PRELIMINARY CM1470 Praetorian™ 4-, 6- and 8-Channel Series Inductor Networks Features Product Description • CMD’s CM1470 is a family of series inductor networks providing EMI filtering for applications that are sensitive to signal integrity such as high-resolution camera interfaces. The CM1470 is configured in 4, 6 and 8 channel formats. Each channel is implemented as a single inductor element where the component value is 17nH. The CM1470 will help suppress EMI radiation to the external environment. The parts integrate ESD diodes on every pin to provide protection during the manufacturing process when the device is placed on the PCB from a pick-and-place machine. The ESD protection diodes safely dissipate ESD strikes of ±2kV, per the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD. • • • • • • • • Ultra-low capacitance filter results in excellent signal integrity 4, 6 and 8 channels of EMI filtering 0.4mm pitch Chip Scale Package (CSP) ±2kV HBM – MIL-STD883 (Method 3015) 10 bump, 2.030mm x 0.836mm footprint CSP for CM1470-04 14 bump, 2.830mm x 0.836mm footprint CSP for CM1470-06 18 bump, 3.630mm x 0.836mm footprint CSP for CM1470-08 OptiGuard™ Coating for improved reliability at assembly Lead-free finishing Applications • • • • This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs) because of its small package format and easy-to-use pin assignments. In particular, the CM1470 is ideal for EMI filtering data and control lines in camera modules where it is placed near the transmission source on a flexible PCB. The CM1470 level of performance (i.e. cutoff frequency and attenuation level) can be tuned with external signal trace capacitance. Data and control lines for high resolution camera modules in phones LCD modules Mobile handsets High-speed data I/O lines The CM1470 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1470 is available in a space-saving, low-profile Chip Scale Package with lead-free finishing. Electrical Schematic 17nH B2 - B(n+1) A1 - An 3.2pF 3.2pF B1 A(n+1) 1 of n Channels (n = 4, 6, 8) © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 PRELIMINARY CM1470 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking 1 2 A 3 4 BOTTOM VIEW (Bumps Up View) 5 N704 B Orientation Marking B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 A1 CM1470-04CP 10-bump CSP Orientation Marking 1 2 A 3 4 5 6 7 N706 B B1 B2 B3 B4 B5 B6 B7 A1 A2 A3 A4 A5 A6 A7 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 Orientation Marking A1 CM1470-06CP 14-bump CSP Orientation Marking 1 2 A 3 4 5 6 7 8 9 147008 B Orientation Marking A1 CM1470-08CP 18-bump CSP Notes: 1) These drawings are not to scale. PIN DESCRIPTIONS PIN NUMBER PIN NUMBER -04 -06 -08 PIN DESCRIPTION -04 -06 -08 PIN DESCRIPTION A1 A1 A1 Inductor Input #1 B1 B1 B1 GND A2 A2 A2 Inductor Input #2 B2 B2 B2 Inductor Input #1 A3 A3 A3 Inductor Input #3 B3 B3 B3 Inductor Input #2 A4 A4 A4 Inductor Input #4 B4 B4 B4 Inductor Input #3 A5 A5 Inductor Input #5 B5 B5 B5 Inductor Input #4 A6 A6 Inductor Input #6 B6 B6 Inductor Input #5 A7 Inductor Input #7 B7 B7 Inductor Input #6 A8 Inductor Input #8 B8 Inductor Input #7 A9 GND B9 Inductor Input #8 A5 A7 © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1470 Ordering Information PART NUMBERING INFORMATION Lead-free Finish Bumps Package Ordering Part Number1 Part Marking 10 CSP CM1470-04CP N704 14 CSP CM1470-06CP N706 18 CSP CM1470-08CP 147008 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 PRELIMINARY CM1470 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C 30 mA RATING UNITS -40 to +85 °C DC current per Inductor STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL LTOT R PARAMETER CONDITIONS MIN TYP MAX UNITS Total Channel Inductance 17 nH DC Channel Resistance 10 Ω Total Channel Capacitance (C1 x 2) 2.5V dc; 1MHz, 30mV ac 6.4 pF Capacitance 2.5V dc; 1MHz, 30mV ac 3.2 pF VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA VST Stand-off Voltage I = 10μA 6.0 ILEAK Diode Leakage Current VIN = +3.3V 0.1 1.0 μA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 CTOT C1 fC 5 -15 5.6 -1.5 7 -10 15 -5 V V V Notes 2, 3, 4 and 5 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω ±4 kV ±2 kV 850 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin B2. Note 4: Unused pins are left open. Note 5: These parameters are guaranteed by design and characterization. © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1470 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-B2 to GND) Figure 2. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5V d.c) © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 PRELIMINARY CM1470 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) 25MHz 50MHz 75MHz Figure 3. 2ns Rise and Fall Times of Clocked Signals at 25MHz, 50MHz and 100MHz through CM1470 Inductor Array (Simulation) © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1470 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 4. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 5. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 PRELIMINARY CM1470 Mechanical Details CM1470-04CP Mechanical Specifications Mechanical Package Diagrams Dimensions for the CM1470-04CP supplied in a 10bump, 0.4mm pitch chip scale package (CSP) are presented below. OptiGuardTM Coated CSP For complete information on the CSP-10, see the California Micro Devices CSP Package Information document. BOTTOM VIEW OptiGuardTM Coating A1 C1 PACKAGE DIMENSIONS Custom CSP Bumps 10 Min Nom Max 4 3 Inches Min Nom A1 0.791 0.836 0.881 0.0311 0.0329 0.0347 A2 1.985 2.030 2.075 0.0781 0.0799 0.0817 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.395 0.400 0.405 0.0156 0.0157 0.0159 C1 0.168 0.218 0.268 0.0066 0.0086 0.0106 C2 0.165 0.215 0.265 0.0065 0.0085 0.0104 D1 0.537 0.607 0.676 0.0211 0.0239 0.0266 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 2 Max B A B A C2 Dim Millimeters 5 A2 Package B2 B1 1 D1 0.25 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW NOTE: DIMENSIONS IN MILLIMETERS Package Dimensions for CM1470-04CP Chip Scale Package 3500 pieces Controlling dimension: millimeters © 2006 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1470 Mechanical Details CM1470-06CP Mechanical Specifications Mechanical Package Diagrams Dimensions for the CM1470-04CP supplied in a 14bump, 0.4mm pitch chip scale package (CSP) are presented below. OptiGuardTM Coated CSP For complete information on the CSP-14, see the California Micro Devices CSP Package Information document. BOTTOM VIEW OptiGuardTM Coating A1 C1 PACKAGE DIMENSIONS Package Custom CSP Bumps 14 Millimeters Min Nom Max 7 6 5 Inches Min Nom Max 0.791 0.836 0.881 0.0311 0.0329 0.0347 A2 2.785 2.830 2.875 0.1096 0.1114 0.1132 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.395 0.400 0.405 0.0156 0.0157 0.0159 C1 0.168 0.218 0.268 0.0066 0.0086 0.0106 C2 0.165 0.215 0.265 0.0065 0.0085 0.0104 D1 0.537 0.607 0.676 0.0211 0.0239 0.0266 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel B A B A B A 3 2 C2 A1 4 A2 Dim B2 B1 1 D1 0.25 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW 3500 pieces NOTE: DIMENSIONS IN MILLIMETERS Controlling dimension: millimeters Package Dimensions for CM1470-06CP Chip Scale Package © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9 PRELIMINARY CM1470 Mechanical Details CM1470-08CP Mechanical Specifications Mechanical Package Diagrams Dimensions for the CM1470-08CP supplied in an 18bump, 0.4mm pitch chip scale package (CSP) are presented below. OptiGuardTM Coated CSP For complete information on the CSP-18, see the California Micro Devices CSP Package Information document. BOTTOM VIEW OptiGuardTM Coating A1 C1 PACKAGE DIMENSIONS Package Custom CSP Bumps 18 Dim Millimeters Min Nom Max 9 8 7 Inches Min Nom B2 B1 6 Max 0.791 0.836 0.881 0.0311 0.0329 0.0347 5 A2 3.585 3.630 3.675 0.1411 0.1429 0.1447 4 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.395 0.400 0.405 0.0156 0.0157 0.0159 C1 0.168 0.218 0.268 0.0066 0.0086 0.0106 C2 0.165 0.215 0.265 0.0065 0.0085 0.0104 D1 0.537 0.607 0.676 0.0211 0.0239 0.0266 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Controlling dimension: millimeters B A B A 3 2 C2 # per tape and reel A A2 A1 B 1 D1 0.25 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW NOTE: DIMENSIONS IN MILLIMETERS Package Dimensions for CM1470-08CP Chip Scale Package © 2006 California Micro Devices Corp. All rights reserved. 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1470 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W CM1470-04CP 2.03 X 0.836 X 0.644 2.17 x 1.12 x 0.71 8mm 178mm (7") CM1470-06CP 2.83 X 0.836 X 0.644 2.97 x 0.97 x 0.74 8mm CM1470-08CP 3.63 X 0.836 X 0.644 3.76 x 0.97 x 0.74 8mm Po Top Cover Tape REEL QTY PER DIAMETER REEL P0 P1 3500 4mm 4mm 178mm (7") 3500 4mm 4mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 7. Tape and Reel Mechanical Data © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11