PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 15-A NON-ISOLATED DDR/QDR MEMORY BUS TERMINATION MODULES FEATURES • • • • • • • • • VTT Bus Termination Output (Output Tracks the System VREF) 15 A Output Current (12 A for 12-V Input) 3.3-V, 5-V or 12-V Input Voltage DDR and QDR Compatible On/Off Inhibit (for VTT Standby) Undervoltage Lockout Operating Temperature: –40°C to 85°C • • • Efficiencies up to 91% Output Overcurrent Protection (Nonlatching, Auto-Reset) 62 W/in3 Power Density Safety Agency Approvals UL/cUL60950, EN60950, VDE Point-of-Load Alliance (POLA™) Compatible Nominal Size 1.37 in x 0.62 in (34,8 mm x 15,75 mm) DESCRIPTION The PTHxx010Y are a series of ready-to-use switching regulator modules from Texas Instruments designed specifically for bus termination in DDR and QDR memory applications. Operating from either a 3.3-V, 5-V or 12-V input, the modules generate a VTT output that will source or sink up to 15 A of current (12 A for 12-V input) to accurately track their VREF input. VTT is the required bus termination supply voltage, and VREF is the reference voltage for the memory and chipset bus receiver comparators. VREF is usually set to half the VDDQ power supply voltage. Both the PTHxx010Y series employs an actively switched synchronous rectifier output to provide state-of-the-art stepdown switching conversion. The products are small in size (1.37 in × 0.62 in), and are an ideal choice where space, performance, and high efficiency are desired, along with the convenience of a ready-to-use module. Operating features include an on/off inhibit and output over-current protection (source mode only). The on/off inhibit feature allows the VTT bus to be turned off to save power in a standby mode of operation. To ensure tight load regulation, an output remote sense is also provided. Package options include both throughhole and surface mount configurations. STANDARD APPLICATION V IN V REF V DDQ 1k 1% 1 10 9 8 1k 1% V TT Con hf−Ceramic (Top View) 2 Q1 BSS138 (Optional) 6 3 4 5 Co1 Low−ESR (Required) Co2 Ceramic (Optional) V TTTermination Island CIN (Required) Standby 7 PTHxx010Y SSTL−2 Bus GND CIN = Required Capacitor; 470 µF (3.3 ± 5 V Input), 560 µF (12 V Input). Co1 = Required Low-ESR Electrolyitic Capacitor; 470 µF (3.3 ± 5 V Input), 940 µF (12 V Input). Co2 = Ceramic Capacitance for Optimum Response to a 3 A (± 1.5 A) Load Transient; 200 µF (3.3 ± 5 V Input), 400 µF (12 V Input). Con = Distributed hf-Ceramic Decoupling Capacitors for VTT bus; as Recommended for DDR Memory Applications. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. POLA is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2005, Texas Instruments Incorporated PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 ORDERING INFORMATION PTHXX010Y (Base Part Number) Input Voltage Part Number 3.3 V 5V 12 V (1) (2) (3) (4) (1) DESCRIPTION Pb – free and RoHS (3) Mechanical Package (2) PTH03010YAH Horizontal T/H Yes PTH03010YAS Standard SMD No (4) EUH EUJ EUJ PTH03010YAZ Optional SMD Yes (3) PTH05010YAH Horizontal T/H Yes (3) EUH PTH05010YAS Standard SMD No (4) EUJ EUJ PTH05010YAZ Optional SMD Yes (3) PTH12010YAH Horizontal T/H Yes (3) EUH PTH12010YAS Standard SMD No (4) EUJ PTH12010YAZ Optional SMD Yes (3) EUJ Add T to end of part number for tape and reel on SMD packages only. Reference the applicable package reference drawing for the dimensions and PC board layout. Lead (Pb) –free option specifies Sn/Ag pin solder material. Standard option specifies 63/37, Sn/Pb pin solder material. ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS voltages are with respect to GND UNIT VREF Control input voltage TA Operating temperature range Over VIN range Twave Wave solder temperature Surface temperature of module body or pins (5 seconds) Treflow Solder reflow temperature Surface temperature of module body or pins Ts –0.3 V to Vin+03 V 2 260°C (2) PTHXX010YAS 235°C (2) PTHXX010YAZ 260°C (2) Storage temperature –40°C to 125°C Per Mil-STD-883D, Method 2002.3 1 msec, 1/2 Sine, mounted 500 G Mechanical vibration Mil-STD-883D, Method 2007.2 20-2000 Hz 20 G Flammability (2) PTHXX010YAH Mechanical shock Weight (1) –40°C to 85°C (1) 3.7 grams Meets UL 94V-O For operation below 0°C the external capacitors must bave stable characteristics, use either a low ESR tantalum, Os-Con, or ceramic capacitor. During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated maximum. PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 ELECTRICAL SPECIFICATIONS TA = 25°C; nominal VIN; VREF = 1.25 V; CIN, CO1, and CO2 = typical values; and IO = IOmax (unless otherwise stated) PARAMETER TEST CONDITIONS IO Output current Over ∆VREF range VIN Input voltage range Over IO range ∆VREF Tracking range for VREF |VTT– VREF| Tracking tolerance to VREF Over line, load and temperature η Efficiency Io = 10 A Vr Vo Ripple (pk-pk) 20 MHz bandwidth Io trip ttr Overcurrent threshold Load transient response Vtr Reset, followed by auto recovery 15 A/µs load step, from –1.5 A to 1.5 A Under-voltage lockout VIN Dncreasing Inhibit control (pin 4) Input high voltage VIH Inhibit control (pin 4) Input low voltage IIL inhibit Inhibit control (pin 4) Input low curent Pin to GND IIN inh Input standby current Inhibit (pin 3) to GND Switching frequency CIN External input capacitance Over VIN and IO ranges Capacitance value: Nonceramic CO1, CO2 External output capacitance Capacitance value: Ceramic (1) (2) (3) (4) (5) (6) Reliability MAX UNIT ±15 (1) A ±12 (1) PTH03010Y 2.95 PTH05010Y 4.5 5.5 PTH12010Y 10.8 13.2 0.55 1.8 V –10 10 mV 3.65 PTH03010Y 88% PTH05010Y 88% PTH12010Y 85% PTH03010Y/PTH05010Y 27.5 20 A 20 30 VO over/undershoot 30 40 PTH03010Y 2.45 2.8 PTH05010Y 4.3 4.45 PTH12010Y 9.5 10.4 PTH03010Y 2.0 2.40 PTH05010Y 3.4 3.7 PTH12010Y 8.8 9 µsec VIN–0.5 Open (2) –0.2 0.6 10 V V mA 250 300 350 PTH12010Y 200 250 300 PTH03010Y/PTH05010Y 470 (3) PTH12010Y 560 (3) PTH03010Y/PTH05010Y 470 (4) 8200 (5) PTH12010Y 940 (4) 6600 (5) kHz µF PTH03010Y/PTH05010Y 200 (4) 300 PTH12010Y 400 (4) 600 6 V µA PTH03010Y/PTH05010Y 4 (6) mV V 130 Per Bellcore TR-332 50 % stress, TA = 40°C, ground benign V mVpp Recovery time Equiv. series resistance (non-ceramic) MTBF TYP 0 PTH12010Y Referenced to GND VIL fs MIN PTH12010Y VIN Increasing UVLO PTH03010Y/PTH05010Y µF µF mΩ 106 Hrs Rating is conditional on the module being directly soldered to a 4-layer PCB with 1 oz. copper. See the SOA curves or contact the factory for appropriate derating. This control pin has an internal pull-up to the input voltage VIN. If it is left open-circuit the module will operate when input power is applied. A small low-leakage (<100 nA) MOSFET is recommended for control. For further information, consult the related application note. An input capacitor is required for proper operation. The capacitor must be rated for a minimum a minimum of 500 mA rms( 750 mA rms for 12-V input) of ripple current. The minimum value of external output capacitance value ensures that VTT meets the specified transient performance requirements for the memory bus terminations. Lower values of capacitance may be possible when the measured peak change in output current is consistently less than 3 A. This is the calculated maximum. The minimum ESR limitation will often result in a lower value. Consult the application notes for further guidance. This is the typcial ESR for all the electrolytic (non-ceramic) output capacitance. Use 7 mΩ as the minimum when using max-ESR values to calculate. 