STM6513 Reset TM Dual push-button Smart with dual reset outputs and user-selectable setup delay Features ■ Dual Smart Reset push-button inputs with user-selectable extended reset setup delay (by three-state input logic): tSRC = 2, 6, 10 s (min.) ■ Capacitor-adjustable reset pulse duration (tREC1) ■ Power-on reset ■ Dual reset output (RST1 is active-high, pushpull type, RST2 is active-low, open-drain) ■ Factory-programmable thresholds to monitor VCC in the range of 1.575 to 4.625 V typ. ■ Operating voltage 1.0 V (active-low output valid) to 5.5 V ■ Low supply current 3 µA ■ Operating temperature: industrial grade –40 °C to +85 °C ■ Mobile phones, smartphones ■ e-books ■ TDFN8 package: 2 mm x 2 mm x 0.75 mm ■ MP3 players ■ RoHS compliant ■ Games ■ Portable navigation devices ■ Any application that requires delayed reset push-button(s) response for improved system stability. June 2010 TDFN8 (DG) 2 mm x 2 mm Applications Doc ID 16490 Rev 2 1/29 www.st.com 1 Contents STM6513 Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 Power supply (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2 Ground (VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.3 Smart Reset inputs (SR0, SR1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.4 User-programmable Smart Reset delay (TSR pin) . . . . . . . . . . . . . . . . . . 8 3.5 Reset outputs (RST1, RST2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.6 Adjustable output reset timeout period input pin (TRECADJ) . . . . . . . . . . . 8 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 9 Package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 10 Tape and reel information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 11 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 12 Package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 2/29 Doc ID 16490 Rev 2 STM6513 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 tREC1 programmed by an ideal external capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Operating and measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Possible VCC voltage thresholds. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm package mechanical data . . . . . . . . . . . . . . . . . 21 Parameter for landing pattern - TDFN – 8-lead 2 x 2 mm package . . . . . . . . . . . . . . . . . . 22 Carrier tape dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Package marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Doc ID 16490 Rev 2 3/29 List of figures STM6513 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. 4/29 Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Timing waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Smart Reset delay tSRC vs. temperature and supply voltage VCC, TSR = VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Output reset timeout period tREC2 vs. temperature and supply voltage VCC (tREC option E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Supply current ICC vs. temperature and supply voltage VCC . . . . . . . . . . . . . . . . . . . . . . . 13 Reset voltage VRST (falling) vs. temperature (threshold option S, 2.925 V typ.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Input leakage current, TSR pin, logic low vs. temperature and supply voltage VCC . . . . . . 14 Input leakage current, TSR pin, logic high vs. temperature and supply voltage VCC . . . . . 15 AC testing input/output waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 TDFN - 8-lead, 2 x 2 x 0.75 mm, 0.5 mm pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Landing pattern - TDFN – 8-lead 2 x 2 mm without thermal pad . . . . . . . . . . . . . . . . . . . . 22 Carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Tape trailer/leader. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Pin 1 orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Package marking area, top view. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Doc ID 16490 Rev 2 STM6513 1 Description Description The STM6513 has two separate delayed Smart Reset inputs (SR0, SR1) which when taken low simultaneously provide three user-selectable delayed Smart Reset setup time (tSRC) options of 2 s, 6 s and 10 s. These are selected through a three-state TSR input pin: when connected to ground, tSRC = 2 s; when left open, tSRC = 6 s; when connected to VCC, tSRC = 10 s (all the times are minimum). There are two reset outputs, both going active simultaneously after both the Smart Reset inputs were held active for the selected tSRC delay time. The first reset output, RST1, is active-high, push-pull; the second reset output, RST2, is active-low, open-drain requiring an external pull-up resistor. The duration of the output reset pulses is independently programmable: tREC1 is user-programmable (by external capacitor CtREC), tREC2 is factory-programmed to 210 ms (typ.), with the option of 360 ms typ. Additionally, the VCC is monitored and if it drops below the selected VRST threshold, both the reset outputs go active and remain so while VCC is below the VRST threshold, plus the defined duration of the reset pulse tREC on each output. Smart Reset devices The Smart Reset device family STM65xx provides a useful feature that ensures inadvertent short reset push-button closures do not cause system resets. This is done by implementing extended Smart Reset input delay (tSRC). Once the valid Smart Reset input levels and setup delay are met, the device generates an output reset pulse with user-programmable timeout period (tREC). The Smart Reset inputs can be also connected to the applications interrupt to allow the control of both the interrupt pin and the hard reset functions. If the push-buttons are closed for a short time, the processor is only interrupted. If the system still does not respond properly, holding the push-buttons for the extended setup time (tSRC) causes hard reset of the processor through the reset outputs. The Smart Reset feature helps significantly increase system stability. The STM65xx family of Smart Reset devices consists of low current microprocessor reset circuits targeted at applications such as MP3 players, navigation, smartphones or mobile phones; generally any application that requires delayed reset push-button(s) response for improved system stability. The STM65xx devices feature single or dual Smart Reset inputs (SR). The delayed Smart Reset setup time (tSRC) options of 2 s, 6 s and 10 s (all min.) are adjustable by an external capacitor on the SRC pin or selectable by three-state logic. The delayed setup period ignores switch closures shorter than tSRC, thus preventing unwanted resets. The STM65xx devices have active-low (optionally active-high) open-drain reset (RST) output(s) with or without internal pull-up resistor or push-pull as output options, with factoryprogrammed or capacitor-adjustable or push-buttons defined output reset pulse duration, with or without power-on reset function. Some devices also have an undervoltage monitoring feature: the reset output is also asserted when the monitored supply voltage VCC drops below the specified threshold. The reset output remains asserted for the reset timeout period (tREC) after the monitored supply voltage goes above the specified threshold. Doc ID 16490 Rev 2 5/29 Description STM6513 Figure 1. Logic diagram VCC SR1 TRECADJ STM6513 RST1 RST2 SR0 TSR VSS Figure 2. AM00372 Pin connections RST1 1 8 VCC VSS 2 7 SR0 SR1 3 6 TRECADJ RST2 4 5 TSR STM 6513 AM00373 6/29 Doc ID 16490 Rev 2 STM6513 2 Device overview Device overview Table 1. Signal names Symbol Input/output