ANPEC APM3020P

APM3020P
P-Channel Enhancement Mode MOSFET
Features
•
Pin Description
-30V/-11A, RDS(ON) = 17mΩ(typ.) @ VGS = -10V
RDS(ON) = 24mΩ(typ.) @ VGS = -5V
•
•
•
Super High Density Cell Design
Reliable and Rugged
TO-252 Package
G
D
S
Applications
Top View of TO-252
•
Power Management in Notebook Computer,
Portable Equipment and Battery Powered
Systems
Ordering and Marking Information
APM 3020P
P ackage C ode
U : T O -2 5 2
O p e ra tin g J u n c tio n T e m p . R a n g e
C : -5 5 to 1 2 5 ° C
H a n d lin g C o d e
TU : Tube
TR : Tape & Reel
H a n d lin g C o d e
T e m p. R a ng e
P a c ka g e C o d e
APM 3020P U :
APM 3020P
XXXXX
X X X X X - D a te C o d e
Absolute Maximum Ratings
Symbol
(TA = 25°C unless otherwise noted)
Parameter
Rating
VDSS
Drain-Source Voltage
-30
VGSS
Gate-Source Voltage
±20
ID*
Maximum Drain Current – Continuous
-40
IDM
Maximum Drain Current – Pulsed
-70
PD
Maximum Power Dissipation
TA=25 ºC
50
TA=100 ºC
20
Unit
V
A
W
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - July., 2002
1
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APM3020P
Absolute Maximum Ratings
Symbol
TJ
(TA = 25°C unless otherwise noted)
Parameter
Rating
Unit
150
ºC
-55 to 150
ºC
2.5
ºC/W
Maximum Junction Temperature
TSTG
Storage Temperature Range
RθJC
Thermal Resistance – Junction to Case
Electrical Characteristics
Symbol
(TA = 25°C unless otherwise noted)
Parameter
Static
BVDSS
Test Condition
Drain-Source Breakdown Voltage VGS=0V , IDS=-250A
IDSS
VGS(th)
Zero Gate Voltage Drain Current
Gate Threshold Voltage
IGSS
RDS(ON)a
VSDa
APM3020P
Min.
Typ.
Max.
-30
Unit
V
VDS=-24V , VGS=0V
-1
-3
µA
V
±100
nA
Gate Leakage Current
VDS=VGS , IDS=-250µA
VGS=±20V , VDS=0V
Drain-Source On-state
VGS=-10V , IDS=-11A
17
20
Resistance
VGS=-5V , IDS=-7A
24
30
Diode Forward Voltage
ISD=-11A, VGS=0V
-1
-1.3
-1.3
mΩ
V
b
Dynamic
Qg
Total Gate Charge
VDS=-15V , VGS=-4.5V,
23
30
Qgs
Gate-Source Charge
IDS=-4.6A
10
Qgd
Gate-Drain Charge
9
td(ON)
Turn-on Delay Time
30
Tr
Turn-on Rise Time
VDD=-15V , IDS=-6A ,
16
22
30
td(OFF)
Turn-off Delay Time
75
120
31
80
VGEN=-10 V , RG=1Ω
RL=2.5Ω
Tf
Turn-off Fall Time
Ciss
Input Capacitance
VGS=0V
3720
Coss
Output Capacitance
VDS=-25V
580
Crss
Reverse Transfer Capacitance
Frequency=1.0MHz
245
nC
ns
pF
Notes
a
: Guaranteed by design, not subject to production testing
b
: Pulse test ; pulse width ≤ 500µs, duty cycle ≤ 2%
Copyright  ANPEC Electronics Corp.
Rev. A.1 - July., 2002
2
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APM3020P
Typical Characteristics
Transfer Characteristics
Output Characteristics
50
50
VGS=4,5,6,7,8,9,10V
40
-IDS-Drain Current (A)
-IDS-Drain Current (A)
40
30
30
20
10
0
20
V GS=3V
2
4
6
8
0
10
0
1
-VDS-Drain-to-Source Voltage (V)
RDS(ON)-On-Resistance (Ω)
-VGS(th)-Threshold Voltage (V)
(Normalized)
1.00
0.75
0.50
0.25
0
25
50
75
5
0.030
-VGS=5V
0.025
-VGS=10V
0.020
0.015
0.010
0.005
100 125 150
Tj-Junction Temperature (°C)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - July., 2002
4
0.035
-IDS=250µA
-25
3
On-Resistance vs. Drain Current
1.25
0.00
-50
2
-VGS-Gate-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.50
TJ=-55°C
TJ=25°C
10
VGS=2.5V
0
TJ=125°C
0
5
10
15
20
25
30
-IDS-Drain Current (A)
3
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APM3020P
Typical Characteristics Cont.
On-Resistaence vs. Junction Temperature
On-Resistance vs. Gate-to-Source Voltage
0.030
-IDS=7A
RDS(ON)-On-Resistance (Ω)
(Normalized)
RDS (ON)-On-Resistance (Ω)
0.15
0.12
0.09
0.06
0.03
0.00
0
2
4
6
8
0.025
0.020
0.015
0.010
0.005
0.000
-50
10
-VGS - Gate-to-Source Voltage (V)
0
25
50
75
100 125 150
Capacitance Characteristics
3000
10
-VDS =15V
-IDS=4.6A
2500
8
C-Capacitance (pF)
-VGS-Gate-to-Source Voltage (V)
-25
Tj-Junction Temperature (°C)
Gate Charge
6
4
2
0
0
-V GS=10V
-IDS=11A
Ciss
2000
1500
1000
Coss
500
10
20
30
0
40
0
5
10
15
20
25
30
-VDS-Drain-to-Source Voltage (V)
QG-Total Gate Charge (nC)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - July., 2002
Crss
4
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APM3020P
Typical Characteristics Cont.
