TI PTH05060YAH

PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
10-A NON-ISOLATED DDR/QDR
MEMORY BUS TERMINATION MODULES
FEATURES
•
•
•
•
•
•
•
•
•
VTT Bus Termination Output
(Output Tracks the System VREF)
10 A Output Current
3.3-V, 5-V or 12-V Input Voltage
DDR and QDR Compatible
On/Off Inhibit (for VTT Standby)
Undervoltage Lockout
Operating Temperature: –40°C to 85°C
Efficiencies up to 91%
Output Overcurrent Protection (Non-Latching,
Auto-Reset)
•
•
•
57 W/in3 Power Density
Safety Agency Approvals:
UL/cUL60950, EN60950, VDE
Point-of-Load Alliance (POLA™) Compatible
NOMINAL SIZE
1 in. x 0.62 in
(25,4 mm x 15,75 mm)
DESCRIPTION
The PTHxx060Y are a series of ready-to-use switching regulator modules from Texas Instruments designed
specifically for bus termination in DDR and QDR memory applications. Operating from either a 3.3-V, 5-V or 12-V
input, the modules generate a VTT output that will source or sink up to 10 A of current to accurately track their
VREF input. VTT is the required bus termination supply voltage, and VREF is the reference voltage for the memory
and chipset bus receiver comparators. VREF is usually set to half the VDDQ power supply voltage.
Both the PTHxx060Y series employs an actively switched synchronous rectifier output to provide state-of-the-art
stepdown switching conversion. The products are small in size (1 in × 0.62 in), and are an ideal choice where
space, performance, and high efficiency are desired, along with the convenience of a ready-to-use module.
Operating features include an on/off inhibit and output over-current protection (source mode only). The on/off
inhibit feature allows the VTT bus to be turned off to save power in a standby mode of operation. To ensure tight
load regulation, an output remote sense is also provided. Package options include both throughhole and surface
mount configurations.
STANDARD APPLICATION
VIN
VREF
VDDQ
1k
1%
1
10
9
8
VTT
7
PTHxx060Y
(Top View)
1k
1%
2
Con
hf−Ceramic
6
3
4
5
Standby
Q1
BSS138
(Optional)
GND
Co1
Low−ESR
(Required)
Co2
Ceramic
(Optional)
VTT Termination Island
CIN
(Required)
SSTL−2
Bus
CIN = Required Capacitor; 330µF (3.3 ± 5 V Input), 560 µF (12 V Input).
Co1 = Required Low-ESR Electrolyitic Capacitor; 470 µF (3.3 ± 5 V Input), 940 µF (12 V Input).
Co2 = Ceramic Capacitance for Optimum Response to a 3 A (+ 1.5 A) Load Transient; 200 µF (3.3 ± 5 V Input), 400 µF (12 V Input).
Con = Distributed hf-Ceramic Decoupling Capacitors for VTT bus; as Recommended for DDR Memory Applications.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
POLA is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
ORDERING INFORMATION
PTHXX060Y (Base Part Number)
Input Voltage
Part Number
3.3 V
5V
12 V
(1)
(2)
(3)
(4)
(1)
DESCRIPTION
Pb – free and
RoHS
(3)
Mechanical Package
(2)
PTH03060YAH
Horizontal T/H
Yes
PTH03060YAS
Standard SMD
No
(4)
EUW
EUY
EUY
PTH03060YAZ
Optional SMD
Yes
(3)
PTH05060YAH
Horizontal T/H
Yes
(3)
EUW
PTH05060YAS
Standard SMD
No
(4)
EUY
EUY
PTH05060YAZ
Optional SMD
Yes
(3)
PTH12060YAH
Horizontal T/H
Yes
(3)
EUW
PTH12060YAS
Standard SMD
No
(4)
EUY
PTH12060YAZ
Optional SMD
Yes
(3)
EUY
Add T to end of part number for tape and reel on SMD packages only.
Reference the applicable package reference drawing for the dimensions and PC board layout.
Lead (Pb) –free option specifies Sn/Ag pin solder material.
Standard option specifies 63/37, Sn/Pb pin solder material.
