TI TLV320DAC23IPW

!" "# $#%&
Data Manual
February 2004
Digital Audio Products
SLES001C
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Contents
Section
Title
Page
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−1
1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−2
1.2
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−3
1.3
Terminal Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−4
1.4
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−5
1.5
Terminal Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−6
2 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−1
2.1
Absolute Maximum Ratings Over Operating Free-Air Temperature
Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−1
2.2
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 2−1
2.3
Electrical Characteristics Over Recommended Operating
Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−2
2.3.1
DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−2
2.3.2
Analog Line Input to Line Output . . . . . . . . . . . . . . . . . . . . . . 2−2
2.3.3
Stereo Headphone Output . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−3
2.3.4
Analog Reference Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−3
2.3.5
Digital I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−3
2.3.6
Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−3
2.4
Digital-Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−4
2.4.1
Audio Interface (Master Mode) . . . . . . . . . . . . . . . . . . . . . . . 2−4
2.4.2
Audio Interface (Slave-Mode) . . . . . . . . . . . . . . . . . . . . . . . . 2−5
2.4.3
Three-Wire Control Interface (SDI) . . . . . . . . . . . . . . . . . . . . 2−6
2.4.4
Two-Wire Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−6
3 How to Use the DAC23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3.1
Control Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3.1.1
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3.1.2
2-Wire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3.1.3
Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−2
3.2
Analog Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−4
3.2.1
Line Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−4
3.2.2
Line Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−5
3.2.3
Headphone Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−5
3.3
Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−5
3.3.1
Digital Audio-Interface Modes . . . . . . . . . . . . . . . . . . . . . . . . 3−5
3.3.2
Audio Sampling Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−7
3.3.3
Digital Filter Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3−10
A Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A−1
iii
List of Illustrations
Figure
2−1
2−2
2−3
2−4
2−5
3−1
3−2
3−3
3−4
3−5
3−6
3−7
3−8
3−9
3−10
3−11
3−12
3−13
3−14
3−15
3−16
3−17
iv
Title
System-Clock Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Master-Mode Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Slave-Mode Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Three-Wire Control Interface Timing Requirements . . . . . . . . . . . . . . . . . .
Two-Wire Control Interface Timing Requirements . . . . . . . . . . . . . . . . . . .
SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-Wire Compatible Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog Line Input Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Right Justified Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Left Justified Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2S Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DSP Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital De-Emphasis Filter Response − 44.1 kHz Sampling . . . . . . . . . . .
Digital De-Emphasis Filter Response − 48 kHz Sampling . . . . . . . . . . . .
DAC Digital Filter Response 0: USB Mode . . . . . . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Ripple 0: USB Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Response 1: USB Mode Only . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Ripple 1: USB Mode Only . . . . . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Response 2: USB Mode and Normal Modes . . . . . . . .
DAC Digital Filter Ripple 2: USB Mode and Normal Modes . . . . . . . . . . .
DAC Digital Filter Response 3: USB Mode Only . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Ripple 3: USB Mode Only . . . . . . . . . . . . . . . . . . . . . . . .
Page
2−4
2−4
2−5
2−6
2−6
3−1
3−2
3−5
3−6
3−6
3−6
3−7
3−10
3−11
3−11
3−11
3−12
3−12
3−12
3−13
3−13
3−13
1 Introduction
The TLV320DAC23 is a high performance stereo DAC with highly integrated analog functionality. The DACs within
the TLV320DAC23 are comprised of multibit sigma-delta technology with integrated over-sampling digital
interpolation filters. Supported data transfer word lengths are 16, 20, 24, and 32 bits with sample rates from 8 kHz
to 96 kHz. The DAC sigma-delta modulator features a second order multibit architecture with up to 100 dBA SNR
at audio sample rates up to 96 kHz. This enables high quality digital audio playback capability while consuming less
than 19 mW during playback only. The TLV320DAC23 is the ideal choice for portable digital audio player applications
such as MP3 digital audio players.
Integrated analog features consist of stereo line inputs with an analog bypass path and a stereo headphone amplifier
with analog volume control and mute. The headphone amplifier is capable of delivering 30 mW per channel into 32 Ω.
The analog bypass path allows use of the stereo line inputs and the headphone amplifier with analog volume control
while completely bypassing the DAC, thus enabling further design flexibility such as integrated FM tuners.
While the TLV320DAC23 supports the industry standard over-sample rates of 256 fs and 384 fs, unique over-sample
rates of 250 fs and 272 fs are provided which optimize interface considerations in designs using TI C54x DSPs and
USB data interfaces. A single 12-MHz crystal can be used to supply clocking to the DSP, USB, and DAC. The
TLV320DAC23 features an internal oscillator which, when connected to a 12-MHz external crystal, will provide a
system clock to the DSP and other peripherals at either 12 MHz or 6 MHz using an internal clock buffer and selectable
divider. Audio sample rates of 48 kHz and CD standard rates of 44.1 kHz are directly supported from a 12-MHz master
clock with 250 fs and 272 fs over-sample rates.
Low power consumption and flexible power management allow selective shutdown of DAC functions, thus extending
battery life in portable applications. Couple this design solution with the industry’s smallest package, the TI proprietary
MicroStar Junior using only 25 mm2 of board area, powerful portable stereo audio designs are easily realizable in
a cost effective, space saving total analog solution.
MicroStar Junior is a trademark of Texas Instruments.
