TI PTH12010YAH

PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
15-A NON-ISOLATED DDR/QDR
MEMORY BUS TERMINATION MODULES
FEATURES
•
•
•
•
•
•
•
•
•
VTT Bus Termination Output
(Output Tracks the System VREF)
15 A Output Current (12 A for 12-V Input)
3.3-V, 5-V or 12-V Input Voltage
DDR and QDR Compatible
On/Off Inhibit (for VTT Standby)
Undervoltage Lockout
Operating Temperature: –40°C to 85°C
•
•
•
Efficiencies up to 91%
Output Overcurrent Protection
(Nonlatching, Auto-Reset)
62 W/in3 Power Density
Safety Agency Approvals
UL/cUL60950, EN60950, VDE
Point-of-Load Alliance (POLA™) Compatible
Nominal Size
1.37 in x 0.62 in
(34,8 mm x 15,75 mm)
DESCRIPTION
The PTHxx010Y are a series of ready-to-use switching regulator modules from Texas Instruments designed
specifically for bus termination in DDR and QDR memory applications. Operating from either a 3.3-V, 5-V or 12-V
input, the modules generate a VTT output that will source or sink up to 15 A of current (12 A for 12-V input) to
accurately track their VREF input. VTT is the required bus termination supply voltage, and VREF is the reference
voltage for the memory and chipset bus receiver comparators. VREF is usually set to half the VDDQ power supply
voltage.
Both the PTHxx010Y series employs an actively switched synchronous rectifier output to provide state-of-the-art
stepdown switching conversion. The products are small in size (1.37 in × 0.62 in), and are an ideal choice where
space, performance, and high efficiency are desired, along with the convenience of a ready-to-use module.
Operating features include an on/off inhibit and output over-current protection (source mode only). The on/off
inhibit feature allows the VTT bus to be turned off to save power in a standby mode of operation. To ensure tight
load regulation, an output remote sense is also provided. Package options include both throughhole and surface
mount configurations.
STANDARD APPLICATION
V IN
V REF
V DDQ
1k
1%
1
10
9
8
1k
1%
V TT
Con
hf−Ceramic
(Top View)
2
Q1
BSS138
(Optional)
6
3
4
5
Co1
Low−ESR
(Required)
Co2
Ceramic
(Optional)
V TTTermination Island
CIN
(Required)
Standby
7
PTHxx010Y
SSTL−2
Bus
GND
CIN = Required Capacitor; 470 µF (3.3 ± 5 V Input), 560 µF (12 V Input).
Co1 = Required Low-ESR Electrolyitic Capacitor; 470 µF (3.3 ± 5 V Input), 940 µF (12 V Input).
Co2 = Ceramic Capacitance for Optimum Response to a 3 A (± 1.5 A) Load Transient; 200 µF (3.3 ± 5 V Input), 400 µF (12 V Input).
Con = Distributed hf-Ceramic Decoupling Capacitors for VTT bus; as Recommended for DDR Memory Applications.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
POLA is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
ORDERING INFORMATION
PTHXX010Y (Base Part Number)
Input Voltage
Part Number
3.3 V
5V
12 V
(1)
(2)
(3)
(4)
(1)
DESCRIPTION
Pb – free and
RoHS
(3)
Mechanical Package
(2)
PTH03010YAH
Horizontal T/H
Yes
PTH03010YAS
Standard SMD
No
(4)
EUH
EUJ
EUJ
PTH03010YAZ
Optional SMD
Yes
(3)
PTH05010YAH
Horizontal T/H
Yes
(3)
EUH
PTH05010YAS
Standard SMD
No
(4)
EUJ
EUJ
PTH05010YAZ
Optional SMD
Yes
(3)
PTH12010YAH
Horizontal T/H
Yes
(3)
EUH
PTH12010YAS
Standard SMD
No
(4)
EUJ
PTH12010YAZ
Optional SMD
Yes
(3)
EUJ
Add T to end of part number for tape and reel on SMD packages only.
Reference the applicable package reference drawing for the dimensions and PC board layout.
Lead (Pb) –free option specifies Sn/Ag pin solder material.
Standard option specifies 63/37, Sn/Pb pin solder material.
