STP22NF03L N-channel 30 V, 0.0038 Ω, 22 A, TO-220 STripFET™ II Power MOSFET Features Type VDSS RDS(on) max ID STP22NF03L 30 V < 0.05 Ω 22 A ■ Exceptional dv/dt capability ■ Low gate charge at 100°C ■ Application oriented characterization ■ 100% avalanche tested 3 1 TO-220 Application ■ 2 Switching applications Figure 1. Description Internal schematic diagram This Power MOSFET is the latest development of STMicroelectronics unique "single feature size" strip-based process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility. Table 1. Device summary Order code Marking Package Packaging STP22NF03L P22NF03L@ TO-220 Tube October 2008 Rev 5 1/12 www.st.com 12 Contents STP22NF03L Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2/12 ................................................ 8 STP22NF03L 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Symbol VDS VDGR VGS Parameter Value Unit Drain-source voltage (VGS = 0) 30 V Drain-gate voltage (RGS = 20 kΩ) 30 V ± 15 V Gate- source voltage ID Drain current (continuous) at TC = 25 °C 22 A ID(1) Drain current (continuous) at TC = 100 °C 16 A Drain current (pulsed) 88 A Total dissipation at TC = 25 °C 45 W Derating factor 0.3 W/°C 6 V/ns 200 mJ -55 to 175 °C Value Unit IDM(1) Ptot dv/dt(2) EAS (3) Tstg Tj Peak diode recovery voltage slope Single pulse avalanche energy Storage temperature Max. operating junction temperature 1. Pulse width limited by safe operating area. 2. ISD ≤ 22 A, di/dt ≤ 300 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX 3. Starting Tj = 25 °C, ID = 11 A, VDD = 15 V Table 3. Symbol Thermal data Parameter Rthj-case Thermal resistance junction-case max 3.33 °C/W Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W Maximum lead temperature for soldering purpose 300 °C TJ 3/12 Electrical characteristics 2 STP22NF03L Electrical characteristics (TCASE = 25 °C unless otherwise specified) Table 4. On/off states Symbol Parameter Test conditions V(BR)DSS Drain-source breakdown voltage ID = 250 µA, VGS =0 IDSS Zero gate voltage drain current (VGS = 0) VDS = max ratings VDS = max ratings, TC = 125 °C IGSS Gate-body leakage current (VDS = 0) VGS = ± 20 V VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA RDS(on) Static drain-source on resistance VGS = 10 V, ID = 11 A VGS = 5 V, ID = 11 A Table 5. Symbol Typ. Max. 30 Unit V 1 10 µA µA ±100 nA 1 V 0.038 0.045 0.05 0.06 Ω Ω Typ. Max. Unit Dynamic Parameter Test conditions Min. gfs (1) Forward transconductance VDS= 15 V , ID = 11 A 7 S Ciss Coss Crss Input capacitance Output capacitance Reverse transfer capacitance VDS = 25 V, f = 1 MHz, VGS = 0 330 90 40 pF pF pF td(on) tr td(off) tf Turn-on delay time Rise time Turn-off delay time Fall time VDD = 15 V, ID = 11 A RG = 4.7 Ω VGS = 5 V (see Figure 13) 13 4 12 5 ns ns ns ns Qg Qgs Qgd Total gate charge Gate-source charge Gate-drain charge VDD = 24 V, ID = 22 A, VGS = 5 V (see Figure 14) 6.5 3.6 2 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%. 4/12 Min. 9 nC nC nC STP22NF03L Electrical characteristics Table 6. Symbol Source drain diode Parameter ISDM (1) Source-drain current Source-drain current (pulsed) VSD (2) Forward on voltage ISD trr Qrr IRRM Test conditions Min. Typ. ISD = 22 A, VGS = 0 ISD = 22 A, Reverse recovery time di/dt = 100 A/µs, Reverse recovery charge VDD = 15 V, Tj = 150 °C Reverse recovery current (see Figure 15) 30 18 1.2 Max. Unit 22 88 A A 1.5 V ns nC A 1. Pulse width limited by safe operating area. 2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5% 5/12 Electrical characteristics STP22NF03L 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance AM01526v1 n) (o 100µs DS Op Lim era ite tion d by in th m is a ax R re a is ID (A) 10 1ms 10ms 1 0.1 0.1 1 10 100 VDS(V) Figure 4. Output characteristics Figure 5. Transfer characteristics Figure 6. Transconductance Figure 7. Static drain-source on resistance 6/12 STP22NF03L Figure 8. Electrical characteristics Gate charge vs. gate-source voltage Figure 9. Figure 10. Normalized gate threshold voltage vs. temperature Capacitance variations Figure 11. Normalized on resistance vs. temperature Figure 12. Source-drain diode forward characteristics 7/12 Test circuit 3 STP22NF03L Test circuit Figure 13. Switching times test circuit for resistive load Figure 14. Gate charge test circuit VDD 12V 47kΩ 1kΩ 100nF 3.3 µF 2200 RL µF VGS IG=CONST VDD 100Ω Vi=20V=VGMAX VD RG 2200 µF D.U.T. D.U.T. VG 2.7kΩ PW 47kΩ 1kΩ PW AM01468v1 AM01469v1 Figure 15. Test circuit for inductive load Figure 16. Unclamped Inductive load test switching and diode recovery times circuit A A D.U.T. FAST DIODE B B L A D G VD L=100µH S 3.3 µF B 25 Ω 1000 µF D VDD 2200 µF 3.3 µF VDD ID G RG S Vi D.U.T. Pw AM01470v1 Figure 17. Unclamped inductive waveform AM01471v1 Figure 18. Switching time waveform ton V(BR)DSS tdon VD toff tr tdoff tf 90% 90% IDM 10% ID VDD 10% 0 VDD VDS 90% VGS AM01472v1 8/12 0 10% AM01473v1 STP22NF03L 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 9/12 Package mechanical data STP22NF03L TO-220 mechanical data mm inch Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 ∅P Q 10/12 Typ 4.40 0.61 1.14 0.48 15.25 Max Min 4.60 0.88 1.70 0.70 15.75 0.173 0.024 0.044 0.019 0.6 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 Max 0.181 0.034 0.066 0.027 0.62 0.050 16.40 28.90 3.75 2.65 Typ 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 3.85 2.95 0.147 0.104 0.151 0.116 STP22NF03L 5 Revision history Revision history Table 7. Document revision history Date Revision Changes 09-Sep-2004 1 Datasheet according to PCN DSG-TRA/04/532 09-Aug-2006 2 New template, no content change 20-Feb-2007 3 Typo mistake on page 1 03-Sep-2007 4 Figure 2: Safe operating area has been update. 08-Oct-2008 5 Figure 2: Safe operating area has been update. 11/12 STP22NF03L Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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