MICROCHIP TC1267

TC1267
400mA PCI LDO
Features
General Description
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The TC1267 is an application-specific, low dropout
regulator (LDO), specifically intended for use in PCI
peripheral card applications complying with PCI Power
Management (PCI 2.0). It provides an uninterrupted,
3.3V output voltage when the main (5V) or auxiliary
(3.3V) input voltage supplies are present.
Glitch Free Transition Between Input Sources
Automatic Input Source Selection
External PMOS Bypass Switch Control
Built-in 5V Detector
1% Regulated Output Voltage Accuracy
400mA Load Current Capability
Kelvin Sense Input
Low Ground Current, Independent of Load
Applications
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PCMCIA
PCI
Network Interface Cards (NICs)
CardbusTM Technology
Desktop Computers
Device Selection Table
Part Number
Package
Junction
Temp. Range
TC1267VET
5-Pin DDPAK
-5°C to +95°C
Pin Configuration
The TC1267 consists of an LDO, a voltage threshold
detector, external switchover logic and gate drive
circuitry. It functions as a conventional LDO as long as
the voltage on the main supply input (VIN) is above the
lower threshold (3.90V typical). Should the voltage on
VIN fall below the lower threshold, the LDO is disabled
and an external P-channel MOSFET is automatically
turned on, connecting the auxiliary supply input to
VOUT, and ensuring an uninterrupted 3.3V output. The
main supply is automatically selected, if both the main
and auxiliary input supplies are present, and transition
from one input supply to the other is ensured glitchfree. High integration, automatic secondary supply
switchover, Kelvin sensing, and small size make the
TC1267 the optimum LDO for PCI 2.0 applications.
Functional Block Diagram
VIN
VAUX
5-Pin DDPAK
Tab is GND
Detect
DR
Bandgap
Reference
TC1267
–
E/A
+
VOUT
GND
VAUX
VIN
GND
VOUT
DR
1 2 3 4 5
 2002 Microchip Technology Inc.
DS21378B-page 1
TC1267
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Supply Voltage (VIN).............. -0.5V to +7V (Max)
Auxiliary Supply Voltage (VAUX) ..... -0.5V to +7V (Max)
LDO Output Current (IOUT)................................ 400mA
Thermal Impedance,
Junction-to-Ambient (θJA).......... 27°C/W for DDPAK
ESD Rating .......................................................... 2 KV
Operating Temperature Range (TA)........ -5°C to +70°C
Storage Temperature Range (TSTG) ...-65°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1267 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25°C, VIN = 5V, VAUX = 3.3V, IOUT = 0.1mA, COUT = 4.7µF, unless otherwise noted. Boldface
type specifications apply over full operating range.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
VIN
Supply Voltage
4.4
5.0
5.5
V
IGND
Ground Current
—
—
230
260
450
500
µA
VAUX = 0V (Note 6)
VAUX = 3.3V (Note 6)
IVIN
Reverse Leakage from
VAUX
—
-0.1
-1.0
µA
VAUX = 3.5V, VIN = 0V, IOUT = 0mA
VAUX
Supply Voltage
3.0
3.3
3.6
V
IQ(AUX)
Quiescent Current
—
—
50
—
70
100
µA
VIN = 0V, IOUT = 0mA
—
—
60
—
80
120
µA
VIN = 5V, IOUT = 0mA
VIN = 5.5V, VAUX = 0V, IOUT = 0mA
IVAUX
Reverse Leakage from VIN
—
-0.1
-1.0
µA
VTH(LO)
5V Detector
Low Threshold Voltage
—
3.75
3.90
—
—
4.05
V
VHYST
5V Detector
Hysteresis Voltage
—
200
260
—
—
300
mV
VTH(HI)
5V Detector
High Threshold Voltage
—
4.0
4.15
—
—
4.30
V
VOUT
LDO Output Voltage
VAUX = 0V
VIN Falling (Notes 2, 3)
(Notes 2, 3)
VIN Rising (Notes 2, 3)
—
3.300
—
V
IOUT = 20mA
3.201
—
3.366
V
4.4V ≤ VIN ≤ 5.5V, 0mA ≤ IOUT ≤ 400mA
0mA ≤ IOUT ≤ 400mA (Note 4)
3.000
—
—
V
IOUT
Output Current
400
—
—
mA
REG(LINE)
Line Regulation
—
-0.5
0.05
—
—
+0.5
%
VIN = 4.3V to 5.5V
REG(LOAD)
Load Regulation
—
-1.5
-0.1
—
—
+0.5
%
IOUT = 0.1mA to 400mA
VDR
Drive Voltage
VIN - 0.2
VIN - 0.3
VIN - 0.1
—
—
—
V
4.3V ≤ VIN ≤ 5.5V, IDR = 200µA
—
—
35
—
150
200
mV
Note
1:
2:
3:
4:
5:
6:
VIN < VTH(LO), IDR = 200µA
Ensured by design.