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
voltages are with respect to GND
UNIT
VREF
Control input voltage
TA
Operating temperature
range
Over VIN range
Twave
Wave solder temperature
Surface temperature of module body or pins
(5 seconds)
Treflow
Solder reflow temperature
Surface temperature of module body or pins
Ts
–0.3 V to Vin+03 V
2
260°C
(2)
PTHXX010YAS
235°C
(2)
PTHXX010YAZ
260°C
(2)
Storage temperature
–40°C to 125°C
Per Mil-STD-883D, Method 2002.3 1 msec, 1/2 Sine, mounted
500 G
Mechanical vibration
Mil-STD-883D, Method 2007.2 20-2000 Hz
20 G
Flammability
(2)
PTHXX010YAH
Mechanical shock
Weight
(1)
–40°C to 85°C (1)
3.7 grams
Meets UL 94V-O
For operation below 0°C the external capacitors must bave stable characteristics, use either a low ESR tantalum, Os-Con, or ceramic
capacitor.
During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated
maximum.
PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
ELECTRICAL SPECIFICATIONS
TA = 25°C; nominal VIN; VREF = 1.25 V; CIN, CO1, and CO2 = typical values; and IO = IOmax (unless otherwise stated)
PARAMETER
TEST CONDITIONS
IO
Output current
Over ∆VREF range
VIN
Input voltage range
Over IO range
∆VREF
Tracking range for VREF
|VTT– VREF|
Tracking tolerance to VREF
Over line, load and temperature
η
Efficiency
Io = 10 A
Vr
Vo Ripple (pk-pk)
20 MHz bandwidth
Io trip
ttr
Overcurrent threshold
Load transient response
Vtr
Reset, followed by auto recovery
15 A/µs load step, from –1.5 A to
1.5 A
Under-voltage lockout
VIN Dncreasing
Inhibit control (pin 4)
Input high voltage
VIH
Inhibit control (pin 4)
Input low voltage
IIL inhibit
Inhibit control (pin 4)
Input low curent
Pin to GND
IIN inh
Input standby current
Inhibit (pin 3) to GND
Switching frequency
CIN
External input capacitance
Over VIN and IO ranges
Capacitance value: Nonceramic
CO1, CO2
External output capacitance
Capacitance value: Ceramic
(1)
(2)
(3)
(4)
(5)
(6)
Reliability
MAX
UNIT
±15 (1)
A
±12 (1)
PTH03010Y
2.95
PTH05010Y
4.5
5.5
PTH12010Y
10.8
13.2
0.55
1.8
V
–10
10
mV
3.65
PTH03010Y
88%
PTH05010Y
88%
PTH12010Y
85%
PTH03010Y/PTH05010Y
27.5
20
A
20
30
VO over/undershoot
30
40
PTH03010Y
2.45
2.8
PTH05010Y
4.3
4.45
PTH12010Y
9.5
10.4
PTH03010Y
2.0
2.40
PTH05010Y
3.4
3.7
PTH12010Y
8.8
9
µsec
VIN–0.5
Open (2)
–0.2
0.6
10
V
V
mA
250
300
350
PTH12010Y
200
250
300
PTH03010Y/PTH05010Y
470 (3)
PTH12010Y
560 (3)
PTH03010Y/PTH05010Y
470 (4)
8200 (5)
PTH12010Y
940 (4)
6600 (5)
kHz
µF
PTH03010Y/PTH05010Y
200 (4)
300
PTH12010Y
400 (4)
600
6
V
µA
PTH03010Y/PTH05010Y
4 (6)
mV
V
130
Per Bellcore TR-332 50 % stress, TA = 40°C, ground benign
V
mVpp
Recovery time
Equiv. series resistance (non-ceramic)
MTBF
TYP
0
PTH12010Y
Referenced to GND
VIL
fs
MIN
PTH12010Y
VIN Increasing
UVLO
PTH03010Y/PTH05010Y
µF
µF
mΩ
106 Hrs
Rating is conditional on the module being directly soldered to a 4-layer PCB with 1 oz. copper. See the SOA curves or contact the
factory for appropriate derating.
This control pin has an internal pull-up to the input voltage VIN. If it is left open-circuit the module will operate when input power is
applied. A small low-leakage (<100 nA) MOSFET is recommended for control. For further information, consult the related application
note.
An input capacitor is required for proper operation. The capacitor must be rated for a minimum a minimum of 500 mA rms( 750 mA rms
for 12-V input) of ripple current.