3 PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 Terminal Functions TERMINAL NAME VIN NO. 2 DESCRIPTION The positive input voltage power node to the module, which is referenced to common GND. 1, 7 This is the common ground connection for the VIN and VTT power connections. It is also the 0-VDC reference for the control inputs. VREF 8 The module senses the voltage at this input to regulate the output voltage, VTT. The voltage at VREF is also the reference voltage for the system bus receiver comparators. It is normally set to precisely half the bus driver supply voltage (VDDQ÷ 2), using a resistor divider. The Thevenin impedance of the network driving the VREF pin should not exceed 500 Ω. See the Typical DDR Application Diagram in the Application Information section for reference. VTT 6 This is the regulated power output from the module with respect to the GND node, and the tracking termination supply for the application data and address buses. It is precisely regulated to the voltage applied to the module's VREF input, and is active active about 20 ms after a valid input source is applied to the module. Once active it will track the voltage applied at VREF. Vo Sense 5 The sense input allows the regulation circuit to compensate for voltage drop between the module and the load. For optimal voltage accuracy Vo Sense should be connected to VTT. 3 The Inhibit pin is an open-collector/drain negative logic input that is referenced to GND. Applying a low-level ground signal to this input turns off the output voltage, VTT. Although the module is inhibited, a voltage, VDDQ will be present at the output terminals, fed through the DDR memory. When the Inhibit is active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open circuit, the module will produce an output whenever a valid input source is applied. See the Typical DDR Application Diagram in the Application Information section for reference. GND Inhibit N/C 4, 9, 10 No connection 1 10 9 8 7 PTHXX010 (Top View) 2 6 3 4 4 5 PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 TYPICAL CHARACTERISTICS (VREF = 1.25 V ) (1) (2) EFFICIENCY vs LOAD CURRENT OUTPUT RIPPLE vs LOAD CURRENT POWER DISSIPATION vs LOAD CURRENT 60 10 0 5 VIN = 3.3 V Output Ripple − mV Efficiency − % VIN = 12 V 80 VIN = 5 V 70 40 20 10 0 3 6 9 12 IL − Load Current − A VIN = 5 V VIN = 3.3 V 30 60 50 0 15 VIN = 12 V 0 3 6 9 12 1 VIN = 3.3 V 0 3 6 9 2 IL − Load Current − A 15 Figure 3. 90 80 70 100 LFM 200 LFM 60 400 LFM 50 40 30 0 3 Nat Conv 80 Nat Cinv TA− Ambient Temperature 5−C TA− Ambient Temperature 5−C VIN = 5 V PTH12010Y ONLY; VIN = 12 V TEMPERATURE DERATING vs LOAD CURRENT 90 (2) 2 0 15 VIN = 12 V 3 Figure 2. PTH03010Y/PTH05010Y AT NOMINAL VIN TEMPERATURE DERATING vs LOAD CURRENT (1) 4 IL − Load Current − A Figure 1. 20 PD − Power Dissipation − W 50 90 6 9 12 15 100 LFM 70 400 LFM 200 LFM 60 50 40 30 20 0 VIN = 12 V IL − Load Current − A 2 3 4 6 IL − Load Current − A Figure 4. Figure 5. 8 10 The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the converter. Applies to Figure 1, Figure 2, and Figure 3. The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to modules soldered directly to a 4 in x 4 in double-sided PCB with 1 oz. copper. For surface mount packages (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around the power pins. Please refer to the mechanical specification for more information. Applies to Figure 4, and Figure 5. 5 PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 TYPICAL CHARACTERISTICS TRANSIENT PERFORMANCE FOR ∆3-A LOAD CHANGE PTH03010Y/PTH05010Y: SOURCE-SINK-SOURCE TRANSIENT 100 ms/div Figure 6. 