STMICROELECTRONICS VNI8200XP

VNI8200XP
Octal high-side smart power solid state relay with serial/parallel
selectable interface on chip
Datasheet − preliminary data
Features
Type
Vdemag(1) RDS(on)(1)
VNI8200XP VCC-45 V
0.11 Ω
Iout(1)
VCC
0.7 A
45 V
1. Per channel
■
Output current: 0.7 A per channel
■
Serial/parallel selectable interface
■
Short-circuit protection
■
8-bit and 16-bit SPI Interface for IC command
and control diagnostic
■
Channel overtemperature detection and
protection
■
Thermal independence of separate channels
■
Drives all type of loads (resistive, capacitive,
inductive load)
■
Loss of GND protection
■
Power Good diagnostic
■
Undervoltage shutdown with hysteresis
■
Overvoltage protection (VCC clamping)
■
Very low supply current
■
Common fault open drain output
■
IC warning temperature detection
■
Channels output enable
■
100 mA high efficiency step-down switching
regulator with integrated boot diode
■
Adjustable regulator output
■
Switching regulator disable
■
5 V and 3.3 V compatible I/Os
■
Channel outputs status LED driving 4 x 2
multiplexed array
■
Fast demagnetization of inductive loads
■
ESD protection
■
Designed to meet IEC 61131-2, IEC61000-4-4,
and IEC61000-4-5
June 2012
PowerSSO-36
Applications
■
Programmable logic control
■
Industrial PC peripheral input/output
■
Numerical control machines
Table 1.
Device summary
Part number
Package
VNI8200XP
Packing
Tube
PowerSSO-36
VNI8200XPTR
Doc ID 15234 Rev 4
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
Tape and reel
1/34
www.st.com
34
Contents
VNI8200XP
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1
5
6
7
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1
Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2
SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3
Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4
Logic inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.5
Protection and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.6
Step-down switching regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.7
LED driving array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Functional pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.1
SPI/parallel selection mode (SEL2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.2
Serial data in (SDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.3
Serial data out (SDO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.4
Serial data clock (CLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.5
Slave select (SS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.6
8/16-bit selection (SEL1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.7
Output enable (OUT_EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.8
IC warning case temperature detection (TWARN) . . . . . . . . . . . . . . . . . . 16
6.9
Fault indication (FAULT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.10
Power Good (PG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.11
Programmable watchdog counter reset (WD) . . . . . . . . . . . . . . . . . . . . . 18
SPI operation (SEL2 = H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.1
2/34
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
8-bit SPI mode (SEL1 = L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Doc ID 15234 Rev 4
VNI8200XP
Contents
7.2
16-bit SPI mode (SEL1 = H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8
LED driving array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
9
Step-down switching regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
10
Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
11
Thermal management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
11.1
Thermal behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
12
Interface timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
13
Switching parameters test conditions . . . . . . . . . . . . . . . . . . . . . . . . . 27
14
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Doc ID 15234 Rev 4
3/34
Description
1
VNI8200XP
Description
The VNI8200XP is a monolithic 8-channel driver featuring a very low supply current, with
integrated SPI interface and high efficiency 100 mA micropower step-down switching
regulator peak current control loop mode. The IC, realized in STMicroelectronics™
VIPower™ technology, is intended for driving any kind of load with one side connected to
ground.
Active channel current limitation combined with thermal shutdown, independent for each
channel, and automatic restart, protect the device against overload.
Additional embedded functions are: loss of GND protection that automatically turns off the
device outputs in case of ground disconnection, undervoltage shutdown with hysteresis,
Power Good diagnostic for valid supply voltage range recognition, output enable function for
immediate power outputs ON/OFF, and programmable watchdog function for microcontroller
safe operation; case overtemperature protection to control the IC case temperature.
The device embeds a four-wire SPI serial peripheral with selectable 8 or 16-bit operations;
through a select pin the device can also operate with a parallel interface.
Both the 8-bit and 16-bit SPI operations are compatible with daisy chain connection.
The SPI interface allows command of the output driver by enabling or disabling each
channel featuring, in 16-bit format, a parity check control for communication robustness. It
also allows the monitoring of the status of the IC signaling Power Good, overtemperature
condition for each channel, IC pre-warning temperature detection.
Built-in thermal shutdown protects the chip from overtemperature and short-circuit. In
overload condition, the channel turns OFF and ON again automatically after the IC
temperature decreases below a threshold fixed by a temperature hysteresis so that junction
temperature is controlled. If this condition makes case temperature reaching case
temperature limit, TCSD, overloaded channels are turned OFF and restart, nonsimultaneously, when case and junction temperature decrease below their own reset
threshold. If the case of thermal reset, the channels loaded are not switched on until the
junction temperature reset event. Non-overloaded channels continue to operate normally.
Case temperature above TCSD is reported through the TWARN open drain pin.
An internal circuit provides a not latched common FAULT indicator reporting if one of the
following events occurs: channel OVT (overtemperature), parity check fail. The Power Good
diagnostic warns the controller that the supply voltage is below a fixed threshold.
The watchdog function is used to detect the occurrence of a software fault of the host
controller. The watchdog circuitry generates an internal reset on expiry of the internal
watchdog timer. The watchdog timer reset can be achieved by applying a negative pulse on
the WD pin. The watchdog function can be disabled by the WD_EN dedicated pin. This pin
also allows the programming of a wide range of watchdog timings.
An internal LED matrix driver circuitry (4 rows, 2 columns) allows the detection of the status
of the single outputs. An integrated step-down voltage regulator provides supply voltage to
the internal LED matrix driver and logic output buffers and can be used to supply the
external optocouplers if the application requires isolation. The regulator is protected against
short-circuit or overload conditions by means of pulse-by-pulse current limit with a peak
current control loop.
4/34
Doc ID 15234 Rev 4
VNI8200XP
Block diagram
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Doc ID 15234 Rev 4
5/34
Pin connection
3
VNI8200XP
Pin connection
Figure 2.
Pin connection (top view)
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Table 2.
6/34
Pin description
Pin
Name
Type
Description
1
SEL2
Logic input
SPI/parallel selection mode
2
SEL1/IN1
Logic input
8/16-bit SPI selection mode/channel 1 input
3
WD_EN/ IN2
Logic/analog input
4
OUT_EN /IN3
Logic input
Output enable/channel 3 input
5
WD/IN4
Logic input
Watchdog input. The internal watchdog counter is
cleared on the falling edges/channel 4 input.
6
SDI/IN5
Logic input
Serial data input/channel 5 input
7
CLK/IN6
Logic input
Serial clock/channel 6 input
8
SS/IN7
Logic input
Slave select/channel 7 input
9
SDO/IN8
Logic input/output
10
VREG
Power supply
11
COL0
Open source output
LED source output
12
COL1
Open source output
LED source output
13
DCVDD
Analog output
Internally generated DC-DC low voltage supply. (To be
connected to external 10 nF capacitor).
14
VREF
Analog output
Internally generated DC-DC voltage reference. (To be
connected to external 10 nF capacitor).
Watchdog enable_setting/channel 2 input
Serial data output/channel 8 input
SPI/inputs/LED supply voltage
Doc ID 15234 Rev 4
VNI8200XP
Pin connection
Table 2.
Pin description (continued)
Pin
Name
Type
15
ROW0
Open drain output
Status channel 1-2
16
ROW1
Open drain output
Status channel 3-4
17
ROW2
Open drain output
Status channel 5-6
18
ROW3
Open drain output
Status channel 7-8
19
PG
Open drain output
Power Good diagnostic - active low
20
FAULT
Open drain output
Fault indication - active low
21
TWARN
Open drain output
IC case warning temperature detection - active low
Analog input
Description
Step-down feedback input. Connecting the output
voltage directly to this pin results in an output voltage
of 3.3 V. An external resistor divider is required for
higher output voltages.
22
FB
23
GND
24
PHASE
Power output
Step-down output
25
BOOT
Power output
Step-down bootstrap voltage. Used to provide a drive
voltage, higher than the supply voltage, to power the
switch of the step-down regulator.
26
NC
27
OUT8
Power output
Channel 8 power output
28
OUT7
Power output
Channel 7 power output
29
OUT6
Power output
Channel 6 power output
30
OUT5
Power output
Channel 5 power output
31
OUT4
Power output
Channel 4 power output
32
OUT3
Power output
Channel 3 power output
33
OUT2
Power output
Channel 2 power output
34
OUT1
Power output
Channel 1 power output
35
NC
Not connected
36
NC
Not connected
TAB
TAB
Ground
Not connected
Power supply
Exposed tab internally connected to VCC
Doc ID 15234 Rev 4
7/34
Maximum ratings
4
VNI8200XP
Maximum ratings
Table 3.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
45
V
-0.3
V
VCC
Power supply voltage
-VCC
Reverse supply voltage
VREG
Logic supply voltage
-0.3 to +6
V
Voltage range at pins TWARN, FAULT, PG
-0.3 to +6
V
VCC+6
V
VFAULT
VTWARN
VPG
VBOOT
Bootstrap peak voltage VPHASE = Vcc
VROW
Voltage range at ROW pins
-0.3 to +6
V
VCOL
Voltage range at COL pins
-0.3 to +6
V
Vdig
Voltage level range at logic input pins
-0.3 to +6
IOUT
IR
Output current (continuous)
Reverse output current (per channel)
Internally limited
V
(1)
-5
A
IGND
DC ground reverse current
-250
mA
IREG
VREG input current
-1/10
mA
Current range at pins TWARN, FAULT, PG
-1 to +10
mA
Input current range
-1 to +10
mA
Current range at ROW pins (ROW in ON state)
+20
mA
Current range at ROW pins (ROW in OFF state)
-1 to +10
mA
Current range at COL pins (COL in ON state)
-10
mA
Current range at COL pins (COL in OFF state)
-1 to +10
mA
IFAULT
ITWARN,
IPG
IIN
IROW
ICOL
VESD
Electrostatic discharge (R = 1.5 kΩ; C = 100 pF)
2000
V
EAS
Single pulse avalanche energy per channel not
simultaneously
300
mJ
PTOT
Power dissipation at Tc = 25 °C
Internally limited(1)
W
TJ
Junction operating temperature
Internally limited
°C
-55 to 150
°C
TSTG
Storage temperature
1. Protection functions are intended to avoid IC damage in fault conditions and are not intended for
continuous operation. Continuous and repetitive operation of protection functions may reduce the IC
lifetime.
8/34
A
Doc ID 15234 Rev 4
VNI8200XP
4.1
Electrical characteristics
Thermal data
Table 4.
Thermal data
Symbol
Rth(JC)
Rth(JA)
Parameter
Thermal resistance junction-case (1)
Thermal resistance junction-ambient
(2)
Value
Unit
Max.
2
°C/W
Max.
52
°C/W
1. Per channel.
2. When mounted using minimum recommended pad size on FR-4 board (for details refer to Section 11).
5
Electrical characteristics
5.1
Power section
10.5 V < VCC < 36 V; -40 °C < TJ < 125 °C; unless otherwise specified.
Table 5.
Symbol
Vcc
Power section
Parameter
Test conditions
Supply voltage
IS
IDS
45
IOUT = 0.5 A at TJ = 25 °C
IOUT = 0.5 A
On state resistance
Vcc supply current
VREG supply current
Unit
36
V
52
V
0.11
0.2
Ω
1
All channels in ON state, DCDC in ON state VREG=5 V, SPI
ON (2)
TBD
DC-DC OFF VREG= 5 V SPI
OFF WD_EN=0
TBD
mA
DC-DC ON VREG=5 V SPI ON
WD_EN=VREG
TBD
mA
All pins at 24 V except VOUT =
0V
VOUT(OFF)
OFF state output
voltage
VIN = 0 V, IOUT = 0 A
IOUT(OFF)
OFF state output
current
VIN = VOUT = 0 V
Charge pump
frequency
Channel in ON state (3)
FCP
50
Max.
All channels in OFF state, DCDC in OFF state, VREG=5 V,
SPI OFF(1)
Output current at
GND disconnection
ILGND
Typ.
10.5
VccClamp Clamp on Vcc
RDS(ON)
Min.
0
1.45
mA
TBD
mA
0.5
mA
3
V
5
µA
MHz
1. SS signal high, NO communication.
2. SS signal low, communication ON.
3. To cover EN55022 class A and class B normatives.
Doc ID 15234 Rev 4
9/34
Electrical characteristics
5.2
VNI8200XP
SPI characteristics
10.5 V < VCC < 36 V; 2.7 V < VREG < 5 V; -40 <Tj <125; unless otherwise specified.
Table 6.
SPI characteristics
Symbol
Typ.
Max.
Unit
SPI clock frequency
-
5
MHz
tr(CLK),
tf(CLK)
SPI clock rise/fall time
-
20
ns
tsu(SS)
SS setup time
120
-
ns
th(SS)
SS hold time
120
-
ns
tw(CLK)
CLK high time
80
-
ns
tsu(SDI)
Data input setup time
100
-
ns
th(SDI)
Data input hold time
100
-
ns
ta(SDO)
Data output access time
-
100
ns
tdis(SDO)
Data output disable time
-
200
ns
tv(SDO)
Data output valid time
-
100
ns
th(SDO)
Data output hold time
fCLK
VSDO
5.3
Parameter
Test conditions
Voltage on serial data output
ISDO = 15 mA
Min.
0
-
ns
VREG-0.8
-
V
ISDO = -4 mA
-
0.8
V
Min.
Typ.
Max.
Unit
Switching
VCC = 24 V; -40 °C < TJ < 125 °C.
Table 7.
Symbol
td(ON)
tr
td(OFF)
tf
Switching
Parameter
Test condition
Turn-ON delay time
IOUT = 0.5 A, resistive load,
input rise time < 0.1 µs
-
5
-
µs
Rise time
IOUT = 0.5 A, resistive load,
input rise time < 0.1 µs
-
5
-
µs
Turn-OFF delay time
IOUT = 0.5 A, resistive load,
input rise time < 0.1 µs
-
10
-
µs
Fall time
IOUT = 0.5 A, resistive load,
input rise time < 0.1 µs
-
5
-
µs
IOUT = 0.5 A, resistive load,
input rise time < 0.1 µs
-
3
-
V/µs
IOUT = 0.5 A, resistive load,
input rise time < 0.1 µs
-
4
-
V/µs
dV/dt(ON) Turn-ON voltage slope
dV/dt(off)
10/34
Turn-OFF voltage
slope
Doc ID 15234 Rev 4
VNI8200XP
5.4
Electrical characteristics
Logic inputs
10.5 V < VCC < 36 V; -40 °C < TJ < 125 °C; unless otherwise specified.
Table 8.
Logic inputs
Symbol
Parameter
VIL
Input low level voltage
VIH
Input high level voltage
VI(HYST)
IIN
5.5
Test conditions
Min.
Typ.
Max.
Unit
0.8
V
2.20
Input hysteresis
voltage
V
0.15
Input current
VIN = 5 V
V
µA
8
Protection and diagnostic
10.5 V < VCC < 36 V; -40 °C < TJ < 125 °C; unless otherwise specified.
Table 9.
Protection and diagnostic
Symbol
Parameter
VPGH1
Min.
Typ.
Max.
Power Good diagnostic
ON threshold
16.6
17.5
18.4
VPGH2
Power Good diagnostic
OFF threshold
15.6
16.5
17.4
V
VPGHYS
Power Good diagnostic
hysteresis
10.5
V
VUSD
VUSDHYS
Test conditions
Unit
1
Undervoltage ON
protection
9.5
Undervoltage OFF
protection
9
V
0.5
V
VCC-52 VCC-50 VCC-45
V
Undervoltage
hysteresis
0.4
Vdemag
Output voltage at turnOFF
IOUT = 0.5 A; LLOAD ≥ 1 mH
VTWARN
TWARN pin low-state
output voltage
ITWARN = 3 mA (active
condition)
0.6
V
VFAULT
FAULT pin low-state
output voltage
IFAULT = 3 mA (fault condition)
0.6
V
0.7
V
VPG
PG pin low-state output IPG = 3 mA (active condition)
voltage
VREG=3.3 V VCC=0
IPEAK
Maximum DC output
current
ILIM
Short-circuit current
limitation per channel
RLOAD = 0
Hyst
ILIM tracking limits
RLOAD = 0
1.4
Doc ID 15234 Rev 4
0.7
1.1
0.3
A
1.7
A
A
11/34
Electrical characteristics
Table 9.
VNI8200XP
Protection and diagnostic (continued)
Symbol
Parameter
Test conditions
ILFAULT
FAULT leakage current
ITWARN
TWARN leakage
current
Min.
Typ.
Max.
Unit
2
µA
170
°C
Junction reset
temperature
150
°C
THIST
Junction thermal
hysteresis
20
°C
TCSD
Case shutdown
temperature
TCR
Case reset
temperature
TCHYST
Case thermal
hysteresis
IPG
PG leakage current
TTSD
Junction shutdown
temperature
TR
Vpin = 5 V
150
115
tWD
Watchdog hold time
See Figure 6
tWM
Watchdog time
See Table 13 and Figure 6
tOUT_EN
OUT_EN pin
propagation delay(1)
tres
OUT_EN hold time
tWO
Watchdog timeout(2)
130
145
°C
110
°C
20
°C
50
ns
td(off)
ms
50
ns
tWM +
td(off)
ms
1. Time from reset active low and power out disable.
2. The time from tWM elapsed to power out disable.
5.6
Step-down switching regulator
10.5 V < VCC < 36 V; -40 °C < TJ < 125 °C; unless otherwise specified.
Table 10.
Symbol
VDC_out
VFB
12/34
Step-down switching regulator
Parameter
Test conditions
Min.
Typ.
Max.
Ireg from 0 to 100 mA
VREG 3.3 V, Figure 8.
3.135
3.3
3.465
Regulated output voltage
V
Ireg from 0 to 100 mA
VREG 5 V, Figure 10.
Voltage feedback
5
3.135
RDSON
MOSFET on-resistance
IDC_out
Regulator output current
IPEAK
Maximum peak current
Unit
Doc ID 15234 Rev 4
3.3
3.465
Ω
1.5
100
0.5
V
mA
A
VNI8200XP
Electrical characteristics
Table 10.
Step-down switching regulator (continued)
Symbol
Parameter
Min.
Total operating quiescent
current
Iqop
Total standby quiescent
current
Iqst-by
IBOOTleak
Regulator standby
Typ.
Max.
Unit
TBD
mA
TBD
µA
Bootstrap reverse leakage
current
TBD
µA
fs
Switching frequency
400
kHz
Dmax
Maximum duty cycle
80%
%
Minimum on-time
TBD
ns
Tonmin
5.7
Test conditions
LED driving array
10.5 V < VCC < 36 V; -40 °C < TJ < 125 °C; unless otherwise specified.
Table 11.
LED driving array
Symbol
Parameter
VCOL
Output source voltage at COL pins
Output current 0 to
VREG-0.3 VREG-0.2
7 mA
VROW
Open drain voltage at ROW pins
Output current 0 to
15 mA
Fsw
Test conditions
Row refresh frequency with
duty=25%
Doc ID 15234 Rev 4
Min.
Typ.
0.2
780
Max. Unit
V
0.3
V
Hz
13/34
Functional pin description
VNI8200XP
6
Functional pin description
6.1
SPI/parallel selection mode (SEL2)
This pin allows the selection of the IC interfacing mode. The SPI interface is selected if
SEL2 = H, while the parallel interface is selected if SEL2 = L, according to Table 12:
Table 12.
Pin description
Function
Pin
SDO/IN8
SDO
SS/IN7
SEL2(1) = H
SEL2 = L
SPI operation
Parallel operation
Serial data output
IN8
Input to channel 8
SS
Slave select
IN7
Input to channel 7
CLK/IN6
CLK
Serial clock
IN6
Input to channel 6
SDI/IN5
SDI
Serial data input
IN5
Input to channel 5
WD/IN4
WD
Watchdog input
IN4
Input to channel 4
OUT_EN/IN3
OUT_EN
IC OUTPUT enable /
disable
IN3
Input to channel 3
WD_EN/IN2
WD_EN
Watchdog enable /
disable and timing
preset
IN2
Input to channel 2
SEL1/IN1
SEL1
8/16-bit SPI selection
mode
IN1
Input to channel 1
1. SEL2 has an internal weak pull-down.
6.2
Serial data in (SDI)
If SEL2 = H, this pin is the input of the serial control frame. SDI is read on CLK rising edges
and, therefore, the microcontroller must change SDI state during the CLK falling edges.
After the SS falling edge, the SDI is equal to the most significant bit of the control frame
(Figure 3).
6.3
Serial data out (SDO)
If SEL2 = H, this pin is the output of the serial fault frame. SDO is updated on CLK falling
edges and, therefore, the microcontroller must read SDO state during the CLK rising edges.
The SDO pin is tri-stated when SS signal is high and it is equal to the most significant bit of
the fault frame after the SS falling edge (Figure 3).
14/34
Doc ID 15234 Rev 4
VNI8200XP
6.4
Functional pin description
Serial data clock (CLK)
If SEL2 = H, the CLK line is the input clock for serial data sampling. On CLK rising edge the
SDI input is sampled by the IC and the SDO output is sampled by the host microcontroller.
On CLK falling edge, both SDI and SDO lines are updated to the next bit of the frame, from
the most to the less significant one (see Figure 3). When the SS signal is high, slave not
selected, the microcontroller should drive the CLK low (the settings for the MCU SPI port
are CPHA = 0 and CPOL = 0).
6.5
Slave select (SS)
If SEL2 = H, the slave select (SS) signal is used to enable the VNI8200XP serial
communication shift register; data is flushed-in through the SDI pin and flushed-out from the
SDO pin only when the SS pin is low. On the SS pin falling edge the shift register (containing
the fault conditions) is frozen, so any change on the power switches status is latched until
the next SS falling edge event and the SDO output is enabled. On the SS pin rising edge
event the 8/16 bits present on the SPI shift register are evaluated and the outputs are driven
according to this frame. If more than 8/16 bits (depending on the SPI settings) are flushed
inside only the last 8/16 are evaluated; the others are flushed out from the SDO pin after
fault condition bits; in this way a proper communication is possible also in a daisy chain
configuration.
Figure 3.
6.6
SPI mode diagram
8/16-bit selection (SEL1)
If SEL2 = H, SEL1 is used to select between two possible SPI configurations: the 8-bit SPI
mode (SEL1 = L) and the 16-bit SPI mode (SEL1 = H). 8/16-bit SPI operation is described
below.
Doc ID 15234 Rev 4
15/34
Functional pin description
6.7
VNI8200XP
Output enable (OUT_EN)
If SEL2 = H, the OUT_EN pin provides a fast way to disable all the outputs simultaneously.
When the OUT_EN pin is driven low for at least TRES, the outputs are disabled while fault
conditions in the SPI register are latched. To enable the outputs it is then necessary to raise
the OUT_EN pin and re-program the IC through the SPI interface. As fault conditions are
latched inside the IC and SPI interface is working also while the OUT_EN pin is driven low,
it’s possible to use SPI to detect if a fault condition occurred before the reset event.
The device is ready to operate normally after a TSU period. The OUT_EN pin is the fastest
way to disable all the outputs when a fault occurs.
Figure 4.
Output channel enable/disable behavior
OUT_EN
t
Vin( i)
t
OUT(i)
t
tOUT_EN
AM12824v1
6.8
IC warning case temperature detection (TWARN)
The TWARN pin is an active low open drain output. This pin is activated if the IC case
temperature exceeds TCSD. According to the PCB thermal design and RthJC value, this
function allows a warning about a PCB overheating condition to be given.
The TWARN bit is also available through SPI. This bit is not latched: the TWARN pin is low
only while the case overtemperature condition is active (TC > TCSD) and is released when
this condition is removed (TC < TCR).
16/34
Doc ID 15234 Rev 4
VNI8200XP
6.9
Functional pin description
Fault indication (FAULT)
The FAULT pin is an open drain active low fault indication pin. This pin is activated by one or
more of the following conditions:
●
Channel overtemperature (OVT)
This pin is activated when at least one of the channels is in junction overtemperature.
Unlike the SPI fault detection bits, this signal is not latched: the FAULT pin is low only
when the fault condition is active and is released if the input driving signal is off or after
the OVT protection condition has been removed. This last event occurs if the channel
temperature decreases below the threshold level and the case temperature has not
exceeded TCSD or is below TCR. This means that the FAULT pin is low only while the
junction overtemperature is active (TJ >TTSD) and is released after this condition has
been removed (TJ < TR and TC < TCR).
●
Parity check fail
When SPI mode is used (SEL2 = H), if a parity check fault of the incoming SPI frame is
detected or counted, CLK rising edges are different by a multiple of 8, the FAULT pin is
kept low. When counted CLK rising edges are a multiple of 8 and parity check is valid,
the FAULT pin is kept high.
6.10
Power Good (PG)
The PG terminal is an open drain, that indicates the status of the supply voltage. When VCC
supply voltage reaches the Vsth1 threshold, PG goes into a high impedance state. It goes
into a low impedance state when VCC falls below the Vsth2 threshold.
In 16-bit SPI mode, a PG bit is also available. This bit is set high when the Power Good
diagnostic is active, it is otherwise cleared.
Figure 5.
Power Good diagnostic
0'
60'(
60'(
6CC
!-V
Doc ID 15234 Rev 4
17/34
Functional pin description
6.11
VNI8200XP
Programmable watchdog counter reset (WD)
If SEL2 = H, the VNI8200XP embeds a watchdog counter that must be erased, with a
negative pulse on the WD pin, before it expires. If the WD counter elapses, the VNI8200XP
goes into an internal RESET state where all the outputs are disabled; to restart normal
operation a negative pulse must be applied at the WD pin.
The watchdog enable/disable pin should be connected through an external divider to VREG.
The watchdog time is fixed following Table 13:
Table 13.
Programmable watchdog time
VWD_EN
tWM
0.25 VREG > VWD_EN
Disable
0.25 VREG ≤VWD_EN < 0.5 VREG
40 ± 10% ms
0.5 VREG ≤VWD_EN < 0.75 VREG
80 ± 10% ms
0.75 VREG ≤VWD_EN = VREG
160 ± 10% ms
Figure 6.
Watchdog reset
WD
tWM
tWD
t
AM11802v1
18/34
Doc ID 15234 Rev 4
VNI8200XP
SPI operation (SEL2 = H)
7
SPI operation (SEL2 = H)
7.1
8-bit SPI mode (SEL1 = L)
If SEL2 = H, the 8-bit SPI mode is based on an 8-bit command frame sent from the
microcontroller to the IC; each bit directly drives the corresponding output where LSB drives
output 0 and MSB drives output 7. Each bit, set to ‘1’, activates (closes) the corresponding
output.
At the same time, the IC transfers the channel fault conditions (OVT) to the microcontroller.
These fault conditions are latched at the occurrence and cleared after each communication
(each time the SS signal has a positive transition). Each bit, set to ‘1’, indicates an OVT
condition for the corresponding channel.
Table 14.
Command 8-bit frame (master to slave)
MSB
LSB
IN7
IN6
Table 15.
IN5
IN4
IN3
IN2
IN1
IN0
Fault 8-bit frame (slave to master)
MSB
LSB
F7
7.2
F6
F5
F4
F3
F2
F1
F0
16-bit SPI mode (SEL1 = H)
The 16-bit SPI mode is based on a 16-bit command frame sent from the microcontroller to
the IC; the first 8 bits directly drive the output channels (each bit, set to ‘1’, activates the
corresponding output), the other 8 bits contain a 4-bit parity check code where the last bit
(the inversion of the previous one) is used to detect a communication error condition
(providing at least a transition in each frame):
P0 = IN0 ⊕ IN1 ⊕ IN2 ⊕ IN3 ⊕ IN4 ⊕ IN5 ⊕ IN6 ⊕ IN7
P1 = IN1 ⊕ IN3 ⊕ IN5 ⊕ IN7
P2 = IN0 ⊕ IN2 ⊕ IN4 ⊕ IN6
nP0 = NOT P0
Table 16.
Command 16-bit frame (master to slave)
MSB
IN7
LSB
IN6
IN5
IN4
IN3
IN2
IN1
IN0
-
-
-
-
P2
P1
P0
nP0
At the same time, the IC transfers to the microcontroller a 16-bit fault frame where the first 8
bits indicate a channel fault (OVT) condition (each bit, set to ‘1’, indicates an OVT event), the
following 4 bits provide general fault condition information. FB_OK: this bit is related to the
DC-DC regulation: at the DC-DC turn-on, this bit is low and becomes high after FB rises
above 90% of the nominal VFB voltage and a correct SPI communication occurred. If the FB
voltage falls below 80% of the nominal VFB voltage, this bit is zero; TWARN (IC warning
Doc ID 15234 Rev 4
19/34
SPI operation (SEL2 = H)
VNI8200XP
case temperature, see Section 6.8), PC (parity check fail, the bit, set to ‘1’, indicates a PC
fail or the length is not a multiple of 8) and PG (Power Good, see Section 6.10). The last 4
bits are used as parity check bits and communication error condition (see command 16 bit
frame):
P0 = F0 ⊕ F1 ⊕ F2 ⊕ F3 ⊕ F4 ⊕ F5 ⊕ F6 ⊕ F7
P1 = PC ⊕ FB_OK ⊕ F1 ⊕ F3 ⊕ F5 ⊕ F7
P2 = PG ⊕ TWARN ⊕ F0 ⊕ F2 ⊕ F4 ⊕ F6
nP0 = NOT P0
Table 17.
Fault 16-bit frame slave to master
MSB
F7
LSB
F6
F5
F4
F3
F2
F1
F0
FB_OK TWARN
PC
PG
P2
Channel indications are latched and cleared only after a communication.
20/34
Doc ID 15234 Rev 4
P1
P0
nP0
VNI8200XP
8
LED driving array
LED driving array
Figure 7.
LED driving array
2/7
2/7
2/7
#/,
#/,
62%'
34!453
34!453
34!453
34!453
34!453
34!453
34!453
2/7
34!453
!-V
The following is an indication of how to choose the Rext resistors value.
Equation 1
( VCOLmin ) – ( V ROWmax ) – VF ( LED )
R ext = ------------------------------------------------------------------------------------------IF ( LED )
Note:
IF(LED) ≤7 mA.
Where (VCOL min.) and (VROW max.) can be found in Table 11 and VF(LED) and IF(LED)
depend on the electrical characteristics of the LEDs.
Doc ID 15234 Rev 4
21/34
Step-down switching regulator
9
VNI8200XP
Step-down switching regulator
The IC embeds a high efficiency 100 mA micropower step-down switching regulator. The
regulator is protected against short-circuit or overload conditions. Pulse-by-pulse current
limit regulation is obtained in normal operation through a current loop control.
A low ESR output capacitor connected to the VREG pin helps to limit the regulated voltage
ripple; a low ESR (less than 10 mΩ) capacitor is preferable. The control loop pin FB allows
3.3 V to be regulated, connecting it directly to VREG, or 5 V connecting it through a voltage
divider Rl/Rfbl. The DC-DC converter can be turned off by connecting the feedback pin to
the DCVDD pin. In some applications it is possible to supply a 5 V or 3.3 V voltage externally
or, in the case of two or more VNI8200XPs inside the same board, it's possible to configure
the DC-DC converter on only one device and supply also the other ICs.
22/34
Doc ID 15234 Rev 4
VNI8200XP
10
Conventions
Conventions
Figure 8.
Typical circuit for switching regulation VDC-out = 3.3 V
3%,
.#
3%,).
.#
7$?%.).
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/54?%.).
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7$).
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3$)).
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#,+).
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33).
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3$/).
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#/,
#/,
$#6$$
#
N&
#
N&
/54
62%'
4AB6CC
.#
"//4
0(!3%
62%&
&"
2/7
'.$
2/7
47!2.
2/7
&!5,4
2/7
0'
# N&
,
)REG
U(2)SM!
2
K
2
K
6REG
# N&
6.)
#
U&
LOW%32MOHM-,#
#
!-V
Doc ID 15234 Rev 4
23/34
Conventions
VNI8200XP
Figure 9.
Typical circuit for switching regulation VDC-out = 5 V
#
N&
#
N&
.#
3%,
.#
3%,).
7$?%.).
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/54?%.).
/54
7$).
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3$)).
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#,+).
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33).
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3$/).
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62%'
#/,
4AB6CC
.#
#/,
"//4
$#6$$
0(!3%
62%&
&"
2/7
'.$
2/7
47!2.
2/7
&!5,4
2/7
0'
# N&
,
)REG
U(2)SM!
2
K
2
K
# N&
6REG
6.)
2
K
#
U&
LOW%32MOHM
-,##
!-V
Figure 10. SPI directional logic convention
3$)
6REG
33
#,+
/54
3$/
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7$
/54
/54?%.
7$?%.
4!"6CC
/54
/54
/54
3%,
/54
3%,
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0'
&!5,4
47!2.
'.$
!-V
24/34
Doc ID 15234 Rev 4
VNI8200XP
11
Thermal management
Thermal management
The power dissipation in the IC is the main factor that sets the safe operating condition of
the device in the application. Therefore, it must be taken into account very carefully.
Heatsinking can be achieved using copper on the PCB with proper area and thickness. The
following image (Figure 11) shows the junction-to-ambient thermal impedance values for the
PSSO36 package.
Figure 11. PSSO36 thermal impedance vs. time
For instance, three cases have been considered using a PSSO36 packaged with copper
slug soldered on a 1.6 mm thickness FR4 board with dissipating footprint (copper thickness
of 70 µm):
●
single layer PCB with just IC footprint dissipating area
●
double layer PCB with footprint dissipating area on the top side and a 2 cm2 dissipating
layer on the bottom side through 15 via holes
●
double layer PCB with footprint dissipating area on the top side and an 8 cm2
dissipating layer on the bottom side through 15 via holes.
Doc ID 15234 Rev 4
25/34
Thermal management
11.1
VNI8200XP
Thermal behavior
Figure 12. Thermal behavior
6INI(
/54I/N
34!4I/FF(
1
./
4JI4TSD
9%3
/54I/FF
34!4I/N,
4
9%3
4C4CSD
./
2
9%3
./
4C4CR
./
4JI4JR
9%3
3
!-V
Note:
26/34
1
Thermal shutdown.
2
Junction hysteresis.
3
Restore to idle condition.
4
Case hysteresis.
Doc ID 15234 Rev 4
VNI8200XP
12
Interface timing diagram
Interface timing diagram
Figure 13. Serial timing
Switching parameters test conditions
Figure 14. dV/dt(ON) and dV/dt(OFF) time diagram test conditions
6OUT
D6/&&
D6/.
13
TR
TF
T
!-V
Doc ID 15234 Rev 4
27/34
Switching parameters test conditions
VNI8200XP
Figure 15. td(ON) and td(OFF) time diagram test conditions
^^
ϱϬй
ƚĚ;K&&Ϳ
ƚ
sŽƵƚ
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ϭϬй
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28/34
Doc ID 15234 Rev 4
VNI8200XP
14
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 18.
PowerSSO-36 mechanical data
mm
Symbol
Min.
Typ.
Max.
A
2.15
2.47
A2
2.15
2.40
a1
0
0.075
b
0.18
0.36
c
0.23
0.32
D
10.10
10.50
E
7.4
7.6
e
0.5
e3
8.5
F
2.3
G
0.075
G1
0.06
H
10.1
10.5
h
L
0.4
0.55
M
0.85
4.3
N
10deg
O
1.2
Q
0.8
S
2.9
T
3.65
U
1.0
X
4.1
4.7
Y
4.9
5.5
Doc ID 15234 Rev 4
29/34
Package mechanical data
VNI8200XP
Figure 16. PowerSSO-36 package dimensions
Figure 17. PowerSSO-36 tube shipment (no suffix)
Table 19.
Note:
30/34
PowerSSO-36 tube shipment
Base Q.ty
49
Bulk Q.ty
1225
Tube length (± 0.5)
532
A
3.5
B
13.8
C (± 0.1)
0.6
All dimensions are in mm.
Doc ID 15234 Rev 4
VNI8200XP
Package mechanical data
Figure 18. PowerSSO-36 reel shipment (suffix “TR”)
Table 20.
PowerSSO-36 reel dimensions
Base Q.ty
1000
Bulk Q.ty
1000
A (max.)
330
B (min.)
1.5
C (± 0.2)
13
F
20.2
G (2 ± 0)
24.4
N (min.)
100
T (max.)
30.4
Doc ID 15234 Rev 4
31/34
Package mechanical data
VNI8200XP
Figure 19. PowerSSO-36 tape dimensions
Table 21.
Note:
32/34
PowerSSO-36 tape dimensions
Tape width
W
24
Tape hole spacing
P0 (± 0.1)
4
Component spacing
P
12
Hole diameter
D (± 0.05)
1.55
Hole diameter
D1 (min.)
1.5
Hole position
F (± 0.1)
11.5
Compartment depth
K (max.)
2.85
Hole spacing
P1 (± 0.1)
2
According to the Electronic Industries Association (EIA) standard 481 rev. A, Feb 1986.
Doc ID 15234 Rev 4
VNI8200XP
15
Revision history
Revision history
Table 22.
Document revision history
Date
Revision
Changes
04-Dec-2008
1
Initial release
29-Apr-2009
2
Updated Table 5 on page 9
19-Jun-2012
3
Updated:
Features,Section 6.4,Section 6.7,Section 6.9,Section 6.10,
Section 9,Table 2,Table 3,Table 5,Table 7,Table 8,Table 9,
Table 10,Table 11,Table 13,Figure 1,Figure 2.
Changed:
Figure 4,Figure 5,Figure 6,Figure 14,Figure 15.
Content reworked to improve the readability.
27-Jun-2012
4
Changed:
Symbols in 16-bit frame Section 7.2 .
Doc ID 15234 Rev 4
33/34
VNI8200XP
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