BYT01-400 ® HIGH EFFICIENCY ULTRAFAST DIODE MAIN PRODUCT CHARACTERISTICS IF(AV) 1A VRRM 400 V Tj (max) 150°C VF (max) 1.4 V trr (max) 25 ns ) s ( ct u d o r P e t e l o FEATURES AND BENEFITS Very low conduction losses Negligible switching losses Low forward & reverse recovery times ■ ■ ■ DESCRIPTION The BYT01-400 which is using ST’s 400V planar technology, is specially suited for switching mode base drive & transistor circuits. The device, which is available in axial (DO-15) package, is also intended for use as a free wheeling diode in power supplies and other power switching applications. ) (s s b O DO-15 BYT01-400 t c u d o r P e t e l o ABSOLUTE RATINGS (limiting values) Symbol s b O Parameter VRRM Repetive peak reverse voltage IF (AV) Average forward current TI = 80°C IFSM Surge non repetitive forward current tp = 10ms Sinusoidal Tstg Storage temperature range Tj Maximum operating junction temperature October 2001 - Ed: 2A δ = 0.5 Value Unit 400 V 1 A 30 A - 65 to +150 °C 150 °C 1/5 BYT01-400 THERMAL PARAMETERS Symbol Rth(j-a) Parameter Junction to ambient* Value Unit 45 °C/W * On infinite heatsink with 10mm lead length. STATIC ELECTRICAL CHARACTERISTICS Symbol IR* Parameters Test Conditions Tj = 25°C Reverse leakage current Min. Tj = 25°C Forward voltage drop u d o 0.1 r P e IF = 1A let Tj = 100°C o s b (s) Max. ct VR = VRRM Tj = 100°C VF** Typ. 1.0 Unit 20 µA 0.5 mA 1.5 V 1.4 Pulse test: * tp = 5ms, δ < 2% ** tp = 380µs, δ < 2% To evaluate the maximum conduction losses use the following equation: P = 1.1 x IF(AV) + 0.25 IF2(RMS) O ) s ( t c u d o DYNAMIC ELECTRICAL CHARACTERISTICS Symbol ete trr l o s b O 2/5 Pr Parameter Reverse recovery time Test Conditions Tj = 25°C IF = 0.5A IR = 1A Irr = 0.25A Min. Typ. Max. Unit 16 25 ns 55 IF = 1A dIF/dt = - 15A/µs VR = 30V tfr Forward recovery time Tj = 25°C IF = 1A dIF/dt = 50A/µs VFR = 1.1 x VFmax 60 ns VFP Forward recovery voltage Tj = 25°C IF = 1A 9.5 V dIF/dt = 50A/µs BYT01-400 Fig. 1: Average forward power dissipation versus average forward current. Fig. 2: Average forward current versus ambient temperature (δ = 0.5) PF(av)(W) IF(av)(A) 1.8 δ = 0.1 δ = 0.05 1.6 δ = 0.2 1.2 δ = 0.5 Rth(j-a)=Rth(j-l) 1.0 1.4 δ=1 1.2 0.8 1.0 0.6 Rth(j-a)=100°C/W 0.8 0.4 0.6 T 0.4 0.2 0.2 IF(av)(A) tp 0.0 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 ) s ( ct Tamb(°C) δ=tp/T 1.1 0 1.2 25 50 75 100 125 150 u d o Fig. 3: Thermal resistance versus lead length. r P e Fig. 4: Relative variation of thermal impedance junction ambient versus pulse duration (printed circuit board epoxy FR4, Lleads = 10mm). Rth(°C/W) t e l o Zth(j-a)/Rth(j-a) 110 1.0 Rth(j-a) 100 s b O 0.9 90 0.8 80 )- 70 60 Rth(j-l) s ( t c 50 40 du 30 20 ro 0 5 P e 10 0.6 δ = 0.5 0.5 0.4 0.3 δ = 0.2 0.2 Lleads(mm) 10 0.7 T δ = 0.1 0.1 tp(s) Single pulse δ=tp/T 0.0 15 20 25 t e l o Fig. 5: Forward voltage drop versus forward current. s b O 1.E-01 1.E+00 1.E+01 1.E+02 tp 1.E+03 Fig. 6: Junction capacitance versus reverse voltage applied (typical values). C(pF) IFM(A) 10 100.0 F=1MHz Vosc=30mV Tj=25°C 9 Tj=100°C (Typical values) 8 7 10.0 6 Tj=100°C (Maximum values) 5 4 1.0 3 Tj=25°C (Maximum values) 2 1 VFM(V) VR(V) 0 0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 1 10 100 1000 3/5 BYT01-400 Fig. 7: Forward recovery time versus dIF/dt (90% confidence). Fig. 8. Transient peak forward voltage versus dIF/dt (90% confidence). tfr(ns) VFP(V) 15.0 100 IF=1A Tj=100°C IF=1A Tj=100°C 12.5 80 10.0 60 7.5 40 5.0 20 ) s ( ct 2.5 dIF/dt(A/µs) dIF/dt(A/µs) 0 0.0 0 10 20 30 40 50 60 70 80 90 100 Fig. 9: Peak reverse recovery current versus dIF/dt (90% confidence). 0 10 30 40 50 60 70 u d o 80 t e l o % IF=1A dIF/dt=-50A/µs VR=30V 2.0 100 r P e 300 IF=1A VR=200V 90 Fig. 10: Dynamic parameters versus junction temperature. IRM(A) 2.5 20 Qrr s b O 250 ) (s 1.5 Tj=100°C 1.0 0.5 t c u od trr 200 IRM 150 Tj=25°C Tj(°C) dIF/dt(A/µs) 0.0 1 Pr 100 10 e t e ol 100 Fig. 11: Non repetitive surge peak current versus number of cycles. s b O IFSM(A) 35 Tj initial=25°C 30 25 20 15 10 5 Number of cycles 0 1 4/5 10 100 1000 25 50 75 100 125 150 BYT01-400 PACKAGE MECHANICAL DATA DO-15 C C A D ) s ( ct B u d o DIMENSIONS REF. Millimeters Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 let ■ ■ O s b O d o r Package Weight Base qty Delivery mode BYT01-400 DO-15 0.4 g 1000 Ammopack BYT01-400 DO-15 0.4 g 6000 Tape & Reel Cooling method: by conduction (method A) Epoxy meets UL 94,V0 Bending method: Application note AN1471 o s b ■ 0.035 t e l o Marking P e BYT01-400RL ) (s t c u Ordering code BYT01-400 r P e Inches Information furnished is believed to be accurate and reliable. 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