6 PTH12010Y: SOURCE-SINK-SOURCE TRANSIENT VTT − VREF VTT − VREF (50 mV/div) (50 mV/div) ITT (2A/div) ITT (2A/div) 100 ms/div Figure 7. PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 APPLICATION INFORMATION Typical DDR Application Diagram Auto-Track VI= 5V VI + Margin ± +Sense PTH05010W VDDQ I/O Memory +VADJ Inhibit 470 µF 5.51 kΩ 47 µF VI + 220 µF Inhibit PTH05050Y DDR Termination VDDQ = 1.8 V VO + 2× 330 µF 2× 22 µF VTT = 0.9 V VTT +VREF DDRII/ QDRII + 2× 330 µF 2× 22 µF 1 kΩ 47 µF 1 kΩ UDG−05096 CAPACITOR RECOMMENDATIONS FOR THE PTH03010Y AND PTH05010Y DDR POWER MODULES (3.3-V/5-V OPTION) Input Capacitor The recommended input capacitor(s) is determined by the 470 µF minimum capacitance and 500 mArms minimum ripple current rating. Ripple current, less than 160 mΩ equivalent series resistance (ESR), and temperature are the major considerations when selecting input capacitors. Unlike polymer tantalum, regular tantalum capacitors have a recommended minimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to ensure reliability. For improved ripple reduction on the input bus, ceramic capacitors may used to complement electrolytic types to achieve the minimum required capacitance. Output Capacitors For applications with load transients (sudden changes in load current), regulator response benefits from external output capacitance. The recommended output capacitance of 470 µF will allow the modue to meet its transieint response specification. (See Electrical Specifications table). For most applications, a high quality computer-grade aluminum electrolytic capacitor is adequate. These capacitors provide decoupling over the frequency range, 2 kHz to 150 kHz, and are suitable for ambient temperatures above 0°C. Below 0°C, tantalum, ceramic or Os-Con type capacitors are recommended. When using one or more nonceramic capacitors, the calculated equivalent ESR should be no lower than 4 mΩ (7 mΩ using the manufacturer’s maximum ESR for a single capacitor). A list of preferred low-ESR type capacitors are identified in Table 1. In addition to electrolytic capacitance, adding a 10-µF to 22-µF X5R/X7R ceramic capacitor to the output reduces the output ripple voltage and improve the regulator’s transient response. The measurement of both the output ripple and transient response is also best achieved across a 10-µF ceramic capacitor. 7 PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 APPLICATION INFORMATION (continued) Ceramic Capacitors Above 150 kHz the performance of aluminum electrolytic capacitors becomes less effective. To further improve the reflected input ripple current or the output transient response, multilayer ceramic capacitors can be added. Ceramic capacitors have very low ESR and their resonant frequency is higher than the bandwidth of the regulator. When used on the output their combined ESR is not critical as long as the total value of ceramic capacitance does not exceed 300 µF. Also, to prevent the formation of local resonances, do not place more than five identical ceramic capacitors in parallel with values of 10 µF or greater. Tantalum Capacitors Tantalum type capacitors can be used at both the input and output, and are recommended for applications where the ambient operating temperature can be less than 0°C. The AVX TPS, Sprague 593D/594/595, and Kemet T495/T510 capacitor series are suggested over many other tantalum types due to their higher rated surge, power dissipation, and ripple current capability. As a caution, many general-purpose tantalum capacitors have considerably higher ESR, reduced power dissipation and lower