TI PTH08T210WAH

PTH08T210W
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SLTS262D – OCTOBER 2005 – REVISED OCTOBER 2006
30-A, 5.5-V to 14-V INPUT, NON-ISOLATED,
WIDE OUTPUT ADJUST, POWER MODULE w/TurboTrans™
FEATURES
•
•
•
•
•
•
•
•
•
•
•
Up to 30-A Output Current
5.5-V to 14-V Input Voltage
Wide-Output Voltage Adjust (0.7 V to 3.6 V)
Efficiencies up to 96%
±1.5% Total Output Voltage Variation
On/Off Inhibit
Differential Output Voltage Remote Sense
Adjustable Undervoltage Lockout
Output Overcurrent Protection
(Nonlatching, Auto-Reset)
Operating Temperature: –40°C to 85°C
Safety Agency Approvals: (Pending)
– UL 1950, CSA 22.2 950, EN60950 VDE
•
•
•
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TurboTrans™ Technology
Designed to meet Ultra-Fast Transient
Requirements up to 300 A/µs
Auto-Track™ Sequencing
Multi-Phase, Switch-Mode Topology
APPLICATIONS
•
•
•
Complex Multi-Voltage Systems
Microprocessors
Bus Drivers
DESCRIPTION
The PTH08T210W is a high-performance 30-A rated, non-isolated power module which utilizes a multi-phase,
switch-mode topology. This module represents the 2nd generation of the PTH series power modules which
include a reduced footprint and improved features.
Operating from an input voltage range of 5.5 V to 14 V, the PTH08T210W requires a single resistor to set the
output voltage to any value over the range, 0.7 V to 3.6 V. The wide input voltage range makes the
PTH08T210W particularly suitable for advanced computing and server applications that uses a loosely regulated
8-V to 12-V intermediate distribution bus. The module uses double-sided surface mount construction to provide
a low profile and compact footprint. Package options include both through-hole and surface mount configurations
that are lead (Pb) – free and RoHS compatible.
A new feature included in this 2nd generation of PTH and PTV modules is TurboTrans™ technology (patent
pending). TurboTrans allows the transient response of the regulator to be optimized externally, resulting in a
reduction of output voltage deviation following a load transient and a reduction in required output capacitance.
This feature also offers enhanced stability when used with ultra-low ESR output capacitors.
The PTH08T210W incorporates a comprehensive list of standard features. They include on/off inhibit, a
differential remote output voltage sense which ensures tight load regulation, and an output overcurrent and
overtemperature shutdown to protect against load faults. A programmable undervoltage lockout allows the
turn-on voltage threshold to be customized. AutoTrack™ sequencing is a feature which simplifies the
simultaneous power-up and power-down of multiple modules in a power system by allowing the outputs to track
a common voltage.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TurboTrans, AutoTrack, TMS320 are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2006, Texas Instruments Incorporated
PTH08T210W
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SLTS262D – OCTOBER 2005 – REVISED OCTOBER 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Track
TurboTranst
14
VI
2,6
13
Track
TT
+Sense
VI
PTH08T210W
Inhibit
1
3,4
CI
470 µF
(Required)
VO
−Sense
GND
+
RUVLO
1%
0.05 W
(Opional)
5, 9
+Sense
11
INH/UVLO
GND
VO
10
RTT
1%
0.05 W
(Optional)
7,8
VOAdj
12
RSET
1%
0.05 W
(Required)
+
L
O
A
D
CO
470 µF
(Required)
GND
−Sense
GND
UDG−05097
A.
RSET is required to set the output voltage higher than 0.7 V. See the Electrical Characteristics table.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
2
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DATASHEET TABLE OF CONTENTS
DATASHEET SECTION
PAGE NUMBER
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
3
ELECTRICAL CHARACTERISTICS TABLE (PTH08T210W)
4
TERMINAL FUNCTIONS
6
TYPICAL CHARACTERISTICS (VI = 12V)
7
TYPICAL CHARACTERISTICS (VI = 8V)
8
INPUT & OUTPUT CAPACITOR RECOMMENDATIONS
9
TURBOTRANS™ INFORMATION
13
ADJUSTING THE OUTPUT VOLTAGE
18
UNDERVOLTAGE LOCKOUT (UVLO)
20
SOFT-START POWER-UP
21
REMOTE SENSE
21
OUTPUT INHIBIT
22
OVER-CURRENT PROTECTION
22
OVER-TEMPERATURE PROTECTION
23
AUTO-TRACK SEQUENCING
23
TAPE & REEL AND TRAY DRAWINGS
26
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
(Voltages are with respect to GND)
Signal input voltage
Track control (pin 14)
TA
Operating temperature range Over VI range
Twave
Wave soldering temperature
Surface temperature of module body or pins
(20 seconds)
Treflow
Solder reflow temperature
Surface temperature of module body or pins
(20 seconds)
Tstg
Storage temperature
V
–40 to 85
PTH08T210WAD
260
PTH08T210WAS
235 (1)
PTH08T210WAZ
260 (1)
Mechanical shock
Per Mil-STD-883D, Method 2002.3 1 msec, ½ sine, mounted
250
Mechanical vibration
Mil-STD-883D, Method 2007.2 20-2000 Hz
15
Flammability
(2)
UNIT
°C
–40 to 125 (2)
Weight
(1)
UNIT
–0.3 to VI + 0.3
8.5
G
grams
Meets UL94V-O
During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above the
stated maximum.
The shipping tray or tape & reel cannot be used to bake parts at temperatures higher than 65°C.
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ELECTRICAL CHARACTERISTICS
TA =25°C, VI = 12 V, VO = 3.3 V, CI = 470 µF, CO = 470 µF OS-CON, and IO = IO max (unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
0
25
60°C, 200 LFM
0
30
IO
Output current
VI
Input voltage range
Over IO range
5.5
14
Output adjust range
Over IO range
0.7
3.6
±1
Set-point voltage tolerance
VO
η
±0.3
%Vo
±4
mV
Load regulation
Over IO range
±7
Total output variation
Includes set-point, line, load, –40°C ≤ TA ≤ 85°C
IO = 26 A
RSET = 1.62 kΩ, VO = 3.3 V
93%
RSET = 5.23 kΩ, VO = 2.5 V
91%
RSET = 12.7 kΩ, VO = 1.8 V
89%
RSET = 19.6 kΩ, VO = 1.5 V
89%
RSET = 35.7 kΩ, VO = 1.2 V
87%
RSET = 63.4 kΩ, VO = 1.0 V
84%
Open, VO = 0.7 V
80%
%Vo
25
mVPP
Overcurrent threshold
Reset, followed by auto-recovery
55
A
w/o TurboTrans
CO = 470 µF
Transient response
w/o TurboTrans
CO = 940 µF, Type C
2.5 A/µs load step
50 to 100% IOmax
w/ TurboTrans
CO = 940 µF, Type C
Track input current (pin 14) Pin to GND
dVtrack/dt
Track slew rate capability
CO ≤ CO (max)
UVLOADJ
Adjustable Undervoltage
lockout (pin 1)
Pin 1 open
Recovery time
50
µs
VO over/undershoot
150
mV
Recovery time
50
µs
VO over/undershoot
125
mV
Recovery time
50
µs
VO over/undershoot
85
mV
–130 (2)
1
VI increasing
5
VI decreasing
4.1
Input low voltage (VIL)
-0.2
Input low current (IIL)
Iin
Input standby current
Inhibit (pin 1) to GND, Track (pin 14) open
fs
Switching frequency
Over VI and IO ranges
CI
External input capacitance
5.5
Open (3)
Input high voltage (VIH)
Inhibit control (pin 1)
(4)
(1)
20-MHz bandwidth
IIL
(3)
mV
±1.5
VO Ripple (peak-to-peak)
∆VtrTT
(2)
V
%Vo
Over VI range
ttrTT
(1)
V
–40°C < TA < 85°C
∆Vtr
∆Vtr
A
Line regulation
ttr
ttr
(1)
UNIT
Temperature variation
Efficiency
ILIM
4
MAX
25°C, natural convection
470
(4)
0.6
µA
V/ms
V
V
125
µA
3
mA
480
kHz
µF
The set-point voltage tolerance is affected by the tolerance and stability of RSET. The stated limit is unconditionally met if RSET has a
tolerance of 1% with 100 ppm/°C or better temperature stability.