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
voltages are with respect to GND
UNIT
VREF
Control input voltage
TA
Operating temperature
range
Over VIN range
Twave
Wave solder temperature
Surface temperature of module body or pins
(5 seconds)
Treflow
Solder reflow temperature
Surface temperature of module body or pins
Ts
Storage temperature
–0.3 V to Vin+03 V
2
260°C
(2)
PTHXX060YAS
235°C
(2)
PTHXX060YAZ
260°C
(2)
–40°C to 125°C
Per Mil-STD-883D, Method 2002.3 1 msec, 1/2 Sine, mounted
500 G
Mechanical vibration
Mil-STD-883D, Method 2007.2 20-2000 Hz
20 G
Flammability
(2)
PTHXX060YAH
Mechanical shock
Weight
(1)
–40°C to 85°C (1)
3.7 grams
Meets UL 94V-O
For operation below 0°C, the external capacitors must have stable characteristics, use either a low ESR tantalum, Os-Con, or ceramic
capacitor.
During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated
maximum.
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
ELECTRICAL SPECIFICATIONS
TA = 25°C; nominal VIN; VREF = 1.25 V; CIN, CO1, and CO2 = typical values; and IO = IOmax (unless otherwise stated)
PARAMETER
Output current
IO
TEST CONDITIONS
Over ∆VREF range
Continuous
PTH03060Y
Input voltage range
VIN
Over IO range
∆VREF
Tracking range for VREF
|VTT– VREF|
Tracking tolerance to VREF
Over line, load and temperature
η
Efficiency
Io = 8 A
MIN
MAX
UNIT
0
TYP
±10 (1)
A
2.95
3.65
PTH05060Y
4.5
5.5
PTH12060Y
10.8
13.2
0.55
1.8
V
–10
10
mV
PTH03060Y
86%
PTH05060Y
86%
PTH12060Y
83%
V
Vr
Vo Ripple (pk-pk)
20 MHz bandwidth
20
Io trip
Overcurrent threshold
Reset, followed by auto recovery
20
A
30
µsec
ttr
Load transient response
Vtr
15 A/µs load step, from:
–1.5 A to 1.5 A
VIN Increasing
UVLO
Under-voltage lockout
VIN Dncreasing
Recovery time
VO over/undershoot
25
40
PTH03060Y
2.45
2.8
PTH05060Y
4.3
4.45
PTH12060Y
9.5
10.4
PTH03060Y
2.0
2.40
PTH05060Y
3.4
3.7
8.8
9
PTH12060Y
Inhibit control (pin 4)
Input high voltage
VIH
Referenced to GND
VIL
Inhibit control (pin 4)
Input low voltage
IIL inhibit
Inhibit control (pin 4)
Input low curent
Pin to GND
IIN inh
Input standby current
Inhibit control (pin 4) to GND
fs
Switching frequency
CIN
External input capacitance
Over VIN and IO ranges
CO1, CO2
External output capacitance
Capacitance value: Ceramic
(1)
(2)
(3)
(4)
(5)
(6)
Reliability
Open (2)
–0.2
0.6
10
350
PTH12060Y
200
250
300
330 (3)
PTH03060Y/PTH05060Y
470 (4)
5500 (5)
PTH12060Y
940 (4)
5500 (5)
PTH03060Y/PTH05060Y
200 (4)
300
PTH12060Y
400 (4)
600
6
V
kHz
µF
560
4 (6)
V
mA
300
Per Bellcore TR-332 50 % stress, TA = 40°C, ground benign
V
µA
250
Equuivanent series resistance (non-ceramic)
MTBF
VIN–0.5
PTH03060Y/PTH05060Y
PTH12060Y
mV
V
130
PTH03060Y/PTH05060Y
Capacitance value: Nonceramic
mVpp
µF
µF
mΩ
106 Hrs
Rating is conditional on the module being directly soldered to a 4-layer PCB with 1 oz. copper. See the SOA curves or contact the
factory for appropriate derating.
This control pin has an internal pull-up to the input voltage VIN. If it is left open-circuit the module will operate when input power is
applied. A small low-leakage (<100 nA) MOSFET is recommended for control. For further information, consult the related application
note.
An input capacitor is required for proper operation. The capacitor must be rated for a minimum of 300 mA rms (750 mA rms for 12-V
input) of ripple current.
