STMICROELECTRONICS T1635H6T

T1635H, T1650H
High temperature 16 A Snubberless™ Triacs
Features
A2
■
Medium current Triac
■
150 °C max. Tj turn-off commutation
■
Low thermal resistance with clip bonding
■
Very high 3 quadrant commutation capability
■
Packages are RoHS (2002/95/EC) compliant
■
UL certified (ref. file E81734)
G
A2
A1
A2
A2
G
G
A2
A1
A1
Applications
Especially designed to operate in high power
density or universal motor applications such as
vacuum cleaner and washing machine drum
motor, these 16 A Triacs provide a very high
switching capability up to junction temperatures of
150 °C.
D2PAK
T16xxH-6G
TO-220AB
T16xxH-6T
G
The heatsink can be reduced, compared to
traditional Triacs, according to the high
performance at given junction temperatures.
A2
A1
TO-220AB Insulated
T16xxH-6I
Description
Available in through-hole or surface mount
packages, the T1635H and T1650H Triac series
are suitable for general purpose mains power ac
switching.
By using an internal ceramic pad, the T16xxH-6I
provides voltage insulation (rated at 2500 V rms).
Table 1.
Device summary
Symbol
Value
Unit
IT(RMS)
16
A
VDRM/VRRM
600
V
IGT
35 or 50
mA
TM: Snubberless is a trademark of STMicroelectronics
September 2011
Doc ID 13566 Rev 2
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10
Characteristics
T1635H, T1650H
1
Characteristics
Table 2.
Absolute maximum ratings
Symbol
Parameter
IGM
PG(AV)
Tstg
Tj
Table 3.
A
TO-220AB Ins
Tc = 110 °C
Non repetitive surge peak on-state
current (full cycle, Tj initial = 25 °C)
F = 50 Hz
t = 20 ms
160
F = 60 Hz
t = 16.7 ms
168
I²t Value for fusing
tp = 10 ms
Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns
F = 120 Hz
Non repetitive surge peak off-state
voltage
Peak gate current
ITSM
VDSM/VRSM
16
Tc = 130 °C
On-state rms current (full sine wave)
dI/dt
Unit
D2PAK, TO-220AB
IT(RMS)
I²t
Value
A
169
A²s
Tj = 150 °C
50
A/µs
tp = 10 ms
Tj = 25 °C
VDRM/VRRM
+ 100
V
tp = 20 µs
Tj = 150 °C
4
A
Tj = 150 °C
1
W
- 40 to + 150
- 40 to + 150
°C
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
Electrical characteristics (Tj = 25 °C, unless otherwise specified)
Value
Symbol
IGT (1)
VGT
Test conditions
Quadrant
VD = 12 V, RL = 33 Ω
VGD
VD = VDRM, RL = 3.3 kΩ
IH (2)
IT = 500 mA
IL
IG = 1.2 IGT
Unit
(dI/dt)c (2)
35
50
MAX.
I - II - III
MAX.
1.0
V
I - II - III
MIN.
0.15
V
MAX.
35
75
50
90
80
110
MAX.
II
mA
mA
mA
VD = 67% VDRM, gate open, Tj = 150 °C
MIN.
1000
1500
V/µs
Without snubber, Tj = 150 °C
MIN.
21
28
A/ms
1. minimum IGT is guaranted at 20% of IGT max.
2. for both polarities of A2 referenced to A1.
2/10
T1650H
I - II - III
I - III
dV/dt (2)
T1635H
Doc ID 13566 Rev 2
T1635H, T1650H
Table 4.
Static characteristics
Symbol
VT (1)
Characteristics
Test conditions
Value
Unit
ITM = 23 A, tp = 380 µs
Tj = 25 °C
MAX.
1.5
V
Vt0
(1)
Threshold voltage
Tj = 150 °C
MAX.
0.80
V
Rd
(1)
Dynamic resistance
Tj = 150 °C
MAX.
23
mΩ
Tj = 25 °C
MAX.
