CALMIRCO CM1450-06CS

PRELIMINARY
CM1450
LCD & Camera EMI Filter Array with ESD Protection
Features
Product Description
•
•
The CM1450 comprises a family of inductor-capacitor
(L-C) based EMI filter arrays with integrated ESD protection in CSP form factor. The CM1450-06 and
CM1450-08 are configured in 6 and 8 channel formats
respectively. Each EMI filter channel of the CM1450 is
implemented as a 5-pole L-C filter where the component values are 15pF-17nH-15pF-17nF-15pF. The
CM1450's roll-off frequency at -10dB attenuation is
300MHz and can be used in applications where the
data rates are as high as 120Mbps while providing
greater than 35dB over the 800MHz to 2.7GHz frequency range. The parts integrate ESD protection
diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
ESD protection diodes connected to the filter ports are
designed and characterized to safely dissipate ESD
strikes of ±15kV, beyond the Level 4 requirement of
the IEC61000-4-2 international standard. Using the
MIL-STD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, the pins are protected for
contact discharges at greater than ±30kV.
•
•
•
•
•
•
•
•
Six and eight channels of EMI filtering
Utilizes Praetorian™ inductor-based design technology for true L-C filter implementation
OptiGuard™ coating for improved reliability
±15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±30kV ESD protection on each channel (HBM)
Better than 40dB of attenuation at 1GHz
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
15-bump, 2.960mm x 1.330mm footprint
Chip Scale Package (CM1450-06CS/CP)
20-bump, 4.000mm x 1.458mm footprint
Chip Scale Package (CM1450-08CS/CP)
Lead-free version available
Applications
•
•
•
•
•
•
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
EMI filtering for data phones in cell phones, PDAs
or notebook computersWireless handsets / cell
phones
Wireless Handsets
Handheld PCs/PDAs
LCD and camera modules
This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs) because of its
small package format and easy-to-use pin assignments. In particular, the CM1450 is ideal for EMI filtering and protecting data and control lines for the LCD
display and camera interface in wireless handsets.
The CM1450 incorporates OptiGuard™ which results in
improved reliability at assembly. The CM1450 is available in a space saving, low profile Chip Scale Package
with optional lead-free finishing.
.
Electrical Schematic
L1
L2
FILTERn*
FILTERn*
C
C
C
GND
(Pins B1-Bn)
1 of n EMI Filtering + ESD Channels
(n = 6 for CM1450-06, 8 for CM1450-08)
* See Package/Pinout Diagram
for expanded pin information.
© 2005 California Micro Devices Corp. All rights reserved.
01/27/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
1
PRELIMINARY
CM1450
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
5
6
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
C1
C2
C3
C4
C5
C6
A
GND
N506
B
GND
B1
Orientation
Marking
C
GND
B2
B3
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
A1
A2
A3
A4
A5
A6
A1
CM1450-06CS/CP 15-Bump CSP Package
Orientation
Marking
(see note 2)
1
2
3
4
5
6
7
8
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
C1
C2
C3
C4
C5
C6
C7
C8
A
GND
N508
B
GND
B1
Orientation
Marking
C
GND
B2
GND
B3
B4
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A1
A2
A3
A4
A5
A6
A7
A8
A1
Notes:
CM1450 -08CS/CP 20-Bump CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
CM1450
CM1450
NAME
DESCRIPTION
CM1450
CM1450
PIN(s)
A1
NAME
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
PIN(s)
A1
FILTER1
Filter Channel 1
C1
PIN(s)
NAME
DESCRIPTION
C1
FILTER1
Filter Channel 1
A2
A2
FILTER2
Filter Channel 2
A3
A3
FILTER3
Filter Channel 3
C2
C2
FILTER2
Filter Channel 2
C3
C3
FILTER3
Filter Channel 3
A4
A4
FILTER4
A5
A5
FILTER5
Filter Channel 4
C4
C4
FILTER4
Filter Channel 4
Filter Channel 5
C5
C5
FILTER5
Filter Channel 5
A6
A6
FILTER6
Filter Channel 6
C6
C6
FILTER6
Filter Channel 6
-
A7
FILTER7
Filter Channel 7
-
C7
FILTER7
Filter Channel 7
-
A8
FILTER8
Filter Channel 8
-
C8
FILTER8
Filter Channel 8
B1-B3
B1-B4
GND
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Bumps
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
Part Marking
15
CSP
CM1450-06CS
N506
CM1450-06CP
N506
20
CSP
CM1450-08CS
N508
CM1450-08CP
N508
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/27/05
PRELIMINARY
CM1450
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
LTOT
Total Channel Inductance (L1 + L2)
34
nH
L1, L2
Inductance
17
nH
CTOT
Total Channel Capcitance (C1⏐⏐C2 ⏐⏐ C3 )
C1, C2, C3 Capacitance
At 2.5V DC, 1MHz,
30mV AC
36
45
54
pF
At 2.5V DC, 1MHz,
30mV AC
12
15
18
pF
fC
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
137
MHz
fC
Roll-off Frequency at -10dB Attenuation
ZSOURCE=50Ω, ZLOAD=50Ω
300
MHz
VDIODE
Diode Standoff Voltage
IDIODE=10µA
ILEAK
Diode Leakage Current (reverse bias)
VDIODE=+3.3V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
VCL
5.5
V
100
5.6
-1.5
6.8
-0.8
nA
9.0
-0.4
V
V
±30
kV
±15
kV
+12
-7
V
V
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
© 2005 California Micro Devices Corp. All rights reserved.
01/27/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
3
PRELIMINARY
CM1450
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
© 2005 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/27/05
PRELIMINARY
CM1450
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
01/27/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
5
PRELIMINARY
CM1450
Mechanical Details
CM1450 devices are supplied in custom Chip Scale
Packages (CSP). Dimensions for each of these
devices are presented in the following pages.
Mechanical Package Diagrams
CM1450-06CS/CP Mechanical Specifications
BOTTOM VIEW
The package dimensions for the CM1450-06CS/CP
are presented below.
A1
C1
SIDE
VIEW
B2
B4
B3
B1
C
Custom CSP
Bumps
15
Dim
Millimeters
Min
Nom
Max
A
1
Inches
Min
Nom
Max
A1
2.915 2.960 3.005 0.1148 0.1165 0.1183
A2
1.285 1.330 1.375 0.0506 0.0524 0.0541
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071 0.0091 0.0110
D1
0.561 0.605 0.649 0.0221 0.0238 0.0255
D2
0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
C2
Package
B
A2
PACKAGE DIMENSIONS
2
3
4
5
6
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1450-06CS/CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
© 2005 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/27/05
PRELIMINARY
CM1450
Mechanical Details (cont’d)
CM1450-08CS/CP Mechanical Specifications
Mechanical Package Diagrams
The package dimensions for the CM1450-08CS/CP
are presented below.
BOTTOM VIEW
A1
C1
20
Dim
Millimeters
Min
Nom
Max
A
Min
Nom
Max
A1
3.955 4.000 4.045 0.1557 0.1575 0.1593
A2
1.413 1.458 1.503 0.0556 0.0574 0.0592
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.200 0.250 0.300 0.0079 0.0098 0.0118
C2
0.244 0.294 0.344 0.0096 0.0116 0.0135
D1
0.561 0.605 0.649 0.0221 0.0238 0.0255
D2
0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
A
1
Inches
A2
Bumps
B
C2
Custom CSP
B4
B3
C
PACKAGE DIMENSIONS
Package
SIDE
VIEW
B2
B1
2
3
4
5
6
7
8
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1450-08CS/CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
© 2005 California Micro Devices Corp. All rights reserved.
01/27/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
7
PRELIMINARY
CM1450
Mechanical Details (cont’d)
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B 0 X A0 X K0
CM1450-06
2.96 X 1.33 X 0.6
3.10 X 1.45 X 0.74
8mm
178mm (7")
3500
4mm
4mm
CM1450-08
4.00 X 1.46 X 0.6
4.11 X 1.57 X 0.76
8mm
178mm (7")
3500
4mm
4mm
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 6. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/27/05