 3.6 V; IOL = 100 mA 0.2 VCC = 2.3 V; IOL = 8 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 V VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 mA IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND 5 mA ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 mA 500 mA Increase in ICC per Input 2.3 VCC 3.6 V; VIH = VCC − 0.6 V DICC 2. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W) Limits TA = −40C to +85C Symbol Parameter VCC = 3.3 V 0.3 V VCC = 2.7 V CL = 50 pF CL = 50 pF VCC = 2.5 V 0.2 V CL = 30 pF Waveform Min Max Min Max Min Max Units tPLH tPHL Propagation Delay An to On 1, 2 1.5 1.5 6.0 6.0 1.5 1.5 7.0 7.0 1.5 1.5 7.2 7.2 ns tPLH tPHL Propagation Delay E1, E2 to On 2 1.5 1.5 6.5 6.5 1.5 1.5 7.5 7.5 1.5 1.5 8.4 8.4 ns tPLH tPHL Propagation Delay E3 to On 1 1.5 1.5 6.0 6.0 1.5 1.5 7.0 7.0 1.5 1.5 7.2 7.2 ns tOSHL tOSLH Output−to−Output Skew (Note 3) 1.0 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. http://onsemi.com 4 MC74LCX138 CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Units 7 pF VCC = 3.3 V, VI = 0 V or VCC 8 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF Input Capacitance VCC = 3.3 V, VI = 0 V or VCC COUT Output Capacitance CPD Power Dissipation Capacitance VCC Vmi An, E3 Vmi 0V tPHL tPLH VOH Vmo Vmo On VOL WAVEFORM 1: PROPAGATION DELAYS FOR INVERTING OUTPUTS 2.7 V An, E1, E2 Vmi Vmi 0V tPHL tPLH VOH On Vmo Vmo VOL WAVEFORM 2: PROPAGATION DELAYS FOR NON−INVERTING OUTPUTS Vcc Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V Vmi 1.5 V 1.5 V Vcc/2 Vmo 1.5 V 1.5 V Vcc/2 Figure 4. AC Waveforms VCC PULSE GENERATOR DUT RT CL = CL = RL = RT = CL RL 50 pF at VCC = 3.3 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W) Figure 5. Test Circuit http://onsemi.com 5 MC74LCX138 PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX CASE 948F ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S K S ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. N 8 1 0.25 (0.010) M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74LCX138 PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE K −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K DIM A B C D F G J K M P R F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 S SOLDERING FOOTPRINT* 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC74LCX138/D