1−1
1.1 Features
•
High-Performance Stereo DAC
−
−
−
−
•
Software control via TI McBSP-compatible multiprotocol serial port
−
−
•
2-wire-compatible and SPI-compatible serial port protocols
Glueless interface to TI McBSPs
Audio data input/output via TI McBSP compatible programmable audio interface
−
−
−
−
−
−
I2S-compatible interface
Standard I2S, MSB, or LSB justified data transfers
16/20/24/32-bit word lengths
Audio master/slave timing capability optimized for TI DSPs (250/272 fs)
Industry-standard master/slave support also provided (256/384 fs)
Glueless interface to TI McBSPs
•
Stereo line inputs
•
Stereo line outputs
−
Analog stereo mixer for DAC and analog bypass path
•
Analog volume control with mute
•
Highly efficient linear headphone amplifier
−
•
•
18-mW power consumption during playback mode
Standby power consumption <150 µW
Power-down power consumption <15 µW
Industry’s smallest package: 32-Pin TI proprietary MicroStar Junior
−
−
−
•
30 mW into 32 Ω from a 3.3-V analog supply voltage
Flexible power management under total software control
−
−
−
1−2
100-dB SNR multibit sigma-delta ADC (A-weighted at 48 kHz)
1.42 V – 3.6 V digital supply: compatible with TI C54x DSP core voltages
2.7 V – 3.6 V analog supply: compatible TI C54x DSP buffer voltages
8-kHz – 96-kHz sampling-frequency support
25 mm2 total board area
28-Pin TSSOP available (62 mm2 total board area)
28-Pin QFN available (25 mm2 total board area)
Ideally suitable for portable solid-state audio players and recorders
1.2 Functional Block Diagram
TLV320DAC23
AVDD
50 kΩ
VDAC
CS
1.0X
Control
Interface
VMID
50 kΩ
1.0X
AGND
SDI
SCLK
MODE
VMID
Bypass
RLINEIN
LLINEIN
HPVDD
HPGND
Headphone
Driver
DAC
Select
6 to −73 dB,
1-dB Steps
Σ−∆
DAC
Σ
RHPOUT
Digital
Filters
DVDD
BVDD
DGND
ROUT
VDAC
LOUT
Σ−∆
DAC
Σ
LHPOUT
Headphone
Driver
6 to −73 dB,
1-dB Steps
LRCIN
XTI/MCLK
CLKIN
Divider
(1x, 1/2x)
OSC
XTO
CLKOUT
Digital
Audio
Interface
DIN
BCLK
CLKOUT
(1x, 1/2x)
1−3
1.3 Terminal Assignments
NC
XTO
DVDD
DGND
BVDD
CLKOUT
BCLK
DIN
NC
GQE PACKAGE
(TOP VIEW)
25 24 23 22 21 20 19 18 17
HPVDD
29
13
MODE
LHPOUT
30
12
CS
RHPOUT
31
11
LLINEIN
HPGND
32
10
RLINEIN
2
3
4
5
6
7
8
9
NC
1
NC
SDIN
NC
NC
14
VMID
SCLK
28
AGND
NC
15
AVDD
XTI/MCLK
27
ROUT
16
LOUT
26
NC
LRCIN
PW PACKAGE
(TOP VIEW)
BVDD
CLKOUT
BCLK
DIN
LRCIN
NC
NC
HPVDD
LHPOUT
RHPOUT
HPGND
LOUT
ROUT
AVDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
NC − No internal connection
1−4
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DGND
DVDD
XTO
XTI/MCLK
SCLK
SDIN
MODE
CS
LLINEIN
RLINEIN
NC
NC
VMID
AGND
BCLK
CLKOUT
BVDD
DGND
DVDD
XTO
XTI/MCLK
28
27
26
25
24
23
22
RHD PACKAGE
(TOP VIEW)
4
18
CS
HPVDD
5
17
LLINEIN
LHPOUT
6
16
RLINEIN
RHPOUT
7
15
NC
AGND
14
NC
NC
MODE
13
19
VMID
3
12
NC
11
SDIN
AVDD
20
10
2
ROUT
LRCIN
9
SCLK
LOUT
21
8
1
HPGND
DIN
NC − No internal connection
1.4 Ordering Information
PACKAGE
TA
32-Pin
MicroStar Junior GQE
28-Pin
TSSOP PW
28-Pin
QFN RHD
−10°C to 70°C
TLV320DAC23GQE
TLV320DAC23PW
TLV320DAC23RHD
−40°C to 85°C
TLV320DAC23IGQE
TLV320DAC23IPW
TLV320DAC23IRHD
1−5
1.5 Terminal Functions
TERMINAL
NUMBER
NAME
DESCRIPTION
I/O
GQE
PW
RHD
AGND
5
15
12
−
Analog supply return
AVDD
4
14
11
−
BCLK
23
3
28
I/O
Analog supply input. Voltage level is 3.3 V nominal.
I2S serial-bit clock. In audio master mode, the DAC23 generates this signal and sends it to the
DSP. In audio slave mode, the signal is generated by the DSP.
BVDD
21
1
26
−
Buffer supply input. Voltage range is from 2.7 V to 3.6 V.
CLKOUT
22
2
27
O
Clock output. This is a buffered version of the XTI input and is available in 1X or 1/2X
frequencies of XTI. Frequency selection is controlled by bit X in control register XX.
CS
12
21
18
I
DIN
24
4
1
I
Control port input latch/address select. For SPI control mode this input acts as the data latch
control. For 2-wire control mode this input defines the seventh bit in the device address field.
See Section 3.1 for details.
I2S format serial data input to the sigma-delta stereo DAC
DGND
20
28
25
−
Digital supply return
DVDD
19
27
24
−
Digital supply input. Voltage range is 1.4 V to 3.6 V.
HPGND
32
11
8
−
Analog headphone amplifier supply return
HPVDD
29
8
5
−
Analog headphone amplifier supply input. Voltage level is 3.3 V nominal.
LHPOUT
30
9
6
O
Left stereo mixer-channel amplified headphone output. Nominal 0-dB output level is 1.0 VRMS.
Gain of –73 dB to 6 dB is provided in 1-dB steps.
LLINEIN
11
20
17
I
Left stereo-line input channel
LOUT
2
12
9
O
LRCIN
26
5
2
I/O
Left stereo mixer-channel line output. Nominal output level is 1.0 VRMS.
I2S DAC-word clock signal. In audio master mode, the DAC23 generates this framing signal
and sends it to the DSP. In audio slave mode, the signal is generated by the DSP.
MODE
13
22
19
I
Serial interface mode input. See Section 3.1 for details.
1, 7, 8,
9, 17,
25, 27,
28
6, 7,
17,18
3, 4,
14, 15
−
Not Used—No internal connection
RHPOUT
31
10
7
O
Right stereo mixer-channel amplified headphone output. Nominal 0-dB output level is
1.0 VRMS. Gain of −73 dB to 6 dB is provided in 1-dB steps.
RLINEIN
10
19
16
I
Right stereo-line input channel
ROUT
3
13
10
O
Right stereo mixer-channel line output. Nominal output level is 1.0 VRMS.
SCLK
15
24
21
I
Control port serial data clock. For both SPI and 2-wire control modes this is the serial clock
input. See Section 3.1 for details.
SDIN
14
23
20
I
Control port serial data input. For both SPI and 2-wire control modes this is the serial data input
and also is used to select the control protocol after reset. See Section 3.1 for details.
VMID
6
16
13
I
Midrail voltage decoupling input. 10-µF and 0.1-µF capacitors should be connected in parallel
to this terminal for noise filtering. Voltage level is 1/2 AVDD nominal.
XTI/MCLK
16
25
22
I
Crystal or external clock input. Used for derivation of all internal clocks on the DAC23.
XTO
18
26
23
O
Crystal output. Connect to external crystal for applications where the DAC23 is the audio timing
master. Not used in applications where external clock source is used.
NC
1−6
2 Specifications
2.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless
otherwise noted)†
Supply voltage range, AVDD to AGND, DVDD to DGND, BVDD to DGND, HPVDD to HPGND
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to + 3.63 V
Analog supply return to digital supply return, AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to + 0 .3 V
Input voltage range, all input signals: Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to DVDD + 0.3 V
Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to AVDD + 0.3 V
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −10°C to 70°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: DVDD may not exceed BVDD + 0.3V; BVDD may not exceed AVDD + 0.3V or HPVDD + 0.3.
2.2 Recommended Operating Conditions
MIN
NOM
MAX
2.7
3.3
3.6
V
Digital buffer supply voltage, BVDD (see Note 2)
2.7
3.3
3.6
V
Digital core supply voltage, DVDD (see Note 2)
1.42
1.5
3.6
Analog supply voltage, AVDD, HPVDD (see Note 2)
Analog input voltage, (AVDD = 3.3 V)
UNIT
V
1
VRMS
kΩ
CLKOUT digital output load capacitance
20
pF
All other digital output load capacitance
10
pF
Stereo-line output load capacitance
50
pF
Stereo line output load resistance
Headphone amplifier output load resistance
10
XTI master clock Input
DAC conversion rate
Operating free-air temperature, TA
Ω
0
−10
18.43
MHz
96
kHz
70
°C
NOTE 2: Digital voltage values are with respect to DGND; analog voltage values are with respect to AGND.
2−1
2.3 Electrical Characteristics Over Recommended Operating Conditions, AVDD,
HPVDD, BVDD = 3.3 V, DVDD = 1.5 V, Master Mode, XTI = 12 MHz,
(unless otherwise stated)
2.3.1
DAC
2.3.1.1 Load = 10 kΩ, 50 pF
PARAMETER
TEST CONDITIONS
MIN
TYP
90
100
0-dB full-scale output voltage
Signal-to-noise ratio, A-weighted, 0-dB gain (see Notes 3, 4, and 5)
Dynamic range, A-weighted (see Note 5)
1.0
AVDD = 3.3 V
AVDD = 2.7 V
AVDD = 3.3 V
AVDD = 3.3 V
Total harmonic distortion (THD)
AVDD = 2.7 V
Power supply rejection ratio
fs = 44.1kHz
fs = 96 kHz
fs = 44.1 kHz
2.3.2
UNIT
VRMS
98
dB
93
85
90
1 kHz, 0 dB
–88
1 kHz, −3 dB
−92
1 kHz, 0 dB
−88
1 kHz, −3 dB
−92
1 kHz, 100 mVpp
DAC channel separation
THD+N
MAX
AVDD=3.3 V, 1 kHz, 0dB
dB
–80
dB
−80
dB
50
dB
100
dB
−84
−79
TYP
MAX
dB
Analog Line Input to Line Output
2.3.2.1 Load = 10 kΩ, 50 pF, no gain on input
PARAMETER
TEST CONDITIONS
MIN
0-dB full-scale output voltage
Signal-to-noise ratio, (SNR) A-weighted, 0-dB gain (see Notes 3, 5)
1.0
AVDD = 3.3 V
AVDD = 3.3 V
Total harmonic distortion (THD)
AVDD = 2.7 V
90
UNIT
VRMS
95
dB
1 kHz, 0 dB
–86
–80
1 kHz, −3 dB
−92
−86
1 kHz, 0 dB
−86
1 kHz, −3 dB
−92
dB
dB
Power supply rejection ratio
1 kHz, 100 mVpp
50
dB
Mute attenuation
1 kHz, 0 dB
80
dB
24 k
Ω
Input resistance
2−2
10 k
2.3.3
Stereo Headphone Output
PARAMETER
TEST CONDITIONS
MIN
0-dB full-scale output voltage
TYP
MAX
1.0
Maximum output power, PO
RL = 32 Ω
30
RL = 16 Ω
40
Signal-to-noise ratio, A-weighted (see Note 4)
AVDD = 3.3 V
90
Total harmonic distortion
AVDD = 3.3 V,
1 kHz output, into
32Ω
Power supply rejection ratio
1 kHz, 100 mVpp
Programmable gain
1 kHz output
mW
97
dB
PO = 10 mW
−60
PO = 20 mW
−40
dB
50
dB
−73
6
Programmable-gain step size
Mute attenuation
UNIT
VRMS
1 kHz output
dB
1
dB
80
dB
NOTES: 3. Ratio of output level with 1-kHz full-scale input, to the output level with the input short circuited, measured A-weighted over a 20-Hz
to 20-kHz bandwidth using an audio analyzer.
4. All performance measurements done with 20-kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter
results in higher THD + N and lower SNR and dynamic range readings than shown in the electrical characteristics. The low-pass
filter removes out-of-band noise, which, although not audible, may affect dynamic specification values.
5. Ratio of output level with 1-kHz full-scale input, to the output level with all zeros into the digital input, measured A-weighted over
a 20-Hz to 20-kHz bandwidth.
2.3.4
Analog Reference Levels
PARAMETER
MIN
TYP
Reference voltage, VMID
AVDD/2 − 50 mV
Divider resistance, RVMID
40
2.3.5
V
60
kΩ
Digital I/O
VIL
VIH
Input low level
VOL
VOH
Output low level
MIN
TYP
MAX
UNIT
0.3 × BVDD
V
0.7 × BVDD
Input high level
V
0.1 × BVDD
0.9 × BVDD
Output high level
V
V
Supply Current
PARAMETER
ITOT
UNIT
AVDD/2 + 50 mV
50
PARAMETER
2.3.6
MAX
Total supply current, no input signal
(3.3 V supply)
MIN
TYP
Line playback only (Clk power off, 50 Ω)
6
Line playback only (Clk power on, 50 Ω)
15
Analog bypass (line in to line out)
3
Power down
Oscillator enabled
1.5
Oscillator disabled
0.01
MAX
UNIT
8
mA
0.025
2−3
2.4 Digital-Interface Timing
PARAMETER
MIN
High
18
Low
18
tw(1)
tw(2)
System-clock pulse duration, MCLK/XTI
tc(1)
System-clock period, MCLK/XTI
MAX
Propagation delay, CLKOUT
UNIT
ns
54
Duty cycle, MCLK/XTI
tpd(1)
TYP
ns
40/60%
60/40%
0
10
ns
tc(1)
tw(1)
tw(2)
MCLK/XTI
tpd(1)
CLKOUT
CLKOUT
(Div 2)
Figure 2−1. System-Clock Timing Requirements
2.4.1
Audio Interface (Master Mode)
PARAMETER
MIN
0
TYP
MAX
Propagation delay, LRCIN
Setup time, DIN
10
ns
th(1)
Hold time, DIN
10
ns
BCLK
tpd(2)
LRCIN
DIN
tsu(1)
th(1)
Figure 2−2. Master-Mode Timing Requirements
2−4
10
UNIT
tpd(2)
tsu(1)
ns
2.4.2
Audio Interface (Slave-Mode)
PARAMETER
tw(3)
tw(4)
Pulse duration, BCLK
MIN
High
20
Low
20
TYP
MAX
UNIT
ns
tc(2)
tsu(2)
Clock period, BCLK
50
ns
Setup time, DIN
10
ns
th(2)
tsu(3)
Hold time, DIN
10
ns
Setup time, LRCIN
10
ns
th(3)
Hold time, LRCIN
10
ns
tc(2)
tw(4)
tw(3)
BCLK
LRCIN
tsu(2)
th(3)
tsu(3)
DIN
th(2)
Figure 2−3. Slave-Mode Timing Requirements
2−5
2.4.3
Three-Wire Control Interface (SDI)
PARAMETER
tw(5)
tw(6)
Clock pulse duration, SCLK
MIN
High
20
Low
20
TYP
MAX
UNIT
ns
tc(3)
tsu(4)
Clock period, SCLK
80
ns
Clock rising edge to CS rising edge, SCLK
60
ns
tsu(5)
th(4)
Setup time, SDIN to SCLK
20
ns
20
ns
tw(7)
tw(8)
Hold time, SCLK to SDIN
Pulse duration, CS
High
20
Low
20
ns
tw(8)
CS
tc(3)
tw(5)
tw(6)
tsu(4)
SCLK
tsu(5)
th(4)
LSB
DIN
Figure 2−4. Three-Wire Control Interface Timing Requirements
2.4.4
Two-Wire Control Interface
PARAMETER
tw(9)
Clock pulse duration, SCLK
tw(10)
MIN
High
1.3
Low
600
0
TYP
MAX
UNIT
µs
ns
f(sf)
Clock frequency, SCLK
th(5)
tsu(6)
Hold time (start condition)
600
Setup time (start condition)
600
th(6)
tsu(7)
Data hold time
tr
tf
Rise time, SDIN, SCLK
300
ns
Fall time, SDIN, SCLK
300
ns
tsu(8)
Setup time (stop condition)
tw(9)
tw(10)
SCLK
th(6)
tsu(7)
tsu(8)
DIN
Figure 2−5. Two-Wire Control Interface Timing Requirements
2−6
ns
100
600
kHz
ns
900
Data setup time
th(5)
400
ns
ns
ns
3 How to Use the DAC23
3.1 Control Interfaces
The TLV320DAC23 has many programmable features. The control interface is used to program the registers of the
device. The control interface complies with SPI (three-wire operation) and two-wire operation specifications. The
state of the MODE terminal selects the control interface type. The MODE pin must be hardwired to the required level.
3.1.1
MODE
INTERFACE
0
2-wire
1
SPI
SPI
In SPI mode, SDI carries the serial data, SCLK is the serial clock and CS latches the data word into the
TLV320DAC23. The interface is compatible with microcontrollers and DSPs with an SPI interface.
A control word consists of 16 bits, starting with the MSB. The data bits are latched on the rising edge of SCLK. A rising
edge on CS after the sixteenth rising clock edge latches the data word into the DAC (see Figure 3-1).
The control word is divided into two parts. The first part is the address block, the second part is the data block:
B[15:9]
B[8:0]
Control address bits
Control data bits
CS
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SCLK
SDI
B15 B14 B13 B12 B11 B10 B9
B8
B7
B6
B5
MSB
B4
B3
B2
B1
B0
LSB
Figure 3−1. SPI Timing
3.1.2
2-Wire
In 2-wire mode, the data transfer uses SDI for the serial data and SCLK for the serial clock. The start condition is a
falling edge on SDIN while SCLK is high. The seven bits following the start condition determine the device on the
2-wire bus that receives the data. R/W determines the direction of the data transfer. The TLV320DAC23 is a write
only device and responds only if R/W is 0. The device operates only as a slave device whose address is selected
by setting the state of the CS pin as follows.
CS STATE
(Default = 0)
ADDRESS
0
0011010
1
0011011
The device that recognizes the address responds by pulling SDI low during the ninth clock cycle, acknowledging the
data transfer. The control follows in the next two eight-bit blocks. The stop condition after the data transfer is a rising
edge on SDI when SCLK is high (see Figure 3-2).
3−1
The 16-bit control word is divided into two parts. The first part is the address block, the second part is the data block:
B[15:9]
B[8:0]
Control address bits
Control data bits
Start
Stop
1
SCLK
7
ADDR
SDI
8
9
1
8
9
1
8
R/W ACK B15 − B8 ACK B7 − B0
9
ACK
Figure 3−2. 2-Wire Compatible Timing
3.1.3
Register Map
The TLV320DAC23 has the following set of registers, which are used to program the modes of operation.
ADDRESS
REGISTER
0000000
Left line input channel control
0000001
Right line input channel control
0000010
Left channel headphone volume control
0000011
Right channel headphone volume control
0000100
Analog audio path control
0000101
Digital audio path control
0000110
Power down control
0000111
Digital audio interface format
0001000
Sample rate control
0001001
Digital interface activation
0001111
Reset register
Left Line Input Channel Control (Address: 0000000)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
LRS
LIM
X
X
X
X
X
X
X
Default
0
1
0
0
0
0
0
0
0
LRS
Left/right line simultaneous volume/mute update
Simultaneous update
0 = Disabled
1 = Enabled
Left line input mute
0 = Normal
1 = Muted
Reserved
LIM
X
Right Line Input Channel Control (Address: 0000001)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
RLS
RIM
X
X
X
X
X
X
X
Default
0
1
0
0
0
0
0
0
0
RLS
RIM
X
3−2
Right/left line simultaneous volume/mute update
Simultaneous update
0 = Disabled
1 = Enabled
Right line input mute
0 = Normal
1 = Muted
Reserved
Left Channel Headphone Volume Control (Address: 0000010)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
LRS
LZC
LHV6
LHV5
LHV4
LHV3
LHV2
LHV1
LHV0
Default
0
1
1
1
1
1
0
0
1
LRS
Left/right headphone channel simultaneous volume/mute update
Simultaneous update
0 = Disabled
1 = Enabled
Left-channel zero-cross detect
Zero-cross detect
0 = Off
1 = On
Left Headphone volume control (1111001 = 0 dB default)
1111111 = +6 dB, 79 steps between +6 dB and −73 dB (mute), 0110000 = −73 dB (mute),
any thing below 0110000 does nothing − you are still muted
LZC
LHV[6:0]
Right Channel Headphone Volume Control (Address: 0000011)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
RLS
RZC
RHV6
RHV5
RHV4
RHV3
RHV2
RHV1
RHV0
Default
0
1
1
1
1
1
0
0
1
RLS
Right/left headphone channel simultaneous volume/mute Update
Simultaneous update
0 = Disabled
1 = Enabled
Right-channel zero-cross detect
Zero-cross detect
0 = Off
1 = On
Right headphone volume control (1111001 = 0 dB default)
1111111 = +6 dB, 79 steps between +6 dB and −73 dB (mute), 0110000 = −73 dB (mute),
any thing below 0110000 does nothing − you are still muted
RZC
RHV[6:0]
Analog Audio Path Control (Address: 0000100)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
X
X
X
DAC
BYP
X
X
X
Default
0
0
0
0
0
1
0
1
0
DAC
BYP
X
DAC select
Bypass
Reserved
0 = DAC off
0 = Disabled
1 = DAC selected
1 = Enabled
Digital Audio Path Control (Address: 0000101)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
X
X
X
X
DACM
DEEMP1
DEEMP0
X
Default
0
0
0
0
0
1
0
0
0
DACM
DEEMP[1:0]
X
DAC soft mute
De-emphasis control
Reserved
0 = Disabled
00 = Disabled
1 = Enabled
01 = 32 kHz
10 = 44.1 kHz 11 = 48 kHz
Power Down Control (Address: 0000110)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
OFF
CLK
OSC
OUT
DAC
X
X
LINE
Default
0
0
0
1
1
1
1
1
1
OFF
CLK
OSC
OUT
DAC
LINE
X
Power
Clock
Oscillator
Outputs
DAC
Line input
Reserved
0 = On
0 = On
0 = On
0 = On
0 = On
0 = On
1 = Off
1 = Off
1 = Off
1 = Off
1 = Off
1 = Off
3−3
Digital Audio Interface Format (Address: 0000111)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
X
MS
LRSWAP
LRP
IWL1
IWL0
FOR1
FOR0
Default
0
0
0
0
0
0
0
0
1
MS
LRSWAP
LRP
Master/slave mode
DAC left/right swap
DAC left/right phase
IWL[1:0]
FOR[1:0]
Input bit length
Data format
X
Reserved
0 = Slave
1 = Master
0 = Disabled
1 = Enabled
0 = Right channel on, LRCIN high
1 = Right channel on, LRCIN low
00 = 16 bit
01 = 20 bit
10 = 24 bit
11 = 32 bit
11 = DSP format, frame sync followed by two data words
10 = I2S format, MSB first, left – 1 aligned
01 = MSB first, left aligned
00 = MSB first, right aligned
NOTES: 1. In Master mode, the TLV320AIC23 supplies the BCLK and LRCIN. In Slave mode, BCLK and LRCIN are supplied to the
TLV320AIC23.
2. In normal mode, BCLK = MCLK/4 for all sample rates except for 88.2 kHz and 96 kHz. For 88.2 kHz and 96 kHz sample rate,
BCLK = MCLK.
