TS4604 Stereo headset driver and analog audio line driver with integrated reference to ground Features ■ Operating from VCC = 3 V up to 4.8 V single supply operation ■ Line driver stereo differential inputs ■ External gain setting resistors ■ Space-saving package: TSSOP28 pitch 0.65 mm ■ Dedicated shutdown control per function ■ 100 mW headset drive into a 16 Ω load ■ 90 dB high PSRR on headset drive ■ Two internal negative supplies to ensure ground-referenced, headset and line driver capless outputs ■ Internal undervoltage mute ■ ■ Pin connections (top view) Line driver 2 Vrms typ. Output voltage across entire supply voltage range Pop-&-click reduction circuitry, thermal shutdown and output short-circuit protection Applications ■ PDP/LCD TV ■ Set-top boxes TSSOP28 +LDL 1 28 +LDR -LDL 2 27 -LDR OUTLDL 3 26 OUTLDR AGND 4 25 EUVP ENLD 5 24 PGND PVSSLD 6 23 PVCCLD CNLD 7 22 CPLD CNHP 8 21 CPHP PVSSHP 9 20 PVCCHP ENHP 10 19 PGND AGND 11 18 NC OUTHPL 12 17 OUTHPR -HPL 13 16 -HPR +HPL 14 15 +HPR Description The TS4604 is a stereo ground-referenced output analog line driver and stereo headset driver whose design allows the output DC-blocking capacitors to be removed, thus reducing component count. The TS4604 drives 2 Vrms into a 5 kΩ load or more. The device has differential inputs and uses external gain setting resistors. The TS4604 delivers up to 100 mW per channel into a 16 Ω load. All outputs of the TS4604 include ±8 kV human body model ESD protection cells. October 2010 Doc ID 17913 Rev 1 1/31 www.st.com 31 Contents TS4604 Contents 1 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 3 2 Typical application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Characteristics of the line driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Characteristics of the headset driver . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7 6.1 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6.2 Use of ceramic capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.3 Flying and tank capacitor for the internal negative supply . . . . . . . . . . . . 18 6.4 Power supply decoupling capacitor (Cs) . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.5 Input coupling capacitor (Cin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.6 Range of the gain setting resistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.7 Performance of CMRR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.8 Internal and external undervoltage detection . . . . . . . . . . . . . . . . . . . . . . 21 6.8.1 Internal UVLO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.8.2 External UVLO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.9 2nd order Butterworth low-pass filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6.10 ESD protection and compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6.11 Pop-&-click circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6.12 Start-up phase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6.13 Layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.1 TSSOP28 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2/31 Doc ID 17913 Rev 1 TS4604 1 Absolute maximum ratings and operating conditions Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings (AMR) Symbol VCC Parameter Value Unit 5.5 V GND to VCC V Supply voltage (1) (2) Vin Input voltage enable & standby pin Vin Input signal voltage -2.5 to +2.5 V Toper Operating free-air temperature range -40 to + 85 °C Tstg Storage temperature -65 to +150 °C 150 °C 200 °C/W Tj Rthja Pd Maximum junction temperature Thermal resistance junction to ambient (3) Internally limited(4) Power dissipation Human body model for all pins except outputs Human body model for all output pins ESD Latch-up 2 8 kV Machine model 200 V Charge device model 1500 V Latch-up immunity 200 mA Lead temperature (soldering, 10sec) 260 °C 1. All voltage values are measured with respect to the ground pin. 2. The magnitude of the input signal must never exceed VCC + 0.3 V/GND - 0.3 V. 3. The device is protected from overheating by a thermal shutdown mechanism active at 150° C. 4. Exceeding the power derating curves during a long period provokes abnormal operating conditions. Table 2. Operating conditions Symbol Parameter VCC Supply voltage Vicm Common-mode input voltage range RLD Line drive load resistor RHD Headset drive load resistor Rthja Thermal resistance junction-to-ambient (1) Value Unit 3 to 4.8 V From -1.4 to 1.4 V ≥5 kΩ ≥ 16 Ω 80 °C/W 2 1. With heatsink surface = 125 mm . Doc ID 17913 Rev 1 3/31 Typical application TS4604 2 Typical application Figure 1. Simplified application schematics in differential configuration setting R2 R1 2.2 µF 2.2 µF -LDR OUTLDR +LDR >5 KΩ R1 R2 R2 R1 2.2 µF 2.2 µF -LDL OUTLDL +LDL >5 KΩ R1 R2 TS4604 R2 R1 2.2 µF -HPR OUTHPR 2.2 µF +HPR 1 6 /3 2 Ω R1 R2 R2 R1 2.2 µF -HPL OUTHPL 2.2 µF +HPL 1 6 /3 2 Ω R1 R2 AGND Thermal shutdown UVLO AGND ENHP ENLD PVCCHP 3 to 4.8 V 1 µF Negative charged pump line driver 1 µF 1 µF PGND PVSSLD PVSSHP CPHP R1= 10 kΩ, R2 = Av x R1 with R2 ≤ 100 k 3 to 4.8 V PVCCLD Negative charged pump headset 1 µF PGND EUVP Power management CNHP 1 µF CPLD CNLD 1 µF AM06138 4/31 Doc ID 17913 Rev 1 TS4604 Table 3. Typical application Pin descriptions Pin number I/O(1) Pin name 1 I +LDL Left line driver positive input channel 2 I -LDL Left line driver negative input channel 3 O OUTLDL 4 P AGND Analog line driver power ground 5 I ENLD Line driver enable input pin (active high) 6 O PVSSLD 7 I/O CNLD Line driver charge pump flying capacitor negative terminal 8 I/O CNHP Headset charge pump flying capacitor negative terminal 9 I/O PVSSHP 10 I ENHP Headset driver enable input pin (active high) 11 P AGND Headphone analog input power ground 12 O OUTHPL 13 I -HPL Left headset driver negative input channel 14 I +HPL Left headset driver positive input channel 15 I +HPR Right headset driver positive input channel 16 I -HPR Right headset driver negative input channel 17 O OUTHPR 18 NC Pin description Left line driver output channel Output from line drive charge pump Output from headset drive charge pump Left headset driver output channel Right headset driver output channel Not connected 19 P PGND Headset driver power ground 20 P PVCCHP 21 I/O CPHP Headset charge pump flying capacitor positive terminal 22 I/O CPLD Line driver charge pump flying capacitor positive terminal 23 P PVCCLD 24 P PGND Line driver power ground 25 I EUVP External undervoltage protection input pin 26 O OUTLDR 27 I -LDR Right line driver negative input channel 28 I +LDR Right line driver positive input channel Headset driver power supply voltage(2) Line driver power supply voltage(2) Right line driver output channel 1. I = input, O = output, P = power 2. PVccHP and PVccLD are internally connected, so PVccHP must be equal to PVccLD. Doc ID 17913 Rev 1 5/31 Electrical characteristics TS4604 3 Electrical characteristics Table 4. Common part: VCC = +3.3 V, GND = 0 V, CPhp = CPld = 1 µF, Tamb = 25°C (unless otherwise specified) Symbol Parameters and test conditions Min. Typ. Max. Unit VIL VENHP and VENLD Input voltage low 38 40 43 % Vcc VIH VENHP and VENLD Input voltage high 57 60 66 % Vcc IIH High level input current (ENHP and ENLD) -1 1 µA IIL Low level input current (ENHP and ENLD) -1 1 µA Fosc Internal negative voltage switching frequency, all temperature range 400 550 800 kHz Vup External undervoltage detection threshold 1.15 1.25 1.35 V Ihyst External undervoltage detection hysteresis current Vhyst Vuvl Av 6/31 5 µA Pvcc_HP/LD Internal undervoltage detection hysteresis 200 mV Pvcc_HP/LD internal undervoltage detection – power up – power down 2.8 2.6 V Overall external gain (R2 ≤100 kΩ, R1 = R2/Av) Doc ID 17913 Rev 1 0 1 20 10 dB V/V TS4604 Table 5. Electrical characteristics Headset driver part: VCC = +3.3 V, GND = 0 V, ENHP = VCC, ENLD = GND, CPhp = CPld = 1 µF, Av = 1 (R1 = R2 = 10 kΩ), Tamb = 25°C (unless otherwise specified) Symbol Icc IENHP Parameters and test conditions Min. Typ. Max. Unit Supply current (no input signal, no load) 5 6.5 mA Headset overall standby current (no input signal): VENHP = GND VENHP = 38% VCC 1 5 100 µA 7 mV Vio Input offset voltage -7 0 Po Headphone output power: THD + N = 1% max, f = 1 kHz, BW = 22 kHz, RL = 16 Ω 45 65 mW Po Headphone output power: THD + N = 1% max, f = 1 kHz, BW = 22 kHz, RL = 32 Ω 30 45 mW 0.05 % Headphone power supply rejection ratio with AC inputs grounded: f = 217 Hz,Vripple = 200 mVpp 90 dB Total wake-up time 30 ms tSTBY Standby time 20 µs Xtalk Crosstalk headphone to line: Pout = 50 mW, RL = 16 Ω, f = 20 Hz to 20 kHz -100 dB SNR Signal-to-noise ratio (A-weighting): RL = 16 Ω, Po = 60 mW 102 dB Common-mode rejection ratio: f = 20 Hz to 20 kHz, Vic = 200 mVpp -70 dB Output voltage noise: f = 20 Hz to 20 kHz, A-weighted 7.6 µVRMS THD + N PSRR tWU CMRR VN CL(1) Total harmonic distortion + noise: RL = 16 Ω, Po = 60 mW, f = 20 