ripple current capability. These capacitors are also less reliable as they have lower power dissipation and surge current ratings. Tantalum capacitors that do not have a stated ESR or surge current rating are not recommended for power applications. When specifying Os-Con and polymer tantalum capacitors for the output, the minimum ESR limit is encountered before the maximum capacitance value is reached. Capacitor Table Table 1 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple current (rms) ratings. The recommended number of capacitors required at both the input and output buses is identified for each capacitor type. This is not an extensive capacitor list. Capacitors from other vendors are available with comparable specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical parameters necessary to ensure both optimum regulator performance and long capacitor life. Table 1. Input/Output Capacitors (1) Capacitor Characteristics Working Voltage (V) Value (µF) Max ESR at 100 kHz (Ω) Max Ripple Current at 85°C (Irms) (mA) FC (Radial) 10 470 0.117 FC (SMD) 10 470 0.150 FK (SMD) 10 470 0.160 Capacitor Vendor, Type/Series (Style) Quantity Vendor Part Number Physical Size (mm) Input Bus Output Bus 555 8 × 11,5 1 1 EEUFC1A471 670 10 × 10,2 1 1 EEUFC1A471P 600 8× 10,2 1 1 EEVFK1A471P PXA6.3VC471MJ80TP Panasonic, Aluminum United Chemi-Con PXA, Poly-Aluminum (SMD) 6.3 470 0.020 4130 10 × 7,7 1 ≤2 PS, Poly-Aluminum (Radial) 10 470 0.012 5300 10 × 12,5 1 ≤1 10PS470MJ12 LXZ, Aluminum (Radial) 16 470 0.120 555 8 × 12 1 1 LXZ10VB471M8X12LL Nichicon Aluminum WG(SMD) 10 470 0.150 670 mA 10 × 10 1 1 UWG1A471MNR1GS HD (Radial) 10 470 0.072 760 8 × 11,5 1 1 UHD1A471MPR PM (Radial) 10 470 0.130 600 10 × 12,5 1 1 UPM1A471MPH6 (1) 8 Capacitor Supplier Verification Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term consideration for obsolescence. RoHS, Lead-free and Material Details Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements. Component designators or part number deviations can occur when material composition or soldering requirements are updated. PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 APPLICATION INFORMATION (continued) Table 1. Input/Output Capacitors (continued) Capacitor Characteristics Working Voltage (V) Value (µF) Max ESR at 100 kHz (Ω) Max Ripple Current at 85°C (Irms) (mA) 6.3 180 0.005 4000 SEPC, Os-con (Radial) 6.3 470 0.008 SVP, (SMD) 6.3 470 0.015 TPE, Poscap (SMD) 6.3 470 AVX, Tantalum TPS (SMD) 10 Capacitor Vendor, Type/Series (Style) Quantity Physical Size (mm) Vendor Part Number Input Bus Output Bus 7,3 × 4,3 × 4,2 2 (2) N/R (3) 5700 10 × 13 1 ≤1 6SEPC470M 4200 11 × 11,9 1 ≤2 6SVP470M 0.018 3500 7,3 × 4,3 1 ≤2 6TPE470MI 470 0.045 1723 1 ≤5 TPSE477M010R0045 10 470 0.060 1826 7,3 L × 5,7 W × 4,1 H 1 ≤5 TPSV477M010R0060 T520, (SMD) 10 330 0.040 1800 ≤5 T520X337M010AS 10 330 0.010 5200 4,3 W × 7,3 L ×4H 2 T530, (SMD) 2 ≤1 T530X337M010ASE010 Panasonic, Poly-Aluminum: S/SE (SMD) EEFSE0J181R Sanyo Kemet, Poly-Tantalum Vishay-Sprague 595D, Tantalum (SMD) 10 470 0.100 1440 7,2 L × 6 W 1 ≤5 595D477x0010r2t 94SP, Poly Aluminum (Radial) 10 470 0.015 4510 10 × 10 1 ≤2 94SP477X0010FBP 94SVP, Poly-Aluminum (SMD) 6.3 470 0.017 3960 8 × 12 1 ≤3 94SVP477X06R3E12 Kemet, Ceramic X5R (SMD) 16 10 0.002 – 3225 mm 1 ≤5 C1210C106M4PAC 6.3 47 3225 mm 1 ≤5 C1210C476K9PAC 6.3 100 3225 mm 1 (4) ≤3 GRM32ER60J107M 6.3 47 3225 mm 1 (4) ≤5 GRM32ER60J476M Murata, Ceramic X5R (SMD) TDK, Ceramic X5R (SMD) (2) (3) (4) 0.002 – 16 22 1 (4) ≤5 GRM32ER61C226K 16 10 1 (4) ≤5 GRM32DR61C106K 6.3 100 3225 mm 1 (4) ≤3 C3225X5R0J107MT 6.3 47 3225 mm 1 (4) ≤5 C3225X5R0J476MT 16 22 1 (4) ≤5 C3225X5R1C226MT 16 10 1 (4) ≤5 C3225X5R1C106MT 