STMICROELECTRONICS TS4999

TS4999
Filter-free stereo 2.8 W class D audio power amplifier
with selectable 3D sound effects
Features
■
Operates from VCC = 2.4 to 5.5 V
■
Dedicated standby mode active low/channel
■
Output power per channel: 2.8 W at 5 V into
4 Ω with 10% THD+N or 0.7 W at 3.6 V into 8 Ω
with 1% THD+N max.
■
Selectable 3D sound effect
■
Four gain setting steps: 3.5, 6, 9.5 and 12 dB
■
Low current consumption
■
PSSR: 63 dB typical at 217 Hz.
■
Fast start up phase: 7.8 ms
■
Short-circuit and thermal shutdown protection
■
Flip chip 18-bump lead-free package
Flip chip 18-bump package
Pin connections (top view)
LOUT-
LPVCC
Applications
■
■
■
RPVCC
G1
LOUT+
Cellular phones
ROUT+
AVCC
AGND
PDAs
ROUT-
PGND
STDBYR
G0
STDBYL
Notebook PCs
LIN-
Description
LIN+
RIN-
3D
RIN+
The TS4999 is a stereo fully-differential class D
power amplifier. It can drive up to 1.35 W into a
8 Ω load at 5 V per channel. The device has four
different gain settings utilizing two discrete pins,
G0 and G1.
Pop and click reduction circuitry provides low
on/off switch noise while allowing the device to
start within 8 ms. 3D enhancement effects are
selected through one digital input pin that allows
more amazing stereo audio sound.
Two standby pins (active low) allow each channel
to be switched off separately.
The TS4999 is available in a flip chip, 18-bump,
lead-free package.
December 2008
Rev 1
1/36
www.st.com
36
Contents
TS4999
Contents
1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1
4
5
Electrical characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.1
Differential configuration principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2
Gain settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.3
3D effect enhancement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4
Low frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.5
Circuit decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.6
Wakeup (tWU) and shutdown (tSTBY) times . . . . . . . . . . . . . . . . . . . . . . . 26
4.7
Consumption in shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.8
Single-ended input configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.9
Output filter considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.10
Short-circuit protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.11
Thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1
Flip chip package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.2
Tape and reel package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
2/36
TS4999
1
Absolute maximum ratings
Absolute maximum ratings
Table 1.
Key parameters and their absolute maximum ratings
Symbol
Parameter
VCC
Supply voltage(1)
Vin
Input voltage(2)
Value
Unit
6
V
GND to VCC
V
Toper
Operating free air temperature range
-40 to + 85
°C
Tstg
Storage temperature
-65 to +150
°C
Maximum junction temperature
150
°C
Thermal resistance junction to ambient (3)
200
°C/W
Tj
Rthja
Pd
Power dissipation
ESD
HBM: human body model(5)
ESD
MM: machine model(6)
2
kV
200
V
200
mA
Standby pin voltage maximum voltage
GND to VCC
V
Lead temperature (soldering, 10 secs)
260
°C
Latch-up Latch-up immunity
VSTBY
Internally Limited(4)
Output short-circuit protection(7)
1. All voltages values are measured with respect to the ground pin.
2. The magnitude of input signal must never exceed VCC + 0.3 V / GND - 0.3 V
3. Device is protected in case of over temperature by a thermal shutdown active at 150° C.
4. Exceeding the power derating curves during a long period, involves abnormal operating condition.
5. Human body model: 100 pF discharged through a 1.5 kΩ resistor between two pins of the device, done for
all couples of pin combinations with other pins floating.
6. Machine model: a 200 pF capacitor is charged to the specified voltage, then discharged directly between
two pins of the device with no external series resistor (internal resistor < 5 Ω), done for all couples of pin
combinations with other pins floating.
7. Implemented short-circuit protection protects the amplifier against damage by short-circuit between
positive and negative outputs of each channel and between outputs and ground.
3/36
Absolute maximum ratings
Table 2.
TS4999
Operating conditions
Symbol
Parameter
VCC
Supply voltage(1)
Vin
Input voltage range
VSTBY
RL
Standby voltage input
Device ON
Device OFF
Value
Unit
2.4 to 5.5
V
GND to VCC
(2)
1.4 ≤VSTBY ≤VCC
GND ≤VSTBY ≤0.4(3)
V
≥4
Ω
1.4 ≤VIH ≤VCC
V
GND ≤VIL ≤0.4
V
90
°C/W
Load resistor
VIH
G0, G1, 3D, High Level Input Voltage
VIL
G0, G1, 3D, Low Level Input Voltage
Rthja
(4)
Thermal Resistance Junction to Ambient
(5)
1. For VCC from 2.4 to 2.5 V, the operating temperature range is reduced to 0° C ≤Tamb ≤70° C
2. Without any signal on VSTBY, the device will be in standby (internal 300 kΩ (+/-20 %) pull down resistor)
3. Minimum current consumption is obtained when VSTBY = GND
4. Between G0, G1, 3D pins and GND, there is an internal 300 kΩ (+/-20 %) pull-down resistor. When pins
are floating, the gain is 3.5 dB and 3D effect is off. In full standby (left and right channels OFF), these
resistors are disconnected (HiZ input).
5. With a 4-layer PCB.
Table 3.
Note:
4/36
3D effect pin and STANDBY pins setting truth table
3D
STBYL
STBYR
3D Effect
Left channel
Right channel
0
0
0
X
STDBY
STDBY
0
0
1
OFF
STDBY
ON
0
1
0
OFF
ON
STDBY
0
1
1
OFF
ON
ON
1
0
0
X
STDBY
STDBY
1
0
1
N/A
N/A
N/A
1
1
0
N/A
N/A
N/A
1
1
1
ON
ON
ON
When the 3D effect is switched on, both channels must be in operation or in shutdown mode
at the same time.
TS4999
Application information
Application information
Typical application schematic
VCC
VCC
CsR
1uF
CsL
1uF
VCC
C1
3D
TS4999
D4
3D Effect
Control
Gain Select
Control
Differential
Left Input
Cs
0.1uF
Left IN+
AVCC
RPVCC
B6
Figure 1.
D6
2
LPVCC
Cin
A1
Lin+
Left IN-
B2
Lin-
C3
G0
C5
G1
E1
Rin+
Lout+
A5
Lout-
A7
H
Gain
Cin
PWM
Select
Bridge
3D EFFECT
Left speaker
Differential
Right Input
Right IN+
Oscillator
D2
Rin-
Rout+
E5
Bridge Rout-
E7
H
Gain
Cin
PWM
Select
Right speaker
Cin
A3
STBYL
E3
STBYR
Standby
Control
Protection
Circuit
B4
AGND
PGND
C7
Right IN-
Standby Control
Note:
See Section 4.9: Output filter considerations on page 29.
Table 4.
External component description
Components
Functional description
CS, CSL, CSR
Supply capacitor that provides power supply filtering.
Cin
Input coupling capacitors that block the DC voltage at the amplifier input terminal.
The capacitors also form a high pass filter with Zin
(Fcl = 1 / (2 x π x Zin x Cin)). Note that the value of Zin changes with each gain setting.
These coupling capacitors are mandatory.
5/36
Application information
Table 5.
Pin description
Bump
Name
A1
LIN+
Left channel positive differential input
B2
LIN-
Left channel negative differential input
C1
3D
E1
RIN+
Right channel positive differential input
D2
RIN-
Right channel negative differential input
A3
STBYL
C3
G0
E3
STBYR
Standby input pin (active low) for right channel output
B4
AGND
Analog ground
D4
AVCC
Analog supply voltage
A5
LOUT+
Left channel negative output
C5
G1
Gain select input pin (MSB)
E5
ROUT+
Right channel positive output
B6
LPVCC
Left channel power supply voltage
D6
RPVCC
Right channel power supply voltage
A7
LOUT-
Left channel negative output
C7
PGND
Power ground
E7
ROUT-
Right channel negative output
Table 6.
Note:
Table 7.
6/36
TS4999
Function
3D effect digital input pin
Standby input pin (active low) for left channel output
Gain select input pin (LSB)
Truth table for output gain settings
G1
G0
Gain value (dB)
0
0
3.5
0
1
6
1
0
9.5
1
1
12
See Table 3 on page 4.
Truth table for 3D effects pin settings
3D
3D effect
0
OFF
1
ON
TS4999
Electrical characteristics
3
Electrical characteristics
Table 8.
VCC = +5 V, GND = 0 V, Tamb = 25° C (unless otherwise specified)
Symbol
ICC
.
Parameter
Supply current
ISTANDBY Standby current
Voo
Po
THD+N
Output offset voltage
Output power
Total harmonic distortion +
noise
Efficiency Efficiency per channel
PSRR
Typ.
Max.
Unit
No input signal, no load, both channels
5
7
mA
No input signal, Vstdby = GND
1
2
μA
20
mV
Floating inputs, RL = 8Ω, G = 3.5dB,
3D effect off
THD = 1% max, F = 1kHz, RL = 4Ω
2.25
THD = 1% max, F = 1kHz, RL = 8Ω
1.35
THD = 10% max, F = 1kHz, RL = 4Ω
2.8
W
THD = 10% max, F = 1kHz, RL = 8Ω
1.7
W
Po = 0.9W/Ch, G = 6dB, F=1kHz,
RL = 8Ω
0.2
%
Po = 2.3 WRMS, RL = 4Ω +15µH
82
Po = 1.4 WRMS, RL = 8Ω + 15µH
89
%
Common mode rejection
ratio
dB
F = 1kHz, RL = 8Ω,
3D effects off
100
dB
Cin=1µF, F = 217Hz, RL = 8Ω, gain = 6dB,
ΔVIC = 200mVpp, 3D effects OFF
57
dB
3
3.5
4
G1 = "0" & G0 = "1"
5.5
6
6.5
G1 = "1" & G0 = "0"
9
9.5
10
11.5
12
12.5
24
30
36
kΩ
12
15
18
kΩ
13.5
17.1
20.5
kΩ
6.5
8.6
10.5
190
280
370
Gain value with no load
dB
G1 = G0 = "1"
G1 = G0 = 3D = "0" or
G1 = "0" & G0 = "1" & 3D = "0" or
G1 = "1" & G0 = "0" & 3D = "0"
ZIN
W
65
G1 = G0 = "0"
Gain
Min.
Cin = 1µF (1),3D effects off
Power supply rejection ratio
F = 217Hz, RL = 8Ω, gain = 6dB,
with inputs grounded
Vripple = 200mVpp, Inputs grounded
Crosstalk Channel separation
CMRR
Conditions
G1 = "1" & G0 = "1" & 3D = "0"
Single-ended input
impedance referred to GND G1 = G0 = "0" & 3D = "1" or
G1 = "0" & G0 = "1" & 3D = "1" or
G1 = "1" & G0 = "0" & 3D = "1"
G1 = "1" & G0 = "1" & G3D = "1"
FPWM
Pulse width modulator
base frequency
SNR
Signal to noise ratio
Po = 1.3W, A-weighting, RL = 8Ω,
Gain = 6dB, 3D effects OFF
tWU
Wake-up time
Total wake-up time(2)
99
9
13
kHz
dB
16.5
ms
7/36
Electrical characteristics
Table 8.
Symbol
tSTBY
VN
TS4999
VCC = +5 V, GND = 0 V, Tamb = 25° C (unless otherwise specified) (continued)
Parameter
Conditions
(2)
Standby time
Standby time
Output voltage noise
F = 20Hz to 20kHz, A-weighted,
Gain = 3.5dB
Filterless, 3D effect off, RL = 4Ω
Filterless, 3D effect on, RL = 4Ω
With LC output filter, 3D effect off, RL = 4Ω
With LC output filter, 3D effect on, RL = 4Ω
Filterless, 3D effect off, RL = 8Ω
Filterless, 3D effect on, RL = 8Ω
With LC output filter, 3D effect off, RL = 8Ω
With LC output filter, 3D effect on, RL = 8Ω
Min.
Typ.
Max.
Unit
11
15.8
20
ms
31
50
30
48
32
51
31
50
μVRMS
1. Dynamic measurements - 20*log(rms(Vout)/rms(Vripple)). Vripple is the super-imposed sinus signal to VCC at f = 217 Hz
with fixed Cin cap (input decoupling capacitor).
2. See Section 4.6: Wakeup (tWU) and shutdown (tSTBY) times on page 26.
8/36
TS4999
Table 9.
Symbol
ICC
Electrical characteristics
.
VCC = +3.6V, GND = 0V, Tamb = 25°C (unless otherwise specified)
Parameter
Supply current
ISTANDBY Standby current
Voo
Po
THD+N
Output offset voltage
Output power
Total harmonic distortion +
noise
Efficiency Efficiency per channel
PSRR
No input signal, no load, both channels
No input signal, Vstdby = GND
Common mode rejection
ratio
Max.
Unit
3.5
5.5
mA
1
2
μA
20
mV
THD = 1% max, F = 1kHz, RL = 4Ω
1.15
THD = 1% max, F = 1kHz, RL = 8Ω
0.7
THD = 10% max, F = 1kHz, RL = 4Ω
1.45
W
THD = 10% max, F = 1kHz, RL = 8Ω
0.86
W
Po = 0.45W/Ch, G = 6dB, F=1kHz,
RL = 8Ω
0.15
%
W
Po = 1.15 WRMS, RL = 4Ω +15µH
82
Po = 0.7 WRMS, RL = 8Ω + 15µH
89
%
64
dB
F = 1kHz, RL = 8Ω,
3D effects off
102
dB
Cin=1µF, F = 217Hz, RL = 8Ω, gain = 6dB,
ΔVIC = 200mVpp, 3D effects off
55
dB
3
3.5
4
G1 = "0" & G0 = "1"
5.5
6
6.5
G1 = "1" & G0 = "0"
9
9.5
10
11.5
12
12.5
24
30
36
kΩ
12
15
18
kΩ
13.5
17.1
20.5
kΩ
6.5
8.6
10.5
kΩ
190
280
370
kHz
Gain value with no load
dB
G1 = G0 = "1"
G1 = G0 = 3D = "0" or
G1 = "0" & G0 = "1" & 3D = "0" or
G1 = "1" & G0 = "0" & 3D = "0"
ZIN
Typ.
Floating inputs, RL = 8Ω, G = 3.5dB,
3D effect off
G1 = G0 = "0"
Gain
Min.
Cin = 1µF (1),3D effects off
Power supply rejection ratio
F = 217Hz, RL = 8Ω, gain = 6dB,
with inputs grounded
Vripple = 200mVpp, inputs grounded
Crosstalk Channel separation
CMRR
Conditions
G1 = "1" & G0 = "1" & 3D = "0"
Single-ended input
impedance referred to GND G1 = G0 = "0" & 3D = "1" or
G1 = "0" & G0 = "1" & 3D = "1" or
G1 = "1" & G0 = "0" & 3D = "1"
G1 = "1" & G0 = "1" & G3D = "1"
FPWM
Pulse width modulator
base frequency
SNR
Signal to noise ratio
Po = 0.67W, A-weighting, RL = 8Ω,
Gain = 6dB, 3D effects OFF
tWU
Wake-up time
Total wake-up time(2)
97
7.5
11.3
dB
15
ms
9/36
Electrical characteristics
Table 9.
Symbol
tSTBY
VN
TS4999
VCC = +3.6V, GND = 0V, Tamb = 25°C (unless otherwise specified) (continued)
Parameter
Conditions
(2)
Standby time
Standby time
Output voltage noise
F = 20Hz to 20kHz, A-Weighted,
Gain = 3.5dB
Filterless, 3D effect off, RL = 4Ω
Filterless, 3D effect on, RL = 4Ω
With LC output filter, 3D effect off, RL = 4Ω
With LC output filter, 3D effect on, RL = 4Ω
Filterless, 3D effect off, RL = 8Ω
Filterless, 3D effect on, RL = 8Ω
With LC output filter, 3D effect off, RL = 8Ω
With LC output filter, 3D effect on, RL = 8Ω
Min.
Typ.
Max.
Unit
10
13.8
18
ms
29
49
28
48
29
50
29
50
μVRMS
1. Dynamic measurements - 20*log(rms(Vout)/rms(Vripple)). Vripple is the super-imposed sinus signal to VCC at f = 217 Hz
with fixed Cin cap (input decoupling capacitor).
2. See Section 4.6: Wakeup (tWU) and shutdown (tSTBY) times on page 26.
10/36
TS4999
Table 10.
Symbol
ICC
Electrical characteristics
VCC = +2.5 V, GND = 0V, Tamb = 25° C (unless otherwise specified)
Parameter
Supply current
ISTANDBY Standby current
Voo
Po
THD+N
Output offset voltage
Output power
Total harmonic distortion +
noise
Efficiency Efficiency per channel
PSRR
No input signal, no load, both channels
No input signal, Vstdby = GND
Common mode rejection
ratio
Max.
Unit
2.8
4
mA
1
2
μA
20
mV
THD = 1% max, F = 1kHz, RL = 4Ω
0.53
THD = 1% max, F = 1kHz, RL = 8Ω
0.33
THD = 10% max, F = 1kHz, RL = 4Ω
0.67
W
THD = 10% max, F = 1kHz, RL = 8Ω
0.4
W
Po = 0.2W/Ch, G = 6dB, F=1kHz,
RL = 8Ω
0.07
%
Po = 0.52 WRMS, RL = 4Ω +15µH
81
Po = 0.33 WRMS, RL = 8Ω + 15µH
88
W
%
63
dB
F = 1kHz, RL = 8Ω,
3D effects off
104
dB
Cin=1µF, F = 217Hz, RL = 8Ω, gain = 6dB,
ΔVIC = 200mVpp, 3D effects off
55
dB
3
3.5
4
G1 = "0" & G0 = "1"
5.5
6
6.5
G1 = "1" & G0 = "0"
9
9.5
10
11.5
12
12.5
24
30
36
kΩ
12
15
18
kΩ
13.5
17.1
20.5
kΩ
6.5
8.6
10.5
kΩ
190
280
370
kHz
Gain value with no load
dB
G1 = G0 = "1"
G1 = G0 = 3D = "0" or
G1 = "0" & G0 = "1" & 3D = "0" or
G1 = "1" & G0 = "0" & 3D = "0"
ZIN
Typ.
Floating inputs, RL = 8Ω, G = 3.5dB,
3D effect off
G1 = G0 = "0"
Gain
Min.
Cin = 1µF (1),3D effects off
Power supply rejection ratio
F = 217Hz, RL = 8Ω, gain = 6dB,
with inputs grounded
Vripple = 200mVpp, Inputs grounded
Crosstalk Channel separation
CMRR
Conditions
G1 = "1" & G0 = "1" & 3D = "0"
Single-ended input
impedance referred to GND G1 = G0 = "0" & 3D = "1" or
G1 = "0" & G0 = "1" & 3D = "1" or
G1 = "1" & G0 = "0" & 3D = "1"
G1 = "1" & G0 = "1" & G3D = "1"
FPWM
Pulse width modulator
base frequency
SNR
Signal to noise ratio
Po = 0.3W, A-weighting, RL = 8Ω,
Gain = 6dB, 3D effects OFF
tWU
Wake-up time
Total wake-up time(2)
94
3
7.8
dB
12
ms
11/36
Electrical characteristics
Table 10.
Symbol
tSTBY
VN
TS4999
VCC = +2.5 V, GND = 0V, Tamb = 25° C (unless otherwise specified) (continued)
Parameter
Conditions
(2)
Standby time
Standby time
Output voltage noise
F = 20Hz to 20kHz, A-Weighted,
Gain = 3.5dB
Filterless, 3D effect off, RL = 4Ω
Filterless, 3D effect on, RL = 4Ω
With LC output filter, 3D effect off, RL = 4Ω
With LC output filter, 3D effect on, RL = 4Ω
Filterless, 3D effect off, RL = 8Ω
Filterless, 3D effect on, RL = 8Ω
With LC output filter, 3D effect off, RL = 8Ω
With LC output filter, 3D effect on, RL = 8Ω
Min.
Typ.
Max.
Unit
8
12
16
ms
28
47
27
45
28
48
28
47
μVRMS
1. Dynamic measurements - 20*log(rms(Vout)/rms(Vripple)). Vripple is the super-imposed sinus signal to VCC at f = 217 Hz
with fixed Cin cap (input decoupling capacitor).
2. See Section 4.6: Wakeup (tWU) and shutdown (tSTBY) times on page 26.
12/36
TS4999
3.1
Electrical characteristics
Electrical characteristic curves
The graphs shown in this section use the following abbreviations.
●
RL+ 15 µH or 30 µH = pure resistor + very low series resistance inductor.
●
Filter = LC output filter (1 µF+ 30 µH for 4 Ω and 0.5 µF+15 µH for 8 Ω).
All measurements are done with CSL= CSR=1 µF and CS = 100 nF (see Figure 2), except
for the PSRR where CSL, CSR is removed (see Figure 3).
Figure 2.
Measurement test diagram
VCC
CsL
(CsR)
1μ F
Cs
100nF
GND
GND
RL
4 or 8 Ω
Cin
In+
Out+
15μH or 30μH
1/2 TS4999
In-
or
LC Filter
5th order
50kHz
low-pass filter
Out-
Cin
GND
Audio Measurement
Bandwith < 30kHz
13/36
Electrical characteristics
Figure 3.
TS4999
PSRR measurement test diagram
VCC
Cs
100nF
20Hz to 20kHz
Vripple
GND
1μ F
Cin
Vcc
GND
RL
4 or 8 Ω
Out+
In+
15μH or 30μH
1/2 TS4999
In-
or
50kHz
LC Filter
low-pass filter
Out-
Cin
1μ F
GND
GND
5th order
50kHz
low-pass filter
14/36
reference
5th order
RMS Selective Measurement
Bandwith =1% of Fmeas
TS4999
Electrical characteristics
Figure 4.
6
Current consumption vs. power
supply voltage
Vcc=5V
Current Consumption (mA)
Both channels active
4
One channel active
3
2
1
Vcc=3.6V
2
One channel active
0
1
2
3
4
5
No load
Tamb = 25 ° C
0
1
2
Power Supply Voltage (V)
Figure 6.
Standby current consumption vs.
power supply voltage
Figure 7.
1.4
1.0
80
Efficiency (%)
Standby Current (μ A)
Efficiency vs. output power
(one channel)
0.8
1.0
0.8
0.6
0.6
0.5
Power dissipation
40
20
0.2
1
2
3
4
0
0.0
5
0.4
Power Supply Voltage (V)
Figure 8.
Efficiency vs. output power
(one channel)
100
Figure 9.
0.50
0.7
Efficiency
60
0.4
0
5
0.9
Tamb = 25 ° C
0.0
4
100
No load
V STBYL = V STBYR = GND
1.2
3
Standby Voltage (V)
0.4
0.3
Vcc = 5V
RL = 4 Ω + 15 μ H 0.2
F = 1kHz
0.1
THD+N ≤ 10%
0.0
0.8
1.2
1.6
2.0
2.4
2.8
Output Power (W)
Efficiency vs. output power
(one channel)
100
0.24
0.45
80
0.35
0.30
Power dissipation
40
0.25
0.20
0.15
20
0.2
0.4
0.6
0.8
1.0
Output Power (W)
Vcc = 3.6V
RL = 4 Ω + 15 μ H 0.10
F = 1kHz
0.05
THD+N ≤ 10%
0.00
1.2
1.4
1.6
Dissipated Power (W)
Efficiency (%)
Efficiency (%)
60
0
0.0
0.22
80
0.40
Efficiency
Dissipated Power (W)
0
Vcc=2.5V
1
0.20
0.18
Efficiency
0.16
60
0.14
0.12
40
Power dissipation
0.10
0.08
Vcc = 2.5V
RL = 4 Ω + 15 μ H
F = 1kHz
THD+N ≤ 10%
20
0
0.0
0.1
0.2
0.3
0.4
Output Power (W)
0.5
0.6
0.06
Dissipated Power (W)
0
Current consumption vs. standby
voltage (one channel)
3
No load
Tamb = 25 ° C
5
Current Consumption (mA)
Figure 5.
0.04
0.02
0.00
0.7
15/36
Electrical characteristics
TS4999
80
60
40
20
0
0.0
Figure 12. Efficiency vs. output power
(one channel)
100
0.15
80
Efficiency
0.10
60
Power dissipation
40
0.05
Vcc = 3.6V
RL = 8 Ω + 15 μ H
F = 1kHz
THD+N ≤ 10%
20
0
0.0
0.1
F = 1kHz
RL = 4 Ω + 15 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
Efficiency
Power dissipation
0.04
40
Vcc = 2.5V
RL = 8 Ω + 15 μ H
F = 1kHz
THD+N ≤ 10%
0.05
0.10
0.15 0.20 0.25 0.30
Output Power (W)
0.35
0.40
0.02
THD + N (%)
Efficiency (%)
0.06
Dissipated Power (W)
80
0
0.00
Vcc=5V
Vcc=3.6V
1
Vcc=2.5V
0.1
0.00
0.45
0.01
0.1
1
Figure 15. THD+N vs. output power
10
10
F = 1kHz
RL = 4 Ω + 30 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
F = 1kHz
RL = 8 Ω + 15 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
Vcc=5V
Vcc=3.6V
THD + N (%)
THD + N (%)
0.00
0.9
0.8
Output power (W)
Figure 14. THD+N vs. output power
1
Vcc=2.5V
0.1
0.01
Vcc=5V
Vcc=3.6V
1
Vcc=2.5V
0.1
0.1
Output power (W)
16/36
0.7
10
0.08
20
0.3
0.4
0.5
0.6
Output Power (W)
Figure 13. THD+N vs. output power
100
60
0.2
1
0.01
0.1
Output power (W)
1
Dissipated Power (W)
0.30
0.28
0.26
0.24
0.22
Efficiency
0.20
0.18
0.16
Power dissipation
0.14
0.12
0.10
0.08
Vcc = 5V
RL = 8 Ω + 15 μ H 0.06
0.04
F = 1kHz
0.02
THD+N ≤ 10%
0.00
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Output Power (W)
100
Efficiency (%)
Figure 11. Efficiency vs. output power
(one channel)
Dissipated Power (W)
Efficiency (%)
Figure 10. Efficiency vs. output power
(one channel)
TS4999
Electrical characteristics
Figure 16. THD+N vs. output power
Figure 17. THD+N vs. frequency
10
10
Vcc = 5V
RL = 4 Ω + 15 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
Vcc=5V
Vcc=3.6V
1
THD + N (%)
THD + N (%)
F = 1kHz
RL = 8 Ω + 30 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
1
Vcc=2.5V
Po=1500mW
0.1
Po=750mW
0.1
0.01
0.1
0.01
1
20
100
Output power (W)
Figure 18. THD+N vs. frequency
10
Vcc = 3.6V
RL = 4 Ω + 15 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
Po=800mW
1
THD + N (%)
THD + N (%)
10000
Figure 19. THD+N vs. frequency
10
1
1000
Frequency (Hz)
0.1
Vcc = 2.5V
RL = 4 Ω + 15 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
Po=400mW
0.1
Po=400mW
0.01
20
100
1000
Po=200mW
0.01
20
10000
100
Frequency (Hz)
1000
10000
Frequency (Hz)
v
Figure 20. THD+N vs. frequency
Figure 21. THD+N vs. frequency
10
Po=1500mW
1
THD + N (%)
THD + N (%)
1
10
Vcc = 5V
RL = 4 Ω + 30 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
0.1
Vcc = 3.6V
RL = 4 Ω + 30 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
Po=800mW
0.1
Po=400mW
Po=750mW
0.01
20
100
1000
Frequency (Hz)
10000
0.01
20
100
1000
10000
Frequency (Hz)
17/36
Electrical characteristics
TS4999
Figure 22. THD+N vs. frequency
Figure 23. THD+N vs. frequency
10
Po=1500mW
Vcc = 5V
RL = 8 Ω + 15 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
1
THD + N (%)
THD + N (%)
1
10
Vcc = 5V
RL = 4 Ω + 30 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
0.1
Po=900mW
0.1
Po=750mW
0.01
20
100
1000
Po=450mW
0.01
20
10000
100
Frequency (Hz)
Figure 24. THD+N vs. frequency
Vcc = 2.5V
RL = 8 Ω + 15 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
1
Po=450mW
THD + N (%)
THD + N (%)
10
Vcc = 3.6V
RL = 8 Ω + 15 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
0.1
Po=200mW
0.1
Po=225mW
0.01
20
100
1000
Po=100mW
0.01
10000
20
100
Frequency (Hz)
10
Po=900mW
1
THD + N (%)
Vcc = 5V
RL = 8 Ω + 30 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
0.1
Vcc = 3.6V
RL = 8 Ω + 30 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
Po=450mW
0.1
Po=450mW
0.01
20
100
1000
Frequency (Hz)
18/36
10000
Figure 27. THD+N vs. frequency
10
THD + N (%)
1000
Frequency (Hz)
Figure 26. THD+N vs. frequency
1
10000
Figure 25. THD+N vs. frequency
10
1
1000
Frequency (Hz)
Po=225mW
10000
0.01
20
100
1000
Frequency (Hz)
10000
TS4999
Electrical characteristics
Figure 28. THD+N vs. frequency
Figure 29. Output power vs. power supply
voltage
10
Output power at 1% THD + N (W)
THD + N (%)
1
Vcc = 2.5V
RL = 8 Ω + 30 μ H
G = +6dB
BW < 30kHz
Tamb = 25 ° C
Po=200mW
0.1
Po=100mW
0.01
20
100
1000
10000
2.8
2.6 F = 1kHz
2.4 BW < 30kHz
Tamb = 25 ° C
2.2
2.0
1.8
RL=4 Ω + ≥ 15 μ H
1.6
1.4
1.2
1.0
0.8
0.6
RL=8 Ω + ≥ 15 μ H
0.4
0.2
0.0
2.5
3.0
3.5
4.0
4.5
5.0
Frequency (Hz)
Figure 31. Crosstalk vs. frequency
(3D effect off)
0
3.4
3.2 F = 1kHz
3.0 BW < 30kHz
2.8 Tamb = 25 ° C
2.6
2.4
2.2
2.0
RL=4 Ω + ≥ 15 μ H
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.5
3.0
3.5
-10
-20
Crosstalk Level (dB)
Output power at 10% THD + N (W)
Figure 30. Output power vs. power supply
voltage
RL=8 Ω + ≥ 15 μ H
-30
-40
Vcc = 5V
RL = 4 Ω + ≥ 15 μ H
G = +6dB
Cin = 1 μ F
Tamb = 25 ° C
-50
-60
-70
-80
Po=500mW
-100
4.0
4.5
5.0
5.5
-110
Po=1500mW
-120
20
100
-10
-20
-50
-60
-70
-80
Po=250mW
Po=500mW
-90
-100
-110
-120
20
10000
0
Vcc = 3.6V
RL = 4 Ω + ≥ 15 μ H
G = +6dB
Cin = 1 μ F
Tamb = 25 ° C
Crosstalk Level (dB)
Crosstalk Level (dB)
-40
1000
Figure 33. Crosstalk vs. frequency
(3D effect off)
0
-30
Po=1800mW
Frequency (Hz)
Figure 32. Crosstalk vs. frequency
(3D effect off)
-20
Po=1000mW
-90
Supply voltage (V)
-10
5.5
Supply voltage (V)
-30
-40
Vcc = 2.5V
RL = 4 Ω + ≥ 15 μ H
G = +6dB
Cin = 1 μ F
Tamb = 25 ° C
-50
-60
-70
-80
Po=125mW
Po=250mW
-90
Po=325mW
-100
Po=750mW
100
-110
Po=900mW
1000
Frequency (Hz)
10000
-120
20
Po=450mW
100
1000
10000
Frequency (Hz)
19/36
Electrical characteristics
TS4999
Figure 34. Crosstalk vs. frequency
(3D effect off)
Figure 35. Crosstalk vs. frequency
(3D effect off)
0
-20
Crosstalk Level (dB)
-30
-40
0
Vcc = 5V
RL = 8 Ω + ≥ 15 μ H
G = +6dB
Cin = 1 μ F
Tamb = 25 ° C
-20
-50
-60
-70
-80
Po=600mW
Po=300mW
-90
-100
-110
-120
20
Vcc = 3.6V
RL = 8 Ω + ≥ 15 μ H
G = +6dB
Cin = 1 μ F
Tamb = 25 ° C
-10
-30
Crosstalk Level (dB)
-10
-40
-50
-60
-70
-80
Po=160mW
Po=900mW
-110
Po=1100mW
100
1000
Po=600mW
-120
20
10000
100
1000
Figure 37. Gain vs. frequency
(3D effect off)
0
-40
5
Vcc = 2.5V
RL = 8 Ω + ≥ 15 μ H
G = +6dB
Cin = 1 μ F
Tamb = 25 ° C
no load
4
Gain (dB)
Crosstalk Level (dB)
-30
-50
-60
-70
Po=75mW
-80
3
RL=8 Ω +15 μ H
2
RL=8 Ω +30 μ H
Po=225mW
-90
-100
Po=270mW
100
1000
0
10000
20
10k
20k
Figure 39. Gain vs. frequency
(3D effect off)
8
12
11
no load
7
no load
10
Gain (dB)
6
Gain (dB)
1k
Frequency (Hz)
Figure 38. Gain vs. frequency
(3D effect off)
RL=8 Ω +15 μ H
5
RL=8 Ω +30 μ H
4
Gain = 6dB
Vin = 300mVrms
Cin = 10 μ F
Tamb = 25 ° C
3
20
100
RL=4 Ω +30 μ H
1k
9
RL=8 Ω +15 μ H
8
RL=8 Ω +30 μ H
7
RL=4 Ω +15 μ H
Frequency (Hz)
20/36
RL=4 Ω +30 μ H
100
Frequency (Hz)
2
RL=4 Ω +15 μ H
Gain = 3.5dB
Vin = 400mVrms
Cin = 10 μ F
Tamb = 25 ° C
1
Po=150mW
-110
-120
20
10000
Frequency (Hz)
Figure 36. Crosstalk vs. frequency
(3D effect off)
-20
Po=500mW
-100
Frequency (Hz)
-10
Po=320mW
-90
10k
Gain = 9.5dB
Vin = 200mVrms
Cin = 10 μ F
Tamb = 25 ° C
6
20k
5
20
100
RL=4 Ω +15 μ H
RL=4 Ω +30 μ H
1k
Frequency (Hz)
10k
20k
TS4999
Electrical characteristics
Figure 40. Gain vs. frequency
(3D effect off)
Figure 41. PSRR vs. frequency
(3D effect off)
0
14
Inputs grounded
Vcc = 5V, 3D effect off
Vripple = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
-10
no load
13
-20
-30
11
RL=8 Ω +15 μ H
RL=8 Ω +30 μ H
10
RL=4 Ω +15 μ H
Gain = 12dB
Vin = 150mVrms
Cin = 10 μ F
Tamb = 25 ° C
9
8
PSRR (dB)
Gain (dB)
12
20
-40
G=+9.5dB
-60
-70
RL=4 Ω +30 μ H
-80
100
1k
10k
-90
20k
Figure 42. PSRR vs. frequency
(3D effect off)
20
100
10000
0
Inputs grounded
Vcc = 3.6V, 3D effect off
Vripple = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
-20
-30
-20
-30
-40
G=+9.5dB
Inputs grounded
Vcc = 2.5V, 3D effect off
Vripple = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
-10
PSRR (dB)
-10
PSRR (dB)
1000
Frequency (Hz)
Figure 43. PSRR vs. frequency
(3D effect off)
0
G=+12dB
-50
-60
-70
-40
G=+9.5dB
G=+12dB
-50
-60
-70
-80
G=+3.5dB
-90
20
100
-80
G=+6dB
1000
Frequency (Hz)
G=+3.5dB
-90
20
10000
Figure 44. PSRR vs. frequency
(3D effect on)
100
G=+6dB
1000
Frequency (Hz)
10000
Figure 45. PSRR vs. frequency
(3D effect on)
0
0
Inputs grounded
Vcc = 5V, 3D effect on
Vripple = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
-20
-30
-40
G=+9.5dB
Inputs grounded
Vcc = 3.6V, 3D effect on
Vripple = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
-10
-20
-30
PSRR (dB)
-10
PSRR (dB)
G=+6dB
G=+3.5dB
Frequency (Hz)
G=+12dB
-50
-60
-40
G=+9.5dB
G=+12dB
-50
-60
-70
-80
G=+12dB
-50
G=+3.5dB
20
100
1000
Frequency (Hz)
G=+3.5dB
-70
G=+6dB
10000
-80
20
100
G=+6dB
1000
Frequency (Hz)
10000
21/36
Electrical characteristics
TS4999
Figure 46. PSRR vs. frequency
(3D effect on)
Figure 47. CMRR vs. frequency
(3D effect off)
0
0
Inputs grounded
Vcc = 2.5V, 3D effect on
Vripple = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
-20
PSRR (dB)
-30
-40
-20
-30
G=+12dB
G=+9.5dB
-50
-60
20
100
1000
Frequency (Hz)
1000
Frequency (Hz)
10000
0
-20
Vcc = 2.5V, 3D effect off
Δ Vic = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
-10
-20
-30
-30
G=+9.5dB
-40
CMRR(dB)
CMRR(dB)
100
G=+6dB
Figure 49. CMRR vs. frequency
(3D effect off)
Vcc = 3.6V, 3D effect off
Δ Vic = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
-10
G=+12dB
-50
-60
G=+9.5dB
-40
G=+12dB
-50
-60
G=+3.5dB
-70
20
100
G=+3.5dB
G=+6dB
1000
Frequency (Hz)
-80
20
10000
-30
G=+9.5dB
10000
-20
G=+12dB
-50
-60
G=+3.5dB
Vcc = 3.6V, 3D effect on
Δ Vic = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
-10
-40
-30
G=+9.5dB
G=+12dB
-40
-50
-60
G=+6dB
-70
-80
20
1000
Frequency (Hz)
0
Vcc = 5V, 3D effect on
Δ Vic = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
CMRR(dB)
-20
100
Figure 51. CMRR vs. frequency
(3D effect on)
0
-10
G=+6dB
-70
Figure 50. CMRR vs. frequency
(3D effect on)
CMRR(dB)
G=+3.5dB
-80
20
10000
0
22/36
G=+12dB
-50
-70
G=+6dB
Figure 48. CMRR vs. frequency
(3D effect off)
-80
G=+9.5dB
-40
-60
G=+3.5dB
-70
-80
Vcc = 5V, 3D effect off
Δ Vic = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
-10
CMRR(dB)
-10
G=+3.5dB
G=+6dB
-70
100
1000
Frequency (Hz)
10000
-80
20
100
1000
Frequency (Hz)
10000
TS4999
Electrical characteristics
Figure 52. CMRR vs. frequency
(3D effect on)
Figure 53. Power derating curves
-10
-20
Flip-Chip Package Power Dissipation (W)
0
Vcc = 2.5V, 3D effect on
Δ Vic = 200mVpp
Cin = 10 μ F
RL = 8 Ω + ≥ 15 μ H
Tamb = 25 ° C
CMRR(dB)
-30
G=+12dB
G=+9.5dB
-40
-50
-60
G=+3.5dB
G=+6dB
-70
-80
20
100
1000
Frequency (Hz)
10000
Figure 54. Startup and shutdown phase
VCC= 5 V, G= 6 dB, Cin= 1 µF,
Vin= 2 Vpp, F= 500 Hz
1.6
1.4
With a 4-layer PCB
1.2
1.0
0.8
0.6
0.4
No Heat sink
AMR value
0.2
0.0
0
50
75
100
125
150
Ambiant Temperature (° C)
Figure 55. Startup and shutdown phase
VCC= 5 V, G= 6 dB, Cin= 1 µF, inputs
grounded
Out+
Out+
Out-
Out-
Standby
25
Standby
Out+ - Out-
Out+ - Out-
23/36
Application information
TS4999
4
Application information
4.1
Differential configuration principle
The TS4999 is a monolithic fully-differential input/output class D stereo power amplifier. The
TS4999 also features 3D effect enhancement that can be switched on or off by one digital
pin. Additionally, since the load is connected differentially compared to a single-ended
topology, the output is four times higher for the same power supply voltage.
A fully-differential amplifier offers the following advantages.
4.2
●
A high PSRR (power supply rejection ratio).
●
A high common mode noise rejection.
●
Virtually zero pop with no additional circuitry, giving a faster start-up time compared to
conventional single-ended input amplifiers.
●
Easier interfacing with differential output audio DACs.
Gain settings
In the flat region of the frequency-response curve (no input coupling capacitor or internal
feedback loop + load effect), the differential gain can be set to 3.5, 6, 9.5 or 12 dB,
depending on the logic level of the G0 and G1 pins, as shown in Table 11.
Table 11.
Gain settings with G0 and G1 pins
G1
G0
Gain (dB)
Gain (V/V)
0
0
3.5
1.5
0
1
6
2
1
0
9.5
3
1
1
12
4
Note:
Between pins G0, G1 and GND there is an internal 300 kΩ (+/-20%) resistor. When the pins
are floating, the gain is 6 dB. In full standby (left and right channels OFF), these resistors
are disconnected (HiZ input).
4.3
3D effect enhancement
The TS4999 features 3D audio effects which can be switched off and switched on through
input pin 3D when used as a digital interface. The relation between the logic level of this pin
and the on/off 3D effect is shown in Table 3 on page 4 and Table 7 on page 6.
The 3D audio effect evokes the perception of spatial hearing of stereo audio signals and
improves this effect in cases where the stereo speakers are too close to each other, such as
in small or portable devices.
The perceived amount of 3D effect also depends on many factors such as speaker position,
distance between speakers, listener/frequency spectrum of the audio signal, as well as the
difference of signal between the left and right channel.
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TS4999
Application information
In some cases, the speaker volume can increase when the 3D effect is switched on. This
factor is dependent on the composition and frequency spectrum of listened stereo audio
signal.
4.4
1
When the 3D effect is switched on, both channels must be in operation or shutdown mode at
the same time.
2
Between pin 3D and GND there is an internal 300 kΩ (+/-20%) resistor. When the pin is
floating, the 3D effect is off. In full standby (left and right channels OFF), this resistor is
disconnected (HiZ input).
Low frequency response
If a low frequency bandwidth limitation is required, input coupling capacitors can be used. In
the low frequency region, the input coupling capacitor Cin starts to have an effect. Cin forms,
with the input impedance Zin, a first order high-pass filter with a -3 dB cut-off frequency.
1
F CL = ------------------------------------------2 ⋅ π ⋅ Z in ⋅ C in
So, for a desired cut-off frequency FCL, Cin is calculated as follows:
1
C in = --------------------------------------------2 ⋅ π ⋅ Z in ⋅ F CL
with FCL in Hz, Zin in Ω and Cin in F.
The input impedance Zin is for the whole power supply voltage range and changes with the
gain setting. There is also a tolerance around the typical values (see Table 8, Table 9 and
Table 10.
Figure 56. Cut-off frequency vs. input capacitor
Tamb=25 ° C
Low -3dB Cut Off Frequency (Hz)
Note:
100
G=12dB, 3D on
Zin=8.6k Ω typ.
G=12dB, 3D off
Zin=15k Ω typ.
10
G=3.5dB, 6dB, 9.5dB
3D off, Zin=30k Ω typ.
G=3.5dB, 6dB, 9.5dB
3D on, Zin=17.1k Ω typ.
1
0.1
1
Input Capacitor Cin (μ F)
25/36
Application information
4.5
TS4999
Circuit decoupling
Power supply capacitors, referred to as CS, CSL and CSR, are needed to correctly bypass the
TS4999.
The TS4999 has a typical switching frequency of 280 kHz and an output fall and rise time of
approximately 5 ns. Due to these very fast transients, careful decoupling is mandatory.
A 1 µF ceramic capacitor between each PVCC and PGND (CSL, CSR) and one additional
ceramic capacitor between AVCC and AGND 0.1 µF (CS) are sufficient, but they must be
located as close as possible to the TS4999 in order to avoid any extra parasitic inductance
or resistance created by a long track wire. Parasitic loop inductance, in relation to di/dt,
introduces overvoltage that decreases the global efficiency of the device and may cause, if
this parasitic inductance is too high, the device to break down.
In addition, even if a ceramic capacitor has an adequate high frequency ESR (equivalent
series resistance) value, its current capability is also important. A 0603 size is a good
compromise, particularly when a 4 Ω load is used.
Another important parameter is the rated voltage of the capacitor. A 1 µF/6.3 V capacitor
used at 5 V, loses about 50% of its value. With a power supply voltage of 5 V, the decoupling
value, instead of 1 µF, could be reduced to 0.5 µF. As CS has particular influence on the
THD+N in the medium-to-high frequency region, this capacitor variation becomes decisive.
In addition, less decoupling means higher overshoots which can be problematic if they reach
the power supply AMR value (6 V).
4.6
Wakeup (tWU) and shutdown (tSTBY) times
During the wake-up sequence, there is a delay when the standby is released to switch the
device ON. The wake-up sequence of the TS4999 consists of two phases. During the first
phase tWU-A, a digitally-generated delay, mutes the outputs. Then, the gain increasingphase tWU-A begins. The gain increases smoothly from the mute state to the preset gain
selected by the digital pins G0 and G1. This startup sequence avoid any pop noise during
startup of the amplifier. See Figure 57: Wake-up phase
26/36
TS4999
Application information
Figure 57. Wake-up phase
STBY
Level
HI
LO
STBY
STBY
Time
Gain increasing
Preset gain
Gain
Mute
Mute
tWU-A
Time
tWU-B
tWU
When the standby command is set, the time required to set the output stage to high
impedance and to put the internal circuitry in shutdown mode is called the standby time.
This time is used to decrease the gain from its nominal value set by the digital pins G0 and
G1 to mute and avoid any pop noise during shutdown. The gain decreases smoothly until
the outputs are muted. See Figure 58: Shutdown phase.
Figure 58. Shutdown phase
STBY
Level
HI
STBY
STBY
LO
Time
Gain
Preset gain
Gain decreasing
Mute
Mute
tSTBY
Time
27/36
Application information
4.7
TS4999
Consumption in shutdown mode
Between the shutdown pin and GND there is an internal 300 kΩ (+-/20%) resistor. This
resistor forces the TS4999 to be in shutdown mode when the shutdown input is left floating.
However, this resistor also introduces additional shutdown power consumption if the
shutdown pin voltage is not at 0 V.
With a 0.4 V shutdown voltage pin for example, you must add 0.4 V/300 kΩ = 1.3 µA typical
(0.4 V/240 kΩ = 1.66 µA in maximum) for each shutdown pin to the standby current
specified in Table 8, Table 9 and Table 10.
Of course, this current will be provided by the external control device for standby pins.
4.8
Single-ended input configuration
It is possible to use the TS4999 in a single-ended input configuration. Input coupling
capacitors are also mandatory in this configuration. The schematic diagram in Figure 59
shows a typical single-ended input application.
Figure 59. Typical single-ended input application
VCC
Gain Select
Control
VCC
CsR
1uF
CsL
1uF
VCC
3D
AVCC
RPVCC
B6
D6
TS4999
D4
3D Effect
Control
C1
Left Input
Cs
0.1uF
LPVCC
Cin
A1
Lin+
B2
Lin-
C3
G0
C5
G1
E1
Rin+
Lout+
A5
Lout-
A7
H
Gain
PWM
Cin
Select
Bridge
3D EFFECT
Left speaker
Oscillator
Right Input
D2
Rin-
A3
STBYL
E3
STBYR
Rout+
E5
Bridge Rout-
E7
H
Gain
PWM
Cin
Select
Right speaker
Cin
Protection
Circuit
B4
AGND
Standby Control
28/36
PGND
C7
Standby
Control
TS4999
4.9
Application information
Output filter considerations
The TS4999 is designed to operate without an output filter. However, due to very sharp
transients on the TS4999 output, EMI-radiated emissions may cause some standard
compliance issues.
These EMI standard compliance issues can appear if the distance between the TS4999
outputs and loudspeaker terminal are long (typically more than 50 mm, or 100 mm in both
directions, to the speaker terminals). Because the PCB layout and internal equipment
device are different for each configuration, it is difficult to provide a one-size-fits-all solution.
However, to decrease the probability of EMI issues, there are several simple rules to follow.
●
Reduce, as much as possible, the distance between the TS4999 output pins and the
speaker terminals.
●
Use a ground plane for "shielding" sensitive wires.
●
Place, as close as possible to the TS4999 and in series with each output, a ferrite bead
with a rated current of at least 2.5 A and impedance greater than 50-Ω at frequencies
above 30 MHz. If, after testing, these ferrite beads are not necessary, replace them by
a short-circuit.
●
Allow extra footprint to place, if necessary, a capacitor to short perturbations to ground
(see Figure 60).
Figure 60. Ferrite chip bead placement
From output
Ferrite chip bead
to speaker
about 100pF
gnd
In the case where the distance between the TS4999 output and the speaker terminals is too
long, it is possible to encounter low frequency EMI issues due to the fact that the typical
operating PWM frequency is 280 kHz and that the fall and rise time of the output signal is
less than or equal to 5 ns. In this configuration, it is necessary to use the output filter
represented in Figure 61 on page 30, which consists of L1, C1, L2 and C2 being placed as
close as possible to the TS4999 outputs.
In particular cases where the output filter is used and there is the possibility to disconnect a
load, we recommended using an RC network that consists of C3 and R, as shown in
Figure 61. In this case, when the output filter is connected without any load, the filter acts as
a short-circuit for frequencies above 10 kHz in the output frequency spectrum of the
amplifier. The RC network corrects the frequency response of the output filter and
compensates this limitation.
29/36
Application information
Table 12.
TS4999
Example of component selection
Component
RL = 4 Ω
RL = 8 Ω
L1
15μH / 1.4A
30μH / 0.7A
L2
15μH / 1.4A
30μH / 0.7A
C1
2μF / 10V
1μF / 10V
C2
2μF / 10V
1μF / 10V
C3
1μF / 10V
1μF / 10V
R
22Ω / 0.25W
47Ω / 0.25W
Figure 61. LC output filter with RC network
LC Output Filter
RC network
OUT+
L1
C1
C3
from TS2007
OUT-
4.10
RL
L2
C2
R
Short-circuit protection
The TS4999 includes an output short-circuit protection. This protection prevents the device
from being damaged when faults occur on the amplifier outputs.
When a channel is in operating mode and a short-circuit occurs between two outputs of the
channel or between an output and ground, the short-circuit protection detects this situation
and puts the appropriate channel into standby mode. To put the channel back into operating
mode, it is necessary to put the channel’s standby pin to logical LO and then back to logical
HI and wake-up the channel.
4.11
Thermal shutdown
The TS4999 device has an internal thermal shutdown protection mechanism to protect the
device from overheating in the event of extreme temperatures. The thermal shutdown
mechanism is activated when the device reaches 150° C. When the temperature decreases
to safe levels (around 135° C), the circuit switches back to normal operation.
30/36
TS4999
5
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.1
Flip chip package
Figure 62. Flip chip package
2420 μm
2280 μm
750μm
500μm
Die size: 2.42x2.28 mm ± 100µm
Die height (including bumps): 600µm
Bumps diameter: 315µm ±50µm
Bump diameter before reflow: 300µm ±10µm
Bumps height: 250µm ±40µm
Die height: 350µm ±20µm
Pitch: 500µm ±50µm
Coplanarity: 50µm max
Optional*: Back coating height: 40µm
866μm
866μm
40 μm*
600 μm
31/36
Package mechanical data
TS4999
Figure 63. Pinout (top view)
7
LOUT-
6
5
LPVCC
ROUT+
AVCC
AGND
STDBYR
G0
STDBYL
LIN-
2
1
RPVCC
G1
LOUT+
4
3
ROUT-
PGND
RIN-
3D
LIN+
A
B
C
RIN+
D
E
Figure 64. Marking (top view)
E
K9 X
YWW
32/36
■
ST Logo
■
Symbol for lead-free: E
■
Two first product code: K9
■
third X: Assembly Line Plant code
■
Three digits date code: Y for year - WW for week
■
The dot is for marking pin A1
TS4999
Tape and reel package
Figure 65. Schematic (top view)
1.5
4
1
1
A
Die size Y + 70µm
5.2
Package mechanical data
8
A
Die size X + 70µm
4
All dimensions are in mm
User direction of feed
Figure 66. Recommended footprint data
33/36
Ordering information
6
TS4999
Ordering information
Table 13.
Order codes
Part number
TS4999EIJT
34/36
Temperature
range
Package
Packing
Marking
-40°C to +85°C
Flip chip 18
Tape & reel
K9
TS4999
7
Revision history
Revision history
Table 14.
Document revision history
Date
Revision
18-Dec-2008
1
Changes
Initial release.
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TS4999
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