STTH602C-Y Automotive ultrafast recovery diode Datasheet production data Features ■ Suited for SMPS ■ Low losses A1 ■ Low forward and reverse recovery time A2 ■ High surge current capability ■ High junction temperature K Description A2 K This dual center tap diode is suited for switch mode power supplies and high frequency DC to DC converters. Packaged in DPAK, this device is intended for use in low voltage high frequency inverters, free wheeling and polarity protection for automotive applications. October 2012 This is information on a product in full production. A1 DPAK STTH602CBY-TR Table 1. Doc ID 023250 Rev 1 Device summary IF(AV) 2x3A VRRM 200 V Tj (max) 175° C VF (typ) 0.80 V trr (typ) 14 ns 1/7 www.st.com 7 Characteristics STTH602C-Y 1 Characteristics Table 2. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) RMS forward current 11 A IF(AV) Average forward current, = 0.5 IFSM Surge non repetitive forward current Tstg Tj Table 3. 3 Per device Tc = 155° C 6 tp = 10 ms Sinusoidal A 60 A Storage temperature range -65 to + 175 °C Operating junction temperature -40 to + 175 °C Thermal parameters Symbol Rth(j-c) Per diode Tc = 160° C Parameter Value Per diode 5 Per device 3.0 Per diode 1 Per diode 3 Unit Junction to case ° C/W Rth(c) Coupling When the two diodes 1 and 2 are used simultaneously: Tj(diode 1) = P (diode 1) X Rth(j-c) (Per diode) + P (diode 2) x Rth(c) Table 4. Symbol IR(1) Static electrical characteristics Parameter Test conditions Tj = 25° C Reverse leakage current Tj = 125° C Tj = 25° C VF(2) Tj = 150° C Forward voltage drop Tj = 25° C Tj = 150° C IF = 3 A IF = 6 A To evaluate the conduction losses use the following equation: Doc ID 023250 Rev 1 Unit µA 3 30 0.98 1.1 0.8 0.95 1.1 1.25 0.9 1.05 V 2. Pulse test: tp = 380 µs, < 2% 2/7 Max. 3 VR = VRRM 1. Pulse test: tp = 5 ms, < 2% P = 0.85 x IF(AV) + 0.033 IF2(RMS) Typ. STTH602C-Y Characteristics Table 5. Dynamic characteristics Symbol Parameter trr Test conditions Typ. Max. Unit IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25 °C 14 20 ns IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C 21 30 Reverse recovery current IF = 3 A, dIF/dt = 200 A/µs, VR = 160 V, Tj = 125 °C 4 5.5 Forward recovery time IF = 3 A, dIF/dt = 200 A/µs VFR = 1.1 x VFmax, Tj = 25 °C 24 ns Forward recovery voltage IF = 3 A, dIF/dt = 200 A/µs, Tj = 25 °C 3.7 V Reverse recovery time IRM tfr VFP Figure 1. Peak current versus duty cycle (per diode) Figure 2. Min. A Forward voltage drop versus forward current (typical values per diode) IFM(A) IM(A) 100 100 T IM δd=tp/T 80 80 tp 60 60 P = 10 W 40 40 P=5W Tj=150°C P=3W 20 Tj=25°C 20 δ VFM(V) 0 0 0.0 0.1 Figure 3. 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 Forward voltage drop versus forward current (maximum values per diode) 0.5 Figure 4. IFM(A) 1.0 1.5 2.0 2.5 3.0 3.5 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 100 1.0 90 Single - pulse 80 70 60 50 Tj=150°C 40 30 Tj=25°C 20 10 VFM(V) tp(s) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.1 1.E-03 Doc ID 023250 Rev 1 1.E-02 1.E-01 1.E+00 3/7 Characteristics Figure 5. STTH602C-Y Junction capacitance versus reverse applied voltage (typical values per diode) Figure 6. Reverse recovery charges versus dIF/dt (typical values) QRR(nC) C(pF) 100 100 IF=3A VR=160V F=1MHz Vosc=30mVRMS Tj=25°C 80 Tj=125°C 60 10 40 Tj=25°C 20 VR(V) dIF/dt(A/µs) 0 1 1 Figure 7. 10 100 0 1000 50 Reverse recovery time versus dIF/dt Figure 8. (typical values) 100 150 200 250 300 350 400 450 500 Peak reverse recovery current versus dIF/dt (typical values) IRM(A) tRR(ns) 10 80 IF=3A VR=160V IF=3A VR=160V 70 8 60 50 Tj=125°C 6 40 Tj=125°C 4 30 Tj=25°C 20 Tj=25°C 2 10 dIF/dt(A/µs) dIF/dt(A/µs) 0 10 100 0 1000 0 Figure 9. 50 100 150 200 Dynamic parameters versus junction temperature QRR; IRM [T j] / Q RR; IRM [T j=125°C] 1.4 IF=3A VR=160V 1.2 1.0 IRM 0.8 0.6 QRR 0.4 0.2 Tj(°C) 0.0 25 4/7 50 75 100 Doc ID 023250 Rev 1 125 150 250 300 350 400 450 500 STTH602C-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. DPAK dimensions Dimensions Ref. E A B2 C2 Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L2 D R H L4 A1 B G R C A2 0.60 MIN. V2 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 10. Footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 Doc ID 023250 Rev 1 5/7 Ordering information 3 Ordering information Table 7. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STTH602CBY-TR STTH602CBY DPAK 0.30 g 2500 Tape and Reel Revision history Table 8. 6/7 STTH602C-Y Document revision history Date Revision 24-Oct-2012 1 Changes First issue. Doc ID 023250 Rev 1 STTH602C-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. 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