Hz to 20 kHz, BW = 22 kHz Capacitive load: RL = 16 Ω to 100 Ω RL > 100 Ω 400 100 pF 1. Higher capacitive loads are possible by adding a serial resistor of 47 Ω in the line driver output. Doc ID 17913 Rev 1 7/31 Electrical characteristics Table 6. Line driver part: VCC = +3.3 V, GND = 0 V, Av = 1 (R1 = R2 = 10 kΩ), ENLD = VCC, ENHP = GND, CPhp = CPld = 1 µF, RL = 10 kΩ, Tamb = 25°C (unless otherwise specified) Symbol Icc IENLD Vio TS4604 Parameters and test conditions Min. Supply current (no input signal, no load) Typ. Max. Unit 5 6.5 mA 5 100 µA +7 mV Line drive standby current (no input signal) VENLD = GND VENLD = 38% VCC Input offset voltage -7 0 Output voltage swing: RL = 10 kΩ, CL= 100 pF, THD+N = 0.1% 2.1 Vrms Line driver power supply rejection ratio with AC inputs grounded: f = 217 Hz, Vripple = 200 mVpp 90 dB Wake-up time from shutdown 30 ms tSTBY Standby time 20 µs SNR Signal-to-noise ratio (A-weighting): Vin = 1.7 Vrms 102 dB Output voltage noise: f = 20 Hz to 20 kHz, A-weighted 8 µVRMS Gain bandwidth product 1 MHz 0.5 V / µs 0.001 % VSWING PSRR tWU VN GBw Sr Slew rate THD+N BW = 22 kHz, RL = 10 kΩ, VO = 1.5 Vrms, Av = 1, f = 20 Hz to 20 kHz CMRR f = 20 Hz to 20 kHz, Vic = 200 mVpp -70 dB Xtalk Crosstalk channel: f = 20 Hz to 20 kHz, Vo = 1.5 Vrms, RL = 5 kΩ -120 dB CL(1) Capacitive load: RL > 5 kΩ 400 1. Higher capacitive loads are possible by adding a serial resistor of 47 Ω in the line driver output. 8/31 Doc ID 17913 Rev 1 pF TS4604 Characteristics of the line driver 4 Characteristics of the line driver Figure 2. Current consumption vs. power supply Figure 3. 5.7 Output voltage vs. power supply 2.4 Quiescent supply current Icc (mA) 5.6 5.5 2.3 5.3 5.2 5.1 5.0 4.9 4.8 4.7 No Load; No input signal Line Driver Ta=25°C 4.6 4.5 Output Voltage (Vrms) 5.4 THD+N=1% 2.2 2.1 THD+N=0.1% 4.4 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 1.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 Power Supply Voltage Vcc (V) Figure 4. Power Supply Voltage Vcc (V) THD+N vs. output power (G=0 dB) Figure 5. THD+N vs. output power (G=20 dB) 10 10 RL = 5kΩ to 10kΩ Vcc = 3.3V to 4.8V, G = 0dB Inputs = 0° & 180° BW < 30kHz, Tamb = 25°C 0.1 F=8kHz F=1kHz 0.01 RL = 5kΩ to 10kΩ Vcc = 3.3V to 4.8V, G = 20dB Inputs = 0° & 180° BW < 30kHz, Tamb = 25°C 1 THD+N (%) 1 THD+N (%) RL ≥ 5kΩ, F=1kHz BW<30kHz, Ta=25 C Line Driver 2.0 0.1 F=8kHz 0.01 1E-3 F=80Hz 1E-4 10 Figure 6. F=1kHz 1E-3 100 1000 Output Voltage (mVrms) THD+N vs. frequency (G=0 dB) Figure 7. 1 RL = 5kΩ to 10kΩ Vcc = 3.3V to 4.8V G = 20dB, Inputs = 0° & 180° Bw < 20kHz, Tamb = 25°C THD + N (%) THD + N (%) THD+N vs. frequency (G=20 dB) 1 RL = 5kΩ to 10kΩ Vcc = 3.3V to 4.8V G = 0dB, Inputs = 0° & 180° Bw < 20kHz, Tamb = 25°C 0.1 Vo=2Vrms 0.01 0.1 Vo=2Vrms 0.01 1E-3 1E-4 F=80Hz 100 1000 Output Voltage (mVrms) Vo=1.5Vrms Vo=1.5Vrms 20 100 1000 Frequency (Hz) 10000 20k 1E-3 20 Doc ID 17913 Rev 1 100 1000 Frequency (Hz) 10000 20k 9/31 Characteristics of the line driver Figure 8. TS4604 CMRR vs. frequency Figure 9. 0 CMRR (dB) -20 PSRR (dB) -10 ΔVic = 200mVpp Vcc = 3.3V RL ≥ 5kΩ Tamb = 25°C -30 -40 G=20dB -50 -60 G=0dB -70 -80 20 100 1000 Frequency (Hz) 10000 20k Figure 10. Crosstalk vs. frequency left to right & right to left channel Vcc = 3.3V Vout = 2Vrms Right to Left & Left to Right RL ≥ 5kΩ Tamb = 25°C G=20dB 1000 Frequency (Hz) 100 1000 Frequency (Hz) 10000 20k Vcc = 3.3V, G=0dB RL = 16Ω on HP Po = 50 mW on HP LD inputs grounded Tamb = 25°C HP to Line Left HP to Line Right 100 1000 Frequency (Hz) 10000 20k Figure 13. Frequency response 10 Vcc = 3.3V, G=0dB RL=10kΩ Tamb = 25°C 0 -10 -20 Gain (dB) Output Signal (dBV) 10/31 G=0dB 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 -150 20 10000 20k Figure 12. Output signal spectrum -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 -150 -160 G=20dB Figure 11. Crosstalk vs. frequency headset to line driver G=0dB 100 Vripple = 200mVpp Vcc = 3.3V Inputs = grounded RL ≥ 5kΩ Tamb = 25°C Crosstalk (dB) Crosstalk (dB) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 -150 20 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 20 PSRR vs. frequency -30 -40 -50 -60 -70 100 1000 Frequency (Hz) 10000 Vcc = 3.3V, G=0dB No load Tamb = 25°C -80 1000 Doc ID 17913 Rev 1 10000 100000 1000000 Frequency (Hz) 1E7 TS4604 5 Characteristics of the headset driver Characteristics of the headset driver Figure 14. Current consumption vs. power supply Figure 15. Standby current vs. power