The minimum value of external output capacitance value ensures that VTT meets the specified transient performance requirements for
the memory bus terminations. Lower values of capacitance may be possible when the measured peak change in output current is
consistently less than 3 A.
This is the calculated maximum. The minimum ESR limitation will often result in a lower value. Consult the application notes for further
guidance.
This is the typcial ESR for all the electrolytic (non-ceramic) output capacitance. Use 7 mΩ as the minimum when using max-ESR values
to calculate.
3
PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
Terminal Functions
TERMINAL
NAME
VIN
NO.
2
DESCRIPTION
The positive input voltage power node to the module, which is referenced to common GND.
1, 7
This is the common ground connection for the VIN and VTT power connections. It is also the 0-VDC reference
for the control inputs.
VREF
8
The module senses the voltage at this input to regulate the output voltage, VTT. The voltage at VREF is also
the reference voltage for the system bus receiver comparators. It is normally set to precisely half the bus
driver supply voltage (VDDQ÷ 2), using a resistor divider. The Thevenin impedance of the network driving the
VREF pin should not exceed 500 Ω. See the Typical DDR Application Diagram in the Application Information
section for reference.
VTT
6
This is the regulated power output from the module with respect to the GND node, and the tracking
termination supply for the application data and address buses. It is precisely regulated to the voltage applied
to the module's VREF input, and is active active about 20 ms after a valid input source is applied to the
module. Once active it will track the voltage applied at VREF.
Vo Sense
5
The sense input allows the regulation circuit to compensate for voltage drop between the module and the
load. For optimal voltage accuracy Vo Sense should be connected to VTT.
3
The Inhibit pin is an open-collector/drain negative logic input that is referenced to GND. Applying a low-level
ground signal to this input turns off the output voltage, VTT. Although the module is inhibited, a voltage, VDDQ
will be present at the output terminals, fed through the DDR memory. When the Inhibit is active, the input
current drawn by the regulator is significantly reduced. If the Inhibit pin is left open circuit, the module will
produce an output whenever a valid input source is applied. See the Typical DDR Application Diagram in the
Application Information section for reference.
GND
Inhibit
N/C
4, 9, 10
No connection
1
10
9
8
7
PTHXX010
(Top View)
2
6
3
4
4
5
PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS (VREF = 1.25 V ) (1) (2)
EFFICIENCY
vs
LOAD CURRENT
OUTPUT RIPPLE
vs
LOAD CURRENT
POWER DISSIPATION
vs
LOAD CURRENT
60
10 0
5
VIN = 3.3 V
Output Ripple − mV
Efficiency − %
VIN = 12 V
80
VIN = 5 V
70
40
20
10
0
3
6
9
12
IL − Load Current − A
VIN = 5 V
VIN = 3.3 V
30
60
50
0
15
VIN = 12 V
0
3
6
9
12
1
VIN = 3.3 V
0
3
6
9
2
IL − Load Current − A
15
Figure 3.
90
80
70
100 LFM
200 LFM
60
400 LFM
50
40
30
0
3
Nat Conv
80
Nat Cinv
TA− Ambient Temperature 5−C
TA− Ambient Temperature 5−C
VIN = 5 V
PTH12010Y ONLY; VIN = 12 V
TEMPERATURE DERATING
vs LOAD CURRENT
90
(2)
2
0
15
VIN = 12 V
3
Figure 2.
PTH03010Y/PTH05010Y AT
NOMINAL VIN
TEMPERATURE DERATING
vs LOAD CURRENT
(1)
4
IL − Load Current − A
Figure 1.
20
PD − Power Dissipation − W
50
90
6
9
12
15
100 LFM
70
400 LFM
200 LFM
60
50
40
30
20
0
VIN = 12 V
IL − Load Current − A
2
3
4
6
IL − Load Current − A
Figure 4.
Figure 5.
8
10
The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 1, Figure 2, and Figure 3.
The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 4 in x 4 in double-sided PCB with 1 oz. copper. For
surface mount packages (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around the power
pins. Please refer to the mechanical specification for more information. Applies to Figure 4, and Figure 5.
5
PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS
TRANSIENT PERFORMANCE FOR ∆3-A LOAD CHANGE
PTH03010Y/PTH05010Y: SOURCE-SINK-SOURCE
TRANSIENT
100 ms/div
Figure 6.
