TDK MLZ2012

Inductors for Decoupling Circuits
Multilayer/STD • magnetic shielded
MLZ series
Type:
MLZ1005W
MLZ1608
MLZ2012
1005[0402 inch]*
1608[0603 inch]
2012[0805 inch]
* Dimensions Code JIS[EIA]
Issue date:
May 2012
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/10)
Inductors for Decoupling Circuits
Multilayer/STD • Magnetic Shielded
Conformity to RoHS Directive
MLZ Series MLZ1005W
The MLZ Series is a new line of multilayer choke coils for decoupling with the industry’s best DC superimposition characteristics
and lowest DC resistance. TDK has developed this coil using its
proprietary ferrite material technique and dense electrodes.
The MLZ Series exerts an excellent effect mainly on the decoupling of power circuits. It also exerts an effect on audio lines
because of its low DC resistance.
The MLZ1005 series is now available in addition to the MLZ1608/
2012 series.
PRODUCT IDENTIFICATION

(3) Management symbol
The MLZ Series was regarded as having the industry’ s best DC
superimposition characteristics and lowest DC resistance according to
research conducted in September 2010.
FEATURES
• MLZ10005 series products have the best DC superimposition
characteristics in the industry.
• Magnetically sealed configuration allowing for high-density
mounting.
• Does not contain lead and is compatible with lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Modules such as digital cellular phone and camera module, Netbooks, note PCs, DSCs, DVCs, video games, portable memory
audio devices, navigation systems, PNDs, TVs, W-LANs, solid
state drives
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
[Including self-temperature rise]
–55 to +125°C(After mount)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
Natural
cooling
230˚C
180˚C
MLZ 1005 M 1R0 W T
(1)
(2) (3) (4) (5) (6)
(7)
(1) Series name
(2) Dimensions LW
1005
1.00.50.5mm
(4) Inductance
R47
1R0
0.47H
1.0H
(5) Characteristic type
W
IDC-UP
(6) Packaging style
T
Taping [reel]
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
10000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the temperature difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz
(2/10)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
1.0±0.05
0.5
0.5±0.05
0.5 0.4 0.5
0.1min. 0.1min.
0.5±0.05
Dimensions in mm
Weight: 1.2mg
ELECTRICAL CHARACTERISTICS
Classification
Part No.
Inductance
(µH)
Inductance
tolerance
IDC-UP
MLZ1005MR47WT
MLZ1005MR68WT
MLZ1005M1R0WT
MLZ1005M1R5WT
MLZ1005M2R2WT
0.47
0.68
1.00
1.50
2.20
±20%
±20%
±20%
±20%
±20%
Test
frequency
L (MHz)
2
2
2
2
2
Test
current
L (mA)
0.1
0.1
0.1
0.1
0.1
Self-resonant
frequency
(MHz)typ.
260
210
170
140
120
DC
resistance
( )±30%
0.20
0.30
0.35
0.50
0.55
Rated
current1
(mA)
120
110
100
80
60
Rated
current2
(mA)
500
450
450
350
350
1
Current assumed when inductance ratio has decreased by 50% max..
Current assumed when temperature has risen to 20°C max. (reference value). The maximum operating temperature at this time is 105°C.
• Test equipment
Inductance: Ag-4294A+16034G
2
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE vs. FREQUENCY CHARACTERISTICS
E4991A+16192A
10
M2R2W
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
M1R5W
M1R0W
M2R2W
M1R5W
M1R0W
MR68W
MR47W
1000
Impedance(Ω)
Inductance(μH)
E4991A+16192A
10000
1
MR68W
MR47W
0.1
100
10
0.01
1
10
100
Frequency (MHz)
1
1000
INDUCTANCE CHANGE vs. DC SUPERPOSITION
CHARACTERISTICS
1
10
100
Frequency (MHz)
1000
TEMPERATURE CHARACTERISTICS
60
M1R5W
10
Temperature(˚C)
Inductance(μH)
50
M2R2W
M1R5W
1 M1R0W
MR68W
MR47W
40
1
M1R0W
20
MR68W
10
0
0.1
M2R2W
30
10
100
DC current(mA)
1000
MR47W
0
200
400
600
DC current(mA)
800
1000
• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz
(3/10)
PACKAGING STYLES
REEL DIMENSIONS
ø60min.
1.0
2.0±0.5
8.4 +2.0
–0.0
ø13±0.2
14.4max.
ø21±0.8
ø180±2.0
Dimensions in mm
Cavity
3.5±0.05
1.5 +0.1
–0.0
0.8max.
0.65±0.1
4.0±0.1
2.0±0.05
160min.
