S70GL-P MirrorBit® Flash S70GL02GP 2 Gigabit, 3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology S70GL-P MirrorBit® Flash Cover Sheet Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions. Publication Number S70GL-P_00 Revision 03 Issue Date February 23, 2010 D at a S hee t Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content: “This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.” Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content: “This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.” Combination Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page. Full Production (No Designation on Document) When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category: “This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.” Questions regarding these document designations may be directed to your local sales office. 2 S70GL-P MirrorBit® Flash S70GL-P_00_03 February 23, 2010 S70GL-P MirrorBit® Flash S70GL02GP 2 Gigabit, 3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology Data Sheet General Description The Spansion S70GL02GP 2-Gigabit Mirrorbit Flash memory device is fabricated on 90 nm process technology. This device offers a fast page access time of 25 ns with a corresponding random access time of 110 ns. It features a Write Buffer that allows a maximum of 32 words/64 bytes to be programmed in one operation, resulting in faster effective programming time than standard single byte/word programming algorithms. This makes the device an ideal product for today’s embedded applications that require higher density, better performance and lower power consumption. Distinctive Characteristics Two 1024 Megabit (S29GL01GP) in a single 64-ball FortifiedBGA package (see publication S29GL-P_00 for full specifications) Single 3V read/program/erase (3.0V - 3.6V) 90 nm MirrorBit process technology 8-word/16-byte page read buffer 32-word/64-byte write buffer reduces overall programming time for multiple-word writes Secured Silicon Sector region – 128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random Electronic Serial Number – Can be programmed and locked at the factory or by the customer Uniform 64Kword/128KByte Sector Architecture – S70GL02GP: two thousand forty-eight sectors Suspend and Resume commands for Program and Erase operations Write operation status bits indicate program and erase operation completion Unlock Bypass Program command to reduce programming time Support for CFI (Common Flash Interface) Persistent and Password methods of Advanced Sector Protection WP#/ACC input – Accelerates programming time (when VACC is applied) for greater throughput during system production – Protects first or last sector of each die, regardless of sector protection settings 100,000 erase cycles per sector typical Hardware reset input (RESET#) resets device 20-year data retention typical Ready/Busy# output (RY/BY#) detects program or erase cycle completion Offered Packages – 64-ball Fortified BGA Publication Number S70GL-P_00 Revision 03 Issue Date February 23, 2010 D at a S hee t Performance Characteristics Max. Read Access Times (ns) (Note 1) Parameter 2 Gb Random Access Time (tACC) 110 Page Access Time (tPACC) 25 CE# Access Time (tCE) 110 OE# Access Time (tOE) 25 Notes 1. Access times are dependent on VCC and VIO operating ranges. See Ordering Information on page 6 for further details. 2. Contact a sales representative for availability. Current Consumption (typical values) Random Access Read 30 mA 8-Word Page Read 1 mA Program/Erase 50 mA Standby 2 µA Program & Erase Times (typical values) 4 Single Word Programming 60 µs Effective Write Buffer Programming (VCC) Per Word 15 µs Effective Write Buffer Programming (VACC) Per Word 15 µs Sector Erase Time (64 Kword Sector) 0.5 s S70GL-P MirrorBit® Flash S70GL-P_00_03 February 23, 2010 Data She et Table of Contents General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Distinctive Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 Recommended Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2. Input/Output Descriptions & Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 Special Handling Instructions for BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 LSE064—64 ball Fortified Ball Grid Array, 13 x 11 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3. Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4. Autoselect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5. Erase And Programming Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6. BGA Package Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 February 23, 2010 S70GL-P_00_03 S70GL-P MirrorBit® Flash 5 D at a 1. S hee t Ordering Information The ordering part number is formed by a valid combination of the following: S70GL02GP 11 F F C R1 0 PACKING TYPE 0 = Tray (standard; see (Note 3) 2 = 7” Tape and Reel 3 = 13” Tape and Reel MODEL NUMBER (VIO range, protection when WP# =VIL) R1 = VIO = VCC = 3.0 to 3.6V, highest address sector protected R2 = VIO = VCC = 3.0 to 3.6V, lowest address sector protected TEMPERATURE RANGE I = Industrial (–40°C to +85°C) C = Commercial (0°C to +85°C) PACKAGE MATERIALS SET A = Pb (Note 1) F = Pb-free PACKAGE TYPE F = Fortified Ball Grid Array, 1.0 mm pitch package SPEED OPTION 11 = 110 ns DEVICE NUMBER/DESCRIPTION S70GL02GP 3.0 Volt-only, 2048 Megabit (128 M x 16-Bit/256 M x 8-Bit) Page-Mode Flash Memory Manufactured on 90 nm MirrorBit process technology 1.1 Recommended Combinations Recommended Combinations table below list various configurations planned to be available in volume. The table below will be updated as new combinations are released. Check with your local sales representative to confirm availability of specific configuration not listed or to check on newly released combinations. S29GL-P Recommended Combinations (Note 1) Base OPN Speed (ns) Package & Temperature Model Number Packing Type Ordering Part Number (x = Packing Type) S70GL02GP11FFCR1x S70GL02GP 110 FFC, FAC (Note 2) R1, R2 0, 2, 3 S70GL02GP11FFCR2x (Note 3) S70GL02GP11FACR1x S70GL02GP11FACR2x Notes 1. Contact a local sales representative for availability. 2. BGA package marking omits leading “S29” and packing type designator from ordering part number. 3. Packing Type “0” is standard option. 6 S70GL-P MirrorBit® Flash S70GL-P_00_03 February 23, 2010 Data 2. She et Input/Output Descriptions & Logic Symbol Table 2.1 identifies the input and output package connections provided on the device. Table 2.1 Input/Output Descriptions Symbol Type Description A26–A0 Input DQ14–DQ0 I/O Address lines for GL02GP DQ15/A-1 I/O CE# Input Chip Enable. Data input/output. DQ15: Data input/output in word mode. A-1: LSB address input in byte mode. OE# Input Output Enable. WE# Input Write Enable. VCC Supply Device Power Supply. VIO Supply Versatile IO Input. VSS Supply Ground. RY/BY# Output Ready/Busy. Indicates whether an Embedded Algorithm is in progress or complete. At VIL, the device is actively erasing or programming. At High Z, the device is in ready. BYTE# Input Selects data bus width. At VIL, the device is in byte configuration and data I/O pins DQ0DQ7 are active. At VIH, the device is in word configuration and data I/O pins DQ0-DQ15 are active. RESET# Input Hardware Reset. Low = device resets and returns to reading array data. WP#/ACC Input Write Protect/Acceleration Input. At VIL, disables program and erase functions in the outermost sectors. At VHH, accelerates programming; automatically places device in unlock bypass mode. Should be at VIH for all other conditions. NC No Connect February 23, 2010 S70GL-P_00_03 Not connected internally. S70GL-P MirrorBit® Flash 7 D at a 2.1 S hee t Special Handling Instructions for BGA Package Special handling is required for Flash Memory products in BGA packages. Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. Figure 2.1 64-ball Fortified Ball Grid Array 64-ball Fortified BGA Top View, Balls Facing Down A8 B8 C8 D8 E8 F8 G8 H8 NC A22 A23 VIO VSS A24 A25 NC A7 B7 C7 D7 E7 F7 G7 H7 A13 A12 A14 A15 A16 BYTE# DQ15/A-1 VSS A6 B6 C6 D6 E6 F6 G6 H6 A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6 A5 B5 C5 D5 E5 F5 G5 H5 DQ4 WE# RESET# A21 A19 DQ5 DQ12 VCC A4 B4 C4 D4 E4 F4 G4 H4 A18 A20 DQ2 DQ10 DQ11 DQ3 RY/BY# WP#/ACC 8 A3 B3 C3 D3 E3 F3 G3 H3 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 A2 B2 C2 D2 E2 F2 G2 H2 A3 A4 A2 A1 A0 CE# OE# VSS A1 B1 C1 D1 E1 F1 G1 H1 NC A26 NC NC NC VIO NC NC S70GL-P MirrorBit® Flash S70GL-P_00_03 February 23, 2010 Data 2.2 She et LSE064—64 ball Fortified Ball Grid Array, 13 x 11 mm Figure 2.2 LSE064—64-ball Fortified Ball Grid Array (FBGA), 13 x 11 mm NOTES: PACKAGE LSE 064 JEDEC N/A DxE 13.00 mm x 11.00 mm PACKAGE SYMBOL MIN NOM MAX A --- --- 1.40 A1 0.40 --- --- A2 0.79 --- 0.91 D 13.00 BSC. BALL POSITION DESIGNATION PER JEP95, SECTION 4.3, SPP-010. 4. e REPRESENTS THE SOLDER BALL GRID PITCH. 5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. BODY THICKNESS SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. BODY SIZE BODY SIZE 7.00 BSC. MATRIX FOOTPRINT E1 7.00 BSC. MD 8 MATRIX SIZE D DIRECTION ME 8 MATRIX SIZE E DIRECTION MATRIX FOOTPRINT 64 0.60 ALL DIMENSIONS ARE IN MILLIMETERS. 