6
PTH12010Y: SOURCE-SINK-SOURCE TRANSIENT
VTT − VREF
VTT − VREF
(50 mV/div)
(50 mV/div)
ITT (2A/div)
ITT (2A/div)
100 ms/div
Figure 7.
PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
APPLICATION INFORMATION
Typical DDR Application Diagram
Auto-Track
VI= 5V
VI
+
Margin ±
+Sense
PTH05010W
VDDQ I/O Memory
+VADJ
Inhibit
470 µF
5.51 kΩ
47 µF
VI
+
220 µF
Inhibit
PTH05050Y
DDR Termination
VDDQ = 1.8 V
VO
+
2×
330 µF
2×
22 µF
VTT = 0.9 V
VTT
+VREF
DDRII/
QDRII
+
2×
330 µF
2×
22 µF
1 kΩ
47 µF
1 kΩ
UDG−05096
CAPACITOR RECOMMENDATIONS FOR THE PTH03010Y AND PTH05010Y DDR POWER
MODULES
(3.3-V/5-V OPTION)
Input Capacitor
The recommended input capacitor(s) is determined by the 470 µF minimum capacitance and 500 mArms
minimum ripple current rating.
Ripple current, less than 160 mΩ equivalent series resistance (ESR), and temperature are the major
considerations when selecting input capacitors. Unlike polymer tantalum, regular tantalum capacitors have a
recommended minimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to
ensure reliability.
For improved ripple reduction on the input bus, ceramic capacitors may used to complement electrolytic types to
achieve the minimum required capacitance.
Output Capacitors
For applications with load transients (sudden changes in load current), regulator response benefits from external
output capacitance. The recommended output capacitance of 470 µF will allow the modue to meet its transieint
response specification. (See Electrical Specifications table). For most applications, a high quality computer-grade
aluminum electrolytic capacitor is adequate. These capacitors provide decoupling over the frequency range,
2 kHz to 150 kHz, and are suitable for ambient temperatures above 0°C. Below 0°C, tantalum, ceramic or
Os-Con type capacitors are recommended. When using one or more nonceramic capacitors, the calculated
equivalent ESR should be no lower than 4 mΩ (7 mΩ using the manufacturer’s maximum ESR for a single
capacitor).
A list of preferred low-ESR type capacitors are identified in Table 1. In addition to electrolytic capacitance, adding
a 10-µF to 22-µF X5R/X7R ceramic capacitor to the output reduces the output ripple voltage and improve the
regulator’s transient response. The measurement of both the output ripple and transient response is also best
achieved across a 10-µF ceramic capacitor.
7
PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
APPLICATION INFORMATION (continued)
Ceramic Capacitors
Above 150 kHz the performance of aluminum electrolytic capacitors becomes less effective. To further improve
the reflected input ripple current or the output transient response, multilayer ceramic capacitors can be added.
Ceramic capacitors have very low ESR and their resonant frequency is higher than the bandwidth of the
regulator. When used on the output their combined ESR is not critical as long as the total value of ceramic
capacitance does not exceed 300 µF. Also, to prevent the formation of local resonances, do not place more than
five identical ceramic capacitors in parallel with values of 10 µF or greater.
Tantalum Capacitors
Tantalum type capacitors can be used at both the input and output, and are recommended for applications where
the ambient operating temperature can be less than 0°C. The AVX TPS, Sprague 593D/594/595, and Kemet
T495/T510 capacitor series are suggested over many other tantalum types due to their higher rated surge, power
dissipation, and ripple current capability. As a caution, many general-purpose tantalum capacitors have
considerably higher ESR, reduced power dissipation and lower ripple current capability. These capacitors are
also less reliable as they have lower power dissipation and surge current ratings. Tantalum capacitors that do not
have a stated ESR or surge current rating are not recommended for power applications.
When specifying Os-Con and polymer tantalum capacitors for the output, the minimum ESR limit is encountered
before the maximum capacitance value is reached.
Capacitor Table
Table 1 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple
current (rms) ratings. The recommended number of capacitors required at both the input and output buses is
identified for each capacitor type.
This is not an extensive capacitor list. Capacitors from other vendors are available with comparable
specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical
parameters necessary to ensure both optimum regulator performance and long capacitor life.
