TC1070/TC1071/TC1187 50mA, 100mA and 150mA Adjustable CMOS LDOs with Shutdown Features General Description • • • • The TC1070, TC1071 and TC1187 are adjustable LDOs designed to supersede a variety of older (bipolar) voltage regulators. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators). • • • • Zero Ground Current for Longer Battery Life Adjustable Output Voltage Very Low Dropout Voltage Choice of 50mA (TC1070), 100mA (TC1071) and 150mA (TC1187) Output Power-Saving Shutdown Mode Over Current and Over Temperature Protection Space-Saving 5-Pin SOT-23A Package Pin Compatible with Bipolar Regulators Applications • • • • • • • Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers The devices’ key features include ultra low noise operation, very low dropout voltage – typically 85mV (TC1070); 180mV (TC1071); and 270mV (TC1187) at full load, and fast response to step changes in load. Supply current is reduced to 0.5µA (max) when the shutdown input is low. The devices incorporate both over-temperature and over-current protection. Output voltage is programmed with a simple resistor divider from VOUT to ADJ to GND. The TC1070, TC1071 and TC1187 are stable with an output capacitor of only 1µF and have a maximum output current of 50mA, 100mA and 150mA, respectively. For higher output versions, please see the TC1174 (IOUT = 300mA) data sheet. Typical Application Device Selection Table VIN Part Number Output Voltage (V) Package 1 VIN Adjustable 5-Pin SOT-23A -40°C to +125°C TC1071VCT Adjustable 5-Pin SOT-23A -40°C to +125°C TC1187VCT Adjustable 5-Pin SOT-23A -40°C to +125°C 2 VOUT GND R1 3 Package Type 5 C1 + 1µF TC1070 TC1071 TC1187 Junction Temp. Range TC1070VCT VOUT SHDN ADJ 4 5-Pin SOT-23A VOUT ADJ 5 4 R2 Shutdown Control (from Power Control Logic) VOUT = VREF x +1 ] [ R1 R2 TC1070 TC1071 TC1187 1 2 3 VIN GND SHDN NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A) 2002 Microchip Technology Inc. DS21353B-page 1 TC1070/TC1071/TC1187 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 5) Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature.......................... -65°C to +150°C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Operating Voltage 2.7 — 6.0 V Note 6 IOUTMAX Maximum Output Current 50 100 150 — — — — — — mA TC1070 TC1071 TC1187 VOUT Adjustable Output Voltage Range VREF — 5.5 V VREF Reference Voltage 1.165 1.20 1.235 V ∆VREF/∆T VREF Temperature Coefficient — 40 — ppm/°C Note 1 — 0.05 0.35 % (VR + 1V) ≤ VIN ≤ 6V TC1070; TC1071 TC1187 — — 0.5 0.5 2 3 % IL = 0.1mA to IOUTMAX IL = 0.1mA to IOUTMAX (Note 2) 2 65 85 180 270 — — 120 250 400 mV TC1071; TC1187 TC1187 — — — — — IL = 0.1mA IL = 20mA IL = 50mA IL = 100mA IL = 150mA (Note 3) Supply Current — 50 80 µA SHDN = VIH , IL = 0 IINSD Shutdown Supply Current — 0.05 0.5 µA SHDN = 0V PSRR Power Supply Rejection Ratio — 64 — dB FRE ≤ 1kHz IOUTSC Output Short Circuit Current — 300 450 mA VOUT = 0V ∆VOUT/∆PD Thermal Regulation — 0.04 — V/W Note 4 ∆VOUT/∆VIN Line Regulation ∆VOUT/VOUT Load Regulation VIN-VOUT Dropout Voltage IIN TSD Thermal Shutdown Die Temperature — 160 — °C ∆TSD Thermal Shutdown Hysteresis — 10 — °C eN Output Noise — 260 — nV/√Hz IL = IOUT MAX Note 1: TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x ∆T 2: 3: 4: 5: 6: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.. The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to I OUT MAX. DS21353B-page 2 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3µF, SHDN > VIH , TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions SHDN Input VIH SHDN Input High Threshold 45 — — %VIN VIN = 2.5V to 6.5V VIL SHDN Input Low Threshold — — 15 %VIN VIN = 2.5V to 6.5V Adjust Input Leakage Current — 50 — pA ADJ Input IADJ Note 1: TC VOUT = (VOUTMAX – VOUTMIN) x 10 6 VOUT x ∆T 2: 3: 4: 5: 6: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX . 2002 Microchip Technology Inc. DS21353B-page 3 TC1070/TC1071/TC1187 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (5-Pin SOT-23A) Symbol 1 VIN Description Unregulated supply input. 2 GND 3 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.5 µA (max). 4 ADJ Output voltage adjust terminal. Output voltage setting is programmed with a resistor divider from VOUT to this input. A capacitor may also be added to this input to reduce output noise (See Section 3.2, Output Capacitor). 