STMICROELECTRONICS STP36NF06_07

STP36NF06
STP36NF06FP
N-channel 60V - 0.032Ω - 30A - TO-220/TO-220FP
STripFET™ II Power MOSFET
General features
Type
VDSS
RDS(on)
ID
STP36NF06
60V
<0.040Ω
30A
STP36NF06FP
60V
<0.040Ω
18A(1)
1. Current limited by package
3
3
1
■
Exceptional dv/dt capability
■
100% avalanche tested
■
Application oriented characterization
TO-220
2
1
2
TO-220FP
Description
This Power MOSFET is the latest development of
STMicroelectronics unique "Single Feature
Size™" strip-based process. The resulting
transistor shows extremely high packing density
for low on-resistance, rugged avalanche
characteristics and less critical alignment steps
therefore a remarkable manufacturing
reproducibility.
Internal schematic diagram
Applications
■
Switching application
Order codes
Part number
Marking
Package
Packaging
STP36NF06
P36NF06
TO-220
Tube
STP36NF06FP
P36NF06
TO-220FP
Tube
February 2007
Rev 6
1/14
www.st.com
14
Contents
STP36NF06 - STP36NF06FP
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 6
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
................................................ 9
STP36NF06 - STP36NF06FP
1
Electrical ratings
Electrical ratings
Table 1.
Absolute maximum ratings
Symbol
Parameter
Value
TO-220
VDS
Drain-source voltage (VGS = 0)
VGS
Gate- source voltage
ID
IDM
(2)
Ptot
dv/dt
EAS
(4)
1.
V
± 20
V
A
Drain current (continuous) at TC = 100°C
21
12(1)
A
Drain current (pulsed)
120
72
A
Total dissipation at TC = 25°C
70
25
W
0.47
0.17
W/°C
Peak diode recovery voltage slope
20
V/ns
Single pulse avalanche energy
200
mJ
VISO
Insulation withstand voltage
three leads to external heat
(t = 1s; Tc = 25°C)
Tstg
Storage temperature
Tj
60
18(1)
Derating factor
(3)
TO-220FP
30
Drain current (continuous) at TC = 25°C
ID
Unit
--
2500
V
-55 to 175
°C
Max. operating junction temperature
Current limited by package’s thermal resistance
2. Pulse width limited by safe operating area.
3. ISD ≤36A, di/dt ≤400A/µs, VDD ≤V(BR)DSS, Tj ≤TJMAX
4. Starting Tj = 25 °C, ID = 18A, VDD = 45V
Table 2.
Thermal data
TO-220
TO-220FP
2.14
6
Rthj-case
Thermal resistance junction-case max
°C/W
Rthj-amb
Thermal resistance junction-ambient max
62.5
°C/W
TJ
Maximum lead temperature for soldering
purpose(1)
300
°C
1. 1.6 mm from case, for 10 sec.
3/14
Electrical characteristics
2
STP36NF06 - STP36NF06FP
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 3.
On/off states
Symbol
Parameter
V(BR)DSS
Drain-source
breakdown voltage
ID = 250µA, VGS =0
IDSS
Zero gate voltage
drain current (VGS = 0)
VDS = max ratings
VDS = max ratings,
TC = 125°C
IGSS
Gate-body leakage
current (VDS = 0)
VGS = ± 20V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250µA
RDS(on)
Static drain-source on
resistance
VGS = 10V, ID = 15A
Table 4.
Symbol
Test conditions
Typ.
Max.
60
Unit
V
1
10
µA
µA
±100
nA
4
V
0.032
0.040
Ω
Typ.
Max.
Unit
2
Dynamic
Parameter
Test conditions
Min.
gfs (1)
Forward
transconductance
VDS = 25V, ID = 15A
12
S
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS = 25V, f = 1MHz,
VGS = 0
690
170
68
pF
pF
pF
td(on)
tr
td(off)
tf
Turn-on delay time
Rise time
Turn-off delay time
Fall time
VDD = 30V, ID = 18A
RG = 4.7Ω VGS = 10V
(see Figure 15)
10
40
27
9
ns
ns
ns
ns
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD = 30V, ID = 18A,
VGS = 10V
(see Figure 16)
23
6
9
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
4/14
Min.