Taping
2.0±0.05
1.15±0.1
8.0±0.3
Sprocket hole
1.75±0.1
TAPE DIMENSIONS
200min.
Drawing direction
300min.
Dimensions in mm
• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz
(4/10)
Inductors for Decoupling Circuits
Multilayer/STD • Magnetic Shielded
Conformity to RoHS Directive
MLZ Series MLZ1608
The MLZ Series is a line of multilayer choke coils for decoupling
power circuits.
The MLZ1608-W Series, a line of the MLZ Series, has increased
its DC superimposition characteristics by up to 225% compared
with existing products through the use of TDK's proprietary ferrite
material technology.
Also available is the MLZ1608-L Series. This series has lowered its
resistance by up to 40% compared with existing products through
the adoption of a new ferrite material and dense electrodes. This
series includes the E3 Series, which handles 1.0 to 10µH, hence it
is extremely useful in the power-supply design of low-voltage circuits.
FEATURES
• The W Series (IDC UP type) is a line of products that have
achieved the industry's best DC superimposition characteristics.

According to research conducted in August 2010.
• The L Series (Low-resistance type) has lowered its resistance by
up to 40% compared with existing products.
• The D Series (High frequency type) is a line of decoupling coil
products for high frequencies. It can handle higher noise
frequencies.
PRODUCT IDENTIFICATION
MLZ
(1)
1608
(2)
A 1R0 W T
(3) (4) (5) (6)
(7)
(1) Series name
(2) Dimensions LW
1608
1.60.8mm
(3) Management symbol
(4) Inductance
R10
1R0
100
0.1H
1.0 H
10.0 H
(5) Characteristic type
D
W
L
High frequency type
IDC-UP type
Low-resistance type
(6) Packaging style
T
Taping [reel]
APPLICATIONS
Modules such as digital cellular phone and camera module, Netbooks, note PCs, DSCs, DVCs, video games, portable memory
audio devices, navigation systems, PNDs, TVs, W-LANs, solid
state drives
(7) TDK internal code
SPECIFICATIONS
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the temperature difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Operating temperature range
Storage temperature range
–55 to +125°C
[Including self-temperature rise]
–55 to +125°C(After mount)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
Natural
cooling
230˚C
180˚C
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
4000 pieces/reel
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz
(5/10)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
1.6±0.15
0.3±0.2
0.8
0.6
0.8
0.8±0.15
0.6
0.3±0.2
0.8±0.15
Dimensions in mm
Weight: 4mg
ELECTRICAL CHARACTERISTICS
Classification
Part No.
MLZ1608DR10DT
High frequency
MLZ1608DR22DT
type
MLZ1608DR47DT
MLZ1608A1R0WT
MLZ1608A2R2WT
IDC-UP
MLZ1608M4R7WT
type
MLZ1608M100WT
MLZ1608M220WT
MLZ1608N1R0LT
Low-resistance MLZ1608N2R2LT
type
MLZ1608N4R7LT
MLZ1608N100LT
Inductance
(µH)
Inductance
tolerance
0.10
0.22
0.47
1.00
2.20
4.70
10.0
22.0
1.00
2.20
4.70
10.0
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
Test
frequency
L (MHz)
25
25
25
10
10
2
2
2
2
2
2
2
Test
current
L (mA)
1.0
1.0
1.0
1.0
1.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
Self-resonant
frequency
(MHz)typ.
600
400
260
170
120
80
50
38
170
120
80
50
DC
resistance
( )±30%
0.14
0.27
0.42
0.15
0.25
0.50
1.05
2.40
0.11
0.18
0.32
0.60
Rated
current1
(mA)
700
550
400
190
130
120
90
55
140
110
80
60
Rated
current2
(mA)
850
600
500
600
500
350
250
150
700
500
400
300
1 Current
assumed when inductance ratio has decreased by 50% max..
Current assumed when temperature has risen to 20°C max. (reference value). The maximum operating temperature at this time is 105°C.
• Test equipment
Inductance: Ag-4294A+16034G
2
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE vs. FREQUENCY CHARACTERISTICS
E4991A+16192A
R47D
R10D
0.1
0.01
1
10
100
Frequency (MHz)
1000
100W
10
2R2W
1
0.1
0.01
1
10
100
Frequency (MHz)
E4991A+16192A
100
Inductance(μH)
1
E4991A+16192A
100
Inductance(μH)
Inductance(μH)
10
2R2L
1
0.1
0.01
1000
100L
10
1
10
100
Frequency (MHz)
1000
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
R47D
100
R10D
10
1
1000
2R2W
100
10
1
10
100
Frequency (MHz)
1000
1
E4991A+16192A
10000
100W
100W
1000
Impedance (Ω)
Impedance (Ω)
1000
E4991A+16192A
10000
Impedance (Ω)
E4991A+16192A
10000
2R2W
100
10
1
10
100
Frequency (MHz)
1000
1
1
10
100
Frequency (MHz)
1000
• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz
(6/10)
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE CHANGE vs. DC SUPERPOSITION CHARACTERISTICS
1
100
100
0.1 R10D
0.01
0.1
1
10
100
DC current(mA)
100W
10
2R2W
1
0.1
0.1
1000
Inductance(μH)
Inductance(μH)
Inductance(μH)
R47D
1
10
100
DC current(mA)
10
100L
2R2L
1
0.1
0.1
1000
1
10
100
DC current(mA)
1000
TEMPERATURE CHARACTERISTICS
60
40
R47D
2R2L
30
20
10
R10D
0
200
400
600
DC current(mA)
800
1000
PACKAGING STYLES
REEL DIMENSIONS
TAPE DIMENSIONS
Sprocket hole
1.5 +0.1
–0.0
Cavity
1.1max.
1.1±0.2
4.0±0.1
4.0±0.1
2.0±0.05
2.0±0.5
8.4 +2.0
–0.0
ø13±0.2
14.4max.
160min.
Taping
1.9±0.2
ø60min.
8.0±0.3
1.0
3.5±0.05
0
1.75±0.1
Temperature(˚C)
A2R2W
100L
100W
50
200min.
ø21±0.8
ø180±2.0
Dimensions in mm
Drawing direction
300min.
Dimensions in mm
• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz
(7/10)
Inductors for Decoupling Circuits
Multilayer/STD • Magnetic Shielded
Conformity to RoHS Directive
MLZ Series MLZ2012
The MLZ Series is a line of multilayer choke coils for decoupling
power circuits.
The MLZ2012-W Series, a line of the MLZ Series, has increased
its DC superimposition characteristics by up to 250% compared
with existing products through the use of TDK's proprietary ferrite
material technology.
Also available is the MLZ2012-L Series. This series has lowered its
resistance by up to 50% compared with existing products through
the adoption of a new ferrite material and dense electrodes. This
series includes the E6 Series, which handles 1.0 to 15µH, hence it
is extremely useful in the power-supply design of low-voltage circuits.
FEATURES
• The W Series (IDC UP type) is a line of products that have
achieved the industry's best DC superimposition characteristics.

PRODUCT IDENTIFICATION
MLZ
(1)
2012
(2)
A 1R0 W T
(3) (4) (5) (6)
(7)
(1) Series name
(2) Dimensions LW
2012
2.01.25mm
(3) Management symbol
(4) Inductance
R10
1R0
100
0.1H
1.0 H
10.0 H
According to research conducted in August 2010.
• The L Series (Low-resistance type) has lowered its resistance by
up to 50% compared with existing products.
• The D Series (High frequency type) is a line of decoupling coil
products for high frequencies. It can handle higher noise
frequencies.
• With its wider inductance range (0.1 to 47µH) and the addition of
the E6 Series, this series can satisfy a wide variety of
requirements.
(5) Characteristic type
D
W
L
High frequency type
IDC-UP type
Low-resistance type
(6) Packaging style
T
Taping [reel]
(7) TDK internal code
APPLICATIONS
Modules such as digital cellular phone and camera module, Netbooks, note PCs, DSCs, DVCs, video games, portable memory
audio devices, navigation systems, PNDs, TVs, W-LANs, solid
state drives
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
[Including self-temperature rise]
–55 to +125°C(After mount)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
Natural
cooling
230˚C
180˚C
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Thickness T(mm)
0.85
1.25
Quantity
4000 pieces/reel
2000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the temperature difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz
(8/10)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
2.0±0.2
1.0
0.8
1.2
1.25±0.2
0.8
0.5±0.3
0.5±0.3
Dimensions in mm
T
T(Thickness)
0.85±0.2
1.25±0.2
Weight(mg)
10
14
ELECTRICAL CHARACTERISTICS
Classification
Part No.
