TI TS3A5018RGYRG4

TS3A5018
www.ti.com
SCDS189D – JANUARY 2005 – REVISED MARCH 2010
10-Ω QUAD SPDT ANALOG SWITCH
Check for Samples: TS3A5018
APPLICATIONS
NC2 5
12 COM4
NO2 6
11 NC3
COM2 7
10 NO3
GND 8
9 COM3
3
4
5
6
12 COM4
11 NC3
10 NO3
7
8
9
V+
EN
16
15
14
13
NO1
1
12
NC4
COM1
2
11
NO4
NC2
3
10
COM4
NO2
4
9
NC3
5
6
7
8
NO3
COM1
13 NO4
15 EN
14 NC4
13 NO4
2
COM3
14 NC4
4
16
IN
NO1 3
NC1
NO1
COM1
NC2
NO2
COM2
1
GND
15 EN
RSV PACKAGE
(TOP VIEW)
NC1
16 V+
NC1 2
V+
Logic
Control
COM3
IN 1
Sample-and-Hold Circuits
Battery-Powered Equipment
Audio and Video Signal Routing
Communication Circuits
RGY PACKAGE
(TOP VIEW)
D, DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
IN
•
•
•
•
•
Low ON-State Resistance (10 Ω)
Low Charge Injection
Excellent ON-State Resistance Matching
Low Total Harmonic Distortion (THD)
2.3-V to 3.6-V Single-Supply Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
GND
•
•
•
•
•
•
COM2
FEATURES
1
DESCRIPTION/ORDERING INFORMATION
The TS3A5018 is a quad single-pole double-throw (SPDT) analog switch that is designed to operate from 2.3 V
to 3.6 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either
direction.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2010, Texas Instruments Incorporated
TS3A5018
SCDS189D – JANUARY 2005 – REVISED MARCH 2010
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
TS3A5018D
Reel of 2500
TS3A5018DR
Reel of 2500
TS3A5018DBQR
Tube of 90
TS3A5018PW
Reel of 2000
TS3A5018PWR
TVSOP – DGV
Reel of 2000
TS3A5018DGVR
QFN – RGY
Reel of 3000
uQFN – RSV
Reel of 3000
SOIC – D
SSOP (QSOP) – DBQ
–40°C to 85°C
(1)
(2)
ORDERABLE PART NUMBER
Tube of 40
TSSOP – PW
TOP-SIDE MARKING
TS3A5018
YA018
YA018
YA018
TS3A5018RGYR
YA018
TS3A5018RGYRG4
TS3A5018RSVR
ZUN
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
SUMMARY OF CHARACTERISTICS (1)
Quad Single-Pole,
Double Throw
(4 × SPDT)
Configuration
Number of channels
4
7Ω
ON-state resistance (ron)
0.3 Ω
ON-state resistance match (Δron)
5Ω
ON-state resistance flatness (ron(flat))
Turn-on/turn-off time (tON/tOFF)
3.5 ns/2 ns
Charge injection (QC)
2 pC
Bandwidth (BW)
300 MHz
OFF isolation (OISO)
–48 dB at 10 MHz
Crosstalk (XTALK)
–48 dB at 10 MHz
Total harmonic distortion (THD)
0.2%
Leakage current (ICOM(OFF)
±5 mA
Power-supply current (I+)
2.5 mA
16-pin QFN, uQFN, SOIC,
SSOP, TSSOP, or TVSOP
Package options
(1)
V+ = 3.3 V, TA = 25°C
FUNCTION TABLE
IN
NO TO COM,
COM TO NO
L
L
OFF
ON
L
H
ON
OFF
H
X
OFF
OFF
EN
2
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NC TO COM,
COM TO NC
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS3A5018
TS3A5018
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SCDS189D – JANUARY 2005 – REVISED MARCH 2010
Absolute Minimum and Maximum Ratings (1)
