TI TRF7960

TRF7960/61
www.ti.com
SLOS504 – AUGUST 2006
Multi-Standard Fully Integrated 13.56-MHz Radio Frequency Identification (RFID) Analog
Front End and Data Framing Reader System
•
FEATURES
•
•
•
•
•
•
•
•
Completely integrated protocol handling
(OSI Model Layer 3 and below)
Separate internal high-PSRR power supplies
for analog, digital, and PA sections provides
noise isolation for superior read range and
reliability
Dual receiver input with AM and PM
demodulation to minimize communication
holes (patent pending).
Receiver AM and PM RSSI
Reader-to-reader anti-collision
High Integration reduces total BOM and
board area
– Single external 13.56 MHz crystal oscillator
– MCU-selectable clock-frequency output of
RF, RF/2, or RF/4
– Adjustable 20 mA, high-PSRR LDO for
powering external MCU
Easy to use with high flexibility
– Auto-configured default modes for each
supported ISO protocol
– 11 user-programmable registers
– Selectable receiver gain and AGC
– Programmable output power
(100 mW or 200 mW)
– Adjustable ASK Modulation Range
(8% to 30%)
– Built in receiver bandpass filter with user
selectable corner frequencies
Wide operating voltage range of 2.7 to 5.5 V
•
•
•
Ultra-low power modes
– Power down < 1 µA
– Standby 120 µA
– Active (Rx only) 10 mA
Parallel 8-Bit or Serial 4-pin SPI interface with
MCU using 12-byte FIFO
Ultra-small 32-pin QFN Package (5x5mm)
Available tools
– Reference design/EVM with development
software
– Source code available for MSP430
APPLICATIONS
•
•
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Secure access control
Product authentication
– Printer ink cartridges
– Blood glucose monitors
Contactless payment systems
DESCRIPTION
The TRF7960/61 is an integrated analog front end &
data framing system for a 13.56 MHz RFID reader
system. Built-in programming options make it
suitable for a wide range of applications both in
proximity and vicinity RFID systems.
The reader is configured by selecting the desired
protocol in the control registers. Direct access to all
control registers allows fine tuning of various reader
parameters as needed.
PRODUCT SELECTION TABLE
PROTOCOLS
DEVICE
TRF7960
ISO14443A/B
106 kbps
212 kbps
424 kbps
848 kbps
X
X
X
X
TRF7961
ISO15693
Tag-it™
HF-EPC
X
X
X
X
X
X
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Tag-it is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
TRF7960/61
www.ti.com
SLOS504 – AUGUST 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
VIN
VDD_X
TRF796x
Z-Matching
Circuit
SYS_CLK
TX_OUT
RX_IN2
MSP430
DATA_CLK
RX_IN1
8
VDD_I/O
Xtal
Figure 1. Typical Application
2
EN2 25
DATA_CLK 26
SYS_CLK 27
EN 28
VSS_D 29
OSC_IN 31
OSC_OUT 30
1
VDD_A
I/O_7 24
2
VIN
I/O_6 23
3
VDD_RF
I/O_5 22
4
VDD_PA
TRF796x
I/O_4 21
5
TX_OUT
RHB-32
I/O_3 20
6
VSS_PA
7
VSS_RX
8
RX_IN1
I/O_2 19
I/O_1 18
Thermal Pad
16 VDD_I/O
15 VSS_A
14 MOD
13 IRQ
12 ASK/OOK
11 BAND_GAP
I/O_0 17
10 VSS
The receiver system enables AM and PM
demodulation using a dual-input architecture. The
receiver also includes an automatic gain control
option and selectable gain. Also included is a
selectable bandwidth to cover a broad range of input
sub-carrier signal options. The received signal
strength for AM and PM modulation is accessible via
the RSSI register. The receiver output is selectable
between a digitized sub-carrier signal and any of
eleven integrated sub-carrier decoders (two for
ISO15693 low bit rate, two for ISO15693 high bit
rate, two for ISO14443, three for ISO14443 high bit
rates, one for Tag-it, and one for HF-EPC system).
Selected decoders also deliver bit stream and a data
clock as outputs.
The TRF7960/61 supports data communication
levels between 1.8-5.5 V for MCU I/O interface while
also providing a data synchronization clock. An
auxiliary 20 mA regulator (pin 32) is available for
additional system circuits.
VDD_X 32
Data transmission comprises low level encoding for
ISO15693, modified Miller for ISO14443-A,
high-bit-rate systems, Tag-it, and HF-EPC system
coding. Included with the data encoding is automatic
generation of SOF, EOF, CRC, and/or parity bits.
The receiver system also includes a framing system.
This system performs the CRC and/or parity check,
removes the EOF and SOF settings, and organizes
the data in bytes. Framed data is then accessible to
the MCU via a 12-byte FIFO register and MCU
interface. The framing supports ISO14443 and
ISO15693 protocols.
9 RX_IN2
A parallel or serial interface can be used for
communication between the MCU & reader. When
hardware encoders and decoders are used
(accelerators for different standards), transmission
and receive functions use a 12-byte FIFO register.
For direct transmit or receive functions, the
encoders/decoders can be bypassed in order for the
MCU to process the data in real time. The transmitter
has selectable output-power levels of 100 mW
(+20 dBm) or 200 mW (+23 dBm) into a 50 Ω load
(at 5 V supply) and is capable of ASK or OOK
modulation. Integrated voltage regulators ensure
power-supply noise rejection for the complete reader
system.
Figure 2. TRF796x Pin Assignments (Top View)
Submit Documentation Feedback
TRF7960/61
www.ti.com
SLOS504 – AUGUST 2006
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
UNIT
VIN
Supply voltage
6
V
IO
Output current
150
mA
Continuous power dissipation
TJ
Tstg
See Dissipation Rating Table
Maximum junction temperature, any condition (2)
140
°C
Maximum junction temperature, continuous operation, long term reliability (2)
125
°C
–55 to 150
°C
Storage temperature range
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
300
°C
2
kV
HBM (Human Body Model)
ESDS rating:
(1)
(2)
CDM (Charge Device Model)
500
MM (Machine Model)
200
V
The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those specified are not implied
The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
TABLE 5. PACKAGING/ORDERING INFORMATION (1)
PACKAGED DEVICES
PACKAGE TYPE
TRF7960RHBT
RHB – 32
TRF7960RHBR
TRF7961RHBT
RHB – 32
TRF7961RHBR
(1)
TRANSPORT MEDIA
QUANTITY
Tape and Reel
250
Tape and Reel
3000
Tape and Reel
250
Tape and Reel
3000
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
DISSIPATION RATINGS TABLE PER PACKAGE
(1)
(2)
POWER RATING (2)
PACKAGE
θJC
(°C/W)
θJA (1)
(°C/W)
TA≤ 25°C
TA = 85°C
RHB (32)
31
36.4
2.7 W
1.1 W
This data was taken using the JEDEC standard High-K test PCB.
Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long
term reliability.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
VIN
Supply voltage
2.7
5.0
5.5
V
TJ
Operating virtual junction temperature range
–40
125
°C
TA
Operating ambient temperature range
–40
110
°C
Load impedance at TX OUT (pin 5)
Submit Documentation Feedback
25
10
UNIT
Ω
3
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