See 5V Detect Thresholds, Figure 4-1.
Recommended source impedance for 5V supply: ≤ 0.25Ω. This will ensure that IOUT x RSOURCE < VHYST , thus avoiding DR toggling during
5V detect threshold transitions.
In Application Circuit, Figure 3-1.
See Timing Diagram, Figure 4-2.
Ground Current is independent of ILOAD.
DS21378B-page 2
 2002 Microchip Technology Inc.
TC1267
TC1267 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: TA = +25°C, VIN = 5V, VAUX = 3.3V, IOUT = 0.1mA, COUT = 4.7µF, unless otherwise noted. Boldface
type specifications apply over full operating range.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
IDR(PK)
Peak Drive Current
7
6
—
—
—
—
mA
tDH
Drive High Delay
(Notes 1, 5)
—
—
4
—
—
8
µsec
CDR = 1.2nF, VIN ramping up,
measured from VIN = VTH(HI) to VDR = 2V
tDL
Drive Low Delay
(Notes 1, 5)
—
—
0.6
—
1.5
3.0
µsec
CDR = 1.2nF, VIN ramping down,
measured from VIN = VTH(LO) to VDR = 2V
Note
1:
2:
3:
4:
5:
6:
Sinking: VIN = 3.75V, VDR = 1V;
Sourcing: VIN = 4.3V, VIN – VOR = 2V
Ensured by design.
See 5V Detect Thresholds, Figure 4-1.
Recommended source impedance for 5V supply: ≤ 0.25Ω. This will ensure that IOUT x RSOURCE < VHYST , thus avoiding DR toggling during
5V detect threshold transitions.
In Application Circuit, Figure 3-1.
See Timing Diagram, Figure 4-2.
Ground Current is independent of ILOAD.
 2002 Microchip Technology Inc.
DS21378B-page 3
TC1267
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
3.0
PIN FUNCTION TABLE
Pin No.
Symbol
Description
Auxiliary input supply, nominally 3.3V.
1
VAUX
2
VIN
3
GND
Logic and power ground.
4
VOUT
LDO 3.3V output.
5
DR
Main input supply for the TC1267, nominally 5V.
Driver output for external P-channel MOSFET pass element.
DETAILED DESCRIPTION
FIGURE 3-1:
APPLICATION CIRCUIT
Q1
TAB IS GND
VIN
GND
VOUT
DR
VAUX
TC1267
3.3V
5V
C1
4.7µF
3.3V
C2
0.1µF
C3
0.1µF
C4
4.7µF
C5
0.1µF
NOTE: External switch (Q1): use Motorola MGSF1P02ELT1 or equivalent
(PMOS, typical Gate Threshold Voltage = 1V, typical RDS(ON) = 0.4Ω at VGS = 2.5V)
DS21378B-page 4
 2002 Microchip Technology Inc.
TC1267
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX
= 5V ± 5%
VOUTMIN = 3.217V
ILOADMAX = 400mA
TJMAX
= 95°C
TAMAX
= 70°C
θJA
= 27°C/W (DDPAK mounted on
1000 sq mm topside copper area)
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
Where:
= (5.25V - 3.217V) 400mA
PD = Worst case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
= 813mW
The
maximum
allowable
power
dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (θJA).
Maximum allowable power dissipation:
PDMAX = (T JMAX – TAMAX)
θJA
= (95 – 70)
27
= 423mW
In this example, the TC1267 dissipates a maximum of
813mW; below the allowable limit of 926mW.
EQUATION 4-2:
PDMAX = (TJMAX – TAMAX)
θJA
Where all terms are previously defined.
Table 4-1 shows various values of θJA for the TC1267
packages.
TABLE 4-1:
Copper
Area
(Topside)*
THERMAL RESISTANCE
GUIDELINES FOR TC1267 IN
5-PIN DDPAK
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
(θJA)
2500 sq mm 2500 sq mm 2500 sq mm
25°C/W
1000 sq mm 2500 sq mm 2500 sq mm
27°C/W
125 sq mm
35°C/W
2500 sq mm 2500 sq mm
*Tab of device attached to topside copper.
 2002 Microchip Technology Inc.
DS21378B-page 5
TC1267
FIGURE 4-1:
5V DETECT THRESHOLD
4.4V
VHYST
VTH(HI)
VIN
VTH(LO)
3.65V
2.0V
DR
2.0V
NOTE: VIN rise and fall times (10% to 90%) to be ≥ 100µsec.