Source-Drain Diode Forward Voltage
Single Pulse Power
3000
50
2500
2000
Power (W)
-ISD-Source Current (A)
10
1
TJ=25°C
TJ=150°C
1500
1000
500
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0 -5
10
-4
-3
10
10
-VSD-Source-to-Drain Voltage (V )
-2
-1
10
10
0
10
1
10
Time (sec)
Normalized Transient Thermal Transient Impedence, Junction to Ambient
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle=0.5
D=0.2
0 .1
D=0.1
D=0.05
1. Duty Cycle , D=t1/t2
2. Per Unit Base=RthJA=50°C/W
3. TJM-TA=PDMZthJA
D=0.02
D=0.01
SINGLE PULSE
0 .0 1 -5
10
10
-4
10
-3
10
-2
10
-1
10
0
10
1
Square Wave Pulse Duration (sec)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - July., 2002
5
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APM3020P
Packaging Information
TO-252( Reference JEDEC Registration TO-252)
E
A
b2
C1
L2
D
H
L1
L
b
C
e1
Dim
A
A1
Mi ll im et er s
Inc he s
Min .
Ma x .
Min .
Ma x .
2. 1 8
2. 3 9
0. 0 86
0. 0 94
A1
0. 8 9
1. 2 7
0. 0 35
0. 0 50
b
0. 5 08
0. 8 9
0. 0 20
0. 0 35
b2
5. 2 07
5. 4 61
0. 2 05
0. 2 15
C
0. 4 6
0. 5 8
0. 0 18
0. 0 23
C1
0. 4 6
0. 5 8
0. 0 18
0. 0 23
D
5. 3 34
6. 2 2
0. 2 10
0. 2 45
E
6. 3 5
6. 7 3
0. 2 50
0. 2 65
e1
3. 9 6
5. 1 8
0. 1 56
0. 2 04
H
9. 3 98
10 . 41
0. 3 70
0. 4 10
L
0. 5 1
L1
0. 6 4
1. 0 2
0. 0 25
0. 0 40
L2
0. 8 9
2. 0 32
0. 0 35
0. 0 80
Copyright  ANPEC Electronics Corp.
Rev. A.1 - July., 2002
0. 0 20
6
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APM3020P
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
temperature
Reference JEDEC Standard J-STD-020A APRIL 1999
Peak temperature
183°C
Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/
Convection
Average ramp-up rate(183°C to Peak)
3°C/second max.
120 seconds max
Preheat temperature 125 ± 25°C)
60 – 150 seconds
Temperature maintained above 183°C
Time within 5°C of actual peak temperature 10 –20 seconds
Peak temperature range
220 +5/-0°C or 235 +5/-0°C
Ramp-down rate
6 °C /second max.
6 minutes max.
Time 25°C to peak temperature
VPR
10 °C /second max.
60 seconds
215-219°C or 235 +5/-0°C
10 °C /second max.
Package Reflow Conditions
pkg. thickness ≥ 2.5mm
and all bgas
Convection 220 +5/-0 °C
VPR 215-219 °C
IR/Convection 220 +5/-0 °C
pkg. thickness < 2.5mm and
pkg. volume ≥ 350 mm³
Copyright  ANPEC Electronics Corp.
Rev. A.1 - July., 2002
7
pkg. thickness < 2.5mm and pkg.
volume < 350mm³
Convection 235 +5/-0 °C
VPR 235 +5/-0 °C
IR/Convection 235 +5/-0 °C
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APM3020P
Reliability test program
Test item
SOLDERABILITY
HOLT
PCT
TST
Method
MIL-STD-883D-2003
MIL-STD 883D-1005.7
JESD-22-B, A102
MIL-STD 883D-1011.9
Description
245°C,5 SEC
1000 Hrs Bias @ 125°C
168 Hrs, 100% RH, 121°C
-65°C ~ 150°C, 200 Cycles
Carrier Tape
t
D
P
Po
E
P1
Bo
F
W
Ko
Ao
D1
T2
J
C
A
B
T1
Application
TO-252
A
B
C
J
330 ±3
100 ± 2
13 ± 0. 5
F
D
7.5 ± 0.1
1.5 +0.1
Copyright  ANPEC Electronics Corp.
Rev. A.1 - July., 2002
2 ± 0.5
T1
16.4 + 0.3
-0.2
D1
Po
1.5± 0.25
4.0 ± 0.1
8
T2
P
E
2.5± 0.5
W
16+ 0.3
- 0.1
8 ± 0.1
1.75± 0.1
P1
Ao
Bo
Ko
t
2.0 ± 0.1
6.8 ± 0.1
10.4± 0.1
2.5± 0.1
0.3±0.05
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APM3020P
Cover Tape Dimensions
Application
TO- 252
Carrier Width
16
Cover Tape Width
13.3
Devices Per Reel
2500
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. A.1 - July., 2002
9
www.anpec.com.tw