TI TS5A9411DCKR

TS5A9411
www.ti.com ............................................................................................................................................................... SCDS241A – MAY 2008 – REVISED JULY 2008
10-Ω SPDT ANALOG SWITCH
SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER
FEATURES
APPLICATIONS
•
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1
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2.25-V to 5.5-V Single-Supply Operation
Low ON-State Resistance
(10 Ω Max at V+ = 5V)
Specified Break-Before-Make Switching
Low Power Consumption
TTL/CMOS Compatible Control Input
Low Input/Output Capacitance
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
ESD Performance Tested Per JESD
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Control Inputs Are 5.5-V Tolerant
Excellent ON-State Resistance Matching
Low Total Harmonic Distortion (THD)
DCK PACKAGE
(TOP VIEW)
Cell Phones
Communication Systems
Portable Test Equipment
Battery Operated Systems
Sample-and-Hold Circuits
DESCRIPTION
The TS5A9411 is a single-pole double-throw (SPDT)
analog switch that is designed to operate from 2.25 V
to 5.5 V. The device offers low ON-state resistance,
low
leakage,
and
low
power
with
a
break-before-make feature. These features make this
device suitable for portable and battery-powered
applications.
FUNCTION TABLE
NC TO COM,
COM TO NC
NO TO COM,
COM TO NO
L
ON
OFF
H
OFF
ON
IN
NO
IN 1
6
V+ 2
5 COM
4 NC
GND 3
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
(3)
PACKAGE
(1) (2)
SOT (SC-70) – DCK
TOP-SIDE MARKING (3)
ORDERABLE PART NUMBER
Tape and reel
TS5A9411DCKR
32_
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
DCK: The actual top-side marking has one additional character that designates the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TS5A9411
SCDS241A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
SUMMARY OF CHARACTERISTICS (1)
2:1 Multiplexer/
Demultiplexer
(1 × SPDT)
Configuration
Number of channels
1
ON-state resistance (rON)
5.3 Ω
ON-state resistance match (ΔrON)
0.03 Ω
2Ω
ON-state resistance flatness rON(flat))
Turn-on/turn-off time (tON/tOFF)
9 ns/7 ns
Break-before-make time (tBBM)
1 ns
Charge injection (QC)
12.5 pC
Bandwidth (BW)
100 MHz
OFF isolation (OISO)
–84 dB at 1 MHz
Crosstalk (XTALK)
–85 dB at 1 MHz
Total harmonic distortion (THD)
0.03%
Leakage current (INO(OFF)/INC(OFF))
±3 nA
0.01 µA
Power-supply current (I+)
Package options
(1)
6-pin DCK
V+ = 5 V, TA = 25°C
ABSOLUTE MINIMUM AND MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
V+
Supply voltage range (3)
–0.3
6
V
VNO
VNC
VCOM
Analog voltage range (3) (4) (5)
–0.3
V+ + 0.3
V
IK
Analog port diode current
INO
INC
ICOM
On-state switch current
VI
Digital input voltage range (3) (4)
IIK
Digital input clamp current
I+
Continuous current through V+
IGND
Continuous current through GND
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
VNC, VNO, VCOM < 0
On-state peak switch current (6)
VNO, VNC, VCOM = 0 to V+
VI < 0
–50
mA
–50
50
–200
200
–0.5
V+ + 0.3
–50
mA
V
mA
100
–100
–65
UNIT
mA
mA
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This value is limited to 5.5 V maximum.