Table 1. Input/Output Capacitors (1)
Capacitor Characteristics
Working
Voltage
(V)
Value
(µF)
Max ESR
at 100 kHz
(Ω)
Max Ripple
Current
at 85°C
(Irms) (mA)
FC (Radial)
10
470
0.117
FC (SMD)
10
470
0.150
FK (SMD)
10
470
0.160
Capacitor Vendor,
Type/Series (Style)
Quantity
Vendor
Part Number
Physical
Size
(mm)
Input
Bus
Output
Bus
555
8 × 11,5
1
1
EEUFC1A471
670
10 × 10,2
1
1
EEUFC1A471P
600
8× 10,2
1
1
EEVFK1A471P
PXA6.3VC471MJ80TP
Panasonic, Aluminum
United Chemi-Con
PXA, Poly-Aluminum (SMD)
6.3
470
0.020
4130
10 × 7,7
1
≤2
PS, Poly-Aluminum (Radial)
10
470
0.012
5300
10 × 12,5
1
≤1
10PS470MJ12
LXZ, Aluminum (Radial)
16
470
0.120
555
8 × 12
1
1
LXZ10VB471M8X12LL
Nichicon Aluminum
WG(SMD)
10
470
0.150
670 mA
10 × 10
1
1
UWG1A471MNR1GS
HD (Radial)
10
470
0.072
760
8 × 11,5
1
1
UHD1A471MPR
PM (Radial)
10
470
0.130
600
10 × 12,5
1
1
UPM1A471MPH6
(1)
8
Capacitor Supplier Verification
Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of
limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term
consideration for obsolescence.
RoHS, Lead-free and Material Details
Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process
requirements. Component designators or part number deviations can occur when material composition or soldering requirements are
updated.
PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
APPLICATION INFORMATION (continued)
Table 1. Input/Output Capacitors (continued)
Capacitor Characteristics
Working
Voltage
(V)
Value
(µF)
Max ESR
at 100 kHz
(Ω)
Max Ripple
Current
at 85°C
(Irms) (mA)
6.3
180
0.005
4000
SEPC, Os-con (Radial)
6.3
470
0.008
SVP, (SMD)
6.3
470
0.015
TPE, Poscap (SMD)
6.3
470
AVX, Tantalum TPS (SMD)
10
Capacitor Vendor,
Type/Series (Style)
Quantity
Physical
Size
(mm)
Vendor
Part Number
Input
Bus
Output
Bus
7,3 × 4,3 ×
4,2
2 (2)
N/R (3)
5700
10 × 13
1
≤1
6SEPC470M
4200
11 × 11,9
1
≤2
6SVP470M
0.018
3500
7,3 × 4,3
1
≤2
6TPE470MI
470
0.045
1723
1
≤5
TPSE477M010R0045
10
470
0.060
1826
7,3 L × 5,7 W
× 4,1 H
1
≤5
TPSV477M010R0060
T520, (SMD)
10
330
0.040
1800
≤5
T520X337M010AS
10
330
0.010
5200
4,3 W × 7,3 L
×4H
2
T530, (SMD)
2
≤1
T530X337M010ASE010
Panasonic, Poly-Aluminum:
S/SE (SMD)
EEFSE0J181R
Sanyo
Kemet, Poly-Tantalum
Vishay-Sprague
595D, Tantalum (SMD)
10
470
0.100
1440
7,2 L × 6 W
1
≤5
595D477x0010r2t
94SP, Poly Aluminum (Radial)
10
470
0.015
4510
10 × 10
1
≤2
94SP477X0010FBP
94SVP, Poly-Aluminum (SMD)
6.3
470
0.017
3960
8 × 12
1
≤3
94SVP477X06R3E12
Kemet, Ceramic X5R (SMD)
16
10
0.002
–
3225 mm
1
≤5
C1210C106M4PAC
6.3
47
3225 mm
1
≤5
C1210C476K9PAC
6.3
100
3225 mm
1 (4)
≤3
GRM32ER60J107M
6.3
47
3225 mm
1 (4)
≤5
GRM32ER60J476M
Murata, Ceramic X5R (SMD)
TDK, Ceramic X5R (SMD)
(2)
(3)
(4)
0.002
–
16
22
1 (4)
≤5
GRM32ER61C226K
16
10
1 (4)
≤5
GRM32DR61C106K
6.3
100
3225 mm
1 (4)
≤3
C3225X5R0J107MT
6.3
47
3225 mm
1 (4)
≤5
C3225X5R0J476MT
16
22
1 (4)
≤5
C3225X5R1C226MT
16
10
1 (4)
≤5
C3225X5R1C106MT
0.002
–
A total capacitance of 360 µF is acceptable based on the combined ripple current rating.