A low-leakage (<100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 14. The
open-circuit voltage is less than 5 Vdc.
This control pin has an internal pullup. If it is left open-circuit, the module operates when input power is applied. A small, low-leakage
(<100 nA) MOSFET is recommended for control. The open-circuit voltage is less than 5 Vdc. For additional information, see the related
application note.
A 470 µF electrolytic input capacitor is required for proper operation. The capacitor must be rated for a minimum of 500 mA rms of ripple
current.
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ELECTRICAL CHARACTERISTICS (continued)
TA =25°C, VI = 12 V, VO = 3.3 V, CI = 470 µF, CO = 470 µF OS-CON, and IO = IO max (unless otherwise stated)
PARAMETER
TEST CONDITIONS
w/out TurboTrans
CO
External output
capacitance
Capacitance
Value
MIN
Nonceramic
470
(5)
Ceramic
Equivalent series resistance (nonceramic)
Capacitance Value
w/ TurboTrans
Reliability
Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign
MAX
UNIT
12,000
(6)
µF
5000
3
(7)
See TT
chart (8)
mΩ
12,000
(9)
10,000
Capacitance × ESR product (CO × ESR)
MTBF
TYP
(10)
3.6
µF
µF × mΩ
106 Hr
(5)
A minimum value of external output capacitor is required for proper operation. Adding additional capacitance at the load further improves
transient response. See the Capacitor Application Information section for more guidance.
(6) This is the calculated maximum. This value includes both ceramic and non-ceramic capacitors. The minimum ESR requirement often
results in a lower value. See the related Application Information for more guidance.
(7) This is the minimum ESR for all the electrolytic (nonceramic) capacitance. Use 5 mΩ as the minimum when using manufacturer's
max-ESR values to calculate.
(8) Minimum capacitance will be determined by your transient deviation requirement. A corresponding resistor, RTT is required for proper
operation. See the TurboTrans Selection section for guidance in selecting the capacitance and RTT value.
(9) This is the calculated maximum. This value includes both ceramic and non-ceramic capacitors.
(10) When calculating the Capacitance × ESR product use the capacitance and ESR values of a single capacitor. For an output capacitor
bank of several capacitor types and values, calculate the C × ESR product using the values of the capacitor that makes up the majority
of the capacitance.
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PTH08T210W
(TOP VIEW)
1
14
13
12
11
2
3
4
5
6
7
8
9
10
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
NAME
NO.
VI
2, 6
The positive input voltage power node to the module, which is referenced to common GND.
VO
5, 9
The regulated positive power output with respect to the GND.
GND
3, 4
7, 8
This is the common ground connection for the VI and VO power connections. It is also the 0 Vdc reference for
the control inputs.
Inhibit (1)/
UVLO adjust
1
The Inhibit pin is an open-collector/drain, negative logic input that is referenced to GND. Applying a low level
ground signal to this input disables the module’s output and turns off the output voltage. When the Inhibit control
is active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open-circuit, the
module produces an output whenever a valid input source is applied. This input is not compatible with TTL logic
devices and should not be tied to VI or any other voltage.
This pin is also used for input undervoltage lockout (UVLO) programming. Connecting a resistor from this pin to
GND (pin 3) allows the ON threshold of the UVLO to be adjusted higher than the default value. For more
information, see the Application Information section.
Vo Adjust
12
A 0.1 W 1% resistor must be directly connected between this pin and pin 8 (GND) to set the output voltage to a
value higher than 0.7 V. The temperature stability of the resistor should be 100 ppm/°C (or better). The setpoint
range for the output voltage is from 0.7 V to 3.6 V. If left open circuit, the output voltage will default to its lowest
value. For further information, on output voltage adjustment see the related application note. The specification
table gives the preferred resistor values for a number of standard output voltages.
+ Sense
10
The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.
For optimal voltage accuracy, +Sense must be connected to VO , very close to the load.
– Sense
11
The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.
For optimal voltage accuracy, –Sense must be connected to GND (pin 8), very close to the load.
Track
14
This is an analog control input that enables the output voltage to follow an external voltage. This pin becomes
active typically 20 ms after the input voltage has been applied, and allows direct control of the output voltage
from 0 V up to the nominal set-point voltage. Within this range the module's output voltage follows the voltage at
the Track pin on a volt-for-volt basis. When the control voltage is raised above this range, the module regulates
at its set-point voltage. The feature allows the output voltage to rise simultaneously with other modules powered
from the same input bus. If unused, this input should be connected to VI.
NOTE: Due to the undervoltage lockout feature, the output of the module cannot follow its own input voltage
during power up. For more information, see the related application note.
TurboTrans™
(1)
6
13
This input pin adjusts the transient response of the regulator. To activate the TurboTrans™ feature, a 1%, 50
mW resistor must be connected between this pin and pin 10 (+Sense) very close to the module. For a given
value of output capacitance, a reduction in peak output voltage deviation is achieved by using this feature. If
unused, this pin must be left open-circuit. External capacitance must never be connected to this pin. The
resistance requirement can be selected from the TurboTrans™ resistor table in the Application Information
section.
Denotes negative logic: Open = Normal operation, Ground = Function active
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TYPICAL CHARACTERISTICS (1) (2)
CHARACTERISTIC DATA (VI = 12 V)
EFFICIENCY
vs
LOAD CURRENT
OUTPUT RIPPLE
vs
LOAD CURRENT
16
VO − Output Voltage Ripple − VPP mV
VO = 3.3 V
90
Efficiency − %
80
VO = 1.8 V
VO = 1.5 V
VO = 2.5 V
70
VO = 1.2 V
VO = 0.7 V
60
50
40
5
10
15
20
25
IO − Output Current − A
VO = 1.8 V
VO = 1.5 V
12
10
8
VO = 1.2 V
VO = 3.3 V
7
VO = 2.5 V
6
VO = 1.8 V
5
VO = 1.5 V
4
VO = 1.2 V
3
2
1
VO = 0.7 V
VO = 0.7 V
30
0
0
5
10
15
20
25
0
30
5
IO − Output Current − A
Figure 1.
10
15
20
25
IO − Output Current − A
Figure 2.
30
Figure 3.
AMBIENT CURRENT
vs
OUTPUT CURRENT
AMBIENT TEMPERATURE
vs
OUTPUT CURRENT
90
90
80
TA− Ambient Temperature − oC
TA− Ambient Temperature − oC
8
VO = 2.5 V
14
6
0
9
VO = 3.3 V
PD − Power Dissipation − W
100
30
POWER DISSIPATION
vs
LOAD CURRENT
Nat Conv
70
100 LFM
60
200 LFM
50
400 LFM
40
30
80
Nat Conv
70
100 LFM
60
200 LFM
50
400 LFM
40
VO = 1.2 V
30
VO = 3.3 V
20
20
0
5
10
15
20
IO − Output Current − A
25
30
0
5
10
15
20
IO − Output Current − A
Figure 4.
(1)
(2)
25
30
Figure 5.
The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 1, Figure 2, and Figure 3.
The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm × 100 mm double-sided PCB with 2 oz. copper.
Applies to Figure 5 and Figure 4.