Pulse at 1-ms duration < 10% duty cycle
THERMAL IMPEDANCE RATINGS
UNIT
θJA
(1)
2
Package thermal impedance
(1)
DCK package
259
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
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Product Folder Link(s): TS5A9411
TS5A9411
www.ti.com ............................................................................................................................................................... SCDS241A – MAY 2008 – REVISED JULY 2008
ELECTRICAL CHARACTERISTICS FOR 5-V SUPPLY (1)
V+ = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP MAX UNIT
Analog Switch
Analog signal
range
ON-state
resistance
VCOM,
VNO, VNC
0
rON
VNO or VNC = 3 V,
ICOM = –10 mA,
Switch ON,
See Figure 6
ON-state
resistance
match
between
channels
ΔrON
VNO or VNC = 3 V,
ICOM = –10 mA,
Switch ON,
See Figure 6
ON-state
resistance
flatness
rON(flat)
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –10 mA,
Switch ON,
See Figure 6
Full
5.3
4.5 V
INC(OFF),
INO(OFF)
VNC or VNO = 1 V,
VCOM = 1 V to 4.5 V,
or
VNC or VNO = 4.5 V,
VCOM = 1 V,
Switch OFF,
See Figure 7
NC, NO
ON leakage
current
INC(ON),
INO(ON)
VNC or VNO = 1 V,
VCOM = 1 V
VNC or VNO = 4.5 V,
VCOM = 4.5 V,
Switch ON,
See Figure 8
ICOM(ON)
VNC or VNO = Open,
VCOM = 1 V,
or
VNC or VNO = Open,
VCOM = 4.5 V,
Switch ON,
See Figure 8
Full
25°C
0.03
4.5 V
Full
5.5 V
25°C
Full
5.5 V
25°C
Full
5.5 V
V
Ω
0.3
0.3
4.5 V
25°C
9
10
25°C
NC, NO
OFF leakage
current
COM
ON leakage
current
25°C
V+
Ω
Ω
2
–500
500
pA
–3
3
nA
–500
500
pA
–3
3
nA
–500
500
pA
–3
3
nA
Digital Input (IN)
Input logic high
VIH
Full
Input logic low
VIL
Full
Input leakage
current
IIH, IIL
(1)
VI = 5.5 V or 0
25°C
Full
4.5 V to 5.5 V
2.4
5.5
4.5 V
2
5.5
4.5 V to 5.5 V
0
0.8
–0.05
0.05
–0.05
0.05
5.5 V
V
V
µA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
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SCDS241A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS FOR 5-V SUPPLY (continued)
V+ = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP MAX UNIT
Dynamic
Turn-on time
tON
VCOM = 3 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 10
25°C
5V
9
Full
4.5 V to 5.5 V
10
Turn-off time
tOFF
VCOM = 3 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 10
25°C
5V
Full
4.5 V to 5.5 V
Break-beforemake time
tBBM
VNC = VNO = 3 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 11
25°C
Charge injection
QC
VGEN = 0,
RGEN = 0,
CL = 1 nF,
See Figure 15
25°C
5V
12.5
pC
Full
5V
7
7.5
1
ns
ns
ns
0.9
NC, NO
OFF
capacitance
CNC(OFF),
CNO(OFF)
VNC or VNO = V+ or GND,
f = 1 MHz,
Switch OFF,
See Figure 9
25°C
5V
3.5
pF
NC, NO
ON capacitance
CNC(ON),
CNO(ON)
VNC or VNO = V+ or GND,
f = 1 MHz,
See Figure 9
25°C
5V
8.5
pF
COM
ON capacitance
CCOM(ON)
VCOM = V+ or GND,
f = 1 MHz,
Switch ON,
See Figure 9
25°C
5V
8.5
pF
VI = V+ or GND,
f = 1 MHz,
See Figure 9
25°C
5V
25
pF
Digital input
capacitance
CI
Bandwidth
BW
RL = 50 Ω,
Switch ON,
See Figure 12
25°C
5V
100
MHz
OFF isolation
OISO
RL = 50 Ω, CL = 5 pF,
f = 1 MHz,
Switch OFF,
See Figure 13
25°C
5V
–84
dB
Crosstalk
XTALK
RL = 50 Ω, CL = 5 pF,
f = 1 MHz,
Switch ON,
See Figure 14
25°C
5V
–85
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20
kHz,
See Figure 16
25°C
5V
0.03
%
VI = V+ or GND,
Switch ON or
OFF
Supply
Positive supply
current
4
I+
25°C
Full
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5.5 V
0.01
0.5
µA
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TS5A9411
TS5A9411
www.ti.com ............................................................................................................................................................... SCDS241A – MAY 2008 – REVISED JULY 2008