31
nC
nC
nC
STP36NF06 - STP36NF06FP
Table 5.
Symbol
Electrical characteristics
Source drain diode
Parameter
ISDM (1)
Source-drain current
Source-drain current
(pulsed)
VSD (2)
Forward on voltage
ISD
trr
Qrr
IRRM
Test conditions
Min.
Typ.
ISD = 30A, VGS = 0
ISD = 30A,
Reverse recovery time
di/dt = 100A/µs,
Reverse recovery charge
VDD = 30V, Tj = 150°C
Reverse recovery current
(see Figure 17)
65
155
4.8
Max.
Unit
30
120
A
A
1.5
V
ns
nC
A
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
5/14
Electrical characteristics
STP36NF06 - STP36NF06FP
2.1
Electrical characteristics (curves)
Figure 1.
Safe operating area for TO-220
Figure 2.
Thermal impedance for TO-220
Figure 3.
Safe operating area for TO-220FP
Figure 4.
Thermal impedance for TO-220FP
Figure 5.
Output characteristics
Figure 6.
Transfer characteristics
6/14
STP36NF06 - STP36NF06FP
Electrical characteristics
Figure 7.
Transconductance
Figure 9.
Gate charge vs. gate-source voltage Figure 10. Capacitance variations
Figure 11. Normalized gate threshold voltage
vs. temperature
Figure 8.
Static drain-source on resistance
Figure 12. Normalized on resistance vs.
temperature
7/14
Electrical characteristics
Figure 13. Source-drain diode forward
characteristics
8/14
STP36NF06 - STP36NF06FP
Figure 14. Normalized BVDSS vs. temperature
STP36NF06 - STP36NF06FP
3
Test circuit
Test circuit
Figure 15. Switching times test circuit for
resistive load
Figure 16. Gate charge test circuit
Figure 17. Test circuit for inductive load
Figure 18. Unclamped Inductive load test
switching and diode recovery times
circuit
Figure 19. Unclamped inductive waveform
Figure 20. Switching time waveform
9/14
Package mechanical data
4
STP36NF06 - STP36NF06FP
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
10/14
STP36NF06 - STP36NF06FP
Package mechanical data
TO-220FP MECHANICAL DATA
mm.
DIM.
MIN.
A
4.4
inch
TYP
MAX.
MIN.
TYP.
4.6
0.173
0.181
MAX.
0.106
B
2.5
2.7
0.098
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L2
16
0.630
L3
28.6
30.6
1.126
1.204
L4
9.8
10.6
.0385
0.417
L5
2.9
3.6
0.114
0.141
L6
15.9
16.4
0.626
0.645
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L7
L3
L6
F2
H
G
G1
F
F1
L7
L2
L5
1 2 3
L4
11/14
Package mechanical data
STP36NF06 - STP36NF06FP
TO-220 MECHANICAL DATA
DIM.
mm.
MIN.
inch
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
b
0.61
0.88
0.024
0.034
b1
1.15
1.70
0.045
0.066
c
0.49
0.70
0.019
0.027
D
15.25
15.75
0.60
0.620
E
10
10.40
0.393
0.409
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.194
0.202
F
1.23
1.32
0.048
0.052
H1
6.20
6.60
0.244
0.256
J1
2.40
2.72
0.094
0.107
0.551
L
13
14
0.511
L1
3.50
3.93
0.137
L20
16.40
L30
12/14
TYP
0.154
0.645
28.90
1.137
øP
3.75
3.85
0.147
0.151
Q
2.65
2.95
0.104
0.116
STP36NF06 - STP36NF06FP
5
Revision history
Revision history
Table 6.
Revision history
Date
Revision
Changes
09-Sep-2004
3
Complete version
16-Aug-2006
4
The document has been reformatted
19-Dec-2006
5
Missing value on Table 3. (VGS(th))
21-Feb-2007
6
Typo mistake on page 1
13/14
STP36NF06 - STP36NF06FP
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
14/14