5 VOUT Regulated voltage output. DS21353B-page 4 Ground terminal. 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 3.0 DETAILED DESCRIPTION 3.1 The TC1070, TC1071 and TC1187 are adjustable fixed output voltage regulators. (If a fixed version is desired, please see the TC1014/TC1015/TC1185 data sheet.) Unlike bipolar regulators, the TC1070, TC1071 and TC1187 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05µA (typical), VOUT falls to zero volts. FIGURE 3-1: 3.0V Battery + BATTERY-OPERATED SUPPLY 1 + C1 1µF 2 3 VIN VOUT 5 TC1070 TC1071 TC1187 R1 470K GND SHDN +2.45V C2 + 1µF ADJ 4 C3 100pF to 0.01µF (Optional) Shutdown Control (from Power Control Logic) 2002 Microchip Technology Inc. R2 470K Adjust Input The output voltage setting is determined by the values of R1 and R2 (Figure 3-1). The ohmic values of these resistors should be between 470K and 3M to minimize bleeder current. The output voltage setting is calculated using the following equation. EQUATION 3-1: VOUT = VREF x [ R1 R2 ] +1 The voltage adjustment range of the TC1070, TC1071 and TC1187 is from VREF to (VIN – 0.05V). If so desired, a small capacitor (100pF to 0.01µF) may be added to the ADJ input to further reduce output noise. 3.2 Output Capacitor A 1µF (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1Ω and less than 5.0Ω, and a resonant frequency above 1MHz. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. DS21353B-page 5 TC1070/TC1071/TC1187 4.0 THERMAL CONSIDERATIONS 4.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. 4.2 Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX VOUTMIN = 2.7V – 2% ILOADMAX = 40mA Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: EQUATION 4-1: PD ≈ (VINMAX – VOUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). The 5-Pin SOT-23A package has a θJA of approximately 220°C/Watt. EQUATION 4-2: PDMAX = (TJMAX – TAMAX) θJA Where all terms are previously defined. DS21353B-page 6 = 3.0V ±10% TJMAX = 125°C TAMAX = 55°C Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(3.0 x 1.10) – (2.7 x .0.98)]40 x 10–3 = 26.2mW Maximum allowable power dissipation: PDMAX = (T JMAX – TAMAX) θJA = (125 – 55) 220 = 318mW In this example, the TC1070 dissipates a maximum of 26.2mW; below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. 4.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and therefore increase the maximum allowable power dissipation limit. 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 5.0 TYPICAL CHARACTERISTICS (Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C) The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.020 DROPOUT VOLTAGE (V) 0.018 Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 10mA 0.090 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.100 DROPOUT VOLTAGE (V) Note: CIN = 1µF COUT = 1µF -40 0.200 0 20 50 TEMPERATURE (°C) 70 0.060 0.050 0.040 0.030 0.020 Dropout Voltage vs. Temperature (VOUT = 3.3V) 0.300 ILOAD = 100mA 0.120 0.100 0.080 0.060 0.040 CIN = 1µF COUT = 1µF 0 20 50 TEMPERATURE (°C) 70 125 Dropout Voltage vs. Temperature (VOUT = 3.3V) 0.250 0.200 0.150 0.100 0.050 CIN = 1µF COUT = 1µF 0.000 0.000 -40 -20 0 20 50 70 -40 125 TEMPERATURE (°C) Ground Current vs. VIN (VOUT = 3.3V) 90 ILOAD = 10mA 80 70 60 50 40 30 20 CIN = 1µF COUT = 1µF 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) 2002 Microchip Technology Inc. -20 0 20 50 TEMPERATURE (°C) 70 125 Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 100mA 80 GND CURRENT (µA) GND CURRENT (µA) -20 ILOAD = 150mA 0.140 90 CIN = 1µF COUT = 1µF -40 0.160 0.020 0.070 0.000 125 DROPOUT VOLTAGE (V) DROPOUT VOLTAGE (V) 0.180 -20 ILOAD = 50mA 0.080 0.010 0.000 Dropout Voltage vs. Temperature (VOUT = 3.3V) 70 60 50 40 30 20 CIN = 1µF COUT = 1µF 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) DS21353B-page 7 TC1070/TC1071/TC1187 5.0 TYPICAL CHARACTERISTICS (CONTINUED) (Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C) Ground Current vs. VIN (VOUT = 3.3V) 80 ILOAD = 0 ILOAD = 150mA 3 60 2.5 50 VOUT (V) GND CURRENT (µA) 70 VOUT vs. VIN (VOUT = 3.3V) 3.5 40 30 2 1.5 1 20 0.5 CIN = 1µF COUT = 1µF 10 0 CIN = 1µF COUT = 1µF 0 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) 3.0 