3. In USB mode, bit BCLK = MCLK
Sample Rate Control (Address: 0001000)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
CLKOUT
CLKIN
SR3
SR2
SR1
SR0
BOSR
USB/Normal
Default
0
0
0
0
0
0
0
0
0
CLKOUT
CLKIN
SR[3:0]
BOSR
Clock output divider
0 = MCLK
1 = MCLK/2
Clock input divider
0 = MCLK
1 = MCLK/2
Sampling rate control (see Sections 3.3.2.1 AND 3.3.2.2)
Base oversampling rate
USB mode:
0 = 250 fs
1 = 272 fs
Normal mode:
0 = 256 fs
1 = 384 fs
Clock mode select:
0 =Normal
1 = USB
Reserved
USB/Normal
X
Digital Interface Activation (Address: 0001001)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
X
X
X
X
X
X
X
ACT
Default
0
0
0
0
0
0
0
0
0
ACT
X
Activate interface
Reserved
0 = Inactive
1 = Active
Reset Register (Address: 0001111)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
RES
RES
RES
RES
RES
RES
RES
RES
RES
Default
0
0
0
0
0
0
0
0
0
RES
Write to this register triggers reset
3.2 Analog Interface
3.2.1
Line Inputs
The TLV320DAC23 has line inputs for the left and the right audio channels (RLINEIN and LLINEIN). Both line inputs
have independently programmable mutes. Active and passive filters for the two channels prevent high frequencies
from folding back into the audio band.
3−4
The line inputs are biased internally to VMID. When the line inputs are muted or the device is set to standby mode,
the line inputs are kept biased to VMID using special antithump circuitry. This reduces audible clicks that otherwise
might be heard when reactivating the inputs.
For interfacing to a CD system, the line input should be scaled to 1 VRMS to avoid clipping, using the circuit shown
in Figure 3-3.
Where:
R1 = 5 kΩ
R2 = 5 kΩ
C1 = 47 pF
C2 = 470 nF
R1
C2
CDIN
+
LINEIN
R
2
C1
AGND
Figure 3−3. Analog Line Input Circuit
R1 and R2 divide the input signal by two, reducing the 2 VRMS from the CD player to the nominal 1 VRMS of the DAC23
inputs. C1 filters high-frequency noise, and C2 removes any dc component from the signal.
3.2.2
Line Outputs
The TLV320DAC23 has two low-impedance line outputs (LLINEOUT and RLINEOUT) capable of driving line loads
with 10-kΩ and 50-pF impedances.
The DAC full-scale output voltage is 1.0 VRMS at AVDD = 3.3 V. The full-scale range tracks linearly with the analog
supply voltage AVDD. The DAC is connected to the line outputs via a low-pass filter that removes out-of-band
components. No further external filtering is required in most applications.
The DAC outputs and the line inputs are summed into the line outputs. The line outputs are muted by either muting
the DAC (analog) or soft muting (digital) and disabling the bypass path (see Section 3.1.3).
3.2.3
Headphone Output
The TLV320DAC23 has stereo headphone outputs (LHPOUT and RHPOUT), and is designed to drive 16-Ω or 32-Ω
headphones. The headphone output includes a high-quality volume control and mute function.
The headphone volume is logarithmically adjustable from 6 dB to –73 dB in 1-dB steps. Writing 000000 to the
volume-control registers (see Section 3.1.3) mutes the headphone output. When the headphone output is muted or
the device is placed in standby mode, the dc voltage is maintained at the outputs to prevent audible clicks.
A zero-cross detection circuit is provided under the control of the LZC and RZC bits. If this circuit is enabled, the
volume-control values are updated only when the input signal to the gain stage is close to the analog ground level.
This minimizes audible clicks as the volume is changed or the device is muted. This circuit has no time-out, so if only
dc levels are being applied to the gain stage input of more than 20 mV, the gain is not updated.
The gain is independently programmable on the left and right channels. Both channels can be locked to the same
value by setting the RLS and LRS bits (see Section 3.1.3).
3.3 Digital Audio Interface
3.3.1
Digital Audio-Interface Modes
The TLV320DAC23 supports four audio-interface modes.
•
•
•
•
Right justified
Left justified
I2S mode
DSP mode
3−5
The four modes are MSB first and operate with a variable word width between 16 to 32 bits (except right-justified
mode, which does not support 32 bits).
The digital audio interface consists of clock signal BCLK, data signals DIN and and the synchronization signal LRCIN.
BCLK is an output in master mode and an input in slave mode.
3.3.1.1 Right-Justified Mode
In right-justified mode, the LSB is available on the rising edge of BCLK, preceding a falling edge on LRCIN (see
Figure 3-4).
1/fs
LRCIN
BCLK
Left Channel
DIN
0
n
n−1
Right Channel
1
MSB
0
n
n−1
1
0
LSB
Figure 3−4. Right Justified Mode Timing
3.3.1.2 Left-Justified Mode
In left-justified mode, the MSB is available on the rising edge of BCLK, following a rising edge on LRCIN (see
Figure 3-5)
1/fs
LRCIN
BCLK
Left Channel
DIN
n
n−1
1
MSB
Right Channel
0
n
n−1
1
0
n
LSB
Figure 3−5. Left Justified Mode Timing
3.3.1.3 I2S Mode
In I2S mode, the MSB is available on the second rising edge of BCLK, after the falling edge on LRCIN (see Figure 3-6).
1/fs
LRCIN
BCLK
1BCLK
DIN
Left Channel
n
MSB
n−1
1
0
Right Channel
n
n−1
LSB
Figure 3−6. I2S Mode Timing
3−6
1
0
3.3.1.4 DSP Mode
The DSP mode is compatible with the McBSP ports of TI DSPs. LRCIN must be connected to the Frame Sync signal
of the McBSP. A falling edge on LRCIN starts the data transfer. The left-channel data consists of the first data word,
which is immediately followed by the right channel data word (see Figure 3-7).
LRCIN
BCLK
Left Channel
DIN
n
n−1
1
MSB
Right Channel
0
n
n−1
1
LSB MSB
0
LSB
Figure 3−7. DSP Mode Timing
3.3.2
Audio Sampling Rates
The TLV320DAC23 can operate in master or slave clock mode. In the master mode, the TLV320DAC23 clock and
sampling rates are derived from a 12-MHz MCLK signal. This 12-MHz clock signal is compatible with the USB
specification. The TLV320DAC23 can be used directly in a USB system.
In the slave mode, the TLV320DAC23 clock and sample rates are controlled by using an appropriate MCLK or crystal
frequency and the sample rate control register settings.
The settings in the sample rate control register control the clock mode and sampling rates.
Sample Rate Control (Address: 0001000)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
CLKOUT
CLKIN
SR3
SR2
SR1
SR0
BOSR
USB/Normal
Default
0
0
0
0
0
0
0
0
0
CLKOUT
CLKIN
SR[3:0]
BOSR
USB/Normal
X
Clock output divider
0 = MCLK
1 = MCLK/2
Clock input divider
0 = MCLK
1 = MCLK/2
Sample rate control (see Sections 3.3.2.1 and 3.3.2.2)
Base oversampling rate
USB mode:
0 = 250 fs
1 = 272 fs
Normal mode:
0 = 256 fs
1 = 384 fs
Clock mode select:
0 =Normal
1 =USB
Reserved
The clock circuit of the DAC23 has two internal dividers. The first, controlled by CLKIN, applies to the sampling-rate
generator of the DAC. The second, controlled by CLKOUT, applies only to the CLKOUT terminal. By setting CLKIN
to 1, the entire DAC is clocked with half the frequency, effectively dividing the resulting sampling rates by two.
3−7
3.3.2.1 USB-Mode Sampling Rates
In the USB mode, the following DAC sampling rates are available:
(MCLK = 12 MHz)
SAMPLING RATE
SAMPLING-RATE CONTROL SETTINGS
kHz
FILTER
TYPE
SR3
SR2
SR1
SR0
BOSR
CLKIN
96
3
0
1
1
1
0
0
88.235
2
1
1
1
1
1
0
48
0
0
0
0
0
0
0
44.118
1
1
0
0
0
1
0
32
0
0
1
1
0
0
0
8.021
1
1
0
1
1
1
0
8
0
0
0
1
1
0
0
48
3
0
1
1
1
0
1
44.118
2
1
1
1
1
1
1
24
0
0
0
0
0
0
1
22.059
1
1
0
0
0
1
1
16
0
0
1
1
0
0
1
4.0105
1
1
0
1
1
1
1
4
0
0
0
1
1
0
1
(MCLK = 6 MHz)
SAMPLING RATE
3−8
SAMPLING-RATE CONTROL SETTINGS
kHz
FILTER
TYPE
SR3
SR2
SR1
SR0
BOSR
CLKIN
48
3
0
1
1
1
0
0
44.118
2
1
1
1
1
1
0
24
0
0
0
0
0
0
0
22.059
1
1
0
0
0
1
0
16
0
0
1
1
0
0
0
4.0105
1
1
0
1
1
1
0
4
0
0
0
1
1
0
0
24
3
0
1
1
1
0
1
22.059
2
1
1
1
1
1
1
12
0
0
0
0
0
0
1
11.029
1
1
0
0
0
1
1
8
0
0
1
1
0
0
1
2.005
1
1
0
1
1
1
1
2
0
0
0
1
1
0
1
3.3.2.2 Normal-Mode Sampling Rates
In Normal mode, the following DAC sampling rates, depending on the MCLK frequency, are available:
MCLK = 12.288 MHz
SAMPLING RATE
SAMPLING-RATE CONTROL SETTINGS
kHz
FILTER
TYPE
SR3
SR2
SR1
SR0
BOSR
CLKIN
96
2
0
1
1
1
0
0
48
1
0
0
0
0
0
0
32
1
0
1
1
0
0
0
8
1
0
0
1
1
0
0
48
2
0
1
1
1
0
1
24
1
0
0
0
0
0
1
16
1
0
1
1
0
0
1
4
1
0
0
1
1
0
1
MCLK = 11.2896 MHz
SAMPLING RATE
SAMPLING-RATE CONTROL SETTINGS
kHz
FILTER
TYPE
SR3
SR2
SR1
SR0
BOSR
CLKIN
88.2
2
1
1
1
1
0
0
44.1
1
1
0
0
0
0
0
8.021
1
1
0
1
1
0
0
44.1
2
1
1
1
1
0
1
22.05
1
1
0
0
0
0
1
4.0105
1
1
0
1
0
0
1
MCLK = 18.432 MHz
SAMPLING RATE
SAMPLING-RATE CONTROL SETTINGS
kHz
FILTER
TYPE
SR3
SR2
SR1
SR0
BOSR
CLKIN
96
2
0
1
1
1
1
0
48
1
0
0
0
0
1
0
32
1
0
1
1
0
1
0
8
1
0
0
1
1
1
0
48
2
0
1
1
1
1
1
24
1
0
0
0
0
1
1
16
1
0
1
1
0
1
1
4
1
0
0
1
1
1
1
MCLK = 16.9344 MHz
SAMPLING RATE
SAMPLING-RATE CONTROL SETTINGS
kHz
FILTER
TYPE
SR3
SR2
SR1
SR0
BOSR
CLKIN
88.2
2
1
1
1
1
1
0
44.1
1
1
0
0
0
1
0
8.021
1
1
0
1
1
1
0
44.1
2
1
1
1
1
1
1
22.05
1
1
0
0
0
1
1
4.0105
1
1
0
1
1
1
1
3−9
3.3.3
Digital Filter Characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DAC Filter Characteristics (48-kHz Sampling Rate)
Passband
±0.03 dB
Stopband
−6 dB
0.416 fs
Hz
0.5 fs
Hz
±0.03
Passband ripple
Stopband attenuation
f > 0.584 fs
−50
dB
dB
DAC Filter Characteristics (44.1-kHz Sampling Rate)
Passband
±0.03 dB
Stopband
−6 dB
0.4535 fs
Hz
0.5 fs
Stopband attenuation
f > 0.5465 fs
−50
0
Filter Response − dB
−2
−4
−6
−8
−10
0
0.1
0.2
0.3
0.4
0.5
Normalized Audio Sampling Frequency − Hz
Figure 3−8. Digital De-Emphasis Filter Response − 44.1 kHz Sampling
3−10
Hz
±0.03
Passband ripple
dB
dB
0
Filter Response − dB
−2
−4
−6
−8
−10
0
0.10
0.20
0.30
0.40
0.50
Normalized Audio Sampling Frequency − Hz
Figure 3−9. Digital De-Emphasis Filter Response − 48 kHz Sampling
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
1.5
2
Normalized Audio Sampling Frequency − Hz
2.5
3
Figure 3−10. DAC Digital Filter Response 0: USB Mode
Filter Response − dB
0.10
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
−0.08
−0.10
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
Normalized Audio Sampling Frequency − Hz
Figure 3−11. DAC Digital Filter Ripple 0: USB Mode
3−11
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
1.5
2
2.5
3
Normalized Audio Sampling Frequency − Hz
Figure 3−12. DAC Digital Filter Response 1: USB Mode Only
Filter Response − dB
0.10
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
−0.08
−0.10
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
Normalized Audio Sampling Frequency − Hz
Figure 3−13. DAC Digital Filter Ripple 1: USB Mode Only
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
1.5
2
2.5
Normalized Audio Sampling Frequency − Hz
Figure 3−14. DAC Digital Filter Response 2: USB Mode and Normal Modes
3−12
3
Filter Response − dB
0.4
0.3
0.2
0.1
0
−0.1
−0.2
−0.3
−0.4
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
Normalized Audio Sampling Frequency − Hz
Figure 3−15. DAC Digital Filter Ripple 2: USB Mode and Normal Modes
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
2
1.5
2.5
3
Normalized Audio Sampling Frequency − Hz
Figure 3−16. DAC Digital Filter Response 3: USB Mode Only
Filter Response − dB
0.4
0.3
0.2
0.1
0
−0.1
−0.2
−0.3
−0.4
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
Normalized Audio Sampling Frequency − Hz
Figure 3−17. DAC Digital Filter Ripple 3: USB Mode Only
3−13
3−14
Appendix A
Mechanical Data
GQE (S-PBGA-N80)
PLASTIC BALL GRID ARRAY
5,10
SQ
4,90
4,00 TYP
0,50
J
0,50
H
G
F
E
D
C
B
A
1
0,68
0,62
2
3
4
5
6
7
8
9
1,00 MAX
Seating Plane
0,35
0,25
NOTES: A.
B.
C.
D.
∅ 0,05 M
0,21
0,11
0,08
4200461/C 10/00
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
MicroStar Junior BGA configuration
Falls within JEDEC MO-225
MicroStar Junior is a trademark of Texas Instruments.
A−1
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°−ā 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
A−2
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
RHD (S−PQFP−N28)
PLASTIC QUAD FLATPACK
5,00
A
B
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
5,00
28
1
PIN 1
INDEX AREA
1,00
0,80
0,20 REF
C
SEATING PLANE
0,08 C
0,05 MAX
3,25
SQ
3,00
PIN 1
IDENTIFIER
1
0,65
28 0,45
0,435
28
0,18
0,435
4 3,00
0,18
0,50
EXPOSED THERMAL
DIE PAD
D
28
0,30
0,18
0,10 M C A B
4204400/A 05/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. QFN (Quad Flatpack No−Lead) Package configuration.
A−3
D. The Package thermal performance may be enhanced by bonding the thermal die pad to
an external thermal plane. This pad is electrically and thermally connected to the backside
of the die and possibly selected ground leads.
E. Package complies to JEDEC MO-220.
A−4
PACKAGE OPTION ADDENDUM
www.ti.com
6-Aug-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Lead/Ball Finish
MSL Peak Temp (3)
TLV320DAC23GQE
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQE
80
360
TBD
SNPB
Level-2A-235C-4 WKS
TLV320DAC23GQER
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQE
80
2500
TBD
SNPB
Level-2A-235C-4 WKS
TLV320DAC23IGQE
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQE
80
360
TBD
SNPB
Level-2A-235C-4 WKS
TLV320DAC23IGQER
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQE
80
2500
TBD
SNPB
Level-2A-235C-4 WKS
TLV320DAC23IPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320DAC23IPWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320DAC23IPWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320DAC23IPWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320DAC23IRHD
ACTIVE
QFN
RHD
28
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320DAC23IRHDG4
ACTIVE
QFN
RHD
28
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320DAC23IRHDR
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320DAC23IRHDRG4
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320DAC23PW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320DAC23PWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320DAC23PWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320DAC23PWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320DAC23RHD
ACTIVE
QFN
RHD
28
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320DAC23RHDG4
ACTIVE
QFN
RHD
28
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320DAC23RHDR
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320DAC23RHDRG4
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Aug-2007
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLV320DAC23GQER
GQE
80
SITE 60
330
12
5.3
5.3
1.5
8
12
Q1
TLV320DAC23IGQER
GQE
80
SITE 60
330
12
5.3
5.3
1.5
8
12
Q1
TLV320DAC23IPWR
PW
28
SITE 60
330
16
6.9
10.2
1.8
12
16
Q1
TLV320DAC23IRHDR
RHD
28
SITE 60
330
12
5.3
5.3
1.5
8
12
Q2
TLV320DAC23PWR
PW
28
SITE 60
330
16
6.9
10.2
1.8
12
16
Q1
TLV320DAC23RHDR
RHD
28
SITE 60
330
12
5.3
5.3
1.5
8
12
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TLV320DAC23GQER
GQE
80
SITE 60
342.9
336.6
20.64
TLV320DAC23IGQER
GQE
80
SITE 60
342.9
336.6
20.64
TLV320DAC23IPWR
PW
28
SITE 60
346.0
346.0
33.0
TLV320DAC23IRHDR
RHD
28
SITE 60
342.9
336.6
20.64
TLV320DAC23PWR
PW
28
SITE 60
346.0
346.0
33.0
TLV320DAC23RHDR
RHD
28
SITE 60
342.9
336.6
20.64
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265