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TYPICAL CHARACTERISTICS (1) (2)
CHARACTERISTIC DATA (VI = 8 V)
EFFICIENCY
vs
LOAD CURRENT
OUTPUT RIPPLE
vs
LOAD CURRENT
7
12
VO − Output Voltage Ripple − VPP mV
VO = 3.3 V
90
VO = 1.2 V
VO = 1.5 V
80
70
VO = 0.7 V
VO = 2.5 V
VO = 1.8 V
60
50
10
VO = 2.5 V
VO = 1.8 V
VO = 1.5 V
8
6
VO = 1.2 V
VO = 0.7 V
0
5
10
15
20
25
IO − Output Current − A
5
10
15
20
25
IO − Output Current − A
Figure 6.
VO = 1.8 V
4
VO = 1.5 V
3
2
VO = 1.2 V
VO = 0.7 V
0
30
5
10
15
20
IO − Output Current − A
Figure 7.
25
30
Figure 8.
AMBIENT TEMPERATURE
vs
OUTPUT CURRENT
AMBIENT TEMPERATURE
vs
OUTPUT CURRENT
90
90
80
TA− Ambient Temperature − oC
TA − Ambient Temperature −oC
5
0
0
30
VO = 2.5 V
1
4
40
VO = 3.3 V
6
VO = 3.3 V
PD − Power Dissipation − W
100
Efficiency − %
POWER DISSIPATION
vs
LOAD CURRENT
Nat Conv
70
100 LFM
60
200 LFM
400 LFM
50
40
30
80
Nat Conv
100 LFM
70
200 LFM
60
400 LFM
50
40
VO = 1.2 V
30
VO = 3.3 V
20
20
0
5
10
15
20
25
IO − Output Current − A
30
0
5
Figure 9.
(1)
(2)
8
10
15
20
25
IO − Output Current − A
30
Figure 10.
The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 6, Figure 7, and Figure 8.
The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm × 100 mm double-sided PCB with 2 oz. copper.
Applies to Figure 9 and Figure 10.
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APPLICATION INFORMATION
CAPACITOR RECOMMENDATIONS FOR THE PTH08T210W POWER MODULE
Input Capacitor (Required)
The size and value of the input capacitor is determined by the converter’s transient performance capability. The
minimum amount of required input capacitance is 470 µF, with an RMS ripple current rating of 500 mA. This
minimum value assumes that the converter is supplied with a responsive, low inductance input source. This
source should have ample capacitive decoupling, and be distributed to the converter via PCB power and ground
planes.
For high-performance/transient applications, or wherever the input source performance is degraded, 1000 µF of
input capacitance is recommended. The additional input capacitance above the minimum level insures an
optimized performance.
Ripple current (rms) rating, less than 100 mΩ of equivalent series resistance (ESR), and temperature are the
main considerations when selecting input capacitors. The ripple current reflected from the input of the
PTH08T210W module is moderate to low. Therefore any good quality, computer-grade electrolytic capacitor will
have an adequate ripple current rating.
Regular tantalum capacitors are not recommended for the input bus. These capacitors require a recommended
minimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to ensure reliability.
No tantalum capacitors were found with a sufficient voltage rating to meet this requirement. When the operating
temperature is below 0°C, the ESR of aluminum electrolytic capacitors increases. For these applications,
Os-Con, poly-aluminum, and polymer-tantalum types should be considered. Adding one or two ceramic
capacitors to the input attenuates high-frequency reflected ripple current.
TurboTrans Output Capacitor
The PTH08T210W requires a minimum output capacitance of 470 µF. The required capacitance above 470µF
will be determined by actual transient deviation requirements.
TurboTrans allows the designer to optimize the capacitance load according to the system transient design
requirement. High quality, ultra-low ESR capacitors are required to maximize TurboTrans effectiveness.
Capacitors with a capacitance (µF) × ESR (mΩ) product of ≤ 10,000 mΩ×µF are required.
Working Example:
A bank of 6 identical capacitors, each with a capacitance of 680 µF and 5 mΩ ESR, has a C × ESR product of
3400 µFxmΩ (680 µF × 5 mΩ).
Using TurboTrans in conjunction with the high quality capacitors (capacitance (µF) × ESR (mΩ)) reduces the
overall capacitance requirement while meeting the minimum transient amplitude level.
Table 1 includes a preferred list of capacitors by type and vendor. See the Output Bus / TurboTrans column.
Note: See the TurboTrans Technology Application Notes within this document for selection of specific
capacitance.
Non-TurboTrans Output Capacitor
The PTH08T210W requires a minimum output capacitance of 470 µF. Non-TurboTrans applications must
observe minimum output capacitance ESR limits.
A combination of 200 µF of ceramic capacitors plus low ESR (15 mΩ to 30 mΩ) Os-Con electrolytic/tantalum
type capacitors can be used. When using Polymer tantalum types, tantalum type, or Oscon types only, the
capacitor ESR bank limit is 3 mΩ to 5 mΩ. (Note: no ceramic capacitors are required). This is necessary for the
stable operation of the regulator. Additional capacitance can be added to improve the module's performance to
load transients. High quality computer-grade electrolytic capacitors are recommended. Aluminum electrolytic
capacitors provide adequate decoupling over the frequency range, 2 kHz to 150 kHz, and are suitable when
ambient temperatures are above -20°C. For operation below -20°C, tantalum, ceramic, or Os-Con type
capacitors are necessary.
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APPLICATION INFORMATION (continued)
When using a combination of one or more non-ceramic capacitors, the calculated equivalent ESR should be no
lower than 2 mΩ (4 mΩ when calculating using the manufacturer’s maximum ESR values). A list of preferred
low-ESR type capacitors, are identified in Table 1.
Ceramic Capacitors
Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramic
capacitors have very low ESR and a resonant frequency higher than the bandwidth of the regulator. They can
be used to reduce the reflected ripple current at the input as well as improve the transient response of the
output.
When used on the output their combined ESR is not critical as long as the total value of ceramic capacitors, with
values between 10 µF and 100 µF, does not exceed 5000 µF (non-TurboTrans). In TurboTrans applications,
when ceramic capacitors are used on the output bus, total capacitance including bulk and ceramic types is not
to exceed 12,000 µF.
Tantalum, Polymer-Tantalum Capacitors
Tantalum type capacitors are only used on the output bus, and are recommended for applications where the
ambient operating temperature is less than 0°C. The AVX TPS series and Kemet capacitor series are suggested
over many other tantalum types due to their higher rated surge, power dissipation, and ripple current capability.
As a caution, many general-purpose tantalum capacitors have higher ESR, reduced power dissipation, and
lower ripple current capability. These capacitors are also less reliable due to their reduced power dissipation and
surge current ratings. Tantalum capacitors that have no stated ESR or surge current rating are not
recommended for power applications.
Capacitor Table
Table 1 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple
current (rms) ratings. The recommended number of capacitors required at both the input and output buses is
identified for each capacitor type.
This is not an extensive capacitor list. Capacitors from other vendors are available with comparable
specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical
parameters necessary to ensure both optimum regulator performance and long capacitor life.
Designing for Fast Load Transients
The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of
2.5 A/µs. The typical voltage deviation for this load transient is given in the Electrical Characteristics table using
the minimum required value of output capacitance. As the di/dt of a transient is increased, the response of a
converter’s regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent
limitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability.
