SN54ABT16646, SN74ABT16646 16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS212D – JUNE 1992 – REVISED JULY 1999 D D D D D D D D SN54ABT16646 . . . WD PACKAGE SN74ABT16646 . . . DGG OR DL PACKAGE (TOP VIEW) Members of the Texas Instruments Widebus Family State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Latch-Up Performance Exceeds 500 mA Per JESD 17 Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise Flow-Through Architecture Optimizes PCB Layout High-Drive Outputs (–32-mA IOH, 64-mA IOL) Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings 1DIR 1CLKAB 1SAB GND 1A1 1A2 VCC 1A3 1A4 1A5 GND 1A6 1A7 1A8 2A1 2A2 2A3 GND 2A4 2A5 2A6 VCC 2A7 2A8 GND 2SAB 2CLKAB 2DIR description The ’ABT16646 devices consist of bus-transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. These devices can be used as two 8-bit transceivers or one 16-bit transceiver. Data on the A or B bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the ’ABT16646 devices. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 1OE 1CLKBA 1SBA GND 1B1 1B2 VCC 1B3 1B4 1B5 GND 1B6 1B7 1B8 2B1 2B2 2B3 GND 2B4 2B5 2B6 VCC 2B7 2B8 GND 2SBA 2CLKBA 2OE Output-enable (OE) and direction-control (DIR) inputs are provided to control the transceiver functions. In the transceiver mode, data present at the high-impedance port may be stored in either register or in both. The select-control (SAB and SBA) inputs can multiplex stored and real-time (transparent mode) data. The circuitry used for select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition between stored and real-time data. The direction control (DIR) determines which bus receives data when OE is low. In the isolation mode (OE high), A data can be stored in one register and/or B data can be stored in the other register. When an output function is disabled, the input function is still enabled and can be used to store and transmit data. Only one of the two buses, A or B, can be driven at a time. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated. Copyright 1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ABT16646, SN74ABT16646 16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS212D – JUNE 1992 – REVISED JULY 1999 description (continued) The SN54ABT16646 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ABT16646 is characterized for operation from –40°C to 85°C. FUNCTION TABLE DATA I/O† INPUTS OPERATION OR FUNCTION OE DIR CLKAB CLKBA SAB SBA A1–A8 B1–B8 X X ↑ X X X Input Unspecified Store A, B unspecified{ X X X ↑ X X Unspecified Input Store B, A unspecified{ H X ↑ ↑ X X Input Input Store A and B data H X H or L H or L X X Input disabled Input disabled Isolation, hold storage L L X X X L Output Input Real-time B data to A bus L L X H or L X H Output Input Stored B data to A bus L H X X L X Input Output Real-time A data to B Bus L H H or L X H X Input Output Stored A data to bus † The data-output functions can be enabled or disabled by various signals at OE or DIR. Data-input functions always are enabled, i.e., data at the bus terminals is stored on every low-to-high transition of the clock inputs. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54ABT16646, SN74ABT16646 16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS OE L DIR L CLKAB CLKBA X X SAB X BUS B BUS A BUS A BUS B SCBS212D – JUNE 1992 – REVISED JULY 1999 SBA L OE L DIR H DIR X X H X X X CLKAB CLKBA ↑ X ↑ X ↑ ↑ SAB L SBA X BUS B BUS A BUS A OE CLKBA X REAL-TIME TRANSFER BUS A TO BUS B BUS B REAL-TIME TRANSFER BUS B TO BUS A CLKAB X SAB SBA X X X X X X STORAGE FROM A, B, OR A AND B OE L L DIR L H CLKAB X H or L CLKBA H or L X SAB X H SBA H X TRANSFER STORED DATA TO A AND/OR B Figure 1. Bus-Management Functions POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54ABT16646, SN74ABT16646 16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS212D – JUNE 1992 – REVISED JULY 1999 logic symbol† 1OE 1DIR 1CLKBA 1SBA 1CLKAB 1SAB 2OE 2DIR 2CLKBA 2SBA 2CLKAB 2SAB 1A1 56 1 55 54 2 G3 3 EN1 [BA] 3 EN2 [AB] C4 G5 C6 3 