(2)
over operating free-air temperature range (unless otherwise noted)
Supply voltage range (3)
V+
MIN
MAX
–0.5
4.6
UNIT
V
–0.5
4.6
V
VNC
Analog voltage range (3)
VNO
(4)
VCOM
IK
Analog port diode current
VNC, VNO, VCOM < 0
–50
mA
On-state switch current
VNC, VNO, VCOM = 0 to 7 V
–64
64
mA
–0.5
4.6
V
INC
INO
ICOM
VI
Digital input voltage range (3)
(4)
IIK
Digital input clamp current
I+
Continuous current through V+
–100
100
mA
IGND
Continuous current through GND
–100
100
mA
VI < 0
–50
D package
qJA
Tstg
(1)
(2)
(3)
(4)
(5)
Package thermal impedance (5)
mA
73
DBQ package
90
DGV package
120
PW package
108
RGY package
51
RSV package
184
Storage temperature range
–65
150
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
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TS3A5018
SCDS189D – JANUARY 2005 – REVISED MARCH 2010
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Electrical Characteristics for 3.3-V Supply (1)
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
UNIT
Analog Switch
Analog signal
range
ON-state
resistance
ON-state
resistance
match between
channels
ON-state
resistance
flatness
NC, NO
OFF leakage
current
COM
OFF leakage
current
NC, NO
ON leakage
current
COM
ON leakage
current
VCOM, VNO,
VNC
ron
0
0 ≤ (VNC or VNO) ≤ V+,
ICOM = –32 mA,
Switch ON,
See Figure 13
VNC or VNO = 2.1 V,
ICOM = –32 mA,
Switch ON,
See Figure 13
0 ≤ (VNC or VNO) ≤ V+,
ICOM = –32 mA,
Switch ON,
See Figure 13
VNC or VNO = 1 V,
VCOM = 3 V,
or
VNC or VNO = 3 V,
VCOM = 1 V,
Switch OFF,
See Figure 14
25°C
Full
7
3V
ron(flat)
INC(OFF),
INO(OFF)
ICOM(OFF)
0.3
3V
Full
5
3V
25°C
VNC or VNO = 0 to 3.6 V,
VCOM = 3.6 V to 0,
or
VNC or VNO = 3.6 V to 0,
VCOM = 0 to 3.6 V,
Switch OFF,
See Figure 14
VCOM = 1 V,
VNC or VNO = 3 V,
or
VCOM = 3 V,
VNC or VNO = 3 V,
Switch OFF,
See Figure 14
3.6 V
Full
25°C
25°C
VCOM = 0 to 3.6 V,
VNC or VNO = 3.6 V to 0,
or
VCOM = 3.6 V to 0,
VNC or VNO = 0 to 3.6 V,
25°C
Switch OFF,
See Figure 14
INC(ON),
INO(ON)
VNC or VNO = 1 V,
VCOM = Open,
or
VNC or VNO = 3 V,
VCOM = Open,
Switch ON,
See Figure 15
ICOM(ON)
VCOM = 1 V,
VNC or VNO = Open,
or
VCOM = 3 V,
VNC or VNO = Open,
Switch ON,
See Figure 15
0V
Full
25°C
25°C
3.6 V
Full
0.05
0.1
2
mA
0.1
0.2
0.05
2
mA
10
0.05
–0.2
–0.1
Ω
10
–10
–0.1
3.6 V
Full
0.05
–0.2
–2
Ω
0.2
–10
–0.1
3.6 V
Full
–0.2
–2
0V
Full
0.05
Ω
7
8
–0.1
V
0.8
1
25°C
Full
10
12
25°C
Δron
V+
0.1
0.2
0.05
mA
0.1
mA
–0.2
0.2
2
V+
V
0.8
V
Digital Control Inputs (IN, EN) (2)
Input logic high
VIH
Input logic low
VIL
Input leakage
current
(1)
(2)
4
IIH, IIL
Full
VI = V+ or 0
Full
0
25°C
–1
Full
3.6 V
–1
0.05
1
1
mA
The algebraic convention is used in this data sheet; the most negative value is shown in the minimum column.