If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with
additional low ESR ceramic capacitor decoupling. Generally, with 50% load steps at > 100 A/µs, adding multiple
10 µF ceramic capacitors, 3225 case size, plus 10 × 1 µF, including numerous high frequency ceramics
(≤ 0.1 µF) are all that is required to soften the transient higher frequency edges. Special attention is essential
with regards to location, types, and position of higher frequency ceramic and lower ESR bulk capacitors. DSP,
FPGA and ASIC vendors identify types, location and capacitance required for optimum performance of the high
frequency devices. The details regarding the PCB layout and capacitor/component placement are important at
these high frequencies. Low impedance buses and unbroken PCB copper planes with components located as
close to the high frequency processor are essential for optimizing transient performance. In many instances
additional capacitors may be required to insure and minimize transient aberrations.
10
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APPLICATION INFORMATION (continued)
Table 1. Input/Output Capacitors (1)
Capacitor Characteristics
Capacitor Vendor,
Type Series (Style)
Working Value
Voltage
(µF)
Quantity
Max.
ESR
at 100
kHz
Max
Ripple
Physical
Current at
Size (mm)
85°C
(Irms)
Output Bus
Input
Bus
No
TurboTrans
TurboTrans
(Cap
Type) (2)
Vendor Part No.
Panasonic
25 V
1000
0.043Ω
>1690 mA
16 × 15
1
≥ 2 (3)
N/R (4)
EEUFC1E102S
FC (Radial)
25 V
1800
0.029Ω
2205 mA
16 × 20
1
≥ 1 (3)
N/R (4)
EEUFC1E182
FC(SMD)
25 V
2200
0.028Ω
>2490 mA
18 × 21,5
1
≥ 1 (3)
N/R (4)
EEVFC1E222N
FK(SMD)
25 V
1000
0.060Ω
1100 mA
12,5×13,5
1
≥ 2 (5)
N/R (4)
EEVFK1V102Q
PTB(SMD) Polymer
Tantalum
6.3 V
470
0.025Ω
2600 mA
7,3x 4,3x
2.8
N/R (6)
≥ 2 ~ ≤ 4 (3)
C ≥ 2 (2)
LXZ, Aluminum (Radial)
25 V
680
0.068Ω
1050 mA
10 × 16
1
≥ 1 ~ ≤ 3 (3)
N/R (4)
PS,
Poly-Aluminum(Radial)
16 V
330
0.014Ω
5060 mA
10 × 12,5
2
≥2~≤3
B ≥ 2 (2)
16PS330MJ12
PXA, Poly-Aluminum
(SMD)
16 V
330
0.014Ω
5050 mA
10 × 12,2
2
≥2~≤3
B ≥ 2 (2)
PXA16VC331MJ12TP
PS,
Poly-Aluminum(Radial)
6.3 V
680
0.010Ω
5500 mA
10 × 12,5
N/R (6)
≥ 1 ~≤ 2
C ≥ 1 (2)
6PS680MJ12
PXA,
Poly-Aluminum(Radial)
6.3 V
470
0.012Ω
4770 mA
8 × 12,2
N/R (6)
≥1~≤2
C ≥ 1 (2)
PXA6.3VC471MH12TP
Nichicon, Aluminum
25 V
470
0.070Ω
985 mA
12,5 × 15
1
≥ 2 (3)
N/R (4)
UPM1E471MHH6
2 (3)
N/R (4)
UHD1E471MHR
UPM1V561MHH6
United Chemi-Con
HD (Radial)
25 V
470
0.038Ω
1430 mA
10 × 16
1
≥
PM (Radial)
35 V
560
0.048Ω
1360 mA
16 × 15
1
≥ 2 (3)
N/R (4)
4000 mA
7,3 L×4,3
W ×4,2H
N/R (6)
N/R (6)
B ≥ 2 (2)
Panasonic,
Poly-Aluminum:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
2.0 V
390
0.005Ω
6PTB477MD8TER
LXZ25VB681M10X20LL
EEFSE0J391R(VO≤1.6V) (7)
Capacitor Supplier Verification
Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of
limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term
consideration for obsolescence.
RoHS, Lead-free and Material Details
See the capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements.
Component designators or part number deviations can occur when material composition or soldering requirements are updated.
Required capacitors with TurboTrans. See the TransTrans Application information for Capacitor Selection
Capacitor Type Groups by ESR (Equivalent Series Resistance) :
•
Type A = (100 < capacitance × ESR ≤ 1000)
•
Type B = (1,000 < capacitance × ESR ≤ 5,000)
•
Type C = (5,001 < capacitance × ESR ≤ 10,000)
Total bulk nonceramic capacitors on the output bus with ESR of ≥ 15mΩ to ≤ 30mΩ requires an additional ≥ 200 µF of ceramic
capacitor.
Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higher
ESR capacitors can be used in conjunction with lower ESR capacitance.
Output bulk capacitor's maximum ESR is ≥ 30 mΩ. Additional ceramic capacitance of ≥ 200 µF is required.
N/R – Not recommended. The voltage rating does not meet the minimum operating limits.
The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.
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APPLICATION INFORMATION (continued)
Table 1. Input/Output Capacitors (continued)
Capacitor Characteristics
Capacitor Vendor,
Type Series (Style)
Working Value
Voltage
(µF)
Max.
ESR
at 100
kHz
Quantity
Max
Ripple
Physical
Current at
Size (mm)
85°C
(Irms)
Output Bus
Input
Bus
No
TurboTrans
TurboTrans
(Cap
Type) (2)
Vendor Part No.
Sanyo
TPE, Poscap (SMD)
TPE Poscap(SMD)
TPD Poscap (SMD)
6.3 V
2.5 V
2.5 V
470
470
1000
0.018Ω
0.007Ω
0.005Ω
3500 mA
7,3 × 4,3
N/R (8)
≥1~≤3
C ≥ 1 (9)
6TPE470MI
4400 mA
7,3 × 4,3
N/R (8)
≥1≤2
B ≥ 2 (9)
2R5TPE470M7(VO ≤ 1.8 V) (10)
6100 mA
7,3 × 4,3
N/R (8)
≤1
B≥
2R5TPD1000M5(VO ≤ 1.8 V) (10)
1 (9)
SA, Os-Con (Radial)
16 V
470
0.020Ω
>6080 mA
16 × 23
1
≥1~≤4
N/R (11)
SP Oscon ( Radial)
10 V
470
0.015
>4500 mA
10 × 11,5
N/R (8)
≥1~≤3
C ≥ 2 (9)
10SP470M
SEPC, Os-Con (Radial)
16 V
470
0.010Ω
>4700 mA
10 × 13
1
≥1~≤2
B ≥ 1 (9)
16SEPC470M
SVPA, Os-Con (SMD)
6.3 V
470
0.020Ω
4700mA
10 × 10,3
N/R (8)
≥ 1 ~ ≤ 4 (12)
C ≥ 1 (9) (12)
6SVPA470M
AVX, Tantalum, Series III
TPM Multianode
6.3 V
6.3 V
680
470
0.035Ω
0.018Ω
>2400 mA
>3800 mA
7,3 L
× 4,3 W
× 4,1 H
N/R (8)
N/R (8)
≥ 2 ~ ≤ 7 (12)
≥ 2 ~ ≤ 3 (12)
N/R (11)
C ≥ 2 (9) (12)
TPSE477M010R0045
TPME687M006#0018
TPS Series III (SMD)
4V
1000
0.035Ω
2405
7,3 L ×5,7
W
N/R (8)
≥ 2 ~ ≤ 7 (12)
N/R (11)
TPSV108K004R0035
(VO ≤ 2.2 V) (10)
Kemet, Poly-Tantalum
6.3 V
470
0.018Ω
2700 mA
4,3 W
N/R (8)
≥ 1 ~ ≤ 3 (12)
C ≥ 2 (9)
T520X477M06ASE018
T520 (SMD)
6.3 V
470
0.010Ω
>5200 mA
× 7,3 L
N/R (8)
≥ 1 ~ ≤2
B ≥ 1 (9)
T530X477M006ASE010
T530 (SMD)
6.3 V
470
0.005Ω
7300 mA
×4H
N/R (8)
≤1
B ≥ 1 (9)
T530X477M006ASE005
T530 (SMD)
2.5 V
1000
0.005Ω
7300 mA
4,3 w ×
7,3 L
N/R (8)
≤1
B ≥ 1 (9)
T530X108M2R5ASE005
(VO ≤ 2.0 V) (10)
594D, Tantalum (SMD)
6.3 V
1000
0.030Ω
2890 mA
7,2L ×5,7
W ×4,1H
N/R (8)
≥1~≤6
N/R (11)
594D108X06R3R2TR2T
94SA, Os-con (Radial)
16 V
1000
0.015Ω
9740 mA
16 × 25
1
≥1~≤3
N/R (11)
94SA108X0016HBP
94SVP Os-Con(SMD)
16 V
330
0.017Ω
>4500 mA
10 × 12,7
2
≥2~≤3
C ≥ 1 (9)
94SVP827X06R3F12
Kemet, Ceramic X5R
(SMD)
16 V
10
0.002Ω
–
3225
1
≥ 1 (13)
A (9)