FIGURE 4-2:
TIMING DIAGRAM
4.4V
VIN
3.65V
tDH
tDL
DR
2.0V
2.0V
NOTE: VIN rise and fall times (10% to 90%) to be ≤ 0.1µsec.
DS21378B-page 6
 2002 Microchip Technology Inc.
TC1267
5.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
IQ vs. VIN vs. Junction Temperature
0.45
+125°C
IO = 0.1mA
VAUX = 0V
0.40
0.35
IQ vs. VIN vs. Junction Temperature
0.45
0.35
+125°C
0.30
IQ (mA)
IQ (mA)
0.30
0.25
0.20
0.15
0.25
+25°C
0.20
0.15
-5°C
0.10
-5°C
0.10
+25°C
0.05
0.05
0.00
0.00
0
1
2
3
VIN (V)
4
5
6
0
IQ (Aux) vs. VAUX vs. Junction Temperature
0.35
IQ (Aux) (mA)
+125°C
-5°C
0.15
0.10
+25°C
0.05
2
3
VIN (V)
4
5
6
IO = 0mA
VAUX = 5V
0.30
0.25
0.20
1
IQ (Aux) vs. VAUX vs. Junction Temperature
0.35
IO = 0mA
VAUX = 0V
0.30
IQ (Aux) (mA)
IO = 0.1mA
VAUX = 3.3V
0.40
0.25
0.20
-5°C
+125°C
+25°C
0.15
0.10
0.05
0.00
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
3.3 3.6
VAUX (V)
0.00
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
3.3 3.6
VAUX (V)
LDO Output Voltage vs. Junction Temperature
3.34
3.33
IO = 200mA
VIN = 5V
VOUT (V)
3.32
3.31
3.30
3.29
3.28
3.27
3.26
-50
-25
0
25
50
75
100
125
JUNCTION TEMPERATURE °C
 2002 Microchip Technology Inc.
DS21378B-page 7
TC1267
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
Drive High Delay
Drive Low Delay
VIN steps from 0.8V to 5V
See application circuit on Page 5
ILOAD = 200mA
Trace 1: VIN stepping for 0.8V to 5V
Trace 2: DR
TH(HI)
TDH = < 4 S
VO (min) with VIN Rising
Trace 1: VIN stepping for 5.5V to 0V
R
TDL = < 600nS
VO (min) with VIN Falling
Notice no voltage spikes during transition
from VAUX to LDO output
VOUT voltage difference is IOUT x RDS(ON) and variations
between VAUX supply and LDO output voltage
Trace 1: VIN – 3A charging a 1500µF capacitor
Trace 2: DR going high at VTH(HI)
Trace 3: VOUT, offset 3.3V. VOUT(min) = 3.24V
ILOAD = 200µA
DS21378B-page 8
VOUT voltage difference is IOUT x RDS(ON) + voltage
difference from LDO to VAUX supply
Trace 1: VIN – discharging a 1500µF capacitor
Trace 2: DR going low at VTH(LO)
Trace 3: VOUT, offset 3.3V. VOUT(min) = 3.14V
ILOAD = 200µA
 2002 Microchip Technology Inc.
TC1267
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 5-Pin DDPAK Devices
PIN 1
User Direction of Feed
Device
Marking
W
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
24 mm
16 mm
750
13 in
5-Pin DDPAK
6.3
Package Dimensions
5-Pin DDPAK
.410 (10.41)
.385 (9.78)
.183 (4.65)
.170 (4.32)
.067 (1.70)
.045 (1.14)
.055 (1.40)
.045 (1.14)
3° - 7°
(5x)
.370 (9.40)
.330 (8.38)
.010 (0.25)
.000 (0.00)
.605 (15.37)
.549 (13.95)
.026 (0.66)
.014 (0.36)
.110 (2.79)
.068 (1.72)
.037 (0.94)
.026 (0.66)
PIN 1
.067 (1.70) TYP.
8° MAX.
Dimensions: inches (mm)
 2002 Microchip Technology Inc.
DS21378B-page 9
TC1267
NOTES:
DS21378B-page 10
 2002 Microchip Technology Inc.
TC1267
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21378B-page 11
TC1267
NOTES:
DS21378B-page 12
 2002 Microchip Technology Inc.
TC1267
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
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© 2002, Microchip Technology Incorporated, Printed in the
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 2002 Microchip Technology Inc.
DS21378B-page 13
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05/01/02
*DS21378B*
DS21378B-page 14
 2002 Microchip Technology Inc.