All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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TS3A5018
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SCDS189D – JANUARY 2005 – REVISED MARCH 2010
Electrical Characteristics for 3.3-V Supply (1) (continued)
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
25°C
3.3 V
2.5
3.5
8
Full
3 V to
3.6 V
2.5
25°C
3.3 V
0.5
Full
3 V to
3.6 V
0.5
UNIT
Dynamic
Turn-on time
tON
VCOM = 2 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 17
Turn-off time
tOFF
VCOM = 2 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 17
Charge
injection
QC
VGEN = 0,
RGEN = 0,
CL = 0.1 nF,
See Figure 22
25°C
3.3 V
2
pC
9
2
ns
6.5
7
ns
NC, NO
OFF
capacitance
CNC(OFF),
CNO(OFF)
VNC or VNO = V+ or GND,
See Figure 16
Switch OFF,
25°C
3.3 V
4.5
pF
COM
OFF
capacitance
CCOM(OFF)
VCOM = V+ or GND,
Switch OFF,
See Figure 16
25°C
3.3 V
9
pF
NC, NO
ON
capacitance
CNC(ON),
CNO(ON)
VNC or VNO = V+ or GND,
See Figure 16
Switch ON,
25°C
3.3 V
16
pF
COM
ON
capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
See Figure 16
25°C
3.3 V
16
pF
Digital input
capacitance
CI
VI = V+ or GND,
See Figure 16
25°C
3.3 V
3
pF
Bandwidth
BW
RL = 50 Ω,
Switch ON,
See Figure 18
25°C
3.3 V
300
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 10 MHz,
Switch OFF,
See Figure 19
25°C
3.3 V
–48
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 10 MHz,
Switch ON,
See Figure 20
25°C
3.3 V
–48
dB
Crosstalk
adjacent
XTALK(ADJ)
RL = 50 Ω,
f = 10 MHz,
Switch ON,
See Figure 21
25°C
3.3 V
–81
dB
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 23
25°C
3.3 V
0.21
%
VI = V+ or GND,
Switch ON or OFF
Total harmonic
distortion
Supply
Positive supply
current
I+
25°C
Full
3.6 V
2.5
7
10
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mA
5
TS3A5018
SCDS189D – JANUARY 2005 – REVISED MARCH 2010
www.ti.com
Electrical Characteristics for 2.5-V Supply (1)
V+ = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
UNIT
Analog Switch
Analog signal
range
ON-state
resistance
ON-state
resistance
match between
channels
ON-state
resistance
flatness
NC, NO
OFF leakage
current
COM
OFF leakage
current
NC, NO
ON leakage
current
COM
ON leakage
current
VCOM, VNC,
VNO
ron
0
0 ≤ (VNC or VNO) ≤ V+,
ICOM = –24 mA,
Switch ON,
See Figure 13
VNC or VNO = 1.6 V,
ICOM = –24 mA,
Switch ON,
See Figure 13
0 ≤ (VNC or VNO) ≤ V+,
ICOM = –24 mA,
Switch ON,
See Figure 13
VNC or VNO = 0.5 V,
VCOM = 2.2 V,
or
VNC or VNO = 2.2 V,
VCOM = 0.5 V,
Switch OFF,
See Figure 14
25°C
Full
12
2.3 V
ron(flat)
INC(OFF),
INO(OFF)
ICOM(OFF)
0.3
2.3 V
Full
14
2.3 V
Switch OFF,
See Figure 14
VCOM = 0.5 V,
VNC or VNO = 2.2 V,
or
VCOM = 2.2 V,
VNC or VNO = 0.5 V,
Switch OFF,
See Figure 14
Full
2.7 V
25°C
Full
25°C
Full
2.7 V
INC(ON),
INO(ON)
VNC or VNO = 0.5 V,
VCOM = Open,
or
VNC or VNO = 2.2 V,
VCOM = Open,
Switch ON,
See Figure 15
ICOM(ON)
VCOM = 0.5 V,
VNC or VNO = Open,
or
VCOM = 2.2 V,
VNC or VNO = Open,
Switch ON,
See Figure 15
Full
0V
25°C
Full
25°C
Full
2.7 V
0.05
0.1
2
mA
0.1
0.2
0.05
2
mA
10
0.05
–0.2
–0.1
Ω
10
–10
–0.1
2.7 V
0.05
–0.2
–2
Ω
0.2
–10
–0.1
25°C
Switch OFF,
See Figure 14
–0.2
–2
0V
0.05
Ω
18
20
–0.1
V
1
2
25°C
25°C
VNC or VNO = 0 to 3.6 V,
VCOM = 3.6 V to 0,
or
VNC or VNO = 3.6 V to 0,
VCOM = 0 to 3.6 V,
VCOM = 0 to 3.6 V,
VNC or VNO = 3.6 V to 0,
or
VCOM = 3.6 V to 0,
VNC or VNO = 0 to 3.6 V,
Full
20
22
25°C
Δron
V+
0.1
0.2
0.05
mA
0.1
mA
–0.2
0.2
1.7
V+
V
0.7
V
Digital Control Inputs (IN, EN) (2)
Input logic high
VIH
Input logic low
VIL
Input leakage
current
(1)
(2)
6
IIH, IIL
Full
VI = V+ or 0
Full
0
25°C
–0.1
Full
2.7 V
–1
0.05
0.1
1
mA
The algebraic convention is used in this data sheet; the most negative value is shown in the minimum column.
All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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TS3A5018
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SCDS189D – JANUARY 2005 – REVISED MARCH 2010
Electrical Characteristics for 2.5-V Supply (1) (continued)
V+ = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
25°C
2.5 V
2.5
5
9.5
Full
2.3 V to
2.7 V
2.5
25°C
2.5 V
0.5
Full
2.3 V to
2.7 V
0.5
UNIT
Dynamic
Turn-on time
tON
VCOM = 1.5 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 17
Turn-off time
tOFF
VCOM = 1.5 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 17
Charge
injection
QC
VGEN = 0,
RGEN = 0,
CL = 0.1 nF,
See Figure 22
25°C
2.5 V
1
pC
10.5
3
ns
7.5
9
ns
NC, NO
OFF
capacitance
CNC(OFF),
CNO(OFF)
VNC or VNO = V+ or GND,
See Figure 16
Switch OFF,
25°C
2.5 V
3
pF
COM
OFF
capacitance
CCOM(OFF)
VCOM = V+ or GND,
Switch OFF,
See Figure 16
25°C
2.5 V
9
pF
NC, NO
ON
capacitance
CNC(ON),
CNO(ON)
VNC or VNO = V+ or GND,
See Figure 16
Switch ON,
25°C
2.5 V
16
pF
COM
ON
capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
See Figure 16
25°C
2.5 V
16
pF
Digital input
capacitance
CI
VI = V+ or GND,
See Figure 16
25°C
2.5 V
3
pF
Bandwidth
BW
RL = 50 Ω,
Switch ON,
See Figure 18
25°C
2.5 V
300
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 10 MHz,
Switch OFF,
See Figure 19
25°C
2.5 V
–48
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 10 MHz,
Switch ON,
See Figure 20
25°C
2.5 V
–48
dB
Crosstalk
adjacent
XTALK(ADJ)
RL = 50 Ω,
f = 10 MHz,
Switch ON,
See Figure 21
25°C
3.3 V
–81
dB
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 23
25°C
2.5 V
0.33
%
VI = V+ or GND,
Switch ON or OFF
Total harmonic
distortion
Supply
Positive supply
current
I+
25°C
Full
2.7 V
2.5
7
10
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TYPICAL PERFORMANCE
18
10
TA = 25°C
16
14
8
V+ = 2.5 V
855C
255C
6
10
ron (W)
ron (Ω)
12
8
6
4
V+ = 3.3 V
4
–405C
2
2
0
0.0
0.5
1.0
1.5
2.0
VCOM (V)
2.5
3.0
3.5
0
0.0
0.5
Figure 1. ron vs VCOM
1.0
1.5
2.0
VCOM (V)
2.5
3.0
3.5
Figure 2. ron vs VCOM (V+ = 2.5 V)
18
40
16
INC(ON)
Leakage Current (nA)
14
ron (W)
12
855C
10
8
255C
6
4
2
30
ICOM(ON)
20
10
INC(OFF)
ICOM(OFF)
INO(ON)
INO(OFF)
–405C
0
0.0
0.5
1.0
1.5
2.0
2.5
0
−60
3.0
−40
−20
0
20
40
60
80
100
TA (°C)
VCOM (V)
Figure 3. ron vs VCOM (V+ = 2.5 V)
Figure 4. Leakage Current vs Temperature (V+ = 3.6 V)
7
5
tON
6
5
V+ = 3.3 V
3
tON/tOFF (ns)
Charge Injection (pC)
4
2
V+ = 2.5 V
1
tOFF
4
3
2
1
0
0
1
2
3
4
0
2.0
2.5
VCOM (V)
3.5
4.0
V+ (V)
Figure 5. Charge Injection (QC) vs VCOM
8
3.0
Figure 6. tON and tOFF vs Supply Voltage
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TYPICAL PERFORMANCE (continued)
2.0
8
1.8
tON
tON/tOFF (ns)
6
5
tOFF
4
3
2
1
1.4
25
VIH
1.2
VIL
1.0
0.8
0.6
0.4
0.2
0.0
2.0 2.2
0
−40
TA = 25_C
1.6
Logic Level Threshold (V)
7
85
2.4 2.6
2.8 3.0 3.2
V+ (V)
TA (5C)
Figure 7. tON and tOFF vs Temperature (V+ = 3.3 V)
3.4 3.6
3.8 4.0
Figure 8. Logic-Level Threshold vs V+
0
0
−10
−1
−20
−30
−3
Gain (dB)
Gain (dB)
−2
−4
−5
−6
−40
−50
−60
−70
−80
−7
−90
1
10
100
1K
1
10
Frequency (MHz)
Figure 9. Gain vs Frequency Bandwidth (V+ = 3.3 V)
1k
Figure 10. OFF Isolation and Crosstalk vs Frequency
(V+ = 3.3 V)
0.45
4.0
0.40
3.5
0.35
3.0
0.30
2.5
0.25
2.0
I+ (µA)
THD (%)
100
Frequency (MHz)
0.20
0.15
1.5
1.0
0.10
0.5
0.05
0.00
10
0.0
100
1000
Frequency (MHz)
10 K
−40
100 K
25
85
TA (5C)
Figure 11. Total Harmonic Distortion vs Frequency
Figure 12. Power-Supply Current vs Temperature
(V+ = 3.3 V)
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PIN DESCRIPTION
PIN
NO.
10
NAME
DESCRIPTION
1
IN
2
NC1
Digital control pin to select between NC and NO
Normally closed
3
NO1
Normally open
4
COM1
5
NC2
Normally closed
6
NO2
Normally open
7
COM2
8
GND
Common
Common
Digital ground
9
COM3
10
NO3
Common
Normally open
11
NC3
Normally closed
12
COM4
13
NO4
Normally open
14
NC4
Normally closed
15
EN
Chip enable (active low)
16
V+
Power supply
Common
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SCDS189D – JANUARY 2005 – REVISED MARCH 2010
PARAMETER DESCRIPTION
SYMBOL
VCOM
DESCRIPTION
Voltage at COM
VNC
Voltage at NC
VNO
Voltage at NO
ron
Δron
ron(flat)
Resistance between COM and NC or NO ports when the channel is ON
Difference of ron between channels in a specific device
Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
INC(OFF)
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state
INC(ON)
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output
(COM) open
INO(OFF)
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state
INO(ON)
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output
(COM) open
ICOM(OFF)
Leakage current measured at the COM port, with the corresponding channel (COM to NC or NO) in the OFF state
ICOM(ON)
Leakage current measured at the COM port, with the corresponding channel (COM to NC or NO) in the ON state and the
output (NC or NO) open
VIH
Minimum input voltage for logic high for the control input (IN, EN)
VIL
Maximum input voltage for logic low for the control input (IN, EN)
VI
Voltage at the control input (IN, EN)
IIH, IIL
Leakage current measured at the control input (IN, EN)
tON
Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation
delay between the digital control (IN) signal and analog output NC or NO) signal when the switch is turning ON.
tOFF
Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation
delay between the digital control (IN) signal and analog output (NC or NO) signal when the switch is turning OFF.
QC
Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC or NO)
output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input.
Charge injection, QC = CL × ΔVCOM, CL is the load capacitance and ΔVCOM is the change in analog output voltage.
CNC(OFF)
Capacitance at the NC port when the corresponding channel (NC to COM) is OFF
CNC(ON)
Capacitance at the NC port when the corresponding channel (NC to COM) is ON
CNO(OFF)
Capacitance at the NC port when the corresponding channel (NO to COM) is OFF
CNO(ON)
Capacitance at the NC port when the corresponding channel (NO to COM) is ON
CCOM(OFF)
Capacitance at the COM port when the corresponding channel (COM to NC) is OFF
CCOM(ON)
Capacitance at the COM port when the corresponding channel (COM to NC) is ON
CI
Capacitance of control input (IN, EN)
OISO
OFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific
frequency, with the corresponding channel (NC to COM) in the OFF state.
XTALK
Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC1 to NO1). Adjacent
crosstalk is a measure of unwanted signal coupling from an ON channel to an adjacent ON channel (NC1 to NC2) .This is
measured in a specific frequency and in dB.
BW
Bandwidth of the switch. This is the frequency in which the gain of an ON channel is –3 dB below the DC gain.
THD
Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root
mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the fundamental
harmonic.
I+
Static power-supply current with the control (IN) pin at V+ or GND
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SCDS189D – JANUARY 2005 – REVISED MARCH 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION
V+
VNC NC
COM
+
VCOM
Channel ON
VNO NO
r on +
IN or EN
VI
ICOM
VCOM * VNO or VNC
W
I COM
VI = VIH or VIL
+
GND
Figure 13. ON-State Resistance (ron)
V+
VNC NC
COM
+
VCOM
+
VNO NO
OFF-State Leakage Current
Channel OFF
VI = VIH or VIL
VNC or VNO = 0 to V+
and
VCOM =V+ to 0
IN or EN
VI
+
GND
Figure 14. OFF-State Leakage Current (ICOM(OFF), INC(OFF), INO(OFF))
V+
VNC NC
COM
+
VNO NO
VCOM
ON-State Leakage Current
Channel ON
VI = VIH or VIL
IN or EN
VI
+
GND
Figure 15. ON-State Leakage Current (ICOM(ON), INC(ON))
12
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SCDS189D – JANUARY 2005 – REVISED MARCH 2010
PARAMETER MEASUREMENT INFORMATION (continued)
V+
Capacitance
Meter
VNC
NC
VNO
NO
VBIAS = V+ or GND
VI = VIH or VIL
VCOM COM
Capacitance is measured at NC,
NO, COM, and IN inputs during
ON and OFF conditions.
VBIAS
VI
IN or EN
GND
Figure 16. Capacitance (CI, CCOM(OFF), CCOM(ON), CNC(OFF), CNC(ON))
V+
NC or NO
VCOM (3)
VNC or VNO
TEST
RL
CL
tON
300 Ω
35 pF
tOFF
300 Ω
35 pF
COM
NC or NO
CL(2)
CL(2)
RL
RL
VI
Logic
Input(1)
IN or EN
GND
V+
Logic
Input
(VI)
50%
50%
0
tON
tOFF
Switch
Output
(VNC)
90%
90%
A.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B.
CL includes probe and jig capacitance.
C.
See Electrical Characteristics for VCOM.