C1210C106M4PAC
6.3 V
47
0.002Ω
N/R (8)
≥ 1 (13)
A (9)
C1210C476K9PAC
0.002Ω
N/R (8)
≥
1 (13)
A (9)
GRM32ER60J107M
N/R (8)
≥ 1 (13)
A (9)
GRM32ER60J476M
1 (13)
A (9)
GRM32ER61E226K
16SA470M
Vishay-Sprague
Murata, Ceramic X5R
(SMD)
TDK, Ceramic X5R (SMD)
(8)
(9)
(10)
(11)
(12)
(13)
12
6.3 V
100
6.3 V
47
–
3225
25 V
22
1
≥
16 V
10
1
≥ 1 (13)
A (9)
GRM32DR61C106K
6.3 V
100
N/R (8)
≥ 1 (13)
A (9)
C3225X5R0J107MT
6.3 V
47
N/R (8)
≥ 1 (13)
A (9)
C3225X5R0J476MT
16 V
10
1
≥ 1 (13)
A (9)
C3225X5R1C106MT0
16 V
22
1
≥ 1 (13)
A (9)
C3225X5R1C226MT
0.002Ω
–
3225
N/R – Not recommended. The voltage rating does not meet the minimum operating limits.
Required capacitors with TurboTrans. See the TransTrans Application information for Capacitor Selection
Capacitor Type Groups by ESR (Equivalent Series Resistance) :
•
Type A = (100 < capacitance × ESR ≤ 1000)
•
Type B = (1,000 < capacitance × ESR ≤ 5,000)
•
Type C = (5,001 < capacitance × ESR ≤ 10,000)
The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.
Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higher
ESR capacitors can be used in conjunction with lower ESR capacitance.
Total bulk nonceramic capacitors on the output bus with ESR of ≥ 15mΩ to ≤ 30mΩ requires an additional ≥ 200 µF of ceramic
capacitor.
Maximum ceramic capacitance on the output bus is ≤ 3000 µF. Any combination of the ceramic capacitor values is limited to 3000 µF
for non-TurboTrans applications. The total capacitance is limited to 14,000 µF which includes all ceramic and non-ceramic types.
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TurboTrans™ Technology
TurboTrans technology is a feature introduced in the T2 generation of the PTH/PTV family of power modules.
TurboTrans optimizes the transient response of the regulator with added external capacitance using a single
external resistor. The, benefits of this technology include: reduced output capacitance, minimized output voltage
deviation following a load transient, and enhanced stability when using ultra-low ESR output capacitors. The
amount of output capacitance required to meet a target output voltage deviation, is reduced with TurboTrans
activated. Likewise, for a given amount of output capacitance, with TurboTrans engaged, the amplitude of the
voltage deviation following a load transient will be reduced. Applications requiring tight transient voltage
tolerances and minimized capacitor footprint area benefit from this technology.
TurboTrans™ Selection
Utilizing TurboTrans requires connecting a resistor, RTT, between the +Sense pin (pin 10) and the TurboTrans
pin (pin 13). The value of the resistor directly corresponds to the amount of output capacitance required. All T2
products require a minimum value of output capacitance whether or not TurboTrans is used. For the
PTH08T210W, the minimum required capacitance is 470 µF. When using TurboTrans, capacitors with a
capacitance × ESR product below 10,000 µF × mΩ are required. (Multiply the capacitance (in µF) by the ESR (in
mΩ) to determine the capacitance × ESR product.) See the Capacitor Selection section of the datasheet for a
variety of capacitors that meet this criteria.
Figure 11 through Figure 16, show the amount of output capacitance required to meet a desired transient
voltage deviation with and without TurboTrans for several capacitor types; Type A (e.g. ceramic), Type B
(e.g. polymer-tantalum), and Type C (e.g. OS-CON). To calculate the proper value of RTT, first determine the
required transient voltage deviation limits and magnitude of the transient load step. Next, determine what type of
output capacitors to be used. (If more than one type of output capacitor is used, select the capacitor type that
makes up the majority of the total output capacitance.) Knowing this information, use the chart in Figure 11
through Figure 16 that corresponds to the capacitor type selected. To use the chart, begin by dividing the
maximum voltage deviation limit (in mV) by the magnitude of the load step (in Amps). This gives a mV/A value.
Find this value on the Y-axis of the appropriate chart. Read across the graph to the 'With TurboTrans' plot. From
this point, read down to the X-axis which lists the minimum required capacitance, CO, to meet the transient
voltage deviation. The required RTT resistor value can then be calculated using Equation 1 or selected from the
TurboTrans table. The TurboTrans tables include both the required output capacitance and the corresponding
RTT values to meet several values of transient voltage deviation for 25% (7.5 A), 50% (15 A), and 75% (22.5 A)
output load steps.
The chart can also be used to determine the achievable transient voltage deviation for a given amount of output
capacitance. Selecting the amount of output capacitance along the X-axis, reading up to the 'With TurboTrans'
curve, and then over to the Y-axis, gives the transient voltage deviation limit for that value of output capacitance.
The required RTT resistor value can be calculated using Equation 1 or selected from the TurboTrans table.
As an example, let's look at a 12-V application requiring a 75 mV deviation during a 15 A, 50% load transient. A
majority of 330 µF, 10 mΩ output capacitors will be used. Use the 12 V, Type B capacitor chart, Figure 13.
Dividing 75 mV by 15 A gives 5 mV/A transient voltage deviation per amp of transient load step. Select 5 mV/A
on the Y-axis and read across to the 'With TurboTrans' plot. Following this point down to the X-axis gives us a
minimum required output capacitance of approximately 1300 µF. The required RTT resistor value for 1300 µF
can then be calculated or selected from Figure 13. The required RTT resistor is approximately 10.2 kΩ.
To see the benefit of TurboTrans, follow the 5 mV/A marking across to the 'Without TurboTrans' plot. Following
that point down shows that a minimum of 8200 µF of output capacitance is required to meet the same transient
deviation limit. This is the benefit of TurboTrans. A typical TurboTrans application schematic is shown in
Figure 17.
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Type A Capacitor
12 V Input
Type A Capacitor
8 V Input
20
20
Without Turbo Trans
10
9
8
7
6
5
Transient - mV/A
With Turbo Trans
4
3
10
9
8
7
6
5
With Turbo Trans
4
3
2
2
VI = 8 V
VI = 12 V
C - Capacitance - mF
5000
6000
7000
8000
9000
10000
4000
3000
2000
400
5000
6000
7000
8000
9000
10000
4000
3000
2000
400
1
500
600
700
800
900
1000
1
500
600
700
800
900
1000
Transient - mV/A
Without Turbo Trans
C - Capacitance - mF
Figure 11. Cap Type A, 100 ≤ C(µF)xESR(mΩ) ≤ 1000
(e.g. Ceramic)
Figure 12. Cap Type A, 100 ≤ C(µF)xESR(mΩ) ≤ 1000
(e.g. Ceramic)
Table 2. Type A TurboTrans CO Values & Required RTT Selection Table
Transient Voltage Deviation (mV)
12 V Input
8 V Input
25%
Load Step
(7.5 A)
50%
Load Step
(15 A)
75%
Load Step
(22.5 A)
CO
Minimum Required
Output
Capacitance
(µF)
RTT
Required
TurboTrans
Resistor (Ω)
CO
Minimum Required
Output
Capacitance
(µF)
RTT
Required
TurboTrans
Resistor (Ω)
130
260
390
470
open
580
127 k
120
240
360
520
294 k
640
80.6 k
110
220
330
580
127 k
710
54.9 k
100
200
300
650
76.8 k
800
37.4 k
90
180
270
740
47.5 k
900
26.7 k
80
160
240
850
31.6 k
1050
17.8 k
70
140
210
1000
20.5 k
1250
11.3 k
60
120
180
1200
12.7 k
1500
6.65 k
50
100
150
1500
6.65 k
1900
2.55 k
40
80
120
2000
1.82 k
2600
0
30
60
90
4000
0
7800
0
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming equation, see
Equation 1.
1 - (CO / 2350)
kW
RTT = 40 ´
5 x (CO / 2350) - 1
(1)
Where CO is the total output capacitance in µF. CO values greater than or equal to 2350 µF require RTT to be a
short, 0Ω. (Equation 1 will result in a negative value for RTT when CO ≥ 2350 µF.)
14
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Type B Capacitor
12 V Input
Type B Capacitor
8 V Input
20
20
Without Turbo Trans
Transient - mV/A
7
6
5
With Turbo Trans
4
3
10
9
8
7
6
With Turbo Trans
5
4
3
VI = 12 V
VI = 8 V
C - Capacitance - mF
5000
6000
7000
8000
9000
10000
4000
3000
2000
400
5000
6000
7000
8000
9000
10000
4000
3000
2000
400
2
500
600
700
800
900
1000
2
500
600
700
800
900
1000
Transient - mV/A
Without Turbo Trans
10
9
8
C - Capacitance - mF
Figure 13. Cap Type B, 1000 ≤ C(µF)xESR(mΩ) ≤ 5000
(e.g. Polymer-Tantalum)
Figure 14. Cap Type B, 1000 ≤ C(µF)xESR(mΩ) ≤ 5000
(e.g. Polymer-Tantalum)
Table 3. Type B TurboTrans COValues & Required RTT Selection Table
Transient Voltage Deviation (mV)
12 V Input
25%
Load Step
(7.5 A)
50%
Load Step
(15 A)
75%
Load Step
(22.5 A)
CO
Minimum Required
Output Capacitance
(µF)
100
200
300
90
180
270
80
160
240
70
140
210
60
120
50
40
8 V Input
RTT
Required
TurboTrans
Resistor (Ω)
CO
Minimum Required
Output Capacitance
(µF)
RTT
Required
TurboTrans
Resistor (Ω)
470
open
540
205 k
500
499 k
620
93.1 k
580
127 k
720
52.3 k
680
63.4 k
840
32.4 k
180
800
37.4 k
1000
20.5 k
100
150
1000
20.5 k
1300
10.2 k
80
120
1300
10.2 k
1700
4.22 k
30
60
90
1800
3.32 k
2300
221
25
50
75
2200
698
4900
0
20
40
60
5400
0
14000
0
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming equation, see
Equation 1.
CO values greater than or equal to 2350 µF require RTT to be a short, 0Ω. (Equation 1 will result in a negative
value for RTT when CO ≥ 2350 µF.)
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Type C Capacitor
12 V Input
Type C Capacitor
8 V Input
20
10
9
8
Without Turbo Trans
10
9
8
Transient - mV/A
7
6
5
With Turbo Trans
4
Without Turbo Trans
7
6
5
With Turbo Trans
4
3
3
VI = 8 V
VI = 12 V
C - Capacitance - mF
5000
6000
7000
8000
9000
10000
4000
3000
2000
400
5000
6000
7000
8000
9000
10000
4000
3000
2000
400
2
500
600
700
800
900
1000
2
500
600
700
800
900
1000
Transient - mV/A
20
C - Capacitance - mF
Figure 15. Cap Type C, 5000 ≤ C(µF)xESR(mΩ) ≤ 10,000
(e.g. Os-Con)
Figure 16. Cap Type C, 5000 ≤ C(µF)xESR(mΩ) ≤ 10,000
(e.g. Os-Con)
Table 4. Type C TurboTrans COValues & Required RTT Selection Table
Transient Voltage Deviation (mV)
25%
50%
75%
Load Step Load Step Load Step
(7.5 A)
(15 A)
(22.5 A)
12 V Input
CO
Minimum Required
Output Capacitance
(µF)
8 V Input
RTT
Required TurboTrans
Resistor (Ω)
CO
Minimum Required
Output Capacitance
(µF)
RTT
Required TurboTrans
Resistor (Ω)
80
160
240
470
open
520
294 k
70
140
210
560
158 k
620
93.1 k
60
120
180
680
63.4 k
750
45.3 k
50
100
150
850
31.6 k
940
24.3 k
40
80
120
1100
15.8 k
1300
10.2 k
35
70
105
1300
10.2 k
1500
6.65 k
30
60
90
1600
5.36 k
1800
3.32 k
25
50
75
2000
1.82 k
2200
698
20
40
60
4000
0
5400
0
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming equation, see
Equation 1.
CO values greater than or equal to 2350 µF require RTT to be a short, 0Ω. (Equation 1 will result in a negative
value for RTT when CO ≥ 2350 µF.)
16
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TurboTrans
14
AutoTrack
RTT
3.32 kW
13
TurboTrans
+Sense
VI
2
6
1
PTH08T210W
VI
Inhibit/
Prog UVLO
GND
3
CI
470 mF
(Required)
4
+Sense
10
9
VO
5
VO
−Sense
GND
VOAdj
7 8
12
11
RSET
1%
0.05 W
L
O
A
D
COTT
1800 mF
(Required)
−Sense
GND
GND
Figure 17. Typical TurboTrans Application Schematic
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ADJUSTING THE OUTPUT VOLTAGE
The VO Adjust control (pin 12) sets the output voltage of the PTH08T210W. The adjustment range of the
PTH08T210W is 0.7 V to 3.6 V. The adjustment method requires the addition of a single external resistor, RSET,
that must be connected directly between the Vo Adjust and GND pins. Table 5 gives the preferred value of the
external resistor for a number of standard voltages, along with the actual output voltage that this resistance
value provides.
For other output voltages, the value of the required resistor can either be calculated using the following formula,
or simply selected from the range of values given in Table 6. Figure 18 shows the placement of the required
resistor.
0.7
R
+ 30.1 kW
* 6.49 kW
SET
V * 0.7
O
(2)
Table 5. Preferred Values of RSET for Standard Output Voltages
VO (Standard) (V)
RSET (Preferred Value) (Ω)
VO (Actual) (V)
3.3
1.62 k
3.298
2.5
5.23 k
2.498
2
9.76 k
1.997
1.8
12.7 k
1.798
1.5
19.6 k
1.508
1.2
35.7 k
1.199
1
63.4 k
1.001
0.7
Open
0.700
+Sense
+Sense
10
9
PTH08T210W
−Sense
GND
GND
3 4
7
8
VO
5
VO
11
VOAdj
12
CO
RSET
1%
0.05 W
−Sense
GND
(1)
Use a 0.05 W resistor. The tolerance should be 1%, with temperature stability of 100 ppm/°C (or better). Place the
resistor as close to the regulator as possible. Connect the resistor directly between pins 12 and 8 using dedicated
PCB traces.