G7 29 28 30 31 27 26 G10 10 EN8 [BA] 10 EN9 [AB] C11 G12 C13 G14 ≥1 5 1 1A2 1A3 1A4 1A5 1A6 1A7 1A8 2A1 7 1 2A3 2A4 2A5 2A6 2A7 2A8 ≥1 7 51 49 9 48 10 47 12 45 13 44 14 43 15 16 ≥1 8 1 14 12 11D 42 ≥1 1B3 1B4 1B5 1B6 1B7 1B8 2B1 9 41 17 40 19 38 20 37 21 36 23 34 24 33 POST OFFICE BOX 655303 1B2 12 1 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 4 1B1 2 8 13D 14 2A2 52 5 1 6D 6 4D 5 • DALLAS, TEXAS 75265 2B2 2B3 2B4 2B5 2B6 2B7 2B8 SN54ABT16646, SN74ABT16646 16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS212D – JUNE 1992 – REVISED JULY 1999 logic diagram (positive logic) 1OE 1DIR 1CLKBA 1SBA 1CLKAB 1SAB 56 1 55 54 2 3 One of Eight Channels 1D C1 1A1 5 52 1B1 1D C1 2OE 2DIR 2CLKBA 2SBA 2CLKAB 2SAB To Seven Other Channels 29 28 30 31 27 26 One of Eight Channels 1D C1 2A1 15 42 2B1 1D C1 To Seven Other Channels POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN54ABT16646, SN74ABT16646 16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS212D – JUNE 1992 – REVISED JULY 1999 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT16646 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT16646 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51. recommended operating conditions (see Note 3) SN54ABT16646 VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current ∆t/∆v Input transition rise or fall rate High-level input voltage SN74ABT16646 MIN MAX MIN MAX 4.5 5.5 4.5 5.5 2 2 0.8 Input voltage 0 Low-level output current Outputs enabled VCC –24 V V 0.8 0 UNIT VCC –32 V V mA 48 64 mA 10 10 ns/V TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54ABT16646, SN74ABT16646 16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS212D – JUNE 1992 – REVISED JULY 1999 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = –18 mA IOH = –3 mA VCC = 5 V, VCC = 4 4.5 5V VOL VCC = 4 4.5 5V MIN MAX SN74ABT16646 MIN –1.2 MAX –1.2 2.5 2.5 IOH = –3 mA IOH = –24 mA 3 3 3 2 2 IOH = –32 mA IOL = 48 mA 2* 0.55 0.55* VCC = 5.5 V,, VI = VCC or GND VCC = 5.5 V, VCC = 5.5 V, VO = 2.7 V VO = 0.5 V Ioff VCC = 0, VCC = 5.5 V, VO = 5.5 V VI or VO ≤ 4.5 V VCC = 5.5 V, VO = 2.5 V Outputs high ICEX IO§ 0.55 A or B ports VCC = 5.5 V, IO = 0, VI = VCC or GND Outputs high ±1 ±1 ±1 ±20 ±20 ±20 10 10 10 µA –10 –10 µA ±100 µA 50 µA –180 mA –180 50 –50 –180 –50 2 2 2 32 32 32 Outputs disabled 2 2 2 50 50 50 50 50 50 Control inputs VCC = 5.5 V, Outputs enabled One input at 3.4 V,, Other inputs at Outputs disabled VCC or GND VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND 50 50 50 Control inputs VI = 2.5 V or 0.5 V Data inputs ∆ICC¶ Outputs low 4 Cio A or B ports VO = 2.5 V or 0.5 V 8 * On products compliant to MIL-PRF-38535, this parameter does not apply. † All typical values are at VCC = 5 V. ‡ The parameters IOZH and IOZL include the input leakage current. § Not more than one output should be tested at a time, and the duration of the test should not exceed one second. ¶ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. POST OFFICE BOX 655303 µ µA –10 50 –100 V mV ±100 –50 V V 100 Control inputs UNIT 2 0.55 IOL = 64 mA IOZH‡ IOZL‡ Ci MIN –1.2 A or B ports ICC SN54ABT16646 2.5 Vhys II TA = 25°C TYP† MAX • DALLAS, TEXAS 75265 mA µA pF pF 7 SN54ABT16646, SN74ABT16646 16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS212D – JUNE 1992 – REVISED JULY 1999 timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 2) SN54ABT16646 VCC = 5 V, TA = 25°C MIN MIN MAX UNIT MAX fclock tw Clock frequency Pulse duration, CLK high or low 4.3 125 4.3 125 MHz ns tsu th Setup time, A or B before CLKAB↑ or CLKBA↑ 3.5 4 ns Hold time, A or B after CLKAB↑ or CLKBA↑ 0.5 0.5 ns timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 2) SN74ABT16646 VCC = 5 V, TA = 25°C MIN 8 MIN MAX UNIT MAX fclock tw Clock frequency 125 4.3 4.3 ns tsu th Setup time, A or B before CLKAB↑ or CLKBA↑ 3 3 ns Hold time, A or B after CLKAB↑ or CLKBA↑ 0 0 ns Pulse duration, CLK high or low POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 125 MHz SN54ABT16646, SN74ABT16646 