5
µA
Tj = 150 °C
MAX.
4.1
VD/VR = 400 V (at peak mains voltage)
Tj = 150 °C
MAX.
3.5
VD/VR = 200 V (at peak mains voltage)
Tj = 150 °C
MAX.
3.0
VDRM = VRRM
IDRM
IRRM
(2)
mA
1. for both polarities of A2 referenced to A1
2. tp = 380 µs.
Table 5.
Thermal resistance
Symbol
Rth(j-c)
Parameter
D2PAK / TO-220AB
1.15
TO-220AB Ins
3.1
D2PAK
45
TO-220AB / TO-220AB Ins
60
Unit
Junction to case (AC)
S=1
Rth(j-a)
Value
cm2
°C/W
Junction to ambient
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Characteristics
Figure 1.
T1635H, T1650H
Maximum power dissipation versus Figure 2.
on-state rms current (full cycle)
IT(RMS) (A)
P(W)
18
18
TO-220AB/D²PAK
α=180 °
16
On-state rms current versus case
temperature (full cycle)
16
14
14
12
12
10
10
8
8
6
TO-220AB
Insulated
6
4
4
180°
2
α=180 °
2
IT(RMS)(A)
0
0
1
2
3
Figure 3.
4
5
6
7
8
9
10
11
12
13
14
15
16
On-state rms current versus
ambient temperature
0
25
Figure 4.
IT(RMS) (A)
1.0E+02
4.5
50
75
100
125
150
Variation of thermal impedance
versus pulse duration
Zth(°C/W)
α=180 °
D²PAK
SCU=1 cm²
Epoxy printed circuit board FR4,
copper thickness = 35 µm
4.0
TC(°C)
0
Zth(j-a)
3.5
1.0E+01
3.0
2.5
Zth(j-c)
2.0
1.0E+00
1.5
1.0
0.5
tP(s)
Tamb(°C)
0.0
0
25
Figure 5.
1000
50
75
1.0E-01
100
125
1.0E-03
150
On-state characteristics
(maximum values)
Figure 6.
ITM(A)
180
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
Surge peak on-state current versus
number of cycles
ITSM (A)
160
140
100
t=20ms
Non repetitive
Tj initial=25 °C
One cycle
120
Tj=150 °C
100
80
Repetitive
Tc=110 °C
Tj=25 °C
60
10
40
VTM(V)
1
0.0
4/10
Tj max. :
Vt0 = 0.80 V
Rd = 23 mΩ
0.5
1.0
1.5
2.0
20
Number of cycles
0
2.5
3.0
3.5
4.0
4.5
1
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10
100
1000
T1635H, T1650H
Figure 7.
10000
Characteristics
Non-repetitive surge peak on-state Figure 8.
current for a sinusoidal pulse with
Relative variation of IGT,IH, IL vs
junction temperature
(typical values)
IGT, IH, IL [T j] / IGT, IH, IL [T j=25°C]
ITSM(A), I²t (A²s)
2.5
Tj initial=25 °C
IGT
2.0
dI/dt limitation: 50 A/µs
1.5
1000
IH & IL
1.0
ITSM
0.5
I²t
2
width tp < 10 ms and corresponding value of I t
100
0.01
0.10
1.00
Figure 9.