(2)
Never connect capacitors from VO Adjust to either GND or VO. Any capacitance added to the VO Adjust pin affects
the stability of the regulator.
Figure 18. VO Adjust Resistor Placement
18
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Table 6. Output Voltage Set-Point Resistor Values
Va Required (V)
RSET (kΩ)
Va Required (V)
RSET (kΩ)
0.70
Open
2.10
8.66
0.75
412
2.20
7.50
0.80
205
2.30
6.65
0.85
133
2.40
5.90
0.90
97.6
2.50
5.23
0.95
78.7
2.60
4.64
1.00
63.4
2.70
4.02
1.10
46.4
2.80
3.57
1.20
35.7
2.90
3.09
1.30
28.7
3.00
2.67
1.40
23.7
3.10
2.26
1.50
19.6
3.20
1.96
1.60
16.9
3.30
1.62
1.70
14.7
3.40
1.30
1.80
12.7
3.50
1.02
1.90
11.0
3.60
0.768
2.00
9.76
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UNDERVOLTAGE LOCKOUT (UVLO)
The PTH08T210W power modules incorporate an input undervoltage lockout (UVLO). The UVLO feature
prevents the operation of the module until there is sufficient input voltage to produce a valid output voltage. This
enables the module to provide a clean, monotonic powerup for the load circuit, and also limits the magnitude of
current drawn from the regulator’s input source during the power-up sequence.
The UVLO characteristic is defined by the ON threshold (VTHD) voltage. Below the ON threshold, the Inhibit
control is overridden, and the module does not produce an output. The hysterisis voltage, which is the difference
between the ON and OFF threshold voltages, is nominally set at 900 mV. The hysterisis prevents start-up
oscillations, which can occur if the input voltage droops slightly when the module begins drawing current from
the input source.
UVLO Adjustment
The UVLO feature of the PTH08T210W module allows for limited adjustment of the ON threshold voltage. The
adjustment is made via the Inhbit/UVLO Prog control pin (pin 1). When pin 1 is left open circuit, the ON
threshold voltage is internally set to its default value. The ON threshold has a nominal voltage of 5.0 V, and the
hysterisis 900 mV. This ensures that the module produces a regulated output when the minimum input voltage is
applied. The ON threshold might need to be increased if the module is powered from a tightly regulated 12-V
bus. This allows the ON threshold voltage to be set for a specified input voltage. Adjusting the threshold voltage
prevents the module from operating if the input bus fails to completely rise to its specified regulation voltage.
Equation 3 determines the value of RTHD required to adjust VTHD to a new value. The default value is 5 V, and it
may only be adjusted to a higher value.
RUVLO =
2590 - (24.9 x (VI - 1))
24.9 x (VI - 1) - 100
kW
(3)
Table 7 lists the standard resistor values for RUVLO for different options of the on-threshold (VTHD) voltage.
Table 7. Calculated Values of RUVLO for Various Values of VTHD
VTHD
6.5 V
7.0 V
7.5 V
8.0 V
8.5 V
9.0 V
9.5 V
10.0 V
10.5 V
RUVLO
66.5 kΩ
49.9 kΩ
39.2 kΩ
32.4 kΩ
27.4 kΩ
24.3 kΩ
21.5 kΩ
19.1 kΩ
17.4 kΩ
VI
2
VI
1
PTH08T210W
Inhibit/
UVLO Prog
GND
3
CI
4
RUVLO
GND
Figure 19. UVLO Program Resistor Placement
20
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Soft-Start Power Up
The Auto-Track feature allows the power-up of multiple PTH/PTV modules to be directly controlled from the
Track pin. However in a stand-alone configuration, or when the Auto-Track feature is not being used, the Track
pin should be directly connected to the input voltage, VI. (see Figure 20)
14
VI (5 V/div)
Track
VO (2 V/div)
VI
2, 6
VI
PTH08T210W
II (5 A/div)
GND
3,4
7,8
t − Time − 10 ms/div
CI
GND
Figure 20. Power-Up Application Circuit
Figure 21. Power-Up Waveform
When the Track pin is connected to the input voltage the Auto-Track function is permanently disengaged. This
allows the module to power up entirely under the control of its internal soft-start circuitry. When power up is
under soft-start control, the output voltage rises to the set-point at a quicker and more linear rate. From the
moment a valid input voltage is applied, the soft-start control introduces a short time delay (typically 8 ms–15
ms) before allowing the output voltage to rise. The output then progressively rises to the module’s setpoint
voltage.
Figure 21 shows the soft-start power-up characteristic of the PTH08T210W operating from a 12-V input bus and
configured for a 3.3-V output. The waveforms were measured with a 20-A constant current load and the
Auto-Track feature disabled. The initial rise in input current when the input voltage first starts to rise is the
charge current drawn by the input capacitors. Power-up is complete within 25 ms.
Remote Sense
Products with this feature incorporate one or two remote sense pins. Remote sensing improves the load
regulation performance of the module by allowing it to compensate for any IR voltage drop between its output
and the load. An IR drop is caused by the high output current flowing through the small amount of pin and trace
resistance.
To use this feature simply connect the Sense pins to the corresponding output voltage node, close to the load
circuit. If a sense pin is left open-circuit, an internal low-value resistor (15-Ω or less) connected between the pin
and the output node, ensures the output remains in regulation.
With the sense pin connected, the difference between the voltage measured directly between the VO and GND
pins, and that measured at the Sense pins, is the amount of IR drop being compensated by the regulator. This
should be limited to a maximum of 0.3 V.
The remote sense feature is not designed to compensate for the forward drop of nonlinear or frequency
dependent components that may be placed in series with the converter output. Examples include OR-ing
diodes, filter inductors, ferrite beads, and fuses. When these components are enclosed by the remote sense
connection they are effectively placed inside the regulation control loop, which can adversely affect the
stability of the regulator.
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Output On/Off Inhibit
For applications requiring output voltage on/off control, the PTH08T210W incorporates an output Inhibit control
pin. The inhibit feature can be used wherever there is a requirement for the output voltage from the regulator to
be turned off.
The power modules function normally when the Inhibit pin is left open-circuit, providing a regulated output
whenever a valid source voltage is connected to VI with respect to GND.
Figure 22 shows the typical application of the inhibit function. Note the discrete transistor (Q1). The Inhibit input
has its own internal pull-up to a potential of 5 V. The input is not compatible with TTL logic devices and should
not be tied to VI. An open-collector (or open-drain) discrete transistor is recommended for control.
VO (2 V/div)
VI
2, 6
VI
PTH08T210W
II (5 A/div)
1 Inhibit/
UVLO
GND
3,4
CI
VINH (2 V/div)
7,8
Q1
BSS 138
1 = Inhibit
t − Time − 10 ms/div
GND
Figure 22. On/Off Inhibit Control Circuit
Figure 23. Power-Up Response from Inhibit Control
Turning Q1 on applies a low voltage to the Inhibit control pin and disables the output of the module. If Q1 is then
turned off, the module executes a soft-start power-up sequence. A regulated output voltage is produced within
25 ms. Figure 23 shows the typical rise in both the output voltage and input current, following the turn-off of Q1.
The turn off of Q1 corresponds to the rise in the waveform, Q1 VDS. The waveforms were measured with a 20-A
constant current load.