ELECTRICAL CHARACTERISTICS FOR 3-V SUPPLY (1)
V+ = 2.7 V to 3.3 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP MAX UNIT
Analog Switch
Analog signal
range
ON-state
resistance
VCOM,
VNO, VNC
0
rON
VNO or VNC = 1.5 V,
ICOM = –10 mA,
Switch ON,
See Figure 6
ON-state
resistance
match
between
channels
ΔrON
VNO or VNC = 1.5 V,
ICOM = –10 mA,
Switch ON,
See Figure 6
ON-state
resistance
flatness
rON(flat)
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –10 mA,
Switch ON,
See Figure 6
Full
11.5
2.7 V
INC(OFF),
INO(OFF)
VNC or VNO = 1 V,
VCOM = 1 V to 3 V,
or
VNC or VNO = 3 V,
VCOM = 1 V,
Switch OFF,
See Figure 7
NC, NO
ON leakage
current
INC(ON),
INO(ON)
VNC or VNO = 1 V,
VCOM = 1 V
VNC or VNO = 3 V,
VCOM = 3 V,
Switch ON,
See Figure 8
ICOM(ON)
VNC or VNO = Open,
VCOM = 1 V,
or
VNC or VNO = Open,
VCOM = 3 V,
Switch ON,
See Figure 8
Full
25°C
0.05
2.7 V
Full
3.3V
25°C
Full
3.3 V
25°C
Full
3.3 V
V
Ω
0.3
0.3
3V
25°C
15
20
25°C
NC, NO
OFF leakage
current
COM
ON leakage
current
25°C
V+
Ω
Ω
2
–400
400
pA
–2
2
nA
–400
400
pA
–2
2
nA
–400
400
pA
–2
2
nA
Digital Input (IN)
Input logic high
VIH
Full
2
5.5
V
Input logic low
VIL
Full
0
0.8
V
25°C
–0.05
0.05
–0.05
0.05
Input leakage
current
(1)
IIH, IIL
VI = 5.5 V or 0
Full
3.6 V
µA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
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ELECTRICAL CHARACTERISTICS FOR 3-V SUPPLY (continued)
V+ = 2.7 V to 3.3 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP MAX UNIT
Dynamic
Turn-on time
tON
VCOM = 3 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 10
25°C
3V
13
Full
2.7 V to 3.3 V
15
Turn-off time
tOFF
VCOM = 3 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 10
25°C
3.3 V
7.5
Full
2.7 V to 3.3 V
8.5
Break-beforemake time
tBBM
VNC = VNO = 3 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 11
25°C
VGEN = 0,
RGEN = 0,
CL = 1 nF,
See Figure 15
25°C
3V
6
pC
Charge injection
QC
Full
3.3 V
1
ns
ns
ns
0.9
NC, NO
OFF
capacitance
CNC(OFF),
CNO(OFF)
VNC or VNO = V+ or GND,
f = 1 MHz,
Switch OFF,
See Figure 9
25°C
3V
3.5
pF
NC, NO
ON capacitance
CNC(ON),
CNO(ON)
VNC or VNO = V+ or GND,
f = 1 MHz,
Switch OFF,
See Figure 9
25°C
3V
8.5
pF
COM
ON capacitance
CCOM(ON)
VCOM = V+ or GND,
f = 1 MHz,
Switch OFF,
See Figure 9
25°C
3V
8.5
pF
VI = V+ or GND,
f = 1 MHz,
See Figure 9
25°C
3V
2.5
pF
Digital input
capacitance
CI
Bandwidth
BW
RL = 50 Ω,
Switch ON,
See Figure 12
25°C
3V
100
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 1 MHz,
Switch OFF,
See Figure 13
25°C
3V
–84
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 1 MHz,
Switch ON,
See Figure 14
25°C
3V
–85
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20
kHz,
See Figure 16
25°C
3V
0.09
%
VI = V+ or GND,
Switch ON or
OFF
Supply
Positive supply
current
6
I+
25°C
Full
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3.6 V
0.01
0.5
µA
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Product Folder Link(s): TS5A9411
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www.ti.com ............................................................................................................................................................... SCDS241A – MAY 2008 – REVISED JULY 2008
ELECTRICAL CHARACTERISTICS FOR 2.5-V SUPPLY (1)
V+ = 2.25 V to 2.75, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX UNIT
Analog Switch
Analog signal
range
ON-state
resistance
VCOM,
VNO, VNC
0
rON
VNO or VNC = 1 V,
ICOM = –10 mA,
Switch ON,
See Figure 6
ON-state
resistance
match
between
channels
ΔrON
VNO or VNC = 1 V,
ICOM = –10 mA,
