AF70N03 N-Channel Enhancement Mode Power MOSFET Features General Description -Low Gate Charge -Simple Drive Requirement -Fast Switching -RoHS Compliant -Pb Free Plating Product The advanced power MOSFET provides the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-252 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Product Summary BVDSS (V) 30 RDS(ON) (mΩ) 9 ID (A) 60 Pin Descriptions Pin Assignments (Front View) S 3 2 D 1 Pin Name Description S G D Source Gate Drain G Ordering information Feature F :MOSFET A X 70N03 X X PN Package Packing D: TO-252 Blank : Tube or Bulk A : Tape & Reel Block Diagram D S G This datasheet contains new product information. Anachip Corp. reserves the rights to modify the product specification without notice. No liability is assumed as a result of the use of this product. No rights under any patent accompany the sale of the product. Rev. 1.0 Aug 10, 2005 1/5 AF70N03 N-Channel Enhancement Mode Power MOSFET Absolute Maximum Ratings Symbol VDS VGS Parameter Rating 30 ±20 60 43 195 53 0.36 -55 to 175 -55 to 175 Drain-Source Voltage Gate-Source Voltage TA=25ºC TA=100ºC ID Continuous Drain Current, VGS=10V IDM Pulsed Drain Current (Note 1) Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range PD TSTG TJ TA=25ºC Units V V A A W W/ºC ºC ºC Thermal Data Symbol RθJC RθJA Parameter Thermal Resistance Junction-Case Thermal Resistance Junction- Ambient Maximum 2.8 110 Max. Max. Units ºC/W ºC/W Electrical Characteristics (TJ=25ºC unless otherwise noted) Symbol BVDSS ∆BVDSS/∆TJ RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Static Drain-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-Source Leakage Current(TJ=25ºC) Drain-Source Leakage Current(TJ=175ºC) Gate Source Leakage Total Gate Charge (Note 2) Gate-Source Charge Gate-Drain (“Miller”) Charge Turn-On Delay Time (Note 2) Rise Time Turn-Off Delay Time Fall-Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Min. 30 Limits Typ. - Max. - - 0.032 - 1 - 35 9 18 3 - VDS=30V, VGS=0V - - 1 VDS=24V, VGS=0V - - 250 VGS=±20V ID=33A VDS=20V VGS=4.5V VDS=15V ID=33A RG=3.3Ω, VGS=10V RD=0.45Ω VGS=0V VDS=25V, f=1.0MHz - 16.5 5 10.3 8.2 105 21.4 8.5 1485 245 170 ±100 - Min. Typ. Max. Unit - - 60 A - - 195 A - - 1.3 V Test Conditions VGS=0V, ID=250uA Reference to 25ºC, ID=1mA VGS=10V, ID=33A VGS=4.5V, ID=20A VDS= VGS, ID=250uA VDS=10V, ID=33A Unit V V/ºC mΩ V S uA nA nC nS pF Source-Drain Diode Symbol IS ISM VSD Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Test Conditions VD=VG=0V, VS=1.3V (Note 1) Forward On Voltage (Note 2) TJ=25ºC, IS=60A, VGS=0V Anachip Corp. www.anachip.com.tw Rev. 1.0 2/5 Aug 10, 2005 AF70N03 N-Channel Enhancement Mode Power MOSFET Note 1: Pulse width limited by safe operating area. Note 2: Pulse width < 300us, duty cycle < 2%. Typical Performance Characteristics Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristic of Reverse Diode Fig 6. Gate Threshold Voltage v.s. Junction Temperature Anachip Corp. www.anachip.com.tw Rev. 1.0 3/5 Aug 10, 2005 AF70N03 N-Channel Enhancement Mode Power MOSFET Typical Performance Characteristics Fig 9. Gate Charge Characteristics Fig 7. Maximum Safe Operating Area Fig 10. Typical Capacitance Characteristics Fig 8. Effective Transient Thermal Impedance Fig 11. Switching Time Waveform Fig 12. Gate Charge Waveform Anachip Corp. www.anachip.com.tw Rev. 1.0 4/5 Aug 10, 2005 AF70N03 N-Channel Enhancement Mode Power MOSFET Marking Information TO-252 ( Top View) Logo 70N03 YYWWX Part Number YY : Year WW: Nth week X : Internal code ( Optional) Package Information Package Type: TO-252 F1 E1 E3 E2 D D1 F B1 e e C A3 A2 R: 0.127~0.381 (0.1mm) 1. All Dimensions Are in Millimeters. 2. Dimension Does Not Include Mold Protrusions. Symbol A2 A3 B1 D D1 F F1 E1 E2 E3 e C Dimensions In Millimeters Min. Nom. Max. 1.80 2.30 2.80 0.40 0.50 0.60 0.40 0.70 1.00 6.00 6.50 7.00 4.80 5.35 5.90 2.20 2.63 3.05 0.50 0.85 1.20 5.10 5.70 6.30 0.50 1.10 1.70 3.50 4.00 4.50 2.30 0.35 0.50 0.65 Anachip Corp. www.anachip.com.tw Rev. 1.0 5/5 Aug 10, 2005