N/R –Not recommended. The capacitor voltage rating does not meet the minimum derated operating limits.
A ceramic capacitor is recoommended to compliment electrolytic types at the input to further reduce high-frequency ripple current.
Designing for Very Fast Load Transients
The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of
1 A/µs. The typical voltage deviation for this load transient is given in the data sheet specification table using the
optional value of output capacitance. As the di/dt of a transient is increased, the response of a converter's
regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with
any dc/dc converter once the speed of the transient exceeds its bandwidth capability. If the target application
specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional output
capacitor decoupling. In these cases special attention must be paid to the type, value and ESR of the capacitors
selected.
If the transient performance requirements exceed that specified in the data sheet, or the total amount of load
capacitance is above 8200 µF, the selection of output capacitors becomes more important.
9
PTH03010Y
PTH05010Y
PTH12010Y
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
www.ti.com
CAPACITOR RECOMMENDATIONS FOR THE PTH12010Y DDR POWER MODULES
(12-V OPTION)
INPUT CAPACITOR
The recommended input capacitance is determined by the 560 µF minimum capacitance and 750 mArms
minimum ripple current rating. A 10-µF X5R/X7R ceramic capacitor may also be added to reduce the reflected
input ripple current. The ceramic capacitor should be located between the input electrolytic and the module.
Ripple current, less than 100 mΩ equivalent series resistance (ESR) and temperature are major considerations
when selecting input capacitors. Unlike polymer-tantalum capacitors, regular tantalum capacitors have a
recommended minimum voltage rating of 2 × (max dc voltage + ac ripple). This is standard practice to ensure
reliability. No tantalum capacitors were found with sufficient voltage rating to meet this requirement. At
temperatures below 0°C, the ESR of aluminum electrolytic capacitors increases. For these applications, Os-Con,
polymer-tantalum, and polymer-aluminum types should be considered.
OUTPUT CAPACITORS
For applications with load transients (sudden changes in load current), regulator response benefits from external
output capacitance. The recommended output capacitance of 940 µF will allow the modue to meet its transieint
response specification. (See Electrical Specifications table). For most applications, a high quality computer-grade
aluminum electrolytic capacitor is adequate. These capacitors provide decoupling over the frequency range,
2 kHz to 150 kHz, and are suitable for ambient temperatures above 0°C. Below 0°C, tantalum, ceramic or
Os-Con type capacitors are recommended. When using one or more nonceramic capacitors, the calculated
equivalent ESR should be no lower than 4 mΩ (7 mΩ using the manufacturer’s maximum ESR for a single
capacitor).
A list of preferred low-ESR type capacitors are identified in Table 2.
In addition to electrolytic capacitance, adding a 10-µF to 22-µF X5R/X7R ceramic capacitor to the output reduces
the output ripple voltage and improve the regulator’s transient response. The measurement of both the output
ripple and transient response is also best achieved across a 10-µF ceramic capacitor.
CERAMIC CAPACITORS
Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramic
capacitors have very low ESR and a resonant frequency higher than the bandwidth of the regulator. They can be
used to reduce the reflected ripple current at the input as well as improve the transient response of the output.
When used on the output, their combined ESR is not critical as long as the total value of ceramic capacitance
does not exceed 300 µF. Also, to prevent the formation of local resonances, do not place more than five identical
ceramic capacitors in parallel with values of 10 µF or greater.
TANTALUM CAPACITORS
Tantalum type capacitors are most suited for use on the output bus, and are recommended for applications
where the ambient operating temperature can be less than 0°C. The AVX TPS, Sprague 593D/594/595 and
Kemet T495/T510 capacitor series are suggested over other tantalum types due to their higher rated surge,
power dissipation, and ripple current capability. As a caution, many general purpose tantalum capacitors have
considerably higher ESR, reduced power dissipation and lower ripple current capability. These capacitors are
also less reliable as they have lower power dissipation and surge current ratings. Tantalum capacitors that do not
have a stated ESR or surge current rating are not recommended for power applications.