3. PROFILE 11.00 BSC. 0.50 2. BALL HEIGHT E n DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. NOTE D1 Øb 1. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. BALL COUNT 0.70 eE 1.00 BSC. BALL PITCH eD 1.00 BSC BALL PITCH SD / SE 0.50 BSC. --- WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. BALL DIAMETER WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 SOLDER BALL PLACEMENT 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 9 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. DEPOPULATED SOLDER BALLS 3611 \ 16-038.15 \ 11.13.6 February 23, 2010 S70GL-P_00_03 S70GL-P MirrorBit® Flash 9 D at a S hee t 3. Memory Map The S70GL02GP consist of uniform 64 Kword (128 Kb) sectors organized as shown in Table 3.1. Table 3.1 S70GL02GP Sector & Memory Address Map Uniform Sector Size Sector Count 64 Kword/128 Kb Sector Range Address Range (16-bit) Notes SA00 0000000h–000FFFFh Sector Starting Address 2048 : : SA2047 7FF0000H–7FFFFFFh Sector Ending Address Note This table has been condensed to show sector-related information for an entire device on a single page. Sectors and their address ranges that are not explicitly listed (such as SA001-SA2046) have sector starting and ending addresses that form the same pattern as all other sectors of that size. For example, all 128 Kb sectors have the pattern xxx0000h-xxxFFFFh. 4. Autoselect Table 4.1 provides the device identification codes for the S70GL02GP. For more information on the autoselect function, refer to the S29GL-P data sheet (publication number S29GL-P_00). Table 4.1 Autoselect Addresses in System Description Address Read Data (word/byte mode) Manufacturer ID (Base) + 00h xx01h/1h Device ID, Word 1 (Base) + 01h 227Eh/7Eh Device ID, Word 2 (Base) + 0Eh 2248h/48h Device ID, Word 3 (Base) + 0Fh 2201h/01h Secure Device Verify (Base) + 03h Sector Protect Verify (SA) + 02h For S70GL02GPH: XX19h/19h = Not Factory Locked. XX99h/99h = Factory Locked. For S70GL02GPL: XX09h/09h = Not Factory Locked. XX89h/89h = Factory Locked. xx01h/01h = Locked, xx00h/00h = Unlocked 5. Erase And Programming Performance Table 5.1 Erase And Programming Performance Typ (Note 1) Parameter Sector Erase Time Chip Erase Time S70GL02GP Max (Note 2) Unit 0.5 3.5 sec 1024 4096 sec Total Write Buffer Time, for 64 bytes 480 µs Total Accelerated Write Buffer Programming Time, for 64 bytes 432 µs 1968 sec Chip Program Time S70GL02GP Comments Excludes 00h programming prior to erasure (Note 3) Excludes system level overhead (Note 4) Notes 1. Typical program and erase times assume the following conditions: 25°C, 3.6 V VCC, 10,000 cycles, checkerboard pattern. 2. Under worst case conditions of -40°C, VCC = 3.0 V, 100,000 cycles. 3. In the pre-programming step of the Embedded Erase algorithm, all bits are programmed to 00h before erasure. 4. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. 10 S70GL-P MirrorBit® Flash S70GL-P_00_03 February 23, 2010 Data She et 6. BGA Package Capacitance Parameter Symbol Parameter Description Test Setup Typ Max Unit CIN Input Capacitance VIN = 0 12 20 pF COUT Output Capacitance VOUT = 0 20 24 pF CIN2 Control Pin Capacitance VIN = 0 16 20 pF RESET#, WP#/ACC Separated Control Pin VIN = 0 84 90 pF CE# Separated Control Pin VIN = 0 44 50 pF Notes 1. Sampled, not 100% tested. 2. Test conditions TA = 25°C, f = 1.0 MHz. February 23, 2010 S70GL-P_00_03 S70GL-P MirrorBit® Flash 11 D at a S hee t 7. Revision History Section Description Revision 01 (December 4, 2006) Initial Release. Revision 02 (May 19, 2008) Changed data sheet designation Global Added Product Life-cycle notice Removed Table of Figures and Table of Tables - Changed sample OPN Ordering Information - Added Commercial temperature range - Changed configuration in “Device Number/description” - Modified “Recommended Combination” table & removed TSOP package option Erase And Program Performance Chip Program Time: removed comment Common Flash Memory Interface Removed section (see publication S29GL-P_00 for details) Revision 03 (February 23, 2010) Global 12 Updated available model options. Corrected Chip Program Time. S70GL-P MirrorBit® Flash S70GL-P_00_03 February 23, 2010 Data She et Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2006-2010 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™, EcoRAM™ and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners. February 23, 2010 S70GL-P_00_03 S70GL-P MirrorBit® Flash 13