Chip On Board Mixer Quads Features ■ High Volume Automatic Assembly ■ For Microwave MIC Assembly and Automated High Volume Manufacturing ■ Mechanically Rugged Design ■ 100% DC Tested ■ Three Barrier Heights for Customized Mixer Performance Description Alpha’s ceramic Chip on Board (COB) mixer quads are designed for high performance RF and microwave receiver applications. These devices utilize Alpha’s advanced silicon beamless Schottky technology, combined with precision ceramic COB assembly techniques, to achieve a high degree of device reliability in commercial applications. Performance to 10 GHz is available with the ring quads in the 106 package, which employs via hole technology resulting in metalized contacts on the bottom side and eliminating the need for wire bonds to topside contacts. Absolute Maximum Ratings Characteristic Maximum Current (IMAX) Value 50 mA Power Dissipation (PD) CW 75 mW/Junction Storage Temperature (TST) -65°C to +175°C Operating Temperature (TOP) -65°C to +150°C ESD Human Body Model Class 1B Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 6/99A 1 Chip On Board Mixer Quads Electrical Specifications at 25°C Part Number ∆) VF @ 1 mA1 (∆ (mV) VF @ 1 mA (mV) Barrier CJ @ 0 V (pF) ∆) CT @ 0 V2 (∆ (pF) RT @ 10 mA Ω) (Ω Min. Max. Max. Min. Max. Max. Max. 200 260 15 0.3 0.5 0.07 8 Outline Drawing Ring Quad (to 6 GHz) DMF3926-101 Low 101 DME3927-101 Medium 300 400 15 0.3 0.5 0.07 8 101 DMJ3928-101 High 525 625 15 0.3 0.5 0.07 8 101 DMF3948-106 Low 250 310 15 0.05 0.15 0.07 15 106 DME3949-106 Medium 350 450 15 0.05 0.15 0.07 15 106 DMJ3950-106 High 575 675 15 0.05 0.15 0.07 15 106 200 260 15 0.3 0.5 0.07 8 100 Ring Quad (to 10 GHz) Crossover Ring Quad (to 6 GHz) DMF3926-100 Low DME3927-100 Medium 300 400 15 0.3 0.5 0.07 8 100 DMJ3928-100 High 525 625 15 0.3 0.5 0.07 8 100 260 15 0.3 0.5 0.07 8 103 Back-to-Back Crossover Quad (to 6 GHz) DMF3945-103 Low 200 DME3946-103 Medium 300 400 15 0.3 0.5 0.07 8 103 DMJ3947-103 High 525 625 15 0.3 0.5 0.07 8 103 Part Number Barrier VF @ 1 mA (mV) ∆) VF @ (∆ 1 mA1 (mV) CJ @ 0 V (pF) ∆) CT @ 0 V2 (∆ (pF) RT @ 10 mA Ω) (Ω VB @ 10 µA (V) Min. Max. Max. Min. Max. Max. Max. Min. Outline Drawing Bridge Quad (to 6 GHz) DMF3929-102 Low 200 260 15 0.3 0.5 0.07 8 2 102 DME3930-102 Medium 300 400 15 0.3 0.5 0.07 8 3 102 DMJ3931-102 High 525 625 15 1. Forward voltage difference between package electrodes. 2. Capacitance difference between package electrodes. 0.3 0.5 0.07 8 4 102 SPICE Model Parameters (Per Junction) Parameter Unit DMF3926 DMF3929 DMF3945 DME3927 DME3930 DME3946 DMJ3928 DMJ3931 DMJ3947 DMF3948 DME3949 DMJ3950 IS A 2.5E–07 1.3E–09 9.0E–13 4.4E–08 9.3E–10 3.3E–13 RS Ω N 4 4 9 9 9 1.04 1.04 1.04 1.04 1.04 TT s 1E–11 1E–11 1E–11 1E–11 1E–11 1E–11 CJ0 pF 0.42 0.39 0.39 0.11 0.10 0.10 0.32 0.37 0.42 0.32 0.37 0.42 0.69 0.69 0.69 0.69 0.69 0.69 M EG 2 4 1.04 eV XTI 2 2 2 2 2 2 FC 0.5 0.5 0.5 0.5 0.5 0.5 BV V 2 3 4 3 4 5 IBV A 1.0E–05 1.0E–05 1.0E–05 1.0E–05 1.0E–05 1.0E–05 VJ V 0.495 0.595 0.800 0.495 0.595 0.800 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 6/99A Chip On Board Mixer Quads 100, 101, 102 103 INK DOT 0.010 (0.25 mm) DIA. MIN. COLOR PER INTERNAL SPECIFICATION 0.005 (0.13 mm) 0.001 (0.02 mm) TYP. ORIENTATION DOT SCHEMATIC 2 DOT 0.140 (3.56 mm) ± 0.003 (0.08 mm) 1 0.026 (0.66 mm) MIN. 0.100 (2.54 mm) +0.002 (0.05 mm) -0.004 (0.10 mm) 0.020 (0.51 mm) ±0.003 (0.08 mm) () 3 6 4 5 0.130 (3.30 mm) ±0.003 (0.08 mm) GLASS DAM 0.030 (0.76 mm) ±0.003 (0.08 mm) SQ. 0.120 (3.05 mm) +0.002 (0.05 mm) -0.004 (0.10 mm) EPOXY ENCAPSULATION (BLACK) 0.020 (0.51 mm) X 0.010 (0.25 mm) ORIENTATION MARK 0.040 (1.02 mm) MAX. 0.020 (0.51 mm) ± 0.002 (0.05 mm) GLASS NOT SHOWN FOR CLARITY 106 0.025 (0.64 mm) ±0.003 (0.08 mm) 0.050 (1.27 mm) MAX. 0.020 (0.51 mm) ±0.002 (0.05 mm) CERAMIC SUBSTRATE Notes: 1. Bottom side is free of metalization. 2. The minimum specified area of the contact pads (0.017 x 0.022) shall be free of epoxy. 0.085 (2.159 mm) SQ. EPOXY ENCAPSULATION 0.003 (0.08 mm) TYP. 45˚ REF. EPOXY ENCAPSULATION 0.003 (0.08 mm) TYP 0.015 (0.38 mm) 0.020 (0.51 mm) MAX. GLASS 0.017 (0.43 mm) 0.026 (0.66 mm) GOLD METALIZATION 0.024 (0.61 mm) Pd/Pt /Ag METALIZATION Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 6/99A 3