Switch ON,
See Figure 6
ON-state
resistance
flatness
rON(flat)
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –10 mA,
Switch ON,
See Figure 6
NC, NO
OFF leakage
current
INC(OFF),
INO(OFF)
VNC or VNO = 1.5 V,
VCOM = 0.5 V to 1.5 V,
or
VNC or VNO = 1.5 V,
VCOM = 1.5 V,
Switch OFF,
See Figure 7
NC, NO
ON leakage
current
INC(ON),
INO(ON)
VNC or VNO = 1.5 V,
VCOM = 0.5 V to 1.5 V
VNC or VNO = 1.5 V,
VCOM = 1.5 V,
Switch ON,
See Figure 8
ICOM(ON)
VNC or VNO = Open,
VCOM = 0.5 V,
or
VNC or VNO = Open,
VCOM = 1.5 V,
Switch ON,
See Figure 8
COM
ON leakage
current
25°C
Full
15
2.25 V
25°C
0.06
2.25 V
Full
2.75 V
25°C
Full
2.75 V
25°C
Full
2.75 V
V
Ω
0.3
0.3
2.25 V
25°C
25
28
25°C
Full
V+
Ω
Ω
4
–300
300
pA
–1
1
nA
–300
300
pA
–1
1
nA
–300
300
pA
–1
1
nA
Digital Input (IN)
Input logic high
VIH
Full
2
5.5
V
Input logic low
VIL
Full
0
0.4
V
25°C
–0.05
0.05
–0.05
0.05
Input leakage
current
(1)
IIH, IIL
VI = 5.5 V or 0 V
Full
2.75 V
µA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
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ELECTRICAL CHARACTERISTICS FOR 2.5-V SUPPLY (continued)
V+ = 2.25 V to 2.75, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX UNIT
25°C
2.5 V
18
Full
2.25 V to
2.75 V
20
25°C
2.5 V
8
Full
2.25 V to
2.75 V
Dynamic
Turn-on time
tON
VCOM = 2 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 10
Turn-off time
tOFF
VCOM = 2 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 10
Break-beforemake time
tBBM
VNC = VNO = 2 V,
RL = 300 Ω,
CL = 35 pF,
See Figure 11
VGEN = 0,
RGEN = 0,
CL = 1 nF,
See Figure 15
25°C
2.5 V
4.5
pC
Charge injection
QC
25°C
Full
2.5 V
9.5
1
ns
ns
ns
0.9
NC, NO
OFF
capacitance
CNC(OFF),
CNO(OFF)
VNC or VNO = V+ or GND,
f = 1 MHz,
Switch OFF,
See Figure 9
25°C
2.5 V
3.5
pF
NC, NO
ON capacitance
CNC(ON),
CNO(ON)
VNC or VNO = V+ or GND,
f = 1 MHz,
Switch OFF,
See Figure 9
25°C
2.5 V
8.5
pF
COM
ON capacitance
CCOM(ON)
VCOM = V+ or GND,
f = 1 MHz,
Switch OFF,
See Figure 9
25°C
2.5 V
8.5
pF
VI = V+ or GND,
f = 1 MHz,
See Figure 9
25°C
2.5 V
2.5
pF
Digital input
capacitance
Ci
Bandwidth
BW
RL = 50 Ω,
Switch ON,
See Figure 12
25°C
2.5 V
100
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 1 MHz,
Switch OFF,
See Figure 13
25°C
2.5 V
–84
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 1 MHz,
Switch ON,
See Figure 14
25°C
2.5 V
–84
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20
kHz,
See Figure 16
25°C
2.5 V
0.15
%
Positive supply
current
I+
VI = V+ or GND,
Switch ON or
OFF
8
25°C
Full
Submit Documentation Feedback
2.75 V
0.01
0.5
µA
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Product Folder Link(s): TS5A9411
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www.ti.com ............................................................................................................................................................... SCDS241A – MAY 2008 – REVISED JULY 2008
TYPICAL PERFORMANCE
14
15
12
10
V = 2.5 V
+
10
5
8
V+ = 3.3 V
6
0
4
-5
V =5V
+
2
-10
0
0
1
2
3
4
5
6
-15
0
5
20
20
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
100.00E+3
15
Figure 2. Charge Injection (QC) vs VCOM
0
INS
-20
Gain (dB)
Gain (dB)
Figure 1. rON vs VIN
10
-40
-60
-80
CRO
-100
1.00E+6
10.00E+6
100.00E+6
-120
100.0E+3
1.00E+9
Frequency (Hz)
1.0E+6
10.0E+6
100.0E+6
1.0E+9
Frequency (Hz)
Figure 3. Bandwidth (V+ = 3 V)
Figure 4. OFF Isolation vs Crosstalk (V+ = 3 V)
0.1
0.09
THD (%)
0.08
0.07
0.06
0.05
0.04
0.03
10.0E+0
100.0E+0
1.0E+3
10.0E+3
100.0E+3
Frequency (Hz)
Figure 5. Total Harmonic Distortion vs Frequency
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PIN DESCRIPTION
PIN
NO.