0.002 – A total capacitance of 360 µF is acceptable based on the combined ripple current rating. N/R –Not recommended. The capacitor voltage rating does not meet the minimum derated operating limits. A ceramic capacitor is recoommended to compliment electrolytic types at the input to further reduce high-frequency ripple current. Designing for Very Fast Load Transients The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of 1 A/µs. The typical voltage deviation for this load transient is given in the data sheet specification table using the optional value of output capacitance. As the di/dt of a transient is increased, the response of a converter's regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability. If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional output capacitor decoupling. In these cases special attention must be paid to the type, value and ESR of the capacitors selected. If the transient performance requirements exceed that specified in the data sheet, or the total amount of load capacitance is above 8200 µF, the selection of output capacitors becomes more important. 9 PTH03010Y PTH05010Y PTH12010Y SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 www.ti.com CAPACITOR RECOMMENDATIONS FOR THE PTH12010Y DDR POWER MODULES (12-V OPTION) INPUT CAPACITOR The recommended input capacitance is determined by the 560 µF minimum capacitance and 750 mArms minimum ripple current rating. A 10-µF X5R/X7R ceramic capacitor may also be added to reduce the reflected input ripple current. The ceramic capacitor should be located between the input electrolytic and the module. Ripple current, less than 100 mΩ equivalent series resistance (ESR) and temperature are major considerations when selecting input capacitors. Unlike polymer-tantalum capacitors, regular tantalum capacitors have a recommended minimum voltage rating of 2 × (max dc voltage + ac ripple). This is standard practice to ensure reliability. No tantalum capacitors were found with sufficient voltage rating to meet this requirement. At temperatures below 0°C, the ESR of aluminum electrolytic capacitors increases. For these applications, Os-Con, polymer-tantalum, and polymer-aluminum types should be considered. OUTPUT CAPACITORS For applications with load transients (sudden changes in load current), regulator response benefits from external output capacitance. The recommended output capacitance of 940 µF will allow the modue to meet its transieint response specification. (See Electrical Specifications table). For most applications, a high quality computer-grade aluminum electrolytic capacitor is adequate. These capacitors provide decoupling over the frequency range, 2 kHz to 150 kHz, and are suitable for ambient temperatures above 0°C. Below 0°C, tantalum, ceramic or Os-Con type capacitors are recommended. When using one or more nonceramic capacitors, the calculated equivalent ESR should be no lower than 4 mΩ (7 mΩ using the manufacturer’s maximum ESR for a single capacitor). A list of preferred low-ESR type capacitors are identified in Table 2. In addition to electrolytic capacitance, adding a 10-µF to 22-µF X5R/X7R ceramic capacitor to the output reduces the output ripple voltage and improve the regulator’s transient response. The measurement of both the output ripple and transient response is also best achieved across a 10-µF ceramic capacitor. CERAMIC CAPACITORS Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramic capacitors have very low ESR and a resonant frequency higher than the bandwidth of the regulator. They can be used to reduce the reflected ripple current at the input as well as improve the transient response of the output. When used on the output, their combined ESR is not critical as long as the total value of ceramic capacitance does not exceed 300 µF. Also, to prevent the formation of local resonances, do not place more than five identical ceramic capacitors in parallel with values of 10 µF or greater. TANTALUM CAPACITORS Tantalum type capacitors are most suited for use on the output bus, and are recommended for applications where the ambient operating temperature can be less than 0°C. The AVX TPS, Sprague 593D/594/595 and Kemet T495/T510 capacitor series are suggested over other tantalum types due to their higher rated surge, power dissipation, and ripple current capability. As a caution, many general purpose tantalum capacitors have considerably higher ESR, reduced power dissipation and lower ripple current capability. These capacitors are also less reliable as they have lower power dissipation and surge current ratings. Tantalum capacitors that do not have a stated ESR or surge current rating are not recommended for power applications. When specifying Os-con and polymer tantalum capacitors for the output, the minimum ESR limit are encountered well before the maximum capacitance value is reached. CAPACITOR TABLE Table 2 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple current (rms) ratings. The recommended number of capacitors required at both the input and output buses is identified for each capacitor type. This is not an extensive capacitor list. Capacitors from other vendors are available with comparable specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical parameters necessary to insure both optimum regulator performance and long capacitor life. 10 PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 Table 2. Input/Output Capacitors (1) CAPACITOR CHARACTERISTICS CAPACITOR VENDOR, TYPE/SERIES, (STYLE) WORKING VOLTAGE VALUE (µF) MAX. ESR AT 100 kHz MAX RIPPLE CURRENT AT 85°C (lrms) QUANTITY PHYSICAL SIZE (mm) INPUT BUS OPTIONAL OUTPUT BUS VENDOR PART NUMBER Panasonic, Aluminum (FC) 25 V 560 0.065 Ω 1205 mA 12,5 x 15 1 1 EEUFC1E561S FC, Radial 25 V 1000 0.060 Ω 1100 mA 12,5 x 13,5 1 1 EEVFK1E102Q FK, (SMD) 35 V 680 0.060 Ω 1100 mA 12,5 x 13,5 1 1 EEVFK1V681Q PS, Poly-Aluminum (Radial) 16 V 330 0.014 Ω 5050 mA 10 x 12,5 2 ≤2 16PS330MJ12 LXZ, Aluminium (Radial) 16 V 680 0.068 Ω 1050 mA 10 x 16 1 1 LXZ16VB681M10X16LL PXA, Poly-Aluminum (SMD) 16 V 330 0.014 Ω 5050 mA 10 x 12,2 2 ≤2 PXA16VC331MJ12TP Nichicon, Aluminum (PM) 25 V 560 0.060 Ω 1060 mA 12,5 x 15 1 1 UPM1E561MHH6 HD, (Radial) 16 V 680 0.038 Ω 1430 mA 10 x 16 1 1 UHD1C681MPR PM, (Radial) 35 V 560 0.048 Ω 1360 mA 16 x 15 1 1 UPM1V561MHH6 Sanyo TPE Poscap (SMD) 10 V 330 0.025 Ω 3000 mA 7,3 L x 5,7 W N/R (2) ≤3 10TPE330M SEQP, Os-Con (Radial) 16 V 330 0.016 Ω >4720 mA 10 x 13 2 ≤2 16SEQP330M SVP, Os-Con (SMD) 16 V 330 0.016 Ω 4700 mA 11 x 12 2 ≤2 16SVP330M AVX, Tantalum Series III TPS (SMD) 10 V 470 0.045 Ω >1723 mA 7,3L x 5,7W N/R (2) ≤5 (3) 10 V 330 0.045 Ω >1723 mA x 4,1H N/R (2) ≤5 (3) T520, Poly-Tantalum (SMD) 10 V 330 0.040 Ω 1800 mA 7,3 L N/R (2) ≤5 T520X337M010AS T530, Poly-Tant/Organic 10 V 330 0.010 Ω >3800 mA x 4,3 W N/R (2) ≤1 T530X337M010ASE010 6.3 V 470 0.005 Ω 4200 mA x4H N/R (2) ≤1 (3) United Chemi-Con TPSE477M010R0045 TPSE377M010R0045 Kemet T530X477M006AS E005 Vishay-Sprague 595D, Tantalum (SMD) 10 V 470 0.100 Ω 1440 mA 7,2L x 6W x 4,1H N/R (2) ≤5 (3) 94SA, Os-con (Radial) 16 V 1000 0.015Ω 9750 mA 16 x 25 1 ≤2 94SA108X0016HBP 94SVP, Os-CON(SMD) 16V 330 0.017Ω 4580 mA 10 x 12,7 2 (4) ≤2 94SVP337X0016F12 Kemet, Ceramic X5R (SMD) 16 V 10 0.002 Ω - 3225 mm 1 (5) ≤5 C1210C106M4PAC 6.3 V 47 0.002 Ω 3225 mm N/R (2) ≤5 C1210C476K9PAC