STPS1545C Power Schottky rectifier Features A1 ■ very small conduction losses A2 ■ negligible switching losses ■ extremely fast switching ■ avalanche capability specified K A2 Description A2 K A1 Dual center tap Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. TO-220AB STPS1545CT Packaged either in TO-220AB, D2PAK, I2PAK, or DPAK, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. A1 DPAK STPS1545CB K A2 A2 K A1 D2PAK STPS1545CG Table 1. November 2010 Doc ID 3503 Rev 7 A1 I2PAK STPS1545CR Device summary IF(AV) 2 x 7.5 A VRRM 45 V Tj (max) 175 °C VF(max) 0.57 V 1/10 www.st.com 10 Characteristics 1 STPS1545C Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 20 A 7.5 A 150 A IF(AV) Average forward current δ = 0.5 Tc = 157 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal IRRM Peak repetitive reverse current tp = 2 µs square F = 1 kHz 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 2 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2700 W -65 to + 175 °C 175 °C 10000 V/µs Value Unit 3.0 1.7 °C/W Storage temperature range Tstg Maximum operating junction temperature (1) Tj dV/dt 1. dPtot --------------dTj Per diode Critical rate of rise of reverse voltage < Table 3. 1 -------------------------Rth ( j – a ) condition to avoid thermal runaway for a diode on its own heatsink Thermal resistances Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Per diode Total 0.35 When the diodes 1 and 2 are used simultaneously: ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode2) x Rth(c) Table 4. Symbol IR(1) VF(1) Static electrical characteristics (per diode) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Forward voltage drop VR =VRRM Typ. Max. Unit - - 100 µA - 5 15 mA Tj = 125°C IF = 7.5A - 0.5 0.57 Tj = 25°C IF = 15 A - - 0.84 Tj = 125 °C IF = 15 A - 0.65 0.72 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.020 IF2(RMS) 2/10 Min. Doc ID 3503 Rev 7 V STPS1545C Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current (per diode) IF(AV)(A) PF(AV)(W) 9 6 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-c) 8 δ = 0.05 5 Average forward current versus ambient temperature (δ = 0.5, per diode) 7 Rth(j-a)=40°C/W 6 4 δ=1 Rth(j-a)=15°C/W 5 3 4 2 3 T T 2 1 δ=tp/T IF(AV)(A) 1 tp 0 δ=tp/T 0 0 1 2 Figure 3. 3 4 5 6 7 8 9 10 Normalized avalanche power derating versus pulse duration 0 Figure 4. PARM(tp) PARM(1 µs) Tamb(°C) tp 25 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 1.2 0.1 0.8 1 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values, per diode) Figure 6. 50 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) IM(A) 1.0 120 100 0.8 80 0.6 TC=50°C 60 δ = 0.5 TC=100°C 0.4 TC=150°C 0.2 40 20 IM t δ = 0.1 t(s) δ=0.5 0 1E-3 1E-2 T δ = 0.2 1E-1 1E+0 0.0 1E-4 tp(s) Single pulse Doc ID 3503 Rev 7 1E-3 1E-2 δ=tp/T 1E-1 tp 1E+0 3/10 Characteristics Figure 7. STPS1545C Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 8. Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) IR(µA) 1000 5E+4 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1E+4 Tj=125°C 1E+3 500 Tj=100°C Tj=75°C 1E+2 Tj=50°C 1E+1 200 Tj=25°C 1E+0 VR(V) VR(V) 1E-1 100 0 5 10 Figure 9. 15 20 25 30 35 40 45 Forward voltage drop versus forward current (high values, per diode) IFM(A) 1 2 5 20 50 Figure 10. Thermal resistance junction to ambient versus copper surface under tab (D2PAK) 80 Rth(j-a)(°C/W) Epoxy printed circuit board copper thickness = 35 µm 100.0 70 Tj=125°C (typical values) 10 D²PAK 60 Tj=25°C maximum values 10.0 50 40 Tj=125°C maximum values 30 1.0 20 10 VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 Scu(cm²) 0 5 10 15 20 25 30 35 Figure 11. Thermal resistance junction to ambient versus copper surface under tab (DPAK) 100 Rth(j-a)(°C/W) Epoxy printed circuit board copper thickness = 35 µm 90 DPAK 80 70 60 50 40 30 20 10 Scu(cm²) 0 0 4/10 5 10 15 20 25 Doc ID 3503 Rev 7 30 35 40 40 STPS1545C 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 12. TO-220AB dimensions Dimensions Ref Dia Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 C L5 L7 L6 L2 F2 F1 D L9 L4 F L2 M G1 Inches Min. A H2 Millimeters E G 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Dia. Doc ID 3503 Rev 7 16.4 typ. 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/10 Package information Table 5. STPS1545C D2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 0.40 typ. 0° 8° Figure 13. Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 8.90 6/10 Doc ID 3503 Rev 7 3.70 0.016 typ. 0° 8° STPS1545C Package information Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory. Figure 14. I2PAK dimensions Dimensions Ref c2 L2 D L1 A1 b1 L b e e1 c Inches Min. Typ. Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A 4.40 A1 2.49 2.69 0.098 0.106 A1 2.49 b 0.70 0.93 0.028 0.037 b 0.70 b1 1.14 1.17 0.044 0.046 b1 1.14 b2 1.14 1.17 0.044 0.046 b2 1.14 c 0.45 0.60 0.018 0.024 c 0.45 c2 1.23 1.36 0.048 0.054 c2 1.23 D 8.95 9.35 0.352 0.368 D 8.95 e 2.40 2.70 0.094 0.106 e 2.40 E 10.0 10.4 0.394 0.409 E 10.0 L 13.1 13.6 0.516 0.535 L 13.1 L1 3.48 3.78 0.137 0.149 L1 3.48 L2 1.27 1.40 0.050 0.055 L2 1.27 A E Millimeters Doc ID 3503 Rev 7 7/10 Package information Table 6. STPS1545C DPAK dimensions Dimensions Ref. E A B2 C2 L2 Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 D R H L4 A1 B G R C A2 0.60 MIN. L2 V2 0.80 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 15. Footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 8/10 Doc ID 3503 Rev 7 0.031 typ. STPS1545C 3 Ordering information Ordering information Table 7. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS1545CT STPS1545CT TO-220AB STPS1545CG STPS1545CG 2.23 g 50 Tube 2 1.48 g 50 Tube 2 D PAK STPS1545CG-TR STPS1545CG D PAK 1.48 g 1000 Tape and reel STPS1545CR STPS1545CR I2PAK 1.49 g 50 Tube STPS1545CB-TR STPS1545CB DPAK 0.3 g 2500 Tape and reel For the latest information on available order codes see the product pages on www.st.com. 4 Revision history Table 8. Document revision history Date Revision Changes Jul-2003 5F Last release. 21-Mar-2007 6 Removed ISOWATT and TO-220FPAB packages. 03-Nov-2010 7 Added DPAK package. Doc ID 3503 Rev 7 9/10 STPS1545C Please Read Carefully: Information in this document is provided solely in connection with ST products. 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