Figure 17. Turn-On (tON) and Turn-Off Time (tOFF)
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SCDS189D – JANUARY 2005 – REVISED MARCH 2010
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PARAMETER MEASUREMENT INFORMATION (continued)
V+
Network Analyzer
50 W
VNC
NC
Channel ON: NC to COM
COM
Source
Signal
VNO
VCOM
VI = V+ or GND
NO
Network Analyzer Setup
IN or EN
VI
50 W
Source Power = 0 dBm
(632-mV P-P at 50-W load)
+
GND
DC Bias = 350 mV
Figure 18. Bandwidth (BW)
V+
Network Analyzer
Channel OFF: NC to COM
50 W
VNC
NC
VI = V+ or GND
COM
Source
Signal
50 W
VNO
VCOM
NO
Network Analyzer Setup
IN or EN
Source Power = 0 dBm
(632-mV P-P at 50-W load)
VI
50 W
+
GND
DC Bias = 350 mV
Figure 19. OFF Isolation (OISO)
V+
Network Analyzer
Channel ON: NC to COM
50 W
VNC
NC
Channel OFF: NO to COM
VCOM
Source
Signal
VNO
NO
IN or EN
50 W
VI
50 W
+
VI = V+ or GND
GND
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
Figure 20. Crosstalk (XTALK)
14
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SCDS189D – JANUARY 2005 – REVISED MARCH 2010
PARAMETER MEASUREMENT INFORMATION (continued)
V+
Network Analyzer
50 W
VNC1
NC1
Source
Signal
Channel ON: NC to COM
COM1
VNC2 NC2
COM2
IN or EN
Network Analyzer Setup
50 W
Source Power = 0 dBm
(632 mV P-P at 50 W load)
VI
50 W
+
DC Bias = 350 mV
GND
Figure 21. Crosstalk Adjacent
V+
RGEN
VGEN
Logic
Input
(VI)
OFF
ON
OFF V
IL
NC or NO
COM
+
VIH
VCOM
∆VCOM
VCOM
NC or NO
CL(1)
VI
Logic
Input(2)
IN or EN
VGEN = 0 to V+
RGEN = 0
CL = 0.1 nF
QC = CL × ∆VCOM
VI = VIH or VIL
GND
A.
CL includes probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
Figure 22. Charge Injection (QC)
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SCDS189D – JANUARY 2005 – REVISED MARCH 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
Channel ON: COM to NC
VSOURCE = V+ P-P
VI = VIH or VIL
fSOURCE = 20 Hz to 20 kHz
V+/2
V+
Audio Analyzer
RL
10 mF
Source
Signal
10 mF
NC
COM
600 W
600 W
NO
IN or EN
CL(1)
VI
+
GND
600 W
A.
CL includes probe and jig capacitance.
Figure 23. Total Harmonic Distortion (THD)
16
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TS3A5018D
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TS3A5018DBQR
ACTIVE
SSOP/QSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
TS3A5018DBQRE4
ACTIVE
SSOP/QSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
TS3A5018DBQRG4
ACTIVE
SSOP/QSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
TS3A5018DE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TS3A5018DG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TS3A5018DGVR
ACTIVE
TVSOP
DGV
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TS3A5018DGVRE4
ACTIVE
TVSOP
DGV
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TS3A5018DGVRG4
ACTIVE
TVSOP
DGV
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TS3A5018DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
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TS3A5018DRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
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TS3A5018DRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
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TS3A5018PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TS3A5018PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TS3A5018PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TS3A5018PWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
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TS3A5018PWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
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Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
10-Jun-2010
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TS3A5018PWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TS3A5018RGYR
ACTIVE
VQFN
RGY
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
TS3A5018RGYRG4
ACTIVE
VQFN
RGY
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
TS3A5018RSVR
ACTIVE
UQFN
RSV
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TS3A5018DGVR
Package Package Pins
Type Drawing
TVSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGV
16
2000
330.0
12.4
6.8
4.0
1.6
8.0
12.0
Q1
TS3A5018DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
TS3A5018PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TS3A5018RGYR
VQFN
RGY
16
3000
330.0
12.4
3.8
4.3
1.5
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS3A5018DGVR
TVSOP
DGV
16
2000
346.0
346.0
29.0
TS3A5018DR
SOIC
D
16
2500
333.2
345.9
28.6
TS3A5018PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
TS3A5018RGYR
VQFN
RGY
16
3000
355.0
350.0
50.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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