Murata, Ceramic X5R (SMD) 6.3 V 100 0.002 Ω 3225 mm N/R (2) ≤3 GRM32ER60J107M 16 V 47 3225 mm 1 (5) ≤5 GRM32ER61CJ476K 16 V 22 1 (5) ≤5 GRM32ER61C226K 16 V 10 1 (5) ≤5 GRM32DR61C106K 6.3 V 100 3225 mm N/R (2) ≤3 C3225X5R0J107MT 3225 mm N/R (2) TDK, Ceramic X5R (SMD) (1) (2) (3) (4) (5) 0.002 Ω - - 595D477X0010R2T 6.3 V 47 ≤5 C3225X5R0J476MT 16 V 22 1 (5) ≤5 C3225X5R1C226MT 16 V 10 1 (5) ≤5 C3225X5R1C106MT Capacitor Supplier Verification Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term consideration for obsolescence. RoHS, Lead-free and Material Details Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements. Component designators or part number deviations can occur when material composition or soldering requirements are updated. N/R –Not recommended. The capacitor voltage rating does not meet the minimum derated operating limits. The voltage rating of this capacitor only allows it to be used for output voltages that are equal to or less than 5.1 V. A total capacitance of 540 µF is acceptable based on the combined ripple current rating. A ceramic capacitor can be used to complement electrolytic types at the input further reduce high-frequency ripple current. 11 PTH03010Y PTH05010Y PTH12010Y SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 www.ti.com DESIGNING FOR VERY FAST LOAD TRANSIENTS The transient response of the DC/DC converter has been characterized using a load transient with a di/dt of 1 A/µs. The typical voltage deviation for this load transient is given in the data sheet specification table using the optional value of output capacitance. As the di/dt of a transient is increased, the response of a converter’s regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability. If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional output capacitor decoupling. In these cases special attention must be paid to the type, value and ESR of the capacitors selected. If the transient performance requirements exceed that specified in the data sheet, or the total amount of load capacitance is above 6600 µF, the selection of output capacitors becomes more important. 12 PTH03010Y PTH05010Y PTH12010Y www.ti.com SLTS223A – MARCH 2004 – REVISED OCTOBER 2005 TAPE AND REEL SPECIFICATION TRAY SPECIFICATION 13 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty PTH03010YAD ACTIVE DIP MOD ULE EUH 10 25 Pb-Free (RoHS) Call TI N / A for Pkg Type PTH03010YAH ACTIVE DIP MOD ULE EUH 10 25 Pb-Free (RoHS) Call TI N / A for Pkg Type PTH03010YAS ACTIVE DIP MOD ULE EUJ 10 25 TBD Call TI Level-1-235C-UNLIM PTH03010YAST ACTIVE DIP MOD ULE EUJ 10 250 TBD Call TI Level-1-235C-UNLIM PTH03010YAZ ACTIVE DIP MOD ULE EUJ 10 25 Pb-Free (RoHS) Call TI Level-3-260C-168 HR PTH03010YAZT ACTIVE DIP MOD ULE EUJ 10 250 Pb-Free (RoHS) Call TI Level-3-260C-168 HR PTH05010YAH ACTIVE DIP MOD ULE EUH 10 25 Pb-Free (RoHS) Call TI N / A for Pkg Type PTH05010YAS ACTIVE DIP MOD ULE EUJ 10 25 TBD Call TI Level-1-235C-UNLIM PTH05010YAST ACTIVE DIP MOD ULE EUJ 10 250 TBD Call TI Level-1-235C-UNLIM PTH05010YAZ ACTIVE DIP MOD ULE EUJ 10 25 Pb-Free (RoHS) Call TI Level-3-260C-168 HR PTH05010YAZT ACTIVE DIP MOD ULE EUJ 10 250 Pb-Free (RoHS) Call TI Level-3-260C-168 HR PTH12010YAH ACTIVE DIP MOD ULE EUH 10 25 Pb-Free (RoHS) Call TI N / A for Pkg Type PTH12010YAS ACTIVE DIP MOD ULE EUJ 10 25 TBD Call TI Level-1-235C-UNLIM PTH12010YAST ACTIVE DIP MOD ULE EUJ 10 250 TBD Call TI Level-1-235C-UNLIM PTH12010YAZ ACTIVE DIP MOD ULE EUJ 10 25 Pb-Free (RoHS) Call TI Level-3-260C-168 HR PTH12010YAZT ACTIVE DIP MOD ULE EUJ 10 250 Pb-Free (RoHS) Call TI Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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