Overcurrent Protection
For protection against load faults, all modules incorporate output overcurrent protection. Applying a load that
exceeds the regulator's overcurrent threshold causes the regulated output to shut down. Following shutdown, a
module periodically attempts to recover by initiating a soft-start power-up. This is described as a hiccup mode of
operation, whereby the module continues in a cycle of successive shutdown and power up until the load fault is
removed. During this period, the average current flowing into the fault is significantly reduced. Once the fault is
removed, the module automatically recovers and returns to normal operation.
22
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Overtemperature Protection (OTP)
A thermal shutdown mechanism protects the module’s internal circuitry against excessively high temperatures. A
rise in the internal temperature may be the result of a drop in airflow, or a high ambient temperature. If the
internal temperature exceeds the OTP threshold, the module’s Inhibit control is internally pulled low. This turns
the output off. The output voltage drops as the external output capacitors are discharged by the load circuit. The
recovery is automatic, and begins with a soft-start power up. It occurs when the sensed temperature decreases
by about 10°C below the trip point.
The overtemperature protection is a last resort mechanism to prevent thermal stress to the regulator.
Operation at or close to the thermal shutdown temperature is not recommended and reduces the long-term
reliability of the module. Always operate the regulator within the specified safe operating area (SOA) limits
for the worst-case conditions of ambient temperature and airflow.
Auto-Track™ Function
The Auto-Track function is unique to the PTH/PTV family, and is available with all POLA products. Auto-Track
was designed to simplify the amount of circuitry required to make the output voltage from each module power up
and power down in sequence. The sequencing of two or more supply voltages during power up is a common
requirement for complex mixed-signal applications that use dual-voltage VLSI ICs such as the TMS320™ DSP
family, microprocessors, and ASICs.
How Auto-Track™ Works
Auto-Track works by forcing the module output voltage to follow a voltage presented at the Track control pin (1).
This control range is limited to between 0 V and the module set-point voltage. Once the track-pin voltage is
raised above the set-point voltage, the module output remains at its set-point (2). As an example, if the Track pin
of a 2.5-V regulator is at 1 V, the regulated output is 1 V. If the voltage at the Track pin rises to 3 V, the
regulated output does not go higher than 2.5 V.
When under Auto-Track control, the regulated output from the module follows the voltage at its Track pin on a
volt-for-volt basis. By connecting the Track pin of a number of these modules together, the output voltages follow
a common signal during power up and power down. The control signal can be an externally generated master
ramp waveform, or the output voltage from another power supply circuit (3). For convenience, the Track input
incorporates an internal RC-charge circuit. This operates off the module input voltage to produce a suitable
rising waveform at power up.
Typical Application
The basic implementation of Auto-Track allows for simultaneous voltage sequencing of a number of Auto-Track
compliant modules. Connecting the Track inputs of two or more modules forces their track input to follow the
same collective RC-ramp waveform, and allows their power-up sequence to be coordinated from a common
Track control signal. This can be an open-collector (or open-drain) device, such as a power-up reset voltage
supervisor IC. See U3 in Figure 24.
To coordinate a power-up sequence, the Track control must first be pulled to ground potential. This should be
done at or before input power is applied to the modules. The ground signal should be maintained for at least
20 ms after input power has been applied. This brief period gives the modules time to complete their internal
soft-start initialization (4), enabling them to produce an output voltage. A low-cost supply voltage supervisor IC,
that includes a built-in time delay, is an ideal component for automatically controlling the Track inputs at power
up.
Figure 24 shows how the TL7712A supply voltage supervisor IC (U3) can be used to coordinate the sequenced
power up of PTH08T210W modules. The output of the TL7712A supervisor becomes active above an input
voltage of 3.6 V, enabling it to assert a ground signal to the common track control well before the input voltage
has reached the module's undervoltage lockout threshold. The ground signal is maintained until approximately
28 ms after the input voltage has risen above U3's voltage threshold, which is 10.95 V. The 28-ms time period is
controlled by the capacitor C3. The value of 2.2 µF provides sufficient time delay for the modules to complete
their internal soft-start initialization. The output voltage of each module remains at zero until the track control
voltage is allowed to rise. When U3 removes the ground signal, the track control voltage automatically rises.
This causes the output voltage of each module to rise simultaneously with the other modules, until each reaches
its respective set-point voltage.
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Figure 25 shows the output voltage waveforms after input voltage is applied to the circuit. The waveforms, VO1
and VO2, represent the output voltages from the two power modules, U1 (3.3 V) and U2 (1.8 V), respectively.
VTRK, VO1, and VO2 are shown rising together to produce the desired simultaneous power-up characteristic.
The same circuit also provides a power-down sequence. When the input voltage falls below U3's voltage
threshold, the ground signal is re-applied to the common track control. This pulls the track inputs to zero volts,
forcing the output of each module to follow, as shown in Figure 26. Power down is normally complete before the
input voltage has fallen below the modules' undervoltage lockout. This is an important constraint. Once the
modules recognize that an input voltage is no longer present, their outputs can no longer follow the voltage
applied at their track input. During a power-down sequence, the fall in the output voltage from the modules is
limited by the Auto-Track slew rate capability.
Notes on Use of Auto-Track™
1. The Track pin voltage must be allowed to rise above the module set-point voltage before the module
regulates at its adjusted set-point voltage.
2. The Auto-Track function tracks almost any voltage ramp during power up, and is compatible with ramp
speeds of up to 1 V/ms.
3. The absolute maximum voltage that may be applied to the Track pin is the input voltage VI.
4. The module cannot follow a voltage at its track control input until it has completed its soft-start initialization.
This takes about 20 ms from the time that a valid voltage has been applied to its input. During this period, it
is recommended that the Track pin be held at ground potential.
5. The Auto-Track function is disabled by connecting the Track pin to the input voltage (VI). When Auto-Track
is disabled, the output voltage rises at a quicker and more linear rate after input power has been applied.
RTT
U1
AutoTrack TurboTrans
+Sense
VI = 12 V
VI
VO
PTH08T210W
VO1 = 3.3 V
Inhibit/
UVLO Prog
−Sense
VOAdj
GND
+
CO1
CI1
U3
7
RSET
1.62 kW
8
VCC
SENSE
5
RESET
2
RESIN
1
TL7712A
REF
3
6
AutoTrack TurboTrans
Smart
+Sense
Sync
GND
4
CREF
0.1 mF
RTT
U2
RESET
CT
CT
2.2 mF
RRST
10 kW
VI
VO
PTH08T220W
VO 2 = 1.8 V
Inhibit/
UVLO Prog
−Sense
GND
VOAdj
+
CO2
CI2
RSET2
4.75 kW
Figure 24. Sequenced Power Up and Power Down Using Auto-Track
24
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VTRK (1 V/div)
VTRK (1 V/div)
VO1 (1 V/div)
VO1 (1 V/div)
VO2 (1 V/div)
VO2 (1 V/div)
t − Time − 20 ms/div
t − Time − 400 ms/div
Figure 25. Simultaneous Power Up
With Auto-Track Control
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Figure 26. Simultaneous Power Down
With Auto-Track Control
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TAPE & REEL AND TRAY DRAWINGS
26
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PACKAGE OPTION ADDENDUM
www.ti.com
30-Oct-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
PTH08T210WAD
ACTIVE
DIP MOD
ULE
ECP
14
35
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PTH08T210WAH
ACTIVE
DIP MOD
ULE
ECP
14
35
TBD
Call TI
N / A for Pkg Type
PTH08T210WAS
ACTIVE
DIP MOD
ULE
ECQ
14
35
TBD
Call TI
Level-1-235C-UNLIM
PTH08T210WAST
ACTIVE
DIP MOD
ULE
ECQ
14
250
TBD
Call TI
Level-1-235C-UNLIM
PTH08T210WAZ
ACTIVE
DIP MOD
ULE
ECQ
14
35
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH08T210WAZT
ACTIVE
DIP MOD
ULE
ECQ
14
250
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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