The minimum value of external output capacitance value ensures that VTT meets the specified transient performance requirements for
the memory bus terminations. Lower values of capacitance may be possible when the measured peak change in output current is
consistently less than 3 A.
This is the calculated maximum. The minimum ESR limitation will often result in a lower value. Consult the capacitor application notes
for further guidance.
This is the typcial ESR for all the electrolytic (non-ceramic) output capacitance. Use 7 mΩ as the minimum when using max-ESR values
to calculate.
3
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
Terminal Functions
TERMINAL
NAME
VIN
NO.
2
DESCRIPTION
The positive input voltage power node to the module, which is referenced to common GND.
1, 7
This is the common ground connection for the VIN and VTT power connections. It is also the 0-VDC reference
for the control inputs.
VREF
8
The module senses the voltage at this input to regulate the output voltage, VTT. The voltage at VREF is also
the reference voltage for the system bus receiver comparators. It is normally set to precisely half the bus
driver supply voltage (VDDQ÷ 2), using a resistor divider. The Thevenin impedance of the network driving the
VREF pin should not exceed 500 Ω. See the Typical DDR Application Diagram in the Application Information
section for reference.
VTT
6
This is the regulated power output from the module with respect to the GND node, and the tracking
termination supply for the application data and address buses. It is precisely regulated to the voltage applied
to the module's VREF input, and is active active about 20 ms after a valid input source is applied to the
module. Once active it will track the voltage applied at VREF.
Vo Sense
5
The sense input allows the regulation circuit to compensate for voltage drop between the module and the
load. For optimal voltage accuracy Vo Sense should be connected to VTT.
3
The Inhibit pin is an open-collector/drain negative logic input that is referenced to GND. Applying a low-level
ground signal to this input turns off the output voltage, VTT. Although the module is inhibited, a voltage, VDDQ
will be present at the output terminals, fed through the DDR memory. When the Inhibit is active, the input
current drawn by the regulator is significantly reduced. If the Inhibit pin is left open circuit, the module will
produce an output whenever a valid input source is applied. See the Typical DDR Application Diagram in the
Application Information section for reference.
GND
Inhibit
N/C
4, 9, 10
No connect
1
10
9
8
7
PTHXX060
(Top View)
2
6
3
4
4
5
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS (VREF =1.25 V) (1) (2)
EFFICIENCY
vs
LOAD CURRENT
10 0
VIN = 5 V
OUTPUT RIPPLE
vs
LOAD CURRENT
60
VIN = 12 V
80
70
60
40
30
2
4
6
8
IL − Load Current − A
VIN = 3.3 V
VIN = 5 V
20
10
0
0
10
0
2
4
6
8
IL − Load Current − A
VIN = 5 V
1
VIN = 3.3 V
10
0
0
2
4
6
8
10
IL − Load Current − A
Figure 3.
90
80
Nat Cinv
TA− Ambient Temperature 5−C
TA− Ambient Temperature 5−C
2
PTH12060Y ONLY; VIN = 12 V
TEMPERATURE DERATING
vs LOAD CURRENT
90
200 LFM
70
100 LFM
400 LFM
60
50
40
30
0
2
4
6
IL − Load Current − A
Figure 4.
(2)
VIN = 12 V
Figure 2.
PTH03060Y/PTH05060Y AT
NOMINAL VIN
TEMPERATURE DERATING
vs LOAD CURRENT
(1)
3
VIN = 12 V
Figure 1.
20
PD − Power Dissipation − W
50
Output Ripple − mV
Efficiency − %
4
VIN = 3.3 V
90
50
POWER DISSIPATION
vs
LOAD CURRENT
8
10
Nat Cinv
80
100 LFM
70
200 LFM
400 LFM
60
50
40
30
20
VIN = 12 V
0
2
4
6
8
IL − Load Current − A
10
Figure 5.
The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 1, Figure 2, and Figure 3.
The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 4 in x 4 in double-sided PCB with 1 oz. copper. For
surface mount packages (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around the power
pins. Please refer to the mechanical specification for more information. Applies to Figure 4, and Figure 5.
5
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS
TRANSIENT PERFORMANCE FOR ∆3-A LOAD CHANGE
PTH03060Y/PTH05060Y: SOURCE-SINK-SOURCE
TRANSIENT
PTH12060Y: SOURCE-SINK-SOURCE TRANSIENT
VTT − VREF
VTT − VREF
ITT (52A/div)
ITT (2A/div)
(50 mV/div)
50 ms/div
Figure 6.
6
(50 mV/div)
50 ms/div
Figure 7.
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
APPLICATION INFORMATION
Typical DDR Application Diagram
Auto-Track
VI= 5V
VI
+
Margin ±
+Sense
PTH05010W
VDDQ I/O Memory
+VADJ
Inhibit
470 µF
5.51 kΩ
47 µF
VI
+
220 µF
Inhibit
PTH05050Y
DDR Termination
VDDQ = 1.8 V
VO
+
2×
330 µF
2×
22 µF
VTT = 0.9 V
VTT
+VREF
DDRII/
QDRII
+
2×
330 µF
2×
22 µF
1 kΩ
47 µF
1 kΩ
UDG−05096
CAPACITOR RECOMMENDATIONS FOR THE PTH03060Y AND PTH05060Y DDR POWER
MODULES (3.3-V/5-V OPTION)
Input Capacitor
The recommended input capacitor(s) is determined by the 330 µF(1) minimum capacitance and 300 mArms
minimum ripple current rating.
Ripple current and less than 160 mΩ equivalent series resistance (ESR) values are the major considerations,
along with temperature, when designing with different types of capacitors. Unlike polymer tantalum, regular
tantalum capacitors have a recommended minimum voltage rating of 2 × (maximum DC voltage + AC ripple).
This is standard practice to insure reliability.
For improved ripple reduction on the input bus, ceramic capacitors may be substituted for electrolytic types using
the minimum required capacitance.
Output Capacitors
For applications with load transients (sudden changes in load current), regulator response will benefit from
external output capacitance. The recommended output capacitance of 470 µF will allow the module to meet its
transient response specification (see Electrical Specifications table). For most applications, a high quality
computer-grade aluminum electrolytic capacitor is adequate. These capacitors provide decoupling over the
frequency range, 2 kHz to 150 kHz, and are suitable when ambient temperatures are above 0°C. For operation
below 0°C tantalum, ceramic or Os-Con type capacitors are recommended. When using one or more
non-ceramic capacitors, the calculated equivalent ESR should be no lower than 4 mΩ (7 mΩ using the
manufacturer's maximum ESR for a single capacitor). A list of preferred low-ESR type capacitors are identified in
Table 1.
7
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
APPLICATION INFORMATION (continued)
Ceramic Capacitors
Above 150 kHz the performance of aluminum electrolytic capacitors becomes less effective. To further improve
the reflected input ripple current or the output transient response. Multilayer ceramic capacitors have very low
ESR and their resonant frequency higher than the bandwidth of the regulator. They can be used to reduce the
reflected ripple current at the input as well as improve the transient response of the output. When used on the
output their combined ESR is not critical as long as the total value of ceramic capacitance does not exceed
300 µF. Also, to prevent the formation of local resonances, do not place more than five identical ceramic
capacitors in parallel with values of 10 µF or greater.
Tantalum Capacitors
Tantalum type capacitors can be used at both the input and output, and are recommended for applications where
the ambient operating temperature can be less than 0°C. The AVX TPS, Sprague 593D/594/595 and Kemet
T495/T510 capacitor series are suggested over many other tantalum types due to their higher rated surge, power
dissipation, and ripple current capability. As a caution many general purpose tantalum capacitors have
considerably higher ESR, reduced power dissipation and lower ripple current capability. These capacitors are
also less reliable when determining their power dissipation and surge current rating. Tantalum capacitors that do
not have a stated ESR or surge current rating are not recommended for power applications.
When specifying Os-Con and polymer tantalum capacitors for the output, the minimum ESR limit will be
encountered well before the maximum capacitance value is reached.
Capacitor Table
Table 1 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple
current (rms) ratings. The recommended number of capacitors required at both the input and output buses is
identified for each capacitor type.
This is not an extensive capacitor list. Capacitors from other vendors are available with comparable
specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical
parameters necessary to insure both optimum regulator performance and long capacitor life.
Table 1. Input/Output Capacitors (1)
Capacitor Characteristics
Capacitor Vendor,
Type/Series (Style)
Working
Voltage
(V)
FC (Radial)
FK (SMD)
FC (SMD)
Quantity
Vendor
Part Number
Value
(µF)
Max ESR
at 100 kHz
(Ω)
Max Ripple
Current at 85°C
(Irms) (mA)
Physical
Size
(mm)
Input
Bus
Output
Bus
10
470
0.117
555
8×11,5
1
1
EEUFC1A471
10
470
0.160
600
8×10,2
1
1
EEVFK1A471P
10
470
0.150
670
10×10,2
1
1
EEVFC1A471P
PXA, Poly-Aluminum (SMD)
10
470
0.012
5300
10×12,2
1
≤1
PXA10VC471MJ12TP
PS, Poly-Aluminum (Radial)
10
470
0.012
5300
8×12,2
1
≤1
10PS470MJ12
LXZ, Aluminum (Radial)
10
470
0.120
555
8×12
1
1
LXZ10VB471M8X12LL
Panasonic, Aluminum
United Chemi-Con
Nichicon Aluminum
WG (SMD)
10
470
0.150
670
10×10
1
1
UWG1A471MNR1GS
HD (Radial)
10
470
0.072
760
8×11.5
1
1
UHD1A471MPR
PM (Radial)
16
330
0.120
625
10×12,5
1
2
UPM1C331MPH6
(1)
8
Capacitor Supplier Verification
Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of
limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term
consideration for obsolescence.
RoHS, Lead-free and Material Details
Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process
requirements. Component designators or part number deviations can occur when material composition or soldering requirements are
updated.
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
APPLICATION INFORMATION (continued)
Table 1. Input/Output Capacitors (continued)
Capacitor Characteristics
Capacitor Vendor,
Type/Series (Style)
Quantity
Vendor
Part Number
Working
Voltage
(V)
Value
(µF)
Max ESR
at 100 kHz
(Ω)
Max Ripple
Current at 85°C
(Irms) (mA)
Physical
Size
(mm)
Input
Bus
Output
Bus
6.3
180
0.005
4000
7,.3×4,3×4,2
2
N/R (2)
EEFSE0J181R
SEPC, Os-con (Radial)
16
470
0.010
6100
10×13
1
≤1
16SEPC470M
SVP (SMD)
6.3
470
0.015
4210
8×11,9
1
≤2
6SVP470M
TPE, Poscap (SMD)
6.3
330
0.025
2400
7.3×4.3
1
≤3
6TPE330ML
TPS Series III
10
470
0.045
1915
1
≤5
TPSE477M010R0045
TPS (SMD)
10
470
0.100
1432
7.3L ×5.7W
×4.1H
1
≤5
TPSV477M010R0100
T520 (SMD)
10
330
0.040
1800
T530 (SMD)
10
330
0.010
>5200
595D, Tantalum (SMD)
10
330
0.100
594D, Tantalum (SMD)
10
330
0.045
94SA,Poly-Aluminum (SMD)
6.3
330
0.025
3500
94SVP, Poly-Aluminum
(SMD)
6.3
470
0.017
3960
16
10
0.002
–
6.3
47
0.002
Panasonic, Poly-Aluminum:
S/SE (SMD)
Sanyo
AVX, Tantalum
Kemet, Poly-Tantalum
4.3W ×7.3L
×4.0H
1
1
T520X337M010AS
1
≤1
T530X337M010ASE010
1040
1
≤5
595D377x0010D2T
2360
1
≤5
594D337X0016R2T
1
≤3
94SA337X06R3FBP
1
≤2
94SVP477X06R3E12
3225 mm
1
≤5
C1210C106M4PAC
3225 mm
1
≤5
C1210C476K9PAC
3225 mm
1 (3)
≤3
GRM32ER60J107M
3225 mm
1 (3)
≤5
GRM32ER60J476M
Vishay-Sprague
Kemet, Ceramic X5R (SMD)
Murata, Ceramic X5R (SMD)
TDK, Ceramic X5R (SMD)
(2)
(3)
0.002
6.3
100
6.3
47
16
22
1 (3)
≤5
GRM32ER61C226K
16
10
1 (3)
≤5
GRM32DR61C106K
6.3
100
3225 mm
1 (3)
≤3
C3225X5R0J107MT
6.3
47
3225 mm
1 (3)
≤5
C3225X5R0J476MT
16
22
1 (3)
≤5
C3225X5R1C226MT
16
10
1 (3)
≤5
C3225X5R1C106MT
0.002
–
7.2L×6W
×4.1H
10 ×10,5
8,3x12
–
N/R – Not recommended. The capacitor does not meet the minimum operating limits.
A ceramic capacitor may be used to compliment electrolytic types at the input to further reduce high-frequency ripple current.
Designing for Very Fast Load Transients
The transient response of the DC/DC converter has been characterized using a load transient with a di/dt of 1
A/µs. The typical voltage deviation for this load transient is given in the data sheet specification table using the
optional value of output capacitance. As the di/dt of a transient is increased, the response of a converter's
regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with
any DC/DC converter once the speed of the transient exceeds its bandwidth capability. If the target application
specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional output
capacitor decoupling. In these cases special attention must be paid to the type, value and ESR of the capacitors
selected.
If the transient performance requirements exceed that specified in the data sheet, or the total amount of load
capacitance is above 5500 µF, the selection of output capacitors becomes more important.
9
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
CAPACITOR
RECOMMENDATIONS
(12-V OPTION)
FOR
THE
PTH12060Y
DDR
POWER
MODULES
Input Capacitor
The recommended input capacitance is determined by the 560 µF [1] minimum capacitance and 750 mArms
minimum ripple current rating. A 10-µF X5R/X7R ceramic capacitor can be added to reduce the reflected input
ripple current. The ceramic capacitor should be located between the input electrolytic and the module.
Ripple current, less than 100 mΩ equivalent series resistance (ESR) and temperature, are major considerations
when selecting input capacitors. Unlike polymer-tantalum capacitors, regular tantalum capacitors have a
recommended minimum voltage rating of 2 × (max. dc voltage + ac ripple). No tantalum capacitors were found
with sufficient voltage rating to meet this requirement. At temperatures below 0°C, the ESR of aluminum
electrolytic capacitors increases. For these applications, Os-Con, polymer-tantalum, and polymer-aluminum types
should be considered.
Output Capacitors
For applications with load transients (sudden changes in load current), regulator response will benefit from
external output capacitance. The recommended output capacitance of 940µF will allow the module to meet its
transient response specification (See Electrical Specifications table). For most applications, a high quality,
computer-grade aluminum electrolytic capacitor is adequate. These capacitors provide decoupling over the
frequency range, 2 kHz to 150 kHz, and are suitable for ambient temperatures above 0°C. Below 0°C, tantalum,
ceramic, or Os-Con type capacitors are recommended. When using one or more nonceramic capacitors, the
calculated equivalent ESR should be no lower than 4 mΩ (7 mΩ using the manufacturer's maximum ESR for a
single capacitor).
A list of preferred low-ESR type capacitors are identified in Table 2.
In addition to electrolytic capacitance, adding a 10-µF to 22-µF X5R/X7R ceramic capacitor to the output reduces
the output ripple voltage and improves the regulator's transient response. The measurement of both the output
ripple and transient response is also best achieved across a 10-µF ceramic capacitor.
Ceramic Capacitors
Above 150 kHz, the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramic
capacitors have a low ESR and a resonant frequency higher than the bandwidth of the regulator. They can be
used to reduce the reflected ripple current at the input, and improve the transient response of the output. When
used on the output, their combined ESR is not critical as long as the total value of ceramic capacitance does not
exceed 600 µF. Also, to prevent the formation of local resonances, do not place more than five identical ceramic
capacitors in parallel with values of 10 µF or greater.
Tantalum Capacitors
Tantalum type capacitors are most suited for use on the output bus, and are recommended for applications
where the ambient operating temperature can be less than 0°C. The AVX TPS, Sprague 593D/594/595, and
Kemet T495/T510 capacitor series are suggested over other tantalum types due to their higher rated surge,
power dissipation, and ripple current capability. As a caution, many general-purpose tantalum capacitors have
considerably higher ESR, reduced power dissipation, and lower ripple current capability. These capacitors are
also less reliable as they have lower power dissipation and surge current ratings. Tantalum capacitors that do not
have a stated ESR or surge current rating are not recommended for power applications.