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V) VOUT vs. VIN (VOUT = 3.3V) 3.5 0.5 1 1.5 Output Voltage vs. Temperature (VOUT = 3.3V) 3.320 ILOAD = 100mA ILOAD = 10mA 3.315 3.310 3.305 VOUT (V) VOUT (V) 2.5 2.0 1.5 3.300 3.295 3.290 1.0 3.285 0.5 CIN = 1µF COUT = 1µF 0.0 0 3.290 3.288 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V) CIN = 1µF COUT = 1µF VIN = 4.3V 3.280 3.275 -40 -20 -10 0 20 40 85 125 TEMPERATURE (°C) Output Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 150mA VOUT (V) 3.286 3.284 3.282 3.280 3.278 3.276 CIN = 1µF COUT = 1µF VIN = 4.3V 3.274 -40 -20 -10 0 20 40 85 125 TEMPERATURE (°C) DS21353B-page 8 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 5.0 TYPICAL CHARACTERISTICS (CONTINUED) (Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C) Output Voltage vs. Temperature (VOUT = 5V) 5.025 ILOAD = 10mA 4.990 4.988 5.010 4.986 5.005 5.000 4.995 4.990 4.985 4.984 4.982 4.980 4.978 VIN = 6V CIN = 1µF COUT = 1µF -40 ILOAD = 150mA 4.992 5.015 VOUT (V) VOUT (V) 5.020 Output Voltage vs. Temperature (VOUT = 5V) 4.994 VIN = 6V CIN = 1µF COUT = 1µF 4.976 -20 -10 0 20 40 85 4.974 125 -40 -20 -10 TEMPERATURE (°C) 70 50 40 30 20 10 -10 0 20 40 TEMPERATURE (°C) 85 50 40 30 20 VIN = 6V CIN = 1µF COUT = 1µF -10 125 -30 -35 COUT = 1µF to 10µF -40 100 -45 10 1 0 20 40 85 125 Power Supply Rejection Ratio Stability Region vs. Load Current RLOAD = 50Ω COUT = 1µF CIN = 1µF 1.0 -20 TEMPERATURE (°C) 1000 COUT ESR (Ω) NOISE (µV/√Hz) 125 ILOAD = 150mA -40 Output Noise vs. Frequency 10.0 85 0 0 -20 40 60 10 VIN = 6V CIN = 1µF COUT = 1µF -40 20 Temperature vs. Quiescent Current (VOUT = 5V) 80 ILOAD = 10mA Stable Region PSRR (dB) GND CURRENT (µA) 60 Temperature vs. Quiescent Current (VOUT = 5V) GND CURRENT (µA) 70 0 TEMPERATURE (°C) -50 IOUT = 10mA VINDC = 4V VINAC = 100mVp-p VOUT = 3V CIN = 0 COUT = 1µF -55 -60 -65 0.1 -70 0.1 -75 0.0 0.01K 0.1K 0.01 1K 10K 100K 1000K FREQUENCY (Hz) 2002 Microchip Technology Inc. 0 10 20 30 40 50 60 70 80 90 100 LOAD CURRENT (mA) -80 0.01K 0.1K 1K 10K 100K 1000K FREQUENCY (Hz) DS21353B-page 9 TC1070/TC1071/TC1187 5.0 TYPICAL CHARACTERISTICS (CONTINUED) Measure Rise Time of 3.3V LDO Measure Fall Time of 3.3V LDO Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 4.3V, Temp = 25°C, Fall Time = 184µS Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 4.3V, Temp = 25°C, Fall Time = 52µS VSHDN VSHDN VOUT VOUT Measure Rise Time of 5.0V LDO Measure Fall Time of 5.0V LDO Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 6V, Temp = 25°C, Fall Time = 192µS Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 6V, Temp = 25°C, Fall Time = 88µS VSHDN VSHDN VOUT VOUT Thermal Shutdown Response of 5.0V LDO Conditions: VIN = 6V, CIN = 0µF, COUT = 1µF VOUT ILOAD was increased until temperature of die reached about 160°C, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160°C. The regulator remains off until die temperature drops to approximately 150°C. DS21353B-page 10 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 6.0 PACKAGING INFORMATION 6.1 Package Marking Information “1” & “2” = part number code + temperature range and voltage (V) TC1070 Code TC1071 Code TC1187 Code Adjustable BA BB R9 “3” represents year and quarter code “4” represents lot ID number 6.2 Taping Form Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package 5-Pin SOT-23A 2002 Microchip Technology Inc. Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8 mm 4 mm 3000 7 in DS21353B-page 11 TC1070/TC1071/TC1187 6.3 Package Dimensions SOT-23A-5 .075 (1.90) REF. .071 (1.80) .059 (1.50) .122 (3.10) .098 (2.50) .020 (0.50) .012 (0.30) PIN 1 .037 (0.95) REF. .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) .010 (0.25) .004 (0.09) 10° MAX. .024 (0.60) .004 (0.10) Dimensions: inches (mm) DS21353B-page 12 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21353B-page 13 TC1070/TC1071/TC1187 NOTES: DS21353B-page 14 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. 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B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 San Jose China - Hong Kong SAR Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 New York Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 05/01/02 *DS21353B* DS21353B-page 16 2002 Microchip Technology Inc.