NAME
1
IN
Digital control to connect COM to NO
2
V+
Power supply
3
GND
Digital ground
4
NC
5
COM
6
NO
DESCRIPTION
Normally closed
Common
Normally open
PARAMETER DESCRIPTION
SYMBOL
VCOM
VNC
Voltage at NC
VNO
Voltage at NO
rON
Resistance between COM and NC or COM and NO ports when the channel is ON
ΔrON
Difference of ron between channels
rON(flat)
Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
INC(OFF)
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state under
worst-case input and output conditions
INO(OFF)
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state under
worst-case input and output conditions
INC(ON)
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the
output (COM) being open
INO(ON)
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the
output (COM) being open
ICOM(ON)
ICOM(PWROFF)
Leakage current measured at the COM port, with the corresponding channel (COM to NO or COM to NC) in the ON
state and the output (NC or NO) being open
Leakage current measured at the COM port during the power-down condition, V+ = 0
VIH
Minimum input voltage for logic high for the control input (IN)
VIL
Maximum input voltage for logic low for the control input (IN)
VI
Voltage at IN
IIH, IIL
10
DESCRIPTION
Voltage at COM
Leakage current measured at IN
tON
Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the
propagation delay between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal when the
switch is turning ON.
tOFF
Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the
propagation delay between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal when the
switch is turning OFF.
tBBM
Break-before-make time. This parameter is measured under the specified range of conditions and by the
propagation delay between the output of two adjacent analog channels (NC and NO) when the control signal
changes state.
QC
Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC, NO,
or COM) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the
control input. Charge injection, QC = CL × ΔVO, CL is the load capacitance and ΔVO is the change in analog
output voltage.
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PARAMETER DESCRIPTION (continued)
SYMBOL
DESCRIPTION
CNC(OFF)
Capacitance at the NC port when the corresponding channel (NC to COM) is OFF
CNO(OFF)
Capacitance at the NO port when the corresponding channel (NO to COM) is OFF
CNC(ON)
Capacitance at the NC port when the corresponding channel (NC to COM) is ON
CNO(ON)
Capacitance at the NO port when the corresponding channel (NO to COM) is ON
CCOM(ON)
Capacitance at the COM port when the corresponding channel (COM to NC or COM to NO) is ON
CI
Capacitance of control input (IN)
OISO
OFF isolation of the switch is a measurement OFF-state switch impedance. This is measured in dB in a specific
frequency, with the corresponding channel (NC to COM or NO to COM) in the OFF state.
XTALK
Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC to NO or NO
to NC). This is measured in a specific frequency and in dB.
BW
Bandwidth of the switch. This is the frequency in which the gain of an ON channel is –3 dB below the DC gain.
THD
Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio or
root mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the
fundamental harmonic.
I+
Static power-supply current with the control (IN) pin at V+ or GND
PARAMETER MEASUREMENT INFORMATION
V+
VNC NC
COM
+
VCOM
Channel ON
VNO NO
r ON +
VI
IN
ICOM
VCOM * VNO or VNC
W
I COM
VI = VIH or VIL
+
GND
Figure 6. ON-State Resistance (rON)
V+
VNC NC
COM
+
VCOM
+
VNO NO
IN
VI
OFF-State Leakage Current
Channel OFF
VI = VIH or VIL
+
GND
Figure 7. OFF-State Leakage Current (INC(OFF), INC(PWROFF), INO(OFF), INO(PWROFF), ICOM(OFF), ICOM(PWROFF))
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PARAMETER MEASUREMENT INFORMATION (continued)
V+
VNC NC
COM
+
VCOM
VNO NO
ON-State Leakage Current
Channel ON
VI = VIH or VIL
IN
VI
+
GND
Figure 8. ON-State Leakage Current (ICOM(ON), INC(ON), INO(ON))
V+
Capacitance
Meter
VNC
NC
VNO
NO
VBIAS = V+ or GND
VI = V+ or GND
VCOM COM
VBIAS
VI
Capacitance is measured at NC,
NO, COM, and IN inputs during
ON and OFF conditions.