Description RST1 Output First reset output, active-high, push-pull. RST2 Output Second reset output, active-low, open-drain. SR0 Input Primary push-button Smart Reset input. Active-low. SR1 Input Secondary push-button Smart Reset input. Active-low. TSR Input A Three-state Smart Reset input delay setup control. When connected to ground, tSRC = 2 s; when left open, tSRC = 6 s; when connected to VCC, tSRC = 10 s (all times are minimum). TSR is a DC-type input, intended to be either permanently grounded, permanently connected to VCC or permanently left open. If left open, for improved system glitch immunity it is strongly recommended to connect a 0.1 µF decoupling ceramic capacitor between the TSR and VSS pins. TRECADJ Input Input pin for tREC1 reset pulse duration adjustment. Connect an external capacitor CtREC to this pin to determine tREC1; tREC2 is factoryprogrammed. VCC Supply Positive supply voltage input. Power supply for the device and an input for the monitored supply voltage. A 0.1 µF decoupling ceramic capacitor is recommended to be connected between VCC and VSS pins. VSS Supply Ground Doc ID 16490 Rev 2 7/29 Pin descriptions 3 Pin descriptions 3.1 Power supply (VCC) STM6513 This pin is used to provide the power to the Smart Reset device and to monitor the power supply. A 0.1 µF decoupling ceramic capacitor is recommended to be connected between VCC and VSS pins. 3.2 Ground (VSS) This is the ground for the device and all supplies. 3.3 Smart Reset inputs (SR0, SR1) Push-button Smart Reset inputs. Both inputs need to be held active at the same time for at least tSRC to activate the reset outputs. When only one Smart Reset input is used, connect the unused one permanently to VSS. 3.4 User-programmable Smart Reset delay (TSR pin) Used to allow the user to program the setup time before the push-buttons action is validated by reset output. Controlled by different voltage levels on the TSR pin: when connected to ground, tSRC = 2 s; when left open, tSRC = 6 s; when connected to VCC, tSRC = 10 s (all times are minimum). TSR is a DC-type input, intended to be either permanently grounded, permanently connected to VCC or permanently left open. If left open, for improved system glitch immunity it is strongly recommended to connect a 0.1 µF decoupling ceramic capacitor between the TSR and VSS pins. 3.5 Reset outputs (RST1, RST2) Reset outputs, RST1 active-high, push-pull type, RST2 active-low, open-drain. 3.6 Adjustable output reset timeout period input pin (TRECADJ) The output reset timeout period (tREC1) on RST1 is adjustable by connecting an external capacitor CtREC to the TRECADJ pin. Calculated tREC and CtREC examples are given in Table 2. Refer also to Table 5. 8/29 Doc ID 16490 Rev 2 STM6513 Pin descriptions Table 2. tREC1 programmed by an ideal external capacitor tREC1 (ms)(1)(2) Closest common CtREC value (µF) Min. Typ. Max. CtREC value (µF) 0.001 10 15 20 0.001 0.002 20 30 40 0.0022 0.01 100 150 200 0.01 0.014 140 210 280 0.015 0.028 280 420 560 0.027 0.056 560 840 1120 0.056 0.112 1120 1680 2240 0.12 1. At 25 ° C. Example calculations based on an ideal capacitor. During application design and component selection it should be considered that the current flowing into the external tREC programming capacitor (CtREC) is on the order of 100 nA, therefore a low-leakage capacitor (ceramic or film capacitor) should be used and placed as close as possible to the TRECADJ pin. Also an adequate low-leakage PCB environment should be ensured to prevent tREC accuracy from being affected. A recommended minimum value of C tREC is 0.001 µF. 2. In case of repeated activations of the internal tREC timer, an interval of 10 ms min. is needed between tREC intervals to fully discharge CtREC, so that the next tREC1 is as specified. Doc ID 16490 Rev 2 9/29 Block diagram STM6513 4 Block diagram Figure 3. Block diagram VCC tREC2 RST2 tREC1 RST1 + – VREF IREF TRECADJ SR1 tSRC SR logic SR0 TSR Three-state selector Oscillator AM00374V2 10/29 Doc ID 16490 Rev 2 STM6513 Block diagram STM6513 hookup with RST1 and RST2, bridging the PS_hold reset pulse during the microprocessor reset initiated by the STM6513 Smart Reset device: Figure 4. Typical application diagram VCC PMU VREG LD00 ... LD07 MCU Seq. logic (PU resistor) RST_n RST PWR SW POWER KEY PS_hold PS_hold 100 kΩ VREG GPIO1 RST1 (PP) RST2 (OD) TSR TRECADJ STM6513 SR0 GPIOn Forces PS_hold high during reset period SR1 KEYn CtREC KEY1 AM00375a Figure 5. Timing waveforms POR initiated Smart Reset™ initiated tSRC SR0, SR1 RST2 (OD) Factory programmed RST1 (PP) by CtREC tREC2 (210 ms) tREC1(~1 s) tREC2 (210 ms) tREC1 (~1 s) AM00376V2 Doc ID 16490 Rev 2 11/29 Typical operating characteristics 5 STM6513 Typical operating characteristics Figure 6. Smart Reset delay tSRC vs. temperature and supply voltage VCC, TSR = VSS 3 2.9 2.8 2.7 2.6 2.5 tSRC [s] 2.4 2.3 2.2 2.1 2 –60 –40 –20 0 20 40 60 80 100 120 140 Temperature [˚C] 5.5 V 3.3 V AM00632 12/29 Doc ID 16490 Rev 2 STM6513 Typical operating characteristics Figure 7. Output reset timeout period tREC2 vs. temperature and supply voltage VCC (tREC option E) 280 260 240 220 tREC2 [ms] 200 180 160 140 –60 –40 –20 0 20 40 60 80 100 120 140 Temperature [˚C] 5.5 V 3.3 V AM00633 Supply current ICC vs. temperature and supply voltage VCC Figure 8. 6 5 4 3 ICC [µA] 2 1 0 –60 –40 –20 0 20 40 60 80 100 120 140 Temperature [˚C] 5.5 V 3.3 V AM00634 Doc ID 16490 Rev 2 13/29 Typical operating characteristics Figure 9. STM6513 Reset voltage VRST (falling) vs. temperature (threshold option S, 2.925 V typ.) 2.96 2.95 2.94 2.93 VRST, falling [V] 2.92 2.91 2.9 2.89 –60 –40 –20 0 20 40 60 80 100 120 140 Temperature [˚C] AM00635 Figure 10. Input leakage current, TSR pin, logic low vs. temperature and supply voltage VCC 10 8 6 4 2 ILI(TSR) , LO [µA] –60 –40 –20 0 0 20 40 60 80 100 120 140 –2 –4 –6 –8 –10 Temperature [˚C] 5.5 V 3.3 V 2V AM00636 14/29 Doc ID 16490 Rev 2 STM6513 Typical operating characteristics Figure 11. Input leakage current, TSR pin, logic high vs. temperature and supply voltage VCC 10 8 6 4 2 ILI(TSR), HI [µA] 0 –60 –40 –20 0 20 40 60 80 100 120 140 –2 –4 –6 –8 –10 Temperature [˚C] 5.5 V 3.3 V 2V AM00637 Doc ID 16490 Rev 2 15/29 Maximum rating 6 STM6513 Maximum rating Stressing the device above the rating listed in the Table 3: Absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 3. Absolute maximum ratings Symbol TSTG Parameter Storage temperature (VCC off) TSLD(1) Lead solder temperature for 10 seconds θ JA Thermal resistance (junction to ambient) VIO Input or output voltage VCC Supply voltage TDFN8 Value Unit –55 to +150 °C 260 °C 149.0 °C/W –0.3 to 5.5(2) V –0.3 to 7 V 1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 s. 2. For RST1 –0.3 to V CC +0.3 V only. 16/29 Doc ID 16490 Rev 2 STM6513 7 DC and AC parameters DC and AC parameters This section summarizes the operating measurement conditions, and the DC and AC characteristics of the device. The parameters in the Table 5: DC and AC characteristics that follow, are derived from tests performed under the Measurement Conditions summarized in Table 4.: Operating and measurement conditions. Designers should check that the operating conditions in their circuit match the operating conditions when relying on the quoted parameters. Table 4. Operating and measurement conditions Parameter Value Unit VCC supply voltage 1.0 to 5.5 V Ambient operating temperature (TA) –40 to +85 °C ≤5 ns Input pulse voltages 0.2 to 0.8 VCC V Input and output timing ref. voltages 0.3 to 0.7 VCC V Input rise and fall times