2.0
tP(ms)
Tj(°C)
0.0
10.00
Relative variation of critical rate of
decrease of main current (dI/dt)c
versus reapplied (dV/dt)c
-40
-20
0
20
40
60
80
100
120
140
160
Figure 10. Relative variation of critical rate of
decrease of main current versus
junction temperature
(dI/dt)c [T j] / (dI/dt)c [T j=150°C]
(dI/dt)c [ (dV/dt) c ] / Specified (dI/dt) c
8
typical values
1.8
7
1.6
6
1.4
5
1.2
1.0
4
0.8
3
0.6
2
0.4
1
0.2
T j(°C)
(dV/dt)C (V/µs)
0.0
0.1
1.0
0
10.0
100.0
Figure 11. Leakage current versus junction
temperature for different values of
blocking voltage (typical values)
1.0E+04
25
50
75
100
125
150
Figure 12. Variation of thermal resistance
junction to ambient versus copper
surface under tab
Rth(j-a) (°C/W)
IDRM/IRRM(µA)
80
1.0E+03
Epoxy printed circuit board FR4,
copper thickness = 35 µm
70
VDRM=VRRM=600 V
D²PAK
60
VDRM=VRRM=400 V
50
1.0E+02
VDRM=VRRM=200 V
40
1.0E+01
30
20
1.0E+00
10
SCU(cm²)
T j(°C)
1.0E-01
0
50
75
100
125
150
0
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10
15
20
25
30
35
40
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Ordering information scheme
2
T1635H, T1650H
Ordering information scheme
Figure 13. Ordering information scheme
T 16 xx H - 6 y
Triac series
Current
16 = 16 A
Sensitivity
35 = 35 mA
50 = 50 mA
High temperature
Voltage
6 = 600 V
Package
G = D2PAK
T = TO-220AB
I = TO-220AB Ins
Packing
Blank = Tube (D2PAK, TO-220AB)
-TR = Tape and reel (D2PAK)
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Doc ID 13566 Rev 2
-TR
T1635H, T1650H
3
Package mechanical data
Package mechanical data
●
Epoxy meets UL94, V0
●
Recommended torque 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6.
D2PAK dimensions
Dimensions
Ref.
Millimeters
Min.
A
E
C2
L2
D
L
Typ.
Inches
Max.
Min.
Typ.
Max.
A
4.30
4.60
0.169
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.25
C
0.45
0.60
0.017
0.024
C2
1.21
1.36
0.047
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.28 0.393
0.405
G
4.88
5.28
0.192
0.208
L
15.00
15.85 0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
L3
1.40
0.048 0.055
A1
B2
R
C
B
G
A2
2mm min.
FLAT ZONE
V2
R
V2
0.40
0°
0.016
8°
0°
8°
Figure 14. Footprint (dimensions in mm)
16.90
10.30
5.08
1.30
8.90
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Package mechanical data
Table 7.
T1635H, T1650H
TO-220AB and TO-220AB Ins dimensions
Dimensions
Ref.
Millimeters
Min.
A
15.20
a1
C
B
ØI
Typ.
Max.
Inches
Min.
Typ.
15.90 0.598
3.75
Max.
0.625
0.147
a2
13.00
14.00 0.511
0.551
B
10.00
10.40 0.393
0.409
b1
0.61
0.88
0.024
0.034
b2
1.23
1.32
0.048
0.051
C
4.40
4.60
0.173
0.181
c1
0.49
0.70
0.019
0.027
c2
2.40
2.72
0.094
0.107
e
2.40
2.70
0.094
0.106
F
6.20
6.60
0.244
0.259
ØI
3.75
3.85
0.147
0.151
I4
15.80 16.40 16.80 0.622 0.646 0.661
L
2.65
2.95
0.104
0.116
l2
1.14
1.70
0.044
0.066
l3
1.14
1.70
0.044
0.066
b2
L
F
A
I4
l3
c2
a1
l2
a2
M
b1
c1
e
M
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T1635H, T1650H
4
Ordering information
Ordering information
Table 8.
5
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
T16xxH-6G
T16xxH 6G
D2PAK
1.5 g
50
Tube
T16xxH-6G-TR
T16xxH 6G
D2
1.5 g
1000
Tape and reel
T16xxH-6T
T16xxH 6T
TO-220AB
2.3 g
50
Tube
T16xxH-6I
T16xxH 6I
TO-220AB Ins
2.3 g
50
Tube
PAK
Revision history
Table 9.
Document revision history
Date
Revision
Changes
29-May-2007
1
First issue.
20-Sep-2011
2
Updated: Features, Description and Figure 2.
Doc ID 13566 Rev 2
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T1635H, T1650H
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