IN
GND
Figure 9. Capacitance (CI, CCOM(ON), CNC(OFF), CNO(OFF), CNC(ON), CNO(ON))
12
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V+
VCOM
NC or NO
VNC or VNO
NC or NO
CL(2)
TEST
RL
CL
VCOM
tON
50 Ω
35 pF
V+
tOFF
50 Ω
35 pF
V+
COM
RL
IN
VI
Logic
Input(1)
CL(2)
GND
RL
V+
Logic
Input
(VI)
50%
50%
0
tON
Switch
Output
(VNC or VNO)
tOFF
90%
90%
A.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B.
CL includes probe and jig capacitance.
Figure 10. Turn-On (tON) and Turn-Off Time (tOFF)
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V+
NC or NO
V+
Logic
Input
(VI)
VNC or VNO
VCOM
50%
0
COM
NC or NO
CL(2)
VI
Switch
Output
(VCOM)
RL
IN
90%
90%
tBBM
Logic
Input(1)
VNC or VNO = V+
RL = 50 Ω
CL = 35 pF
GND
A.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B.
CL includes probe and jig capacitance.
Figure 11. Break-Before-Make Time (tBBM)
V+
Network Analyzer
50 W
VNC
NC
Channel ON: NC to COM
COM
Source
Signal
VCOM
VI = V+ or GND
NO
Network Analyzer Setup
50 W
VI
+
IN
Source Power = 0 dBm
(632-mV P-P at 50-W load)
GND
DC Bias = 350 mV
Figure 12. Bandwidth (BW)
14
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V+
Network Analyzer
Channel OFF: NC to COM
50 W
VNC
NC
VI = V+ or GND
COM
Source
Signal
50 W
VCOM
NO
Network Analyzer Setup
IN
Source Power = 0 dBm
(632-mV P-P at 50-W load)
VI
50 W
+
GND
DC Bias = 350 mV
Figure 13. OFF Isolation (OISO)
V+
Network Analyzer
Channel ON: NC to COM
50 W
VNC
Channel OFF: NO to COM
NC
VCOM
Source
Signal
VNO
NO
VI
50 W
+
VI = V+ or GND
50 W
IN
GND
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
Figure 14. Crosstalk (XTALK)
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SCDS241A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
V+
RGEN
VGEN
Logic
Input
(VI)
ON
OFF
OFF V
IL
NC or NO
COM
+
VIH
VCOM
∆VCOM
VCOM
NC or NO
CL(2)
VI
VGEN = 0 to V+
IN
Logic
Input(1)
RGEN = 0
CL = 1 nF
QC = CL × ∆VCOM
VI = VIH or VIL
GND
A.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B.
CL includes probe and jig capacitance.
Figure 15. Charge Injection (QC)
Channel ON: COM to NC
VSOURCE = V+ P-P
VI = VIH or VIL
RL = 600 Ω
fSOURCE = 20 Hz to 20 kHz
CL = 50 pF
V+/2
V+
Audio Analyzer
RL
10 mF
Source
Signal
10 mF
NO
COM
CL(1)
NC
600 W
600 W
VI
IN
GND
600 W
A.
CL includes probe and jig capacitance.
Figure 16. Total Harmonic Distortion (THD)
16
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PACKAGE OPTION ADDENDUM
www.ti.com
2-Jul-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TS5A9411DCKR
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS5A9411DCKRG4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS5A9411DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS5A9411DCKTG4
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TS5A9411DCKR
SC70
DCK
6
3000
180.0
9.2
2.24
2.34
1.22
4.0
8.0
Q3
TS5A9411DCKT
SC70
DCK
6
250
180.0
9.2
2.24
2.34
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Jul-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS5A9411DCKR
SC70
DCK
6
3000
202.0
201.0
28.0
TS5A9411DCKT
SC70
DCK
6
250
202.0
201.0
28.0
Pack Materials-Page 2
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