MLZ2012DR10DT
High frequency
MLZ2012DR22DT
type
MLZ2012DR47DT
MLZ2012A1R0WT
MLZ2012A1R5WT
MLZ2012A2R2WT
MLZ2012A3R3WT
MLZ2012M4R7WT
IDC-UP
type
MLZ2012M6R8WT
MLZ2012M100WT
MLZ2012M150WT
MLZ2012M220WT
MLZ2012M330WT
MLZ2012M470WT
MLZ2012N1R0LT
MLZ2012N1R5LT
MLZ2012N2R2LT
MLZ2012N3R3LT
Low-resistance MLZ2012N4R7LT
type
MLZ2012N6R8LT
MLZ2012N100LT
MLZ2012N150LT
MLZ2012N220LT
MLZ2012N101LT
Inductance
(µH)
Inductance
tolerance
Thickness
(mm)
0.10
0.22
0.47
1.00
1.50
2.20
3.30
4.70
6.80
10.0
15.0
22.0
33.0
47.0
1.00
1.50
2.20
3.30
4.70
6.80
10.0
15.0
22.0
100.0
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
0.85
0.85
1.25
0.85
0.85
0.85
0.85
0.85
1.25
1.25
1.25
1.25
1.25
1.25
0.85
0.85
0.85
0.85
0.85
0.85
1.25
1.25
1.25
1.25
Test
frequency
L (MHz)
25
25
25
10
10
10
10
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Test
current
L (mA)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
Self-resonant
frequency
(MHz)typ.
500
330
230
160
140
120
90
70
60
50
40
35
28
20
160
140
120
90
70
60
50
40
40
12
DC
resistance
( )±30%
0.07
0.13
0.18
0.10
0.13
0.15
0.34
0.30
0.40
0.47
0.95
2.00
2.60
3.70
0.06
0.10
0.12
0.15
0.18
0.25
0.30
0.47
0.67
3.50
Rated
current1
(mA)
1000
800
550
280
250
210
200
180
160
150
120
60
55
50
220
190
170
130
130
110
110
90
70
30
Rated
current2
(mA)
1150
900
700
900
750
650
450
500
400
350
250
220
190
170
1150
900
800
750
600
550
500
350
300
140
1 Current
assumed when inductance ratio has decreased by 50% max..
Current assumed when temperature has risen to 20°C max. (reference value). The maximum operating temperature at this time is 105°C.
• Test equipment
Inductance: Ag4294A-16034G
2
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE vs. FREQUENCY CHARACTERISTICS
E4991A+16192
10
E4991A+16192
1000
R47
R10
0.1
Inductance(μH)
Inductance(μH)
Inductance(μH)
100 470W
1
100W
10
2R2W
1
0.1
0.01
1
10
100
Frequency (MHz)
1000
0.01
1
10
100
Frequency (MHz)
1000
E4991A+16192
100
100L
4R7L
2R2L
10
1
0.1
0.01
1
10
100
Frequency (MHz)
1000
• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz
(9/10)
TYPICAL ELECTRICAL CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
E4991A+16192
1000
R10
2R2W
100
1
10
100
Frequency (MHz)
10
1000
4R7L
1000
100W
10
1
100L
10000
Impedance (Ω)
Impedance (Ω)
100
E4991A+16192
10000
470W
R47
1000
E4991A+16192
100000
Impedance (Ω)
10000
1
10
100
Frequency (MHz)
2R2L
100
10
1
1000
1
10
100
Frequency (MHz)
1000
INDUCTANCE CHANGE vs. DC SUPERPOSITION CHARACTERISTICS
1
100
100
470W
R10
0.1
0.01
0.1
1
10
100
DC current(mA)
1000
10
100W
Inductance(μH)
Inductance(μH)
Inductance(μH)
R47
2R2W
1
0.1
0.1
1
10
100
DC current(mA)
1000
10
100L
4R7L
2R2L
1
0.1
0.1
1
10
100
DC current(mA)
1000
TEMPERATURE CHARACTERISTICS
60
470W
Temperature(˚C)
50
100W
100L
40
4R7L
30
R47D
2R2W
20
2R2L
10
R10D
0
0
200
400
600
DC current(mA)
800
1000
• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz
(10/10)
PACKAGING STYLES
REEL DIMENSIONS
TAPE DIMENSIONS
1.5 +0.1
–0.0
Cavity
1.1max.
1.5±0.2
4.0±0.1
4.0±0.1
2.0±0.05
ø13±0.2
14.4max.
ø21±0.8
1.5max.
Sprocket hole
1.5 +0.1
–0.0
0.5min.
Cavity
Dimensions in mm
0.3max.
1.5±0.2
4.0±0.1
4.0±0.1
2.0±0.05
160min.
Drawing direction
Taping
2.3±0.2
8.0±0.3
ø180±2.0
t=1.25mm
3.5±0.05
8.4 +2.0
–0.0
1.75±0.1
2.0±0.5
2.3±0.2
8.0±0.3
ø60min.
Sprocket hole
3.5±0.05
1.0
1.75±0.1
t=0.85mm
200min.
300min.
Dimensions in mm
• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz