TI SN75C1406DW

SN75C1406
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
D
D
D
D
D
D
D
D
D
Meet or Exceed the Requirements of
TIA/EIA-232-F and ITU Recommendation
V.28
Very Low Power Consumption . . .
5 mW Typ
Wide Driver Supply Voltage Range . . .
±4.5 V to ±15 V
Driver Output Slew Rate Limited to
30 V/µs Max
Receiver Input Hysteresis . . . 1000 mV Typ
Push-Pull Receiver Outputs
On-Chip Receiver 1-µs Noise Filter
Functionally Interchangeable With Motorola
MC145406 and Texas Instruments
TL145406
Package Options Include Plastic
Small-Outline (D, DW, NS) Packages and
(N) DIPs
D, DW, N, OR NS PACKAGE
(TOP VIEW)
VDD
1RA
1DY
2RA
2DY
3RA
3DY
VSS
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
1RY
1DA
2RY
2DA
3RY
3DA
GND
description
The SN75C1406 is a low-power BiMOS device containing three independent drivers and receivers that are used
to interface data terminal equipment (DTE) with data circuit-terminating equipment (DCE). This device is
designed to conform to TIA/EIA-232-F. The drivers and receivers of the SN75C1406 are similar to those of the
SN75C188 quadruple driver and SN75C189A quadruple receiver, respectively. The drivers have a controlled
output slew rate that is limited to a maximum of 30 V/µs, and the receivers have filters that reject input noise
pulses shorter than 1 µs. Both these features eliminate the need for external components.
The SN75C1406 is designed using low-power techniques in a BiMOS technology. In most applications, the
receivers contained in these devices interface to single inputs of peripheral devices such as ACEs, UARTs, or
microprocessors. By using sampling, such peripheral devices are usually insensitive to the transition times of
the input signals. If this is not the case, or for other uses, it is recommended that the SN75C1406 receiver outputs
be buffered by single Schmitt input gates or single gates of the HCMOS, ALS, or 74F logic families.
The SN75C1406 is characterized for operation from 0°C to 70°C.
logic symbol†
1RA
2RA
3RA
1DY
2DY
3DY
logic diagram, each driver and receiver
2
15
4
13
6
11
3
14
5
12
7
10
1RY
RA
RY
DY
DA
2RY
3RY
1DA
2DA
3DA
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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SN75C1406
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
schematics of inputs and outputs
EQUIVALENT DRIVER INPUT
EQUIVALENT DRIVER OUTPUT
VDD
VDD
Internal
1.4-V Reference
Input
DA
160 Ω
Output
DY
74 Ω
VSS
GND
72 Ω
VSS
EQUIVALENT RECEIVER INPUT
EQUIVALENT RECEIVER OUTPUT
VCC
3.4 kΩ
Input
RA
Output
RY
1.5 kΩ
ESD
Protection
ESD
Protection
530 Ω
GND
GND
All resistor values shown are nominal.
2
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SN75C1406
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Supply voltage, VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 15 V
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage range, VI: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS to VDD
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 V to 30 V
Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VSS – 6 V) to (VDD + 6 V)
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to (VCC + 0.3 V)
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150 °C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to the network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51.
recommended operating conditions
MIN
NOM
MAX
Supply voltage, VDD
4.5
12
15
V
Supply voltage, VSS
– 4.5
– 12
– 15
V
4.5
5
6
V
VDD
± 25
V
Supply voltage, VCC
Input voltage,
voltage VI
Driver
VSS+ 2
Receiver
High-level input voltage, VIH
2
Low-level input voltage, VIL
UNIT
V
0.8
V
High-level output current, IOH
–1
mA
Low-level output current, IOL
3.2
mA
70
°C
Operating free-air temperature, TA
0
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SN75C1406
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
DRIVER SECTION
electrical characteristics over operating free-air temperature range, VDD = 12 V, VSS = –12 V,
VCC = 5 V ± 10% (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
VOH
High level output voltage
High-level
VIH = 0.8 V,,
See Figure 1
RL = 3 kΩ,
VOL
Low-level output voltage
g
(see Note 3)
VIH = 2 V,,
See Figure 1
RL = 3 kΩ,
High-level input current
See Figure 2
1
Low-level input current
VI = 5 V,
VI = 0,
See Figure 2
–1
IOS(H)
High-level short-circuit
output current‡
VI = 0.8 V,
VO = 0 or VSS,
See Figure 1
– 7.5
– 12
– 19.5
mA
IOS(L)
Low-level short-circuit
output current‡
VI = 2 V,
VO = 0 or VDD,
See Figure 1
7.5
12
19.5
mA
IDD
Supply current from VDD
No load,,
All inputs at 2 V or 0.8 V
VDD = 5 V,
VDD = 12 V,
VSS = – 5 V
VSS = – 12 V
115
250
115
250
ISS
Supply current from VSS
No load,,
All inputs at 2 V or 0.8 V
VDD = 5 V,
VDD = 12 V,
VSS = – 5 V
VSS = – 12 V
– 115
– 250
– 115
– 250
rO
Output resistance
VDD = VSS = VCC = 0,
See Note 4
VO = – 2 V to 2 V,
IIH
IIL
VDD = 5 V,
VDD = 12 V,
VSS = – 5 V
VSS = – 12 V
VDD = 5 V,
VDD = 12 V,
VSS = – 5 V
VSS = – 12 V
4
4.5
10
10.8
V
– 4.4
–4
– 10.7
– 10
300
V
µA
µA
µA
Ω
400
† All typical values are at TA = 25°C.
‡ Not more than one output should be shorted at a time.
NOTES: 3. The algebraic convention, where the more positive (less negative) limit is designated as maximum, is used in this data sheet for logic
levels only.
4. Test conditions are those specified by TIA/EIA-232-F.
switching characteristics at TA = 25°C, VDD = 12 V, VSS = –12 V, VCC = 5 V ± 10%
PARAMETER
TEST CONDITIONS
tPLH
tPHL
Propagation delay time, low- to high-level output§
Propagation delay time, high- to low-level output§
tTLH
tTHL
Transition time, low- to high-level output¶
Transition time, high- to low-level output¶
tTLH
Transition time, low- to high-level output#
tTHL
SR
MIN
TYP
MAX
1.2
3
µs
2.5
3.5
µs
0.53
2
3.2
µs
0.53
2
3.2
µs
RL = 3 kΩ to 7 kΩ, CL = 2500 pF,
See Figure 3
1
2
µs
Transition time, high- to low-level output#
RL = 3 kΩ to 7 kΩ, CL = 2500 pF,
See Figure 3
1
2
µs
Output slew rate
RL = 3 kΩ to 7 kΩ, CL = 15 pF,
See Figure 3
10
30
V/µs
RL = 3 kΩ to 7 kΩ,, CL = 15 pF,,
See Figure 3
4
§ tPHL and tPLH include the additional time due to on-chip slew rate and are measured at the 50% points.
¶ Measured between 10% and 90% points of output waveform
# Measured between 3-V and – 3-V points of output waveform (TIA/EIA-232-F conditions) with all unused inputs tied either high or low
4
UNIT
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SN75C1406
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
RECEIVER SECTION
electrical characteristics over operating free-air temperature range, VDD = 12 V, VSS = –12 V,
VCC = 5 V ± 10% (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
VIT +
Positive-going input
threshold voltage
See Figure 5
1.7
2
2.55
V
VIT –
Negative-going input
threshold voltage
See Figure 5
0.65
1
1.25
V
Vhys
Input hysteresis voltage
(VIT +–VIT –)
600
1000
VI = 0.75 V,
VOH
VOL
High level output voltage
High-level
Low-level output voltage
VI = 0.75
0 75 V,
V
See Figure 5
VI = 3 V,
VI = 2.5 V
IOH = – 20 µA,
See Figure 5 and Note 5
3.5
2.8
4.4
IOH = – 1 mA,
A
VCC = 4.5 V
VCC = 5 V
3.8
4.9
VCC = 5.5 V
See Figure 5
4.3
5.4
IOL = 3.2 mA,
IIH
High level input current
High-level
IIL
Low level input current
Low-level
IOS(H)
High-level
short-circuit
g
output current
75 V
VI = 0
0.75
V,
VO = 0
0,
IOS(L)
Low-level short-circuit
output current
VI = VCC,
VO = VCC,
ICC
Supply current from VCC
No load,
All inputs at 0 or 5 V
mV
V
0.17
0.4
3.6
4.6
8.3
V
VI = 3 V
VI = – 2.5 V
0.43
0.55
1
– 3.6
–5
– 8.3
VI = – 3 V
– 0.43
– 0.55
–1
See Figure 4
–8
– 15
mA
See Figure 4
13
25
mA
320
450
320
450
VDD = 5 V,
VDD = 12 V,
VSS = – 5 V
VSS = – 12 V
mA
µA
† All typical values are at TA = 25°C.
NOTE 5: If the inputs are left unconnected, the receiver interprets this as an input low and the receiver outputs remain in the high state.
switching characteristics at TA = 25°C, VDD = 12 V, VSS = –12 V, VCC = 5 V ± 10% (unless otherwise
noted)
PARAMETER
tPLH
tPHL
tTLH
tTHL
TEST CONDITIONS
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Transition time, low- to high-level output‡
CL = 50 pF,,
See Figure 6
RL = 5 kΩ,,
Transition time, high- to low-level output‡
MIN
TYP
MAX
3
4
UNIT
µs
3
4
µs
300
450
ns
100
300
ns
§
tw(N) Duration of longest pulse rejected as noise
CL = 50 pF,
RL = 5 kΩ
1
4
µs
‡ Measured between 10% and 90% points of output waveform
§ The receiver ignores any positive- or negative-going pulse that is less than the minimum value of tw(N) and accepts any positive- or negative-going
pulse greater than the maximum of tw(N).
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SN75C1406
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
PARAMETER MEASUREMENT INFORMATION
IOS(L)
VDD
VCC
VDD or GND
VDD
– IOS(H)
VSS or GND
VI
VCC
IIH
VI
– IIL
VO
RL = 3 kΩ
VI
VSS
VSS
Figure 1. Driver Test Circuit
VOH, VOL, IOS(L), IOS(H)
Figure 2. Driver Test Circuit, IIL, IIH
VDD
3V
Input
VCC
Input
1.5
1.5
0V
Pulse
Generator
(See Note B)
tPHL
RL
CL
(see Note A)
tPLH
50%
10%
Output
VSS
VOH
90%
90%
50%
10%
tTHL
tTLH
VOL
VOLTAGE WAVEFORMS
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
Figure 3. Driver Test Circuit and Voltage Waveforms
VDD
VDD
VCC
VCC
– IOS(H)
VIT, VI
VI
IOS(L)
VOH
VOL
VCC
IOL
VSS
VSS
Figure 4. Receiver Test Circuit, IOS(H), IOS(L)
6
– IOH
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Figure 5. Receiver Test Circuit, VIT, VOL, VOH
• DALLAS, TEXAS 75265
SN75C1406
TRIPLE LOW-POWER DRIVERS/RECEIVERS
SLLS148D – MAY 1990 – REVISED DECEMBER 1999
PARAMETER MEASUREMENT INFORMATION
4V
VDD
Input
VCC
Input
50%
50%
0V
Pulse
Generator
(See Note B)
tPHL
RL
CL
(see Note A)
tPLH
90%
90%
50%
10%
Output
VSS
VOH
50%
10%
tTLH
tTHL
VOL
VOLTAGE WAVEFORMS
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
Figure 6. Receiver Test Circuit and Voltage Waveforms
APPLICATION INFORMATION
The TIA/EIA-232-F specification is for data interchange between a host computer and a peripheral at signaling
rates up to 20 kbit/s. Many TIA/EIA-232-F devices will operate at higher data rates with lower capacitive loads
(short cables). For reliable operation at greater than 20 kbit/s, the designer needs to have control of both ends
of the cable. By mixing different types of TIA/EIA-232-F devices and cable lengths, errors can occur at higher
frequencies (above 20 kbit/s). When operating within the TIA/EIA-232-F requirements of less than 20 kbit/s and
with compliant line circuits, interoperability is assured. For applications operating above 20 kbit/s, the design
engineer should consider devices and system designs that meet the TIA/EIA-232-F requirements.
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Copyright  1999, Texas Instruments Incorporated