When specifying Os-con and polymer tantalum capacitors for the output, the minimum ESR limit are encountered
well before the maximum capacitance value is reached.
CAPACITOR TABLE
Table 2 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple
current (rms) ratings. The recommended number of capacitors required at both the input and output buses is
identified for each capacitor type.
This is not an extensive capacitor list. Capacitors from other vendors are available with comparable
specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical
parameters necessary to insure both optimum regulator performance and long capacitor life.
10
PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
Table 2. Input/Output Capacitors
(1)
CAPACITOR CHARACTERISTICS
CAPACITOR VENDOR,
TYPE/SERIES, (STYLE)
WORKING
VOLTAGE
VALUE
(µF)
MAX. ESR
AT 100 kHz
MAX RIPPLE
CURRENT AT
85°C (lrms)
QUANTITY
PHYSICAL
SIZE (mm)
INPUT
BUS
OPTIONAL
OUTPUT
BUS
VENDOR PART
NUMBER
Panasonic, Aluminum (FC)
25 V
560
0.065 Ω
1205 mA
12,5 x 15
1
1
EEUFC1E561S
FC, Radial
25 V
1000
0.060 Ω
1100 mA
12,5 x 13,5
1
1
EEVFK1E102Q
FK, (SMD)
35 V
680
0.060 Ω
1100 mA
12,5 x 13,5
1
1
EEVFK1V681Q
PS, Poly-Aluminum (Radial)
16 V
330
0.014 Ω
5050 mA
10 x 12,5
2
≤2
16PS330MJ12
LXZ, Aluminium (Radial)
16 V
680
0.068 Ω
1050 mA
10 x 16
1
1
LXZ16VB681M10X16LL
PXA, Poly-Aluminum (SMD)
16 V
330
0.014 Ω
5050 mA
10 x 12,2
2
≤2
PXA16VC331MJ12TP
Nichicon, Aluminum (PM)
25 V
560
0.060 Ω
1060 mA
12,5 x 15
1
1
UPM1E561MHH6
HD, (Radial)
16 V
680
0.038 Ω
1430 mA
10 x 16
1
1
UHD1C681MPR
PM, (Radial)
35 V
560
0.048 Ω
1360 mA
16 x 15
1
1
UPM1V561MHH6
Sanyo
TPE Poscap (SMD)
10 V
330
0.025 Ω
3000 mA
7,3 L x 5,7 W
N/R (2)
≤3
10TPE330M
SEQP, Os-Con (Radial)
16 V
330
0.016 Ω
>4720 mA
10 x 13
2
≤2
16SEQP330M
SVP, Os-Con (SMD)
16 V
330
0.016 Ω
4700 mA
11 x 12
2
≤2
16SVP330M
AVX, Tantalum Series III
TPS (SMD)
10 V
470
0.045 Ω
>1723 mA
7,3L x 5,7W
N/R (2)
≤5 (3)
10 V
330
0.045 Ω
>1723 mA
x 4,1H
N/R (2)
≤5 (3)
T520, Poly-Tantalum (SMD)
10 V
330
0.040 Ω
1800 mA
7,3 L
N/R (2)
≤5
T520X337M010AS
T530, Poly-Tant/Organic
10 V
330
0.010 Ω
>3800 mA
x 4,3 W
N/R (2)
≤1
T530X337M010ASE010
6.3 V
470
0.005 Ω
4200 mA
x4H
N/R (2)
≤1 (3)
United Chemi-Con
TPSE477M010R0045
TPSE377M010R0045
Kemet
T530X477M006AS E005
Vishay-Sprague
595D, Tantalum (SMD)
10 V
470
0.100 Ω
1440 mA
7,2L x 6W x
4,1H
N/R (2)
≤5 (3)
94SA, Os-con (Radial)
16 V
1000
0.015Ω
9750 mA
16 x 25
1
≤2
94SA108X0016HBP
94SVP, Os-CON(SMD)
16V
330
0.017Ω
4580 mA
10 x 12,7
2 (4)
≤2
94SVP337X0016F12
Kemet, Ceramic X5R
(SMD)
16 V
10
0.002 Ω
-
3225 mm
1 (5)
≤5
C1210C106M4PAC
6.3 V
47
0.002 Ω
3225 mm
N/R (2)
≤5
C1210C476K9PAC
Murata, Ceramic X5R
(SMD)
6.3 V
100
0.002 Ω
3225 mm
N/R (2)
≤3
GRM32ER60J107M
16 V
47
3225 mm
1 (5)
≤5
GRM32ER61CJ476K
16 V
22
1 (5)
≤5
GRM32ER61C226K
16 V
10
1 (5)
≤5
GRM32DR61C106K
6.3 V
100
3225 mm
N/R (2)
≤3
C3225X5R0J107MT
3225 mm
N/R (2)
TDK, Ceramic X5R (SMD)
(1)
(2)
(3)
(4)
(5)
0.002 Ω
-
-
595D477X0010R2T
6.3 V
47
≤5
C3225X5R0J476MT
16 V
22
1 (5)
≤5
C3225X5R1C226MT
16 V
10
1 (5)
≤5
C3225X5R1C106MT
Capacitor Supplier Verification
Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of
limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term
consideration for obsolescence.