Figure 12. AC testing input/output waveforms 0.8 VCC 0.2 VCC Doc ID 16490 Rev 2 0.7 VCC 0.3 VCC AM00478 17/29 DC and AC parameters Table 5. STM6513 DC and AC characteristics Symbol Parameter VCC Supply voltage range Test conditions(1) Min. 5.5 V Reset output valid - active-high 1.2 5.5 V 3 5 µA 4 6 µA 0.3 V 0.3 V 0.3 V VCC = 3.0 V, TSR left open (3) VOL VCC ≥ 4.5 V, sinking 3.2 mA Reset output voltage VCC ≥ 3.3 V, sinking 2.5 mA low VCC ≥ 1.0 V, sinking 0.1 mA VCC = 5.0 V, TSR left open VCC ≥ 4.5 V, ISOURCE = 0.8 mA Reset output voltage VCC ≥ 2.7 V, ISOURCE = 0.5 mA high, RST1 VCC ≥ 1.2 V, ISOURCE = 0.05 mA VRST VHYST Hysteresis of VRST 0.8 VCC V 0.8 VCC V 0.8 VCC V –40 to +85 °C VRST –2.5% VRST VRST +2.5% V 25 °C VRST –2.0% VRST VRST +2.0% V L, M VCC to reset delay(4) 0.5% T, S, R, Z, Y, W, V 1% VCC falling from (VRST + 100 mV) to (VRST - 100 mV) at 10 mV/µs 20 tREC2 Output reset timeout Option E period on RST2, factory-programmed Option F tREC1 User-adjustable output reset timeout period on RST1 Refer to Table 2. 18/29 Units 1.0 Supply current (VCC) Fixed voltage trip point for VCC monitoring (refer to Table 6) Max. Reset output valid - active-low ICC VOH Typ.(2) Doc ID 16490 Rev 2 µs 140 210 280 ms 240 360 480 ms 10 000 x C tREC (µF) 15 000 x CtREC (µF) 20 000 x CtREC (µF) ms STM6513 DC and AC parameters Table 5. DC and AC characteristics (continued) Symbol Test conditions(1) Min. Typ.(2) Max. Units TSR = VSS 2 2.5 3 s TSR = floating 6 7.5 9 s TSR = VCC 10 12.5 15 s Parameter Smart Reset inputs (SRx) tSRC Smart Reset delay VIL SR0, SR1 input voltage low VSS –0.3 0.3 VCC V VIH SR0, SR1 input voltage high 0.7 VCC 5.5 V Input glitch immunity(5) Corresponds to the actual tSRC tSRC s ILI(SR) Input leakage current (SR0, SR1 pins) –1 1 µA ILI(TSR) Input leakage current (TSR pin) –5 7 µA 1. Valid for ambient operating temperature: TA = –40 to +85 °C; VCC = 1.0 V to 5.5 V (except where noted). 2. Typical value is at 25 °C and VCC = 3.3 V unless otherwise noted. 3. For devices with VRST < 3.0 V. 4. Guaranteed by design. 5. Input glitch immunity is equal to tSRC (when both SR inputs are low), otherwise infinite. Table 6. Possible VCC voltage thresholds VCC monitoring threshold VRST ±2.5% (–40 °C to +85 °C) ±2.0% (25 °C) Typ. Unit Min. Max. Min. Max. L (falling) 4.625 4.509 4.741 4.533 4.718 V M (falling) 4.375 4.266 4.484 4.288 4.463 V T (falling) 3.075 2.998 3.152 3.014 3.137 V S (falling) 2.925 2.852 2.998 2.867 2.984 V R (falling) 2.625 2.559 2.691 2.573 2.678 V Z (falling) 2.313 2.255 2.371 2.267 2.359 V Y (falling) 2.188 2.133 2.243 2.144 2.232 V W (falling) 1.665 1.623 1.707 1.632 1.698 V V (falling) 1.575 1.536 1.614 1.544 1.607 V Doc ID 16490 Rev 2 19/29 Package mechanical data 8 STM6513 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 13. TDFN - 8-lead, 2 x 2 x 0.75 mm, 0.5 mm pitch D A B PIN 1 INDEX AREA E 0.10 C 2x 0.10 C 2x TOP VIEW 0.10 C C A1 A SEATING PLANE SIDE VIEW 0.08 C e b PIN 1 INDEX AREA 1 4 0.10 C A B Pin#1 ID L 5 8 BOTTOM VIEW TDFN-8L 20/29 Doc ID 16490 Rev 2 STM6513 Package mechanical data Table 7. TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm package mechanical data Dimension (mm) Dimension (inches) Symbol Min. Nom. Max. Min. Nom. Max. A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D BSC 1.9 2.00 2.1 0.075 0.079 0.083 E BSC 1.9 2.00 2.1 0.075 0.079 0.083 e L 0.50 0.45 0.55 0.020 0.65 Doc ID 16490 Rev 2 0.018 0.022 0.026 21/29 Package footprint 9 STM6513 Package footprint Figure 14. Landing pattern - TDFN – 8-lead 2 x 2 mm without thermal pad D P E E1 L b Table 8. AM00441 Parameter for landing pattern - TDFN – 8-lead 2 x 2 mm package Dimension (mm) Parameter 22/29 Description Min. Nom. Max. L Contact length 1.05 — 1.15 b Contact width 0.25 — 0.30 E Max. land pattern Y-direction — 2.85 — E1 Contact gap spacing — 0.65 — D Max. land pattern X-direction — 1.75 — P Contact pitch — 0.5 — Doc ID 16490 Rev 2 STM6513 10 Tape and reel information Tape and reel information Figure 15. Carrier tape P0 D P2 T E A0 F Top cover tape W B0 Center lines of cavity K0 P1 User direction of feed AM03073v2 Table 9. Carrier tape dimensions Package W D TDFN8 8.00 +0.30 –0.10 1.50 +0.10/ –0.00 E P0 P2 F 1.75 4.00 2.00 3.50 ±0.10 ±0.10 ±0.10 ±0.05 A0 B0 K0 P1 T 2.30 ±0.05 2.30 ±0.05 1.00 ±0.05 4.00 ±0.10 0.250 ±0.05 Doc ID 16490 Rev 2 Unit Bulk qty. mm 3000 23/29 Tape and reel information STM6513 Figure 16. Reel dimensions T 40 mm min. acces hole at slot location B D C N A Full radius Tape slot in core for tape start 25 mm min width G measured at hub AM00443 Table 10. 24/29 Reel dimensions Tape sizes A max. B min. C D min. N min. G T max. 8 mm 180 (7 inches) 1.50 13.0 +/– 0.20 20.20 60 8.4 +2/–0 14.40 Doc ID 16490 Rev 2 STM6513 Tape and reel information Figure 17. Tape trailer/leader End Top cover tape Start No components Components 100 mm min. T RA IL ER No components L EA D ER 160 mm min. 400 mm min. Sealed with cover tape User direction of feed AM00444 Figure 18. Pin 1 orientation User direction of feed Note: 1 Drawings are not to scale. 2 All dimensions are in mm, unless otherwise noted. Doc ID 16490 Rev 2 AM00442 25/29 Part numbering STM6513 11 Part numbering Table 11. Ordering information scheme Example: STM6513 V E I E DG 6 Device type STM6513 Reset (VCC monitoring threshold) voltage VRST L = 4.625 V (typ., falling) M = 4.375 V T = 3.075 V S = 2.925 V R = 2.625 V Z = 2.313 V Y = 2.188 V W = 1.665 V V = 1.575 V Smart Reset setup delay (tSRC); presence of internal input pull-up on all Smart Reset inputs (SR0, SR1) E = 2 or 6 or 10 s min., user-programmed (three-state); no input pull-up Outputs type I = RST1 active-high, push-pull, RST2 active-low, open-drain, no pull-up Reset timeout period (tREC) E = tREC1 user-programmable (external capacitor), tREC2 factory-programmed (210 ms typ.) F = tREC1 user-programmable (external capacitor), tREC2 factory-programmed (360 ms typ.) Package DG = TDFN8 - 2 x 2 x 0.75 mm, 0.5 mm pitch Temperature range 6 = –40 °C to +85 °C Shipping method F = ECOPACK® package, tape and reel For other options, voltage threshold values etc. or for more information on any aspect of this device, please contact the ST sales office nearest you. 26/29 Doc ID 16490 Rev 2 F STM6513 Package marking information 12 Package marking information Table 12. Package marking Smart RST1 tREC1 Reset VRST output programming inputs type type Full part number tSRC delay control STM6513VEIEDG6F TSR AL, NPU V AH, PP CtREC AL, OD, NPU E 9AH STM6513SEIEDG6F TSR AL, NPU S AH, PP CtREC AL, OD, NPU E 9SH STM6513REIEDG6F TSR AL, NPU R AH, PP CtREC AL, OD, NPU E 9RH Note: RST2 output type tREC2 Topmark option AL = active-low, AH = active-high; PP = push-pull, OD = open-drain, PU = internal pull-up resistor, NPU = no internal pull-up resistor. Figure 19. Package marking area, top view A B C D E Topmark A = dot (pin 1 reference) B = assembly plant (P) C = assembly year (Y, 0-9): 9 = 2009 etc. D = assembly work week (WW, 01 to 52): 20 = WW20 etc. E = marking area (topmark) AM00479 Doc ID 16490 Rev 2 27/29 Revision history 13 STM6513 Revision history Table 13. Document revision history Date Revision 22-Oct-2009 1 Initial release. 2 Updated title, Features, Applications, replaced “smart reset” by “Smart Reset™” and “Smart Reset”, updated Section 1, Table 1, Section 3, Table 2, Figure 3, Figure 5, Figure 6, Table 3, Table 5 to Table 8, Table 11 and Table 12. 21-Jun-2010 28/29 Changes Doc ID 16490 Rev 2 STM6513 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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