supply 1200 5.7 5.5 1000 Standby current Istby (nA) Quiescent supply current Icc (mA) 5.6 5.4 5.3 5.2 5.1 5.0 4.9 4.8 4.7 No Load; No input signal Headset Driver Ta=25°C 4.6 4.5 800 600 400 4.4 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 0 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 Power Supply Voltage Vcc (V) Power Supply Voltage Vcc (V) Figure 16. Output power vs. power supply (RL = 16 Ω, G = 0 dB) Figure 17. Output power vs. power supply (RL = 16 Ω, G = 20 dB) 180 160 180 160 THD+N=10% (180°) 140 THD+N=10% (0°) 120 100 80 40 20 THD+N=1% (180°) THD+N=1% (0°) RL = 16Ω, F=1kHz G=0dB BW<30kHz, Ta=25 C Headset Driver 0 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 Power Output (mW) Power Output (mW) 140 60 No Load; No input signal Line Driver Ta=25°C 200 THD+N=10% (180°) THD+N=10% (0°) 120 100 80 THD+N=1% (180°) 60 40 20 THD+N=1% (0°) RL = 16Ω, F=1kHz G=20dB BW<30kHz, Ta=25 C Headset Driver 0 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 Power Supply Voltage Vcc (V) Power Supply Voltage Vcc (V) Doc ID 17913 Rev 1 11/31 Characteristics of the headset driver TS4604 Figure 18. Output power vs. power supply (RL = 32 Ω, G = 0 dB) Figure 19. Output power vs. power supply (RL = 32 Ω, G = 20 dB) 180 180 RL = 32Ω, F=1kHz G=0dB, 0° & 180° BW<30kHz, Ta=25 C Headset Driver 160 120 140 Power Output (mW) Power Output (mW) 140 THD+N=10% 100 80 60 40 120 THD+N=10% 100 80 60 40 THD+N=1% 20 RL = 32Ω, F=1kHz G=20dB, 0° & 180° BW<30kHz, Ta=25 C Headset Driver 160 THD+N=1% 20 0 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 0 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 Power Supply Voltage Vcc (V) Power Supply Voltage Vcc (V) Figure 20. THD+N vs. output power (RL = 16 Ω, G = 20 dB, VCC = 3.0 V inputs in-phase) Figure 21. THD+N vs. output power (RL = 16 Ω, G = 0 dB, VCC = 3.0 V inputs in-phase) 10 0.1 1 THD+N (%) THD+N (%) 1 10 RL = 16Ω Vcc = 3.0V, G = 20dB Inputs = 0° BW < 30kHz, Tamb = 25°C F=8kHz RL = 16Ω Vcc = 3.0V, G = 0dB Inputs = 0° BW < 30kHz, Tamb = 25°C 0.1 F=8kHz F=1kHz 0.01 F=1kHz 0.01 F=80Hz F=80Hz 1E-3 0.1 1 10 Output Power (mW) 100 Figure 22. THD+N vs. output power (RL = 16 Ω, G = 0 dB, VCC = 3.3 V inputs out-of-phase) 1E-3 0.1 100 10 RL = 16Ω Vcc = 3.0V, G = 0dB Inputs = 180° BW < 30kHz, Tamb = 25°C 1 THD+N (%) THD+N (%) 10 Output Power (mW) Figure 23. THD+N vs. output power (RL = 16 Ω, G = 20 dB, VCC = 3.3 V inputs in-phase) 10 1 1 0.1 RL = 16Ω Vcc = 3.3V, G = 20dB Inputs = 0° BW < 30kHz, Tamb = 25°C 0.1 F=8kHz F=8kHz F=1kHz 0.01 0.01 F=1kHz F=80Hz F=80Hz 1E-3 0.1 12/31 1 10 Output Power (mW) 100 1E-3 0.1 Doc ID 17913 Rev 1 1 10 Output Power (mW) 100 TS4604 Figure 24. Characteristics of the headset driver THD+N vs. output power (RL = 16 Ω, G = 0 dB, VCC = 3.3 V inputs in-phase) Figure 25. 10 10 RL = 16Ω Vcc = 3.3V, G = 0dB Inputs = 0° BW < 30kHz, Tamb = 25°C 1 THD+N (%) THD+N (%) 1 THD+N vs. output power (RL = 16 Ω, G = 0 dB, VCC = 3.3 V, inputs out-of-phase) 0.1 RL = 16Ω Vcc = 3.3V, G = 0dB Inputs = 180° BW < 30kHz, Tamb = 25°C 0.1 F=8kHz F=8kHz F=1kHz 0.01 0.01 F=1kHz F=80Hz 1E-3 0.1 Figure 26. 1 F=80Hz 10 Output Power (mW) 100 THD+N vs. output power (RL = 16 Ω, G = 20 dB, VCC = 4.8 V, inputs in-phase) 1E-3 0.1 Figure 27. 10 10 Output Power (mW) 100 THD+N vs. output power (RL = 16 Ω, G = 0 dB, VCC = 4.8 V inputs in-phase) 10 RL = 16Ω Vcc = 4.8V, G = 20dB Inputs = 0° BW < 30kHz, Tamb = 25°C 0.1 1 THD+N (%) THD+N (%) 1 1 F=8kHz RL = 16Ω Vcc = 4.8V, G = 0dB Inputs = 0° BW < 30kHz, Tamb = 25°C 0.1 F=8kHz 0.01 0.01 1E-3 F=1kHz F=80Hz F=80Hz F=1kHz 1E-3 0.1 1 10 Output Power (mW) 100 Figure 28. THD+N vs. output power (RL = 16 Ω, G = 0 dB, VCC = 4.8 V inputs out-of-phase) 1E-4 0.1 100 10 RL = 16Ω Vcc = 4.8V, G = 0dB Inputs = 180° BW < 30kHz, Tamb = 25°C 1 THD+N (%) THD+N (%) 10 Output Power (mW) Figure 29. THD+N vs. output power (RL = 32 Ω, VCC = 3.0 V, G = 0 dB) 10 1 1 0.1 RL = 32Ω Vcc = 3.0V, G = 0dB Inputs = 0° & 180° BW < 30kHz, Tamb = 25°C 0.1 F=8kHz 0.01 F=8kHz F=1kHz 0.01 1E-3 F=1kHz F=80Hz F=80Hz 1E-3 0.1 1 10 Output Power (mW) 100 1E-4 0.1 Doc ID 17913 Rev 1 1 10 Output Power (mW) 100 13/31 Characteristics of the headset driver TS4604 Figure 30. THD+N vs. output power (RL = 32 Ω, VCC = 3.0 V, G = 20 dB) Figure 31. THD+N vs. output power (RL = 32 Ω, VCC = 3.3 V, G = 0 dB) 10 10 RL = 32Ω Vcc = 3.3V, G = 0dB Inputs = 0° & 180° BW < 30kHz, Tamb = 25°C 1 THD+N (%) THD+N (%) 1 RL = 32Ω Vcc = 3.0V, G = 20dB Inputs = 0° & 180° BW < 30kHz, Tamb = 25°C 0.1 F=8kHz 0.1 F=8kHz 0.01 F=1kHz F=1kHz 0.01 1E-3 F=80Hz 1E-3 0.1 1 10 Output Power (mW) F=80Hz 100 Figure 32. THD+N vs. output power (RL = 32 Ω, VCC = 3.3 V, G = 20 dB) 1E-4 0.1 100 10 RL = 32Ω Vcc = 3.3V, G = 20dB Inputs = 0° & 180° BW < 30kHz, Tamb = 25°C RL = 32Ω Vcc = 4.8V, G = 0dB Inputs = 0° & 180° BW < 30kHz, Tamb = 25°C 1 THD+N (%) THD+N (%) 10 Output Power (mW) Figure 33. THD+N vs. output power (RL = 32 Ω, VCC = 4.8 V, G = 0 dB) 10 1 1 0.1 F=8kHz 0.1 F=8kHz 0.01 0.01 F=80Hz 1E-3 F=1kHz F=1kHz F=80Hz 1E-3 0.1 1 10 Output Power (mW) 100 Figure 34. THD+N vs. output power (RL = 32 Ω, VCC = 4.8 V, G = 20 dB) 1E-4 0.1 100 1 RL = 32Ω Vcc = 4.8V, G = 20dB Inputs = 0° & 180° BW < 30kHz, Tamb = 25°C RL = 16Ω Vcc = 3.0V to 4.8V G = 0dB, Inputs = 0° & 180° Bw < 20kHz, Tamb = 25°C THD + N (%) THD+N (%) 10 Output Power (mW) Figure 35. THD+N vs. frequency (RL = 16 Ω, G = 0 dB) 10 1 1 0.1 F=8kHz 0.1 Po=1mW 0.01 0.01 Po=15mW F=1kHz 1E-3 0.1 14/31 F=80Hz 1 10 Output Power (mW) 100 1E-3 20 Doc ID 17913 Rev 1 100 1000 Frequency (Hz) 10000 20k TS4604 Characteristics of the headset driver Figure 36. THD+N vs. frequency (RL = 16 Ω, G = 20 dB) Figure 37. THD+N vs. frequency (RL = 32 Ω, G = 0 dB) 1 RL = 16Ω Vcc = 3.0V to 4.8V G = 20dB, Inputs = 0° & 180° Bw < 20kHz, Tamb = 25°C 0.1 Po=1mW THD + N (%) THD + N (%) 1 0.01 RL = 32Ω Vcc = 3.0V to 4.8V G = 0dB, Inputs = 0° & 180° Bw < 20kHz, Tamb = 25°C 0.1 Po=1mW 0.01 Po=15mW 1E-3 20 100 1000 Frequency (Hz) 1E-3 10000 20k Figure 38. THD+N vs. frequency (RL = 32 Ω, G = 20 dB) 100 1000 Frequency (Hz) 10000 20k Figure 39. CMRR vs. frequency (headset) 1 0 RL = 32Ω Vcc = 3.0V to 4.8V G = 20dB, Inputs = 0° & 180° Bw < 20kHz, Tamb = 25°C -10 -20 -30 CMRR (dB) 0.1 THD + N (%) Po=10mW 20 Po=1mW 0.01 ΔVic = 200mVpp Vcc = 3.3V RL ≥ 16Ω Tamb = 25°C -40 G=20dB -50 -60 G=0dB -70 Po=10mW -80 -90 1E-3 20 100 1000 Frequency (Hz) 10000 20k 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 20 Vripple = 200mVpp Vcc = 3.3V Inputs = grounded RL ≥ 16Ω Tamb = 25°C G=20dB G=0dB 100 1000 Frequency (Hz) 10000 20k 100 1000 Frequency (Hz) 10000 20k Figure 41. Crosstalk vs. frequency (left to right, Pout = 50 mW) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 -150 20 Crosstalk (dB) PSRR (dB) Figure 40. PSSR vs. frequency (headset) -100 20 Doc ID 17913 Rev 1 Vcc = 3.3V Pout = 50mW, G=0dB RL = 16Ω Tamb = 25°C Left to Right Right to Left 100 1000 Frequency (Hz) 10000 20k 15/31 Characteristics of the headset driver TS4604 Figure 42. Crosstalk vs. frequency (left to right, Pout = 35 mW) Vcc = 3.3V Pout = 35mW, G=0dB RL = 32Ω Tamb = 25°C Left to Right Right to Left 100 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 -150 20 Crosstalk (dB) Crosstalk (dB) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 -150 20 Figure 43. Crosstalk vs. frequency line driver to headset 1000 Frequency (Hz) 10000 20k Figure 44. Frequency response 10 0 -10 Gain (dB) -20 -30 -40 -50 -60 -70 Vcc = 3.3V, G=0dB No load Tamb = 25°C -80 1000 16/31 10000 100000 1000000 Frequency (Hz) 1E7 Doc ID 17913 Rev 1 Vcc = 3.3V Vout = 2Vrms on LD, G=0dB RL = 10kΩ on LD HP inputs = ground Tamb = 25°C LD to HP left 100 1000 Frequency (Hz) LD to HP right 10000 20k TS4604 Application information 6 Application information 6.1 General description The TS4604 is a stereo headset driver and a ground-referenced stereo audio line driver. To save energy, each audio path, line driver or headphone can be independently set to standby mode. The headphone delivers up to 100 mW into a 16 Ω load, and the line driver drives up to 2 Vrms into 5k or more. The gain can be set up to 20 dB by changing the values of the external gain resistors. The outputs of the headphone and line driver are protected against overloads. Overloads can occur when the outputs are short-circuited between them or to Gnd or to VCC. There is also an internal thermal shutdown activated at 150°C (typical) and deactivated at 120°C (typical). To remove the bulky output DC blocking capacitor and maximize the output swing of the amplifier, the TS4604 embeds a low noise internal negative supply. All amplifiers are supplied between a positive voltage +Vp and a negative voltage -Vn. With this architecture, the output voltage is centered on 0 V, allowing the swing of the output voltage between the positive and negative rail, as depicted in Figure 45. Both the line driver and headset driver use this architecture. Figure 45. TS4604 voltage for one channel Vcc +Vp Vreg In- - +Vp 0V Out In+ + Negative supply -Vn Vreg -Vn AM06139 Note: The PVSSHP and PVSSLD voltages are generated internally by the internal negative supply. To avoid damage to the TS4604, do not connect an external power supply on the PVSSHP and PVSSLD pins. Doc ID 17913 Rev 1 17/31 Application information 6.2 TS4604 Use of ceramic capacitors We advise using ceramic capacitors for the decoupling, flying or tank capacitors because of their low ESR properties. The rated voltage of the ceramic capacitor, however, is an important parameter to take into consideration. A 1 µF/6.3 V capacitor used at 4.8 V DC typically loses about 40% of its value. In fact, with a 4.8 V power supply voltage, the decoupling value is about 0.6 µF instead of 1 µF. Because the decoupling capacitor influences the THD+N in the medium-to-high frequency region, this capacitor variation becomes decisive. In addition, less decoupling means higher overshoots, which can be problematic if they reach the power supply's AMR value (5.5 V). This is why it is recommend to use a 1 µF/10 V/X5R or a 2.2 µF/6.3 V/X5R, or a new kind of ceramic capacitor with a low DC bias variation rated at 6.3 V. If a 1 µF/10 V ceramic capacitor is used, at 4.8 V the capacitance will be 0.82 µF. If a 2.2 µF/6.3 V ceramic capacitor is used, at 4.8 V the capacitance will be 1.1 µF. 6.3 Flying and tank capacitor for the internal negative supply The TS4604 embeds two independent internal negative supplies as shown in Figure 1. Each of them requires two capacitors to work properly (a flying and a tank capacitor). The internal negative supply capacitor must be correctly selected to generate an efficient negative voltage. Two flying capacitors (CHP and CLD) of 1 µF each with low ESR are recommended for internal negative power supply operation. ● CHP between pins 8 and 21. ● CLD between pins 7 and 22. Two tank capacitors (CPvss_HP and CPvss_LD) of 1 µF each with low ESR are recommended for internal negative power supply energy storage. ● CPvss_HP between pin 9 and ground. ● CPvss_LD between pin 6 and ground. An X5R dielectric for capacitor tolerance should be used. In order to take into consideration the ΔC/ΔV variation of this type of dielectric (see Section 6.2 above), we also recommend: ● a 10 V DC rating voltage for 4.8 V power supply operation. ● a 6.3 V DC rating operation for 3.3 V power supply operation. These capacitors must be placed as close as possible to the TS4604 to minimize parasitic inductance and resistance that have a negative impact on the audio performance. 6.4 Power supply decoupling capacitor (Cs) A 1 µF decoupling capacitor (Cs) with low ESR is mandatory for the positive power supply X5R dielectric for capacitor tolerance behavior. In order to take into consideration the ΔC/ΔV variation of this type of dielectric (see Section 6.2 above), it is also recommended to use: 18/31 ● a 10 V DC rating voltage for 4.8 V power supply operation. ● a 6.3 V DC rating operation for 3.3 V power supply operation. Doc ID 17913 Rev 1 TS4604 Application information These capacitors must be placed as close as possible to the TS4604 to minimize parasitic inductance and resistance that have a negative impact on the audio performance. 6.5 Input coupling capacitor (Cin) An input coupling capacitor (Cin) might be used for TS4604 operation to block any DC component of the audio signal. Cin starts to have an effect in the low frequency region. Cin forms with Rin a high-pass filter with a -3 dB cut-off frequency. 1 Fc ( – 3dB ) = ------------------------------------------ ( Hz ) 2.π ⋅ Rin ⋅ Cin Example A differential input gain as shown in Figure 46 on page 20 with the gain equalling 0 dB (Rin = 10 kΩ, Rfd = 10 kΩ) and an input capacitor of 2.2 µF gives: 1 - = 7.2Hz Fc = --------------------------------------------------------------–6 2.π ⋅ 10000 ⋅ 2.2e10 The high-pass filter has a -3 dB cut-off frequency at 7.2 Hz in this case. 6.6 Range of the gain setting resistors The TS4604 can be use in different configurations, as shown in figures 46, 47 and 48. The gain is given by the external resistors Rfd divided by Rin. The feedback resistor Rfd does not exceed 100 kΩ for closed-loop stability reasons. Table 7 gives the recommended resistor values and the gain for different types of application. Table 7. Recommended resistors values Rin Rfd Differential gain Inverting gain Non-inverting gain 10 kΩ 10 kΩ 0 dB 0 dB 6 dB 10 kΩ 20 kΩ 6 dB 6 dB 10 dB 10 kΩ 50 kΩ 14 dB 14 dB 16 dB 4.7 kΩ 47 kΩ 20 dB 20 dB 21 dB 10 kΩ 100 kΩ 20 dB 20 dB 21 dB Doc ID 17913 Rev 1 19/31 Application information TS4604 Figure 46. Example of a TS4604 differential input Rfd Cin Rin VinVout Vin+ Rin Cin Rfd AM06140 Figure 47. Example of a TS4604 inverting input Rfd Cin Rin VinVout AM06141 Figure 48. Example of a TS4604 non-inverting input Rfd Cin Rin Vout Vin+ Cin Rx AM06142 20/31 Doc ID 17913 Rev 1 TS4604 6.7 Application information Performance of CMRR When the TS4604 is used in differential mode (Figure 46), because of the resistor matching the CMRR can have important variations. To minimize these variations, we recommend using the same kind of resistor (same tolerance). The following equation is valid for frequencies ranging from DC to about kHz. The equation is simplified by neglecting the ΔR² terms. ΔR is the tolerance value as a percentage. 100 CMRR ≈ 20 ⋅ log ------------ ⎛ 1 + Rfd ----------⎞ ( dB ) 4ΔR ⎝ Rin⎠ It is extremely important to correctly match the resistors to obtain a good CMRR. All the tests have been performed with resistors with a tolerance value of 0.1%. Example: With ΔR = 1% the minimum CMRR would be 34 dB. With ΔR = 0.1% the minimum CMRR would be 54 dB. 6.8 Internal and external undervoltage detection The TS4604 embeds two UVLOs: one internal and one external. 6.8.1 Internal UVLO The internal UVLO monitors the power supply via pins PVCC_HP (20) and PVCC_LD(23). The threshold is set to 2.8 V with a 200 mV hysteresis. If the power supply decreases to 2.6 V, the TS4604 switches to standby mode. To switch the device on again, the power supply voltage must increase to above 2.8 V. Refer to Table 4 for the tolerance of the UVLO voltage. 6.8.2 External UVLO The Ex_UVP pin (25) is an external undervoltage detection input that can be used to start up or shutdown the TS4604 by applying the correct voltage value. A 1.25 V internal precision voltage is used as a reference to monitor the voltage applied to the Ex_UPVP pin. To set a desired shutdown threshold and hysteresis for the application, a resistor divider can be calculated as follows. ( R1 + R2 ) Vuvp = 1.25V ⋅ --------------------------R1 Vhyst≈ 5μA ⋅ R3 ⋅ ⎛ R2 -------- + 1⎞ ⎝ R1 ⎠ with the condition R3>>R1//R2. Doc ID 17913 Rev 1 21/31 Application information TS4604 For example, to obtain Vuvp = 3.3 V with a hysteresis of 200 mV: ● R1 = 1 kΩ ● R2 = 1.6 kΩ ● R3 = 15 kΩ Figure 49. External UVLO Vcc External sense voltage 1.6 k R2 5 µA 15 k + R3 - 1k R1 Precision band gap 1.25 V TS4604 AM06143 Figure 50. Hysteresis of the external UVLO Icc VHyst Vuvp External sense voltage AM06144 When the external sense voltage (ESV) increases, the TS4604 stays in standby mode until the EUVP pin reaches 1.25 V (voltage across the divider R1, R2). At this point, the TS4604 starts, as does the internal 5 µA current source connected to the EUVP pin. Thanks to this 5 µA current, a voltage drop is created across the R3 resistor. 22/31 Doc ID 17913 Rev 1 TS4604 Application information To switch the TS4604 back to standby, the voltage across the divider R1, R2 has to be lower than 1.25 V - VHyst × R1/(R1 + R2). The ESV can be an external voltage or simply the power supply voltage PVcc_LD/HD. 6.9 2nd order Butterworth low-pass filter The TS4604 can also be configured as a low-pass filter to be driven directly by a DAC output. It can be used, for example, as a 2nd order low-pass filter, with either a differential input or a single-ended input. Figure 51 and Figure 52 depict these two kinds of application and represent a multiple feedback 2nd order low-pass filter. An AC-coupling capacitor should be added to block any DC component from the source, which helps to reduce the output DC offset to a minimum. Figure 51. Multi-feedback filter with differential input Figure 52. Multi-feedback filter with singleended input Rfd Rfd Cin Rin R1 C1 VinCin C2 Vout Vin+ Cin Rin R1 Rin R1 C1 VinC2 C1 Vout Rfd AM06145 AM06146 Example 2nd-order multi-feedback filter in differential mode Figure 53 shows a filter in differential mode with a cut-off frequency at 30 kHz (configured as per the values in Table 8, which proposes various filter options using a differential input). Doc ID 17913 Rev 1 23/31 Application information TS4604 Figure 53. Frequency response 2nd-order MFB filter 5 4 3 2 1 Gain (dB) 0 -1 -2 -3 -4 -5 R1 = Rin = 10kΩ, Rfd = 24kΩ, C1 = 680pF, C2 = 120pF, -6 -7 -8 -9 1 10 100 1000 10000 100000 Frequency (Hz) Table 8. Recommended values for 2nd order low-pass filter Low-pass filter Rin R1 Rfd C1 C2 25 kHz 10 kΩ 10 kΩ 15 kΩ 1 nF 200 pF 30 kHz 10 kΩ 10 kΩ 24 kΩ 680 pF 120 pF 6.10 ESD protection and compliance To provide excellent ESD immunity, an audio line IPAD(a) (STMicroelectronics reference EMIF04-EAR02M8) can be added at the output of the TS4604 (Figure 54). By adding the IPAD, the TS4604 complies with the standard IEC 61000-4-2 level 4 on the external pins. ● OUT_HPL and OUT_HPR for the headphone driver. ● OUT_LDL and OUT_LDR for the Line driver. a. Copyright ST Microelectronics. 24/31 Doc ID 17913 Rev 1 TS4604 Application information Figure 54. TS4604 with IPAD for ESD immunity InR- OUT_R A1 InR+ OUT_R A2 + Gnd InL- B2 OUT_L C1 InL+ Gnd Gnd C2 OUT_L IPAD + TS4604 AM06147 6.11 Pop-&-click circuitry Thanks to the internal negative supply the headphone and line driver outputs are referred to ground without the need for bulky in-series capacitors. As a result, the pop created by these bulky capacitors is eliminated. In addition, the TS4604 includes a pop-&-click circuitry that suppresses any residual pop on the outputs, thus enabling the outputs to be virtually pop-&click-free. 6.12 Start-up phase To further improve the pop-&-click performance, two important points must be taken into account during the start-up phase. Input capacitor During the start up phase, as long as the AC input coupling capacitors are not fully charged, we suggested to remain the EN_LD and En_HP and/or Ext_UVP pin low. The constant time for an RC filter is given by: τ = Rin ⋅ Cin We can consider that the input capacitor Cin will be charged at 95% of its maximum value at: T = 3τ Doc ID 17913 Rev 1 25/31 Application information TS4604 With a gain set at G = 0 dB, a Rin = 10 kΩ and Cin = 2.2 µF, to charge Cin to 95% of its final value, 66 ms are necessary. Wake-up time of the TS4604 The TS4604 needs 30 ms to become fully operational (see Table 5 and Table 6). The total startup sequence with the settings described being 66 ms, and since the TS4604 needs 30 ms to wake up, the Enable pin for the line driver and/or headphone can be set high 36 ms after the power supply has reached its normal value (Figure 55). With a lower input capacitance, the startup phase is quicker. Figure 55. Power-up/down sequence Supply Supply ramp EN_xx 36 ms Vout 30 ms 66 ms AM06148 6.13 Layout recommendations Particular attention must be given to the correct layout of the PCB traces and wires between the amplifier, load and power supply. The power and ground traces are critical since they must provide adequate energy and grounding for all circuits. Good practice is to use short and wide PCB traces to minimize voltage drops and parasitic inductance. Proper grounding guidelines help improve audio performances, minimize crosstalk between channels, and prevent switching noise from coupling into the audio signal. It is also recommended to use a large-area and multi-via ground plane to minimize parasitic impedance. Connect all the VCC tracks (PVCCLD and PVCCHP) to one point one the board. The copper traces that connect the output pins to the load and supply pins should be as wide as possible to minimize the trace resistances. The gain setting resistors must be placed as close as possible to the input in order to minimize the parasitic capacitors on these inputs pins. 26/31 Doc ID 17913 Rev 1 TS4604 7 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Doc ID 17913 Rev 1 27/31 Package information 7.1 TS4604 TSSOP28 package Figure 56. TSSOP28 pitch 0.65 mm mechanical drawing Table 9. TSSOP28 pitch 0.65 mm mechanical data Dimensions Ref. Millimeters Min. Typ. A Max. Min. Typ. 1.20 A1 0.05 A2 0.80 b Max. 0.047 0.15 0.002 1.05 0.031 0.19 0.30 0.007 0.011 c 0.09 0.20 0.003 0.008 D 9.60 9.70 9.80 0.378 0.382 0.386 E 6.20 6.40 6.60 0.244 0.252 0.260 E1 4.30 4.40 4.50 0.170 0.173 0.177 e L k aaa 1.00 0.65 0.45 L1 28/31 Inches 0.60 0.039 0.041 0.026 0.75 1.00 0 0.006 0.018 0.024 0.030 0.040 8 0.10 Doc ID 17913 Rev 1 0.004 TS4604 8 Ordering information Ordering information Table 10. Order codes Part number Temperature range Gain Package Marking TS4604IPT -40°C, +85°C External TSSOP28 4604 Doc ID 17913 Rev 1 29/31 Revision history 9 TS4604 Revision history Table 11. 30/31 Document revision history Date Revision 27-Oct-2010 1 Changes Initial release. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 17913 Rev 1 31/31