16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS212D – JUNE 1992 – REVISED JULY 1999 switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 2) SN54ABT16646 PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, TA = 25°C MIN fmax tPLH tPHL tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ tPZH tPZL tPHZ tPLZ MIN TYP MAX 1.5 3.1 4 1 5 1.5 3.2 4.1 1 5 1 2.3 3.2 0.6 4 1 3 4.1 0.6 4.9 1 2.9 4.3 0.6 5.3 1 3.1 4.3 0.6 5.3 125 CLKBA or CLKAB A or B A or B B or A SAB or SBA† B or A OE A or B OE A or B DIR A or B DIR A or B MAX 125 UNIT MHz 1 3.4 4.6 0.6 5.9 1.5 3.5 5.3 1 6 1.5 3.9 5.6 1 6.4 1.5 3.1 4.4 1 4.7 1 3.2 4.5 0.6 5.8 1.5 3.4 5.1 1 6.7 2 4.2 5.9 1.2 7.1 1.5 3.6 5.1 1 6.2 ns ns ns ns ns ns ns † These parameters are measured with the internal output state of the storage register opposite that of the bus input. switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 2) SN74ABT16646 PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, TA = 25°C MIN fmax tPLH tPHL tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ tPZH tPZL tPHZ tPLZ MIN TYP MAX 1.5 3.1 4 1.5 4.9 1.5 3.2 4.1 1.5 4.7 1 2.3 3.2 1 3.9 1 3 4.1 1 4.6 1 2.9 4.3 1 5 1 3.1 4.3 1 5 1 3.4 4.6 1 5.5 1.5 3.5 4.9 1.5 5.7 1.5 3.9 4.9 1.5 5.4 1.5 3.1 4.1 1.5 4.5 125 CLKBA or CLKAB A or B A or B B or A SAB or SBA† B or A OE A or B OE A or B DIR A or B DIR A or B MAX 125 UNIT MHz 1 3.2 4.5 1 5.4 1.5 3.4 4.8 1.5 5.6 2 4.2 5.7 2 6.7 1.5 3.6 5.1 1.5 5.9 ns ns ns ns ns ns ns † These parameters are measured with the internal output state of the storage register opposite that of the bus input. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 SN54ABT16646, SN74ABT16646 16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS212D – JUNE 1992 – REVISED JULY 1999 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V 1.5 V Input 1.5 V Data Input 0V 1.5 V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 3V 1.5 V Input Output Control 1.5 V 0V tPLH VOH 1.5 V VOL tPHL VOH Output tPLZ 3.5 V 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ tPZH 1.5 V 1.5 V 0V Output Waveform 1 S1 at 7 V (see Note B) tPLH 1.5 V 1.5 V tPZL tPHL 1.5 V Output 1.5 V 1.5 V VOH – 0.3 V VOH ≈0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 2. Load Circuit and Voltage Waveforms 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 1 5962-9450201QXA ACTIVE CFP WD 56 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ABT16646DGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16646DGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16646DL ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16646DLG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16646DLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16646DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54ABT16646WD ACTIVE CFP WD 56 TBD A42 SNPB MSL Peak Temp (3) 74ABT16646DGGRE4 1 TBD Lead/Ball Finish A42 SNPB N / A for Pkg Type N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2008 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ABT16646DGGR DGG 56 SITE 41 330 24 8.6 15.6 1.8 12 24 Q1 SN74ABT16646DLR DL 56 SITE 41 330 32 11.35 18.67 3.1 16 32 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2008 Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74ABT16646DGGR DGG 56 SITE 41 346.0 346.0 41.0 SN74ABT16646DLR DL 56 SITE 41 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997 WD (R-GDFP-F**) CERAMIC DUAL FLATPACK 48 LEADS SHOWN 0.120 (3,05) 0.075 (1,91) 0.009 (0,23) 0.004 (0,10) 1.130 (28,70) 0.870 (22,10) 0.370 (9,40) 0.250 (6,35) 0.390 (9,91) 0.370 (9,40) 0.370 (9,40) 0.250 (6,35) 48 1 0.025 (0,635) A 0.014 (0,36) 0.008 (0,20) 25 24 NO. OF LEADS** 48 56 A MAX 0.640 (16,26) 0.740 (18,80) A MIN 0.610 (15,49) 0.710 (18,03) 4040176 / D 10/97 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification only Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA GDFP1-F56 and JEDEC MO -146AB POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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