RoHS, Lead-free and Material Details
Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process
requirements. Component designators or part number deviations can occur when material composition or soldering requirements are
updated.
N/R –Not recommended. The capacitor voltage rating does not meet the minimum derated operating limits.
The voltage rating of this capacitor only allows it to be used for output voltages that are equal to or less than 5.1 V.
A total capacitance of 540 µF is acceptable based on the combined ripple current rating.
A ceramic capacitor can be used to complement electrolytic types at the input further reduce high-frequency ripple current.
11
PTH03010Y
PTH05010Y
PTH12010Y
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
www.ti.com
DESIGNING FOR VERY FAST LOAD TRANSIENTS
The transient response of the DC/DC converter has been characterized using a load transient with a di/dt of
1 A/µs. The typical voltage deviation for this load transient is given in the data sheet specification table using the
optional value of output capacitance. As the di/dt of a transient is increased, the response of a converter’s
regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with
any dc/dc converter once the speed of the transient exceeds its bandwidth capability. If the target application
specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional output
capacitor decoupling. In these cases special attention must be paid to the type, value and ESR of the capacitors
selected.
If the transient performance requirements exceed that specified in the data sheet, or the total amount of load
capacitance is above 6600 µF, the selection of output capacitors becomes more important.
12
PTH03010Y
PTH05010Y
PTH12010Y
www.ti.com
SLTS223A – MARCH 2004 – REVISED OCTOBER 2005
TAPE AND REEL SPECIFICATION
TRAY SPECIFICATION
13
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
PTH03010YAD
ACTIVE
DIP MOD
ULE
EUH
10
25
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PTH03010YAH
ACTIVE
DIP MOD
ULE
EUH
10
25
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PTH03010YAS
ACTIVE
DIP MOD
ULE
EUJ
10
25
TBD
Call TI
Level-1-235C-UNLIM
PTH03010YAST
ACTIVE
DIP MOD
ULE
EUJ
10
250
TBD
Call TI
Level-1-235C-UNLIM
PTH03010YAZ
ACTIVE
DIP MOD
ULE
EUJ
10
25
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH03010YAZT
ACTIVE
DIP MOD
ULE
EUJ
10
250
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH05010YAH
ACTIVE
DIP MOD
ULE
EUH
10
25
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PTH05010YAS
ACTIVE
DIP MOD
ULE
EUJ
10
25
TBD
Call TI
Level-1-235C-UNLIM
PTH05010YAST
ACTIVE
DIP MOD
ULE
EUJ
10
250
TBD
Call TI
Level-1-235C-UNLIM
PTH05010YAZ
ACTIVE
DIP MOD
ULE
EUJ
10
25
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH05010YAZT
ACTIVE
DIP MOD
ULE
EUJ
10
250
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH12010YAH
ACTIVE
DIP MOD
ULE
EUH
10
25
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PTH12010YAS
ACTIVE
DIP MOD
ULE
EUJ
10
25
TBD
Call TI
Level-1-235C-UNLIM
PTH12010YAST
ACTIVE
DIP MOD
ULE
EUJ
10
250
TBD
Call TI
Level-1-235C-UNLIM
PTH12010YAZ
ACTIVE
DIP MOD
ULE
EUJ
10
25
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH12010YAZT
ACTIVE
DIP MOD
ULE
EUJ
10
250
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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Addendum-Page 2
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