When specifying Os-con and polymer tantalum capacitors for the output, the minimum ESR limit is encountered
well before the maximum capacitance value is reached.
Capacitor Table
Table 2 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple
current (rms) ratings. The recommended number of capacitors required at both the input and output buses is
identified for each capacitor type.
Note: This is not an extensive capacitor list. Capacitors from other vendors are available with comparable
specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical
parameters necessary to insure both optimum regulator performance and long capacitor life.
10
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
Designing for Very Fast Load Transients
The transient response of the dc/dc converter is characterized using a load transient with a di/dt of 1 A/µs. The
typical voltage deviation for this load transient is given in the data sheet specification table using the optional
value of output capacitance. As the di/dt of a transient is increased, the response of a converter's regulation
circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with any dc/dc
converter once the speed of the transient exceeds its bandwidth capability. If the target application specifies a
higher di/dt or lower voltage deviation, the requirement is met with additional output capacitor decoupling. In
these cases, special attention must be paid to the type, value, and ESR of the capacitors selected.
If the transient performance requirements exceed that specified in this data sheet, or the total amount of load
capacitance is above 5500 µF, the selection of output capacitors becomes more important.
Table 2. Input/Output Capacitors (1)
Capacitor Characteristics
Capacitor Vendor,
Type/Series (Style)
Working
Voltage
(V)
Value
(µF)
Max ESR
at 100 kHz
(Ω)
Max Ripple
Current at
85°C (Irms)
(mA)
Quantity
Physical Size
(mm)
Input
Bus
Output
Bus
Vendor Number
Panasonic, Aluminum
25
560
0.065
1205
12,5 × 15
1
1
EEUFC1E561S
FC (Radial)
25
1000
0.060
1100
12,5 × 13,5
1
1
EEVFK1E102Q
FK (SMD)
35
680
0.060
1100
12,5 × 13,5
1
1
EEVFK1V681Q
United Chemi-Con
LXZ, Aluminum (Radial)
16
330
0.0014
5050
10 × 12,5
2
≤2
16PS330MJ12
PS, Poly-Aluminum (Radial)
16
680
0.068
1050
10 × 16
1
1
LXZ16VB681M10X16LL
PXA, Poly-Aluminum (SMD)
16
330
0.014
5050
10 × 12,2
2
≤2
PXA16VC331MJ12
Nichicon Aluminum
25
560
0.060
1060
12,5 × 15
1
1
UPM1E561MHH6
PM (Radial)
16
680
0.038
1430
10 × 16
1
1
UHD1C681MHR
HD (Radial)
35
560
0.048
1360
16 × 15
1
1
UPM1V561MHH6
TPE, pos-cap (SMD)
10
330
0.025
3000
7,3 L × 5,7 W
N/R (2)
≤3
10TPE330M
SEPC, Os-con (Radial)
16
270
0.011
5000
8 × 12
2 (3)
≤1
16SP270M
SVP, Os-con (SMD)
16
330
0.016
4700
11 × 12
2
≤2
16SVP330M
SVPC, Os-con (SMD)
4
1200
0.010
4700
8 × 11,9
N/R (2)
≤1
4SVPC1200M
TPS Series III (SMD)
10
470
0.045
>1723
7,3 L× 5,7 W
×4,1H
N/R (2)
≤5
TPSE477M019R0045
TPS (SMD)
10
330
0.045
>1723
7,3 L ×4,3 W ×4,3
H
N/R (2)
≤5
TPSE337M019R0045
T520, Poly-Tantalum ( SMD)
10
470
0.040
1800
7,3 L ×4,3 W ×4,3
H
N/R (2)
≤5
T520X477M006ASE040
T530, Tantalum/Organic
(SMD)
4
680
0.010
>5100
7,3 L ×4,3 W ×4,3
H
N/R (2)
≤1
T530X687M004ASE010
6.3
470
0.010
5200
7,3 L ×4,3 W ×4,3
H
N/R (2)
≤1
T530X477M006ASE010
594D, Tantalum (SMD)
10
470
0.100
1440
7,2 L ×6 W× 4,1 H
N/R (2)
≤5
595D477X0010R2T
94SA, organic (Radial )
16
1000
0.015
>9700
16 × 25
1
≤2
94Sa108X0016HBP
94SVP, Organic (SMD)
16
330
0.017
>4500
10 × 12,7
2
≤2
94SVP477X0016F12
Sanyo
AVX, Tantalum
Kemet
Vishay-Sprague
(1)
(2)
(3)
Capacitor Supplier Verification
Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of
limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term
consideration for obsolescence.
RoHS, Lead-free and Material Details
Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process
requirements. Component designators or part number deviations can occur when material composition or soldering requirements are
updated.
N/R – Not recommended. The capacitor voltage rating does not meet the minimum operating limits.
A total capacitance of 540 µF is acceptable based on the combined ripple current rating.
11
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
Table 2. Input/Output Capacitors (continued)
Capacitor Characteristics
Capacitor Vendor,
Type/Series (Style)
Kemet, Ceramic X5R (SMD)
Murata, Ceramic X5R (SMD)
TDK, Ceramic X5R (SMD)
(4)
12
Working
Voltage
(V)
Value
(µF)
Max ESR
at 100 kHz
(Ω)
Max Ripple
Current at
85°C (Irms)
(mA)
Quantity
Physical Size
(mm)
Input
Bus
Output
Bus
Vendor Number
16
10
0.002
3225 mm
1 (4)
≤5
C1210C106M4PAC
6.3
47
0.002
3225 mm
N/R (2)
≤5
C1210C476K9PAC
6.3
100
0.002
3225 mm
N/R (2)
≤4
GRM32ER60J107M
6.3
47
3225 mm
N/R (2)
≤5
GRM32ER60J476M
16
22
1 (4)
≤5
GRM32ER61C226K
16
10
1 (4)
≤5
GRM32DR61C106K
6.3
100
3225 mm
N/R (2)
≤4
C3225X5R0J107MT
6.3
47
3225 mm
N/R (2)
≤5
C3225X5R0J476MT
16
22
1 (4)
≤5
C3225X5R1C226MT
16
10
1 (4)
≤5
C3225X5R1C106MT
0.002
Ceramic capacitors are recommended to complement electrolytic types at the input bus by reducing high-frequency ripple current.
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
TAPE AND REEL SPECIFICATION
13
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
SLTS222A – MARCH 2004 – REVISED OCTOBER 2005
TRAY SPECIFICATION
14
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
PTH03060YAH
ACTIVE
DIP MOD
ULE
EUW
10
36
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PTH03060YAS
ACTIVE
DIP MOD
ULE
EUY
10
36
TBD
Call TI
Level-1-235C-UNLIM
PTH03060YAST
ACTIVE
DIP MOD
ULE
EUY
10
250
TBD
Call TI
Level-1-235C-UNLIM
PTH03060YAZ
ACTIVE
DIP MOD
ULE
EUY
10
36
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH03060YAZT
ACTIVE
DIP MOD
ULE
EUY
10
250
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH05060YAH
ACTIVE
DIP MOD
ULE
EUW
10
36
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PTH05060YAS
ACTIVE
DIP MOD
ULE
EUY
10
36
TBD
Call TI
Level-1-235C-UNLIM
PTH05060YAST
ACTIVE
DIP MOD
ULE
EUY
10
250
TBD
Call TI
Level-1-235C-UNLIM
PTH05060YAZ
ACTIVE
DIP MOD
ULE
EUY
10
36
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH05060YAZT
ACTIVE
DIP MOD
ULE
EUY
10
250
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH12060YAH
ACTIVE
DIP MOD
ULE
EUW
10
36
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PTH12060YAS
ACTIVE
DIP MOD
ULE
EUY
10
36
TBD
Call TI
Level-1-235C-UNLIM
PTH12060YAST
ACTIVE
DIP MOD
ULE
EUY
10
250
TBD
Call TI
Level-1-235C-UNLIM
PTH12060YAZ
ACTIVE
DIP MOD
ULE
EUY
10
36
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH12060YAZT
